The manufacturing of microprocessors involves growing pure silicon crystals, slicing wafers, and fabricating integrated circuits through repeated photolithography, etching, deposition, and doping steps in a clean room environment. Key steps include slicing silicon ingots into wafers, layering and patterning materials like insulators and conductors through photolithography and etching, and implanting dopants using ion implantation. After fabrication, the wafers are tested, cut into chips, and packaged into protective casings before use in electronic devices.
Semiconductors are materials that have electrical conductivity between conductors such as most metals and nonconductors or insulators like ceramics. How much electricity a semiconductor can conduct depends on the material and its mixture content.
Semiconductors can be insulators at low temperatures and conductors at high temperatures. As they are used in the fabrication of electronic devices, semiconductors play an important role in our lives.
1.Silicon Manufacturing
a) Czochralski method.
b) Wafer Manufacturing
c) Crystal structure
2.Photolithography
a) Photoresists
b) Photomask and Reticles
c) Patterning
Moore's law is the observation that the number of transistors in a dense integrated circuit doubles approximately every two years. The observation is named after Gordon Moore, the co-founder of Fairchild Semiconductor and Intel, whose 1965 paper described a doubling every year in the number of components per integrated circuit, and projected this rate of growth would continue for at least another decade. In 1975, looking forward to the next decade, he revised the forecast to doubling every two years. The period is often quoted as 18 months because of Intel executive David House, who predicted that chip performance would double every 18 months (being a combination of the effect of more transistors and the transistors being faster).
Semiconductors are materials that have electrical conductivity between conductors such as most metals and nonconductors or insulators like ceramics. How much electricity a semiconductor can conduct depends on the material and its mixture content.
Semiconductors can be insulators at low temperatures and conductors at high temperatures. As they are used in the fabrication of electronic devices, semiconductors play an important role in our lives.
1.Silicon Manufacturing
a) Czochralski method.
b) Wafer Manufacturing
c) Crystal structure
2.Photolithography
a) Photoresists
b) Photomask and Reticles
c) Patterning
Moore's law is the observation that the number of transistors in a dense integrated circuit doubles approximately every two years. The observation is named after Gordon Moore, the co-founder of Fairchild Semiconductor and Intel, whose 1965 paper described a doubling every year in the number of components per integrated circuit, and projected this rate of growth would continue for at least another decade. In 1975, looking forward to the next decade, he revised the forecast to doubling every two years. The period is often quoted as 18 months because of Intel executive David House, who predicted that chip performance would double every 18 months (being a combination of the effect of more transistors and the transistors being faster).
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
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2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
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Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Are you looking to buy Si Wafer? We are a leading supplier of Silicon wafers across six continents in over 45 countries. Call (561) 842-4441 or Shop at our website.
*(PPT was prepared for a 15 min presentation)
The topic "Photonic Integrated circuit technology" is in itself very vast that it cant be explained completely in a matter of minutes, so it is better to focus on a particular type of PIC throughout the presentation .(because,based on substrate material,the technology changes and it is always important to maintain a flow throughout the presentation).
Research well on the topic,do your best and leave the rest
:)
3D IC Presented by Tripti Kumari, School of Engineering, CUSATthevijayps
A 3D Integrated Circuit is a chip that has active electronic components stacked on one or more layers that are integrated both vertically and horizontally forming a single circuit.
In the 3-D design architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
In a generic 3D IC structure, each die is stacked on top of another and communicated by Through-Silicon Vias (TSVs).
Architectural issues
Traditional shared buses do not scale well – bandwidth saturation
Chip IO is pad limited
Physical issues
On-chip Interconnects become increasingly slower w.r.t. logic
IOs are increasingly expensive
Consequences
Performance losses
Power/Energy cost
Design closure issues or infeasibility
Reduced wire length
Total wire length
Larger circuits produce more improvement
Lower power per transistor
Decreased interconnect delay
Higher transistor packing densities
Smaller chip areas
There are four ways to build a 3D IC:
Monolithic
Wafer-on-Wafer
Die-on-Wafer
Die On Die
At runtime, thermal variations will introduce additional time-varying clock skew, further increasing design uncertainty
2 - Thermal Issues In 3-D ICs
Due to reduction in chip size of a 3D implementation, 3D circuits exhibit a sharp increase in power density
Analysis of Thermal problems in 3D is necessary to evaluate thermal robustness of different 3D technology and design options.
3 - Reliability Issues In 3-D ICs
Electro thermal and Thermo-mechanical effects between various active layers can influence electro-migration and chip performance
Die yield issues may arise due to mismatches between die yields of different layers, which affect net yield of 3D chips.
TSV check on reset
Control use dedicated Vias in order to establish which vias are corrupted.
If 1, 2 and 3 TSVs are OK, the control set the enable signal set_to and set_from: broken path are skipped!
Pads routing shift as show in the figure
Need to define The handling protocol during the TSVs check
3D IC design is a relief to interconnect driven IC design.
Still many manufacturing and technological difficulties
Physical Design needs to consider the multiple layers of Silicon available.
Optimization of both temperature and wirelength
Placement and routing algorithms need to be modified
[1] J. Davis, et al., "Interconnect limits on gigascale integration (GSI) in the 21st century," Proceedings of the IEEE , vol.89, no.3, pp.305-324, Mar 2001.
[2] Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C.; , "3-D ICs: a novel chip design for improving deep- submicrometer interconnect performance and systems-on-chip integration," Proceedings of the IEEE , vol.89, no.5, pp.602-633, May 2001.
MONOLITHIC IC PROCESSES A monolithic integrated circuit (IC) is a set of circuitry on a single semiconductor plate or chip rather than built of separate elements as a discrete circuit is.
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2. Preliminary Discussion
• Integrated circuit: An electronic circuit designed to perform some
function, in which the electronic components (transistors, resistors,
diodes, capacitors, etc.) are miniaturized, built into a small "chip" made
of silicon and interconnected through tiny strands of aluminum. More
commonly referred to as "microchips", or "IC chips―
• The chip found inside of a "musical" birthday card contain only a few
dozen components, whereas a Pentium processor today contains over 800
million transistors! When an integrated circuit is extremely complex, it
is usually known as a microprocessor.
3. Preliminary Discussion (contd.)
• Microprocessors are manufactured in clean rooms, the ambiance of which
cleaner than a hospital operating room.
– The air in the clean room is air conditioned to a temperature of 21C (70F) and 45%
relative humidity.
– The air is passed through a high-efficiency particulate air (HEPA) filter to capture particle
contaminants
– workers must be covered from head to toe in specialized garments, called bunny suits,
designed to trap particles.
4. Outline of the processing steps
Sequence of processing steps in the production of integrated circuits: (1)
pure silicon is formed from the molten state into an ingot and then sliced
into wafers; (2) fabrication of integrated circuits on the wafer surface; and
(3) wafer is cut into chips and packaged.
5. Silicon Ingot
• To provide uniform electrical properties throughout, the silicon must be
almost totally pure and a perfect crystal.
Ingot diameter 300mm(12 in) and up to
3m(10 ft) long
The Czochralski process for growing single-crystal ingots of silicon: (a) initial
setup prior to start of crystal pulling, and (b) during crystal pulling to form
the boule.
6. Silicon Ingot (contd.)
Grinding operations used in shaping the silicon ingot: (a) a form of
cylindrical grinding provides diameter and roundness control, and (b) a flat
ground on the cylinder.
7. Silicon Wafers
Wafer slicing using a
diamond abrasive cutoff saw.
8. Silicon Wafers (contd.)
Two of the steps in wafer preparation: (a) contour grinding to round the
wafer rim, and (b) surface polishing.
9. IC Fabrication
• Repeated sequential steps (200 times or more).
• Layering: Adding new material on top of or
into the silicon like dopants, insulators,
conductors.
• Photolithography: By exposing a light
sensitive chemical (photoresist) through a
mask, the desired pattern is transferred
onto the current top layer.
• Etching: Removes the material to give the
desired pattern.
10. IC Fabrication (contd.)
AN EXAMPLE: How can you create a p-type region in a n-type doped silicon
region? Ions of arsenic are bombarded
using ion implantation to create a
n-type doped region.
Layer of SiO2 is grown using
oxidation.
Layer of photoresist is applied.
• photoresist is an organic polymer sensitive
to light radiation in a certain wavelength
range; the sensitivity causes either an
increase or decrease in solubility of the
polymer to certain chemicals.
11. IC Fabrication (E.g. contd.)
Expose photoresist using
appropriate lithographic mask.
Develop the photoresist.
Etch photoresist and silicon
dioxide.
Implant boron
Remove silicon dioxide
12. IC Fabrication (contd.)
(A) A p-type wafer (silicon doped with Boron) has a epilayer of n-type (silicon doped with Phosphorous or
Arsenic)
(B) A mask is used to implant Silicon Dioxide, for the insulator
(C) Acceptor atoms (Boron) are diffused into the window in the Silicon Dioxide
(D) Using another mask additional Silicon Dioxide is grown. and donor atoms (elements like Arsenic with
excess electrons) are implanted.
(E) Another mask is used to grow additional Silicon Dioxide. Another mask is then used to implant
evaporated Aluminum or Copper for the contacts. This is a Bipolar Junction Transistor (BJT).
13. Packaging
• Wafer Testing: a computer-controlled needle probes contacts the chip
connection pads and a series of DC tests are carried out to indicate short
circuits and other faults; the failed chips are marked with an ink dot;
these defects are not packaged.
• Chip Separation: A thin diamond-impregnated saw blade is used to
perform the cutting operation. The sawing machine is highly automatic
and its alignment with the ‘‘streets’’ between circuits is very accurate.
• Die Bonding: Automated handling systems pick the separated chips and
place them for on the die. Epoxy is applied to the base of the chip.
• Wire Bonding After the die is bonded to the package, electrical
connections are made between the contact pads on the chip surface and
the package leads.
• Video
15. Ion Implantation
First a gas containing the desired dopant is
ionized by bombarding it with electrons,
producing charged atoms. This process will
also produce ions of other types, are
screened out. By carefully adjusting the
field, the desired ions are given the correct
arc to exit the mass spectrometer.
Ions that are heavier will curve too wide
and ions that are lighter will curve too
sharply to escape. The dopant ions are then
accelerated through a very strong electric
field and fired at the wafer. A patterned
layer of photoresist or other material is
used to block the dopant atoms from areas
where they are not needed. In areas of
silicon that are exposed, the ions crash into
the surface at high rates of speeds.
The total dose of dopant depends upon how many ions are fired into the silicon. Wafer must
be annealed to allow the doper atoms and silicon atoms to position themselves in their proper
places.
16. Photolithography
Photolithography, also known as optical
lithography, uses light radiation to expose a
coating of photoresist on the surface of the
silicon wafer; a mask containing the
required geometric pattern for each layer
separates the light source from the wafer,
so that only the portions of the photoresist
not blocked by the mask are exposed. The
mask consists of a flat plate of transparent
glass on to which a thin film of an opaque
substance has been deposited in certain
areas to form the desired pattern. Thickness
of the glass plate is around 2 mm (0.080 in),
whereas the deposited film is only a few
mm thick—for some film materials, less than
1 mm.The mask itself is fabricated by
lithography, the pattern being based on
circuit design data,
usually in the form of digital output from
the CAD system used by the circuit
designer.
17. Etching
Etching is usually done selectively, by coating surface areas that are to be protected
and leaving other areas exposed for etching. The coating maybe
an etch-resistant photoresist, or it maybe a previously applied layer of material such
as silicon dioxide.
Wet Chemical Etching involves the use of an aqueous solution, usually an acid, to
etch away a target material. The etching solution is selected because it chemically
attacks the specific material to be removed and not the protective layer used as a
mask.
Dry Plasma Etching uses an ionized gas to etch a target material. The ionized gas is
created by introducing an appropriate gas mixture into a vacuum chamber. and using
radio frequency (RF) electrical energy to ionize a portion of the gas, thus creating
a plasma. The high-energy plasma reacts with the target surface, vaporizing the
material to
remove it.