This document discusses trends in atomic layer deposition (ALD) and chemical vapor deposition (CVD) applications, equipment, and precursors for high-volume manufacturing. It notes that ALD equipment sales have grown to $1.8-1.9 billion annually, with 300mm spatial ALD and multi-wafer tools gaining market share. Advanced logic and memory nodes like 10nm and 7nm are driving increased use of ALD for applications like high-k dielectrics. Key precursor suppliers are also discussed.
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Roll-to-Roll ALD Coatings for Battery Cell Interfaces at Production ScaleBeneq
ALD/AVS 2022
Presented by D.Sc. Andrew Cook
ALD is an enabling technology for future batteries. ALD technology introduction has been hindered by lack of production scale equipment, but now Beneq R2R ALD technology offers a straightforward scale-up path to mass-production. Beneq has a long experience with R2R ALD on other application areas, and is now applying that know-how to offer R2R ALD solutions for battery manufacturing.
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Introduction to atomic layer deposition (ALD): principles, applications, futureRiikka Puurunen
<erratum at the bottom / update 3.5.2019> Introductory lecture on Atomic Layer Deposition (ALD) by Prof. Riikka Puurunen, given at Aalto University School of Chemical Engineering on November 8, 2018. Lecture contents: Principles and concepts of ALD; Some history; Applications of ALD; Words on future. In addition to the core lecture contents, discusses where we have ALD layers in our smart mobile phones; mentions (some) faces of ALD in Finland; STG podcasts; Virtual Project on the History of ALD.
Corresponding lecture capture by Panopto available at: https://aalto.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=bd0aee67-7ca5-4973-8216-a99200e888b1
Erratum! Small errors spotted in the slides are described below. Updated 3.5.2019.
* slide 44 Luminescent: ZnS:Mg —> not Mg but Mn! --> ZnS:Mn
* slide 54 high-k solution: article not from 2017 but 2007
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Roll-to-Roll ALD Coatings for Battery Cell Interfaces at Production ScaleBeneq
ALD/AVS 2022
Presented by D.Sc. Andrew Cook
ALD is an enabling technology for future batteries. ALD technology introduction has been hindered by lack of production scale equipment, but now Beneq R2R ALD technology offers a straightforward scale-up path to mass-production. Beneq has a long experience with R2R ALD on other application areas, and is now applying that know-how to offer R2R ALD solutions for battery manufacturing.
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Introduction to atomic layer deposition (ALD): principles, applications, futureRiikka Puurunen
<erratum at the bottom / update 3.5.2019> Introductory lecture on Atomic Layer Deposition (ALD) by Prof. Riikka Puurunen, given at Aalto University School of Chemical Engineering on November 8, 2018. Lecture contents: Principles and concepts of ALD; Some history; Applications of ALD; Words on future. In addition to the core lecture contents, discusses where we have ALD layers in our smart mobile phones; mentions (some) faces of ALD in Finland; STG podcasts; Virtual Project on the History of ALD.
Corresponding lecture capture by Panopto available at: https://aalto.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=bd0aee67-7ca5-4973-8216-a99200e888b1
Erratum! Small errors spotted in the slides are described below. Updated 3.5.2019.
* slide 44 Luminescent: ZnS:Mg —> not Mg but Mn! --> ZnS:Mn
* slide 54 high-k solution: article not from 2017 but 2007
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Battery Show Europe 2022
Presented by D.Sc. Andrew Cook
ALD is an enabling technology for future batteries. ALD technology introduction has been hindered by lack of production scale equipment, but now Beneq R2R ALD technology offers a straightforward scale-up path to mass-production. Beneq has a long experience with R2R ALD on other application areas, and is now applying that know-how to offer R2R ALD solutions for battery manufacturing.
KEMET Webinar - Update on ESA and military standard portfolioIvana Ivanovska
KEMET has successfully launched several High Reliability Tantalum Polymer SMD solutions to the market during the last years. The existing series T540/T541 based on the Mil 55365 specification and T583 ESCC3012/005 provide better capacitance stability, better capacitance retention, lower ESR, higher ripple handling, and long life combined with extreme requirements of Military, Defense and Aerospace applications. Leading the market and bringing innovation to these high demanding segments drive us to continuously expand our portfolio. We will up-date you on T580/T581 1st to market Military Polymer Standard and the T584 series, the ESA ultra-low ESR expansion.
Lithography technology and trends for « Semiconductor frontier » held by Aman...Yole Developpement
Lithography technology and trends for « Semiconductor frontier »
Mask aligners are the fastest lithography technology
Stepper technology provides the best resolution
Key requirements for Advanced Packaging
LED manufacturers use small diameter wafers (2”, 3”, 4” or 6”) and transition more rapidly than traditional semiconductor’s industry to larger diameters
WAFER SIZE
Wafer bow can reach up to 50μm for 2” wafers and 100μm for 4”, inducing pattern distortion.
WAFER BOW
2”
4”
6”
LED manufacturers can use different substrates, mostly sapphire or SiCwafers, which are transparent with light-diffusing features such as rough or patterned surfaces. Also, they can use metal wafers for vertical structures, so there’s large material variability.
Ceramic Solutions Enabling the Evolution of Semiconductor ProcessingCoorsTek, Inc.
The unique properties of engineered ceramics – chemical, thermal, electrical, and structural - enable clean, consistent wafer processing, front-end semiconductor chip fabrication, and back-end device packaging. The presentation will provide an overview of the critical role that ceramic materials play in meeting the stringent requirements of this cutting-edge and continuously evolving industry.
- Beyond Moore’s Law – Heresy or Reality?
- Industry and technology trends
- Citius, Altius, Fortius
- Application drivers and requirements
- What Ceramics bring to the party
- Critical properties and challenges
Speaker Bio
With over 25 years’ experience in the ceramics industry focussed primarily in the Semiconductor, Catalysis, and Oil & Gas segments, Dean has held various positions in Business/General Management, Technology, Operations, and Consulting at CoorsTek, Saint-Gobain, RJ Lee Group, and Risø National Laboratory. His career has taken him all over the globe, including living and working in both Denmark and Germany.
In addition to an M.B.A. from the University of Pittsburgh, Dean holds an M.S. in Ceramic Science and Engineering from Rutgers University and a B.S. in Ceramic Engineering from The Ohio State University.
Dean’s primary interests lie in the translation of application-related opportunities to materials solutions through cross-functional collaboration in the identification, development, industrialization, and commercialization of technology.
Technological Trends in the Field of Circuit Board Design and ManufacturingToradex
Circuit boards are extensively used across in the electronics industry. So much so that nowadays a circuit board designer is expected to be also proficient in the manufacturing technology apart from understanding electrical engineering. Read this article which will provide you with an insight on the various current and emerging technological trends prevailing in the manufacture of printed circuit boards.
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Atomic Layer Deposition solutions for SiC Power ElectronicsBeneq
Power Electronics International
Brussels, Belgium
19.04.2023
Atomic Layer Deposition solutions for SiC Power Electronics
Integrated ALD passivation/gate dielectric stack for SiC MOSFET
Presented by Mikko Söderlund from Beneq Oy
Cristina talks about capacitors that can last longer at high temperatures are extreme humidity. In this case, when there is no moisture or too much moisture. This presentation covers the technology innovations applied to a high-reliability polymer tantalum capacitor.
The Battery Show Japan Showcase Presentation.pdfBeneq
Battery Japan 2023
September 13-15, 2023
Atomic Layer Deposition and some of the aspects around using R2R ALD Coatings for Battery Cell Interfaces.
Presented by Dr. Andrew Cook from Beneq Oy
This report takes a look into the patenting activity around gallium Nitride uncovering the companies, inventors, and key applications.
GaN is a binary III-V direct bandgap semiconductor commonly used in LEDs. Its wide-band gap of 3.4 eV affords its special properties for applications in optoelectronic, high-power and high-frequency devices. Because GaN offers very high breakdown voltages, high electron mobility, and saturation velocity it is also an ideal candidate for high-power and high-temperature microwave applications like RF power amplifiers at microwave frequencies and high-voltage switching devices for power grids. Solutions that use GaN-based RF transistors are also replacing the magnetrons used in microwave ovens.
Gallium Nitride (GaN) transistor models have evolved from GaAs (gallium arsenide) transistor models; however there are many advantages GaN offers:
• Higher operating voltage (over 100-V breakdown)
• Higher operating temperature (over 150°C channel temperature)
• Higher power density (5 to 30 W/mm)
• Durable and crack-resistant material
GaN devices are often grown on SiC (silicon carbide) substrates, but to achieve lower-cost GaN devices, they can be grown on sapphire and silicon wafers. GaN’s wide bandgap allows for higher breakdown voltages and operation at high temperatures. The high thermal conductivity of SiC makes it a better substrate than silicon for power amplifier applications that require good heat sinking.
Technology market trends in LED downconverters presentation held by Eric Vire...Yole Developpement
Phosphor volumes to grow +/-at the same pace for “on-chip”
Surface blue LED chips combined with a downconverter Surface blue LED chips combined with a downconverter
Phosphor volumes to essentially double by 2020
Silicates could essentially disappear unless significant cost reduction and further performance improvement are achieved.
Increasing demand for high CRI in lighting broad band green and yellow + narrow band red.
Wider color gamut display: increasing demand for narrow band green and red.
No more room for ASP decrease.
Yet, YAG is not a commodity!
Overall flat revenue means pain and suffering + attrition (20+ suppliers in China only!)
But even in a difficult environment, some companies will grow and thrive
The most dramatic picture improvements come from higher dynamic contrast and extended color gamut!
More information on that report at http://www.i-micronews.com/reports.html
Similar to ALD/CVD applications, equipment and precursors in high volume manufacturing (20)
Courier management system project report.pdfKamal Acharya
It is now-a-days very important for the people to send or receive articles like imported furniture, electronic items, gifts, business goods and the like. People depend vastly on different transport systems which mostly use the manual way of receiving and delivering the articles. There is no way to track the articles till they are received and there is no way to let the customer know what happened in transit, once he booked some articles. In such a situation, we need a system which completely computerizes the cargo activities including time to time tracking of the articles sent. This need is fulfilled by Courier Management System software which is online software for the cargo management people that enables them to receive the goods from a source and send them to a required destination and track their status from time to time.
TECHNICAL TRAINING MANUAL GENERAL FAMILIARIZATION COURSEDuvanRamosGarzon1
AIRCRAFT GENERAL
The Single Aisle is the most advanced family aircraft in service today, with fly-by-wire flight controls.
The A318, A319, A320 and A321 are twin-engine subsonic medium range aircraft.
The family offers a choice of engines
Immunizing Image Classifiers Against Localized Adversary Attacksgerogepatton
This paper addresses the vulnerability of deep learning models, particularly convolutional neural networks
(CNN)s, to adversarial attacks and presents a proactive training technique designed to counter them. We
introduce a novel volumization algorithm, which transforms 2D images into 3D volumetric representations.
When combined with 3D convolution and deep curriculum learning optimization (CLO), itsignificantly improves
the immunity of models against localized universal attacks by up to 40%. We evaluate our proposed approach
using contemporary CNN architectures and the modified Canadian Institute for Advanced Research (CIFAR-10
and CIFAR-100) and ImageNet Large Scale Visual Recognition Challenge (ILSVRC12) datasets, showcasing
accuracy improvements over previous techniques. The results indicate that the combination of the volumetric
input and curriculum learning holds significant promise for mitigating adversarial attacks without necessitating
adversary training.
Explore the innovative world of trenchless pipe repair with our comprehensive guide, "The Benefits and Techniques of Trenchless Pipe Repair." This document delves into the modern methods of repairing underground pipes without the need for extensive excavation, highlighting the numerous advantages and the latest techniques used in the industry.
Learn about the cost savings, reduced environmental impact, and minimal disruption associated with trenchless technology. Discover detailed explanations of popular techniques such as pipe bursting, cured-in-place pipe (CIPP) lining, and directional drilling. Understand how these methods can be applied to various types of infrastructure, from residential plumbing to large-scale municipal systems.
Ideal for homeowners, contractors, engineers, and anyone interested in modern plumbing solutions, this guide provides valuable insights into why trenchless pipe repair is becoming the preferred choice for pipe rehabilitation. Stay informed about the latest advancements and best practices in the field.
COLLEGE BUS MANAGEMENT SYSTEM PROJECT REPORT.pdfKamal Acharya
The College Bus Management system is completely developed by Visual Basic .NET Version. The application is connect with most secured database language MS SQL Server. The application is develop by using best combination of front-end and back-end languages. The application is totally design like flat user interface. This flat user interface is more attractive user interface in 2017. The application is gives more important to the system functionality. The application is to manage the student’s details, driver’s details, bus details, bus route details, bus fees details and more. The application has only one unit for admin. The admin can manage the entire application. The admin can login into the application by using username and password of the admin. The application is develop for big and small colleges. It is more user friendly for non-computer person. Even they can easily learn how to manage the application within hours. The application is more secure by the admin. The system will give an effective output for the VB.Net and SQL Server given as input to the system. The compiled java program given as input to the system, after scanning the program will generate different reports. The application generates the report for users. The admin can view and download the report of the data. The application deliver the excel format reports. Because, excel formatted reports is very easy to understand the income and expense of the college bus. This application is mainly develop for windows operating system users. In 2017, 73% of people enterprises are using windows operating system. So the application will easily install for all the windows operating system users. The application-developed size is very low. The application consumes very low space in disk. Therefore, the user can allocate very minimum local disk space for this application.
Quality defects in TMT Bars, Possible causes and Potential Solutions.PrashantGoswami42
Maintaining high-quality standards in the production of TMT bars is crucial for ensuring structural integrity in construction. Addressing common defects through careful monitoring, standardized processes, and advanced technology can significantly improve the quality of TMT bars. Continuous training and adherence to quality control measures will also play a pivotal role in minimizing these defects.
Event Management System Vb Net Project Report.pdfKamal Acharya
In present era, the scopes of information technology growing with a very fast .We do not see any are untouched from this industry. The scope of information technology has become wider includes: Business and industry. Household Business, Communication, Education, Entertainment, Science, Medicine, Engineering, Distance Learning, Weather Forecasting. Carrier Searching and so on.
My project named “Event Management System” is software that store and maintained all events coordinated in college. It also helpful to print related reports. My project will help to record the events coordinated by faculties with their Name, Event subject, date & details in an efficient & effective ways.
In my system we have to make a system by which a user can record all events coordinated by a particular faculty. In our proposed system some more featured are added which differs it from the existing system such as security.
3. CMC Seminar / ICMtia Joint Conf 10/2018
The driver behind ALD & CVD
300mm Equipment fab invest
4. ALD Equipment Market <25% of the total CVD Wafer
Equipment market
• Tokyo Electron has passed ASM
in revenue 2017
• 90% of the market is 300mm
wafer processing equipment
• TEL and Hitachi Kokusai
dominates Large Batch ALD
• 300 mm Spatial ALD and Multi
wafer tools continues taking
market shares vs. Single wafer &
Large Batch
4
25%
24%
16%
11%
7%
5%
3%
9%
ALD Equipment Market Estimate 2017
US$ 1.8 to 1.9 B
(Semi, PV, Display, MEMS, R&D)
Tokyo Electron
ASM International
Hitachi Kokusai Electric
Lam Research
Wonik IPS
Jusung Engineering
Applied Materials
Other
5. Trend in IP Filing for Spatial ALD
0%
5%
10%
15%
20%
25%
30%
35%
IP Applications for Spatial ALD
Source: Fraunhofer IKTS
6. Trend in IP Filing for Spatial ALD
0%
5%
10%
15%
20%
25%
30%
35%
IP Applications for Spatial ALD
TEL NT333 for thermal and plasma
ALD of SiO2, SiN, High-k
Source: Fraunhofer IKTS
7. Wafer forecast – growth drivers for ALD & CVD
For more information on TECHCET’s Wafer reports
please go to www.techcet.com
CMC Seminar / ICMtia Joint Conf 10/2018, Ningbo
• Advanced logic benefits as 10 nm
followed by 7 nm moves from
qualification into production
• Multiple patterning (SADP, SAQP)
for logic and memory
• Completion of the NAND to 3D-
NAND transition as 3D will
account for 2/3 of the capacity in
2018 (VLSI Research, April 2018)
• Continued high demand for DRAM
• China investments in new Fabs
and expansions continue for logic
and memory
• Niche memory technologies like
spin-transfer torque MRAM (STT-
MRAM), Resistive RAM (RRAM),
Ferroelectric FET (FeFET) and
RAM (FRAM), and Cross-Point
memory will grow over the coming
5 years
8. Dielectric & High-k Materials IP Trends
8
0
200
400
600
800
1000
1200
1400
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
High-k Material IP (Applications)
Al2O3 TiO2 HfO2 ZrO2 REO STO, BST etc. Ta2O5 Total
0
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
Dielectric & High-k Process IP (Applications)
CVD PECVD ALD SOD PVD Total Dielectric Deposition
Al2O3
TiO2
HfO2
ZrO2REO
STO, BST, PZT
Ta2O5
ALD
PECVD
CVD
SOD
PVD
Ta2O5, SrTiOx, BaSrTiOx and PZT 15 to 20 years ago.
Today most IP concerning the metaloxides of Al, Hf, Ti, Zr
and Rare Earth elements (SiO2 and SiN excluded)
ALD and PECVD are domianting filed IP in deposition of
dielectrics and high-k dielectrics (includeing SiO2 and SiN)
Source: Fraunhofer IKTS
10. ALD/CVD Metal & High-k Precursors
10
TECHCET Critical Materials Report(TM)
• The combined markets for
ALD and CVD metal
precursors are estimated
to be approximately
US$460M 2018 and
above US$620M by 2023.
• Average long term CAGR
of 8% over 2013 to 2023
TECHCET CA LLC Copyright 2018 all rights reserved www.techcet.com
11. ALD/CVD/SOD Dielectric Precursors
• Dielectric precursors show
growth in all segments for the
next 5 years reaching US$660
in 2023 M
• As for metal precursors, the
market has over an extended
period of time had a double
digit growth and we expect the
market to continue to develop
as the transition to 10 nm and
7 nm node logic and 3D-NAND
take place with an average long
term CAGR of 9% over 2015 to
2023
11
TECHCET Critical Materials Report(TM)
TECHCET CA LLC Copyright 2018 all rights reserved www.techcet.com
13. Multiple patterning
Critical Materials Conference, April 26-27, Phoenix AZ
David Bloss, Vice President, Technology Manufacturing Group and Director of
Lithography Technology Sourcing, Intel Corporation
14. Multiple patterning
Critical Materials Conference, April 26-27, Phoenix AZ
David Bloss, Vice President, Technology Manufacturing Group and Director of
Lithography Technology Sourcing, Intel Corporation
15. Lithography beyond 7nm for <24nm pitch
• No single lithography
technology can create <24nm
pitch patterns in a single pass
except for direct-write e-beam
which is too slow and
expensive for HVM.
• Multi-patterning process flows
can be scompared by Cost Per
Wafer Pass (CPWP), a term
defined as the cost-of-
ownership (CoO) Modeling for the evaluation of alternate 1D and 2D
patterning paths
Source: Ed Korczynski, TECHCET
CMC Conference 2018, April 27 2018, Phoenix
ALD
16. Alternatives – Directed self assembly (DSA)
IBM Research at Albany NanoTech, TEL Technology Center, America in Albany, GlobalFoundries, and IBM
Research TJ Watson in Yorktown Heights and IBM Research Almaden, San Jose.
Nature Electronics volume 1, pages562–569 (2018)
ALD
ALD ALD
17. I AIR LIQUIDE, THE WORLD LEADER IN GASES, TECHNOLOGIES AND SERVICES FOR INDUSTRY AND
HEALTH
∙
Critical Material Conference, Phoenix April 26th, 2018 •
THIS DOCUMENT IS ••PUBLIC
Cobalt applications and requirements
BEOL Cu metallization: 22nm →
Co capping layer
✓ Prevents Cu EM
Co liner
✓ Improve wettability
✓ Prevents voids
Source: Applied Materials Inc.
http://www.appliedmaterials.com/products/endura-volta-cvd-cobalt
Challenges
• Conformality, void-free deposition
• Contact resistance
MOL contact fill: <10nm →
Cu
Low-k
Co liner
Co cap
Barrier
Seed
Source: Applied Materials Inc.
Challenges for <10nm integration
• Conformality (low stability precursors)
• Adhesion becomes more challenging
• Selectivity
7
18. Cobalt IP Filing Trends for Chemical Compounds
Increased filing activity for Cobalt chemical compounds starting
2012. Applications focusing on Li-batteries & Electronic
applications (Plating chemicals, Precursors)
2012
Prices for Cobalt cathodes have increased by 60%
in 2017 but appear to be stabilized but volatile.
19. Cobalt IP Filing Trends for Chemical Compounds
Increased filing activity for Cobalt chemical compounds starting
2012. Applications focusing on Li-batteries & Electronic
applications (Plating chemicals, Precursors)
2012
Prices for Cobalt cathodes have increased by 60%
in 2017 but appear to be stabilized but volatile.
Higher demand from Cobalt use in Electric Vechicles
20. Competeing Industries
Competing industries for ALD precursors and the most important
industries in high volume manufacturing today are:
• Non-Semi Wafer based (e.g. MEMS and LED)
• QD-OLED and AMOLED Flexible display
• Photovoltaic
• R&D Equipment
20
From an ALD equipment perspective these markets account for 10 to
15% of the total annual revenue for ALD equipment (US$ 1.8 to 1.9 B). NCD Cluster system for Lucida™ GD series
OLED Encapsluation
6G half (1500mmX925mm)
21. PV – Back side passivation for PERC cells
driving TMA use in PECVD & ALD
Equipment & Process Market Share Estimate (%)
OEM Process
TMA
consumption
[mg / wafer]
2017 2018 2020 2022 2025 2028
Fullshare PECVD 9
90 92 86 87 87 83Centrotherm PECVD 5
Meyer Burger PECVD 2.9
Ideal Energy ALD 4
6 6 11 12 13 16
SoLayTec ALD 3
NCD ALD 2
Levitech Spatial ALD 1.6
Leadmicro Spatial ALD 1
Other PECVD SiNx n/a 4 2 2 1 0 0
21
TMA consumption and Al2O3 thickness for APCVD, PECVD
and ALD Tools (Adapted from TaiyangNews 2018).
The low TMA consumption is a reason why ALD tools
are slowly taking market share from PECVD, especially
in China
22. MEMS
In MEMS applications that consist of numerous 3D structures, narrow
cavities and the need of conformal coatings even in large buried
structures ALD is optimal for deposition in of layers with very specific
properties or combination thereof:
info@techcet.com 22
Large volume of MEMS for Smartphone market (Gyro, Sensors, Speakers, Microphones)
Leading MEMS and companies have implemented ALD i HVM
o Diffusion barriers
o Adhesion layers
o Charge dissipative layers
o Layers lowering frictional wear
o Optical layers
o Coatings for hermetical sealing
o Hydrophobic layers to decrease stiction
o Conformal, thermally conductive layers
o Conductive seed layers for plating purposes
o Etch masks and etch stop layers
o Conformal, electrically insulating layers
23. New 200 mm ALD Wafer
Cluster Tools
Picosun
Singel Wafer
Mini Batch
Veeco
Mini Batch
Beneq
Mini Batch
Oxford Instruments
PlasmaPro Cluster PECVD, ALD & ALE
