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Photonic Integrated Circuit Technology
The document discusses photonic integrated circuits (PICs) that emerged in the 1970s as the optical counterparts to electronic integrated circuits (EICs), emphasizing their integration of optical functions within a single chip for high-speed data transmission. It covers the basic components, classification methods, fabrication techniques, and a comparison of PICs with EICs, outlining their advantages such as increased bandwidth and lower power consumption, as well as challenges like high development costs. The document also looks at current applications in areas like fiber optics and bio-photonics, and future prospects for more complex integrated systems.
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Photonic Integrated Circuit Technology
- 2. INTRODUCTION PHOTONIC IC VSELECTRONIC IC Basic components CLASSIFICATION FABRICATION PIC – AN EXAMPLE EVaLUATION OF a PIC APPLICATIONS CURRENT ASPECTS FUTURE PROSPECTS REFERENCES
- 3. INTRODUCTION Technology introduced-1970’s Optical equivalent of electronic IC Involves integration of optical functions into a single chip High speed data rates Small size, reduced power consumption
- 4. PHOTONIC IC VSELECTRONIC IC FEATURES PIC EIC Data Carrier Photons Electrons Type of components Functional optical devices Transistors No. of components integrated Limited to a few hundred Range into millions Substrate materials Many different materials in a single chip Fits nicely onto Silicon
- 5. BASIC COMPONENTS PASSIVE • Waveguides/Couplers •Switches (optical interconnect, wavelength selective switches) • Filters (add-drop filters, MUX/DEMUX) • Dispersion compensators • Attenuator • Gain equalizer • Isolators/Circulators ACTIVE • Amplifiers • Lasers • LED • Modulators • Detectors • Wavelength Converters
- 7. a) b) c) a)Array Waveguide Grating(AWG) b)MultimodeInterference Couplers (MMI) c)Mach-Zehnder Interferometers(MZI)
- 8. CLASSIFICATION Based onintegration : - Monolithic Integration - Hybrid Integration - Modular Integration Based on type of substrate material : - Indium Phosphide (InP) - Gallium Arsenide (GaAs) - Lithium Niobate - Silicon (Si) - Silica-on-Silicon - Silicon on Insulator
- 10. FABRICATION • Structural strategyfor the fabrication of PICs onto an InP substrate • Basic steps : - Epitaxial growth - Waveguide etching - Passivation and planarization - Metallization and interconnect
- 11. Four active-passive integrationschemes: (a) vertical twin-guide integration (b) vertical single guide integration (c) quantum well intermixing (and selective area growth) (d) butt-joint integration
- 12. Cross section ofthe wafer structure after the 4 processes:
- 13. PIC – ANEXAMPLE WDM chip : Integration of multiple wavelengths onto single transmitter and reciever chips
- 14. EVALUATION OF APIC Merits : Demerits : Compared with EICs Compared to discrete optical components • Increased Bandwidth and lower power consumption • Smaller size, lower power consumption • High Reliability • Improved optical alignment • Data Transparency • Immunity to vibration • High cost for developing new fabrication technology
- 15. APPLICATIONS • Fiber Optics •Bio-Photonics • Sensors • Photonic Computing • Nano Photonics
- 16. CURRENT ASPECTS • WDMsystem on a chip • Match discrete components in performance • Unmatched space ,power and reliability • Deliver lowest cost/bit • High spectral efficiency
- 17. FUTURE PROSPECTS • Complexpackages that support advanced modulation schemes and receiver designs • Integration of electronics and optics
- 18. Optical Fiber Communications– Principles and Practice by John M. Senior www.infinera.com http://en.wikipedia.org http://iopscience.iop.org http://www.sciencedirect.com http://www.vlcphotonics.com http://www.photonics.com http://ieeexplore.ieee.org http://www.researchgate.net http://photonicswiki.org http://www.onechipphotonics.com www.circuitstoday.com
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