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LED 101

LED System Design
LED System Topics



                                       LED Optics


                                       LED
                                       Thermal System


                                       Driver Electronics



LED 101 | LED System Design | Page 2
LED System Design Steps


 Estimate:
 E ti t
 • lumens, max ambient temp. & available space        => LED type
 • CRI / CCT or color, heat sinking, LED current      => LED light output
 • O ti l l
   Optical losses, l
                   lumens, production di t ib ti
                               d ti distribution      => amount of LEDs
                                                       >        t f LED

 Test setup to check:
 • Li ht output, j
   Light t t junction t
                   ti temp / solder j i t t
                               ld joint temp          => confirm amount of
                                                            fi        t f
                                                         LEDs

 Mechanical d i
 M h i l design, heat sink and optics optimization:
                       h t i k d ti           ti i ti
 • Driver design with high efficiency and PFC         => LED electrical
                                                         arrangement



LED 101 | LED System Design | Page 3
Color Temperature and Color Rendering Guidelines

  Follow new Energy Star (Oct. 1, 2011) requirements like
                         (Oct 1
  • Indoor: CRI ≥ 80 for indoor, ∆ in u’, v’ CIE 1976 ≤ 0.007 after 6,000 h.
  • Indoor: Stable light output after 1 min
  • CCT: 2700 K, 3000 k, 3500 K, 4000 k and 5000 K (commercial only)
  • L70 lumen maintenance: ≥ 25,000 h for residential indoor
                                       ≥ 35 000 h f residential outdoor / commercial
                                         35,000 for    id ti l td                i l
  • Defines PFC > 0.7 (residential) or > 0.9 (commercial)
  • For example non directional residential:
            p
            •         till 09/01/2013: ≥ 65 lm / W non directional residential
            •         after that:      ≥ 70 lm / W non directional residential
            •         > 800 lm

LED 101 | LED System Design | Page 4
LED Light Engine

   Goals to look for

   • Low power consumption
        •  High LED efficiency
        •  Low optical l
           L      ti l losses
        •  High driver efficiency

   • Low junction temperature f longer life (if an issue).
                                for      f (f           )
        •   High LED efficiency
        •   Lower LED current
        •   Low thermal resistance

   • Costs


LED 101 | LED System Design | Page 5
LED Efficacy
     Example: OSRAM OSLON CW, 4000 K:
     • 350 mA
          •   95 lm, Vf = 3.2 V
          •   85 lm / W
          •   ∆Tja = 9.4 º
                     94

     • 700 mA
          •   162 lm , Vf = 3.45 V
                            3 45
          •   67 lm / W
          •   ∆Tja = 29º

      Rth LED = 7 K / W
      Rth PCB + Rth Heatsink = 5 K / W
      -0.2 % / K thermal degradation
      30 % blue light conversion at 350 mA and Ts = 25º C


LED 101 | LED System Design | Page 6
LED Optics




LED 101 | LED System Design | Page 7
Secondary Optics
  S    d    O ti

                         TIR Lens                         Reflector




       TIR lens to collect light           Reflector to collect light & shape beam
Optics/Diffuser to further shape beam   Facets to diffuse beam (avoid imaging of LED)




LED 101 | LED System Design | Page 8
Secondary Optics – Stock


   St k optic suppliers:
    Stock ti       li
     – Fraen
     – Gaggione
     – Ledil
     – Ledlink
     – Khatod
     – Polymer Optics
     – Showin




LED 101 | LED System Design | Page 9
Secondary Optics – Custom/Other




LED 101 | LED System Design | Page 10
Thermal System




                                        Thermal System LED
                                                      PCB
                                                      Interface Material
                                                      Heat sink




LED 101 | LED System Design | Page 11
Heat
  H t power = electrical power – emitted light
               l ti l              itt d li ht

                                Tjunction = Tambient + Rth total Pthermal

                                                   where

                                        P thermal = P electric – P light


                                 Bond Wire
                                              Solder
                                                                                    TJunction
                                           Die Molding Compound
                    Leads
                         Die Attach
                                                                           Rth JS            Component
          Dielectric
                                                       Solder Pads
                                                                                    TSolder Point
                                                                           Rth SB            Substrate
                                                                                                     gy
                                                                                             Technology
                                                  Aluminium Plate
                                                                                    TBoard
                                                                           Rth BA            Cooling
                                                                                             System
                                                                                    Tambient
                       Heat Sink



LED 101 | LED System Design | Page 12
PCB                                                     Board layout


                                                      Board Layout:
                                                      • 1 sq. inch
                                                      • 35 μm of Cu
                                                      • 1 Dragon LED (1 W of heat)

                                                                          Metal core
                                         FR4 with filled vias    with enhanced dielectric

                    Rth                       9.7 K / W                   3.4 K / W

           Solder joint                 9.7
                                        9 7 K above heat sink      3.4
                                                                   3 4 K above heat sink
           temperature


    If LEDs are spread, FR4 w. vias can b a good choice
       LED           d          i       be     d h i

LED 101 | LED System Design | Page 13
Interface Material




        Thermal resistance of interface with interface material
        Rth for square inch                      = 0.5 K / W        = 64.5 K / W for 10 mm2

                                        Sufficient thermal contact area is key



LED 101 | LED System Design | Page 14
Heat Sinks
   H t Si k
   Heat sinks
Convection:
Airflow / heat sink orientation seriously alter Rth




                                                                     K/W
                                                                       W
                                        ∆T heat sink (18 W) = 40ºC to 60ºC depending on orientation




LED 101 | LED System Design | Page 15
Heat Sinks

                                                  Influencing Factors
                                                  Inflfl encing Factors
                                                   Influencing F t
                                                   I         i

                                             • Air flow conditions
                                             • Material of heat sink
                                             • Orientation with respect to gravity
                                             • Base plate thickness
                                             • Cross sectional geometry
                                             • Fin geometry
                                             • Number of fins
                                             • Spacing of fins




      A steel lamp house is not a good heat conductor!



LED 101 | LED System Design | Page 16
Thermal Imager: Reveals hot spots in seconds
  Th    lI        R    l h t     t i        d
                                        FR4:   ∆ T = 8 ºC over 1 mm
                                               ∆ T = 18 ºC over 3 mm
                                                         C




                                                        1 mm




LED 101 | LED System Design | Page 17
Driver Electronics




                                        Driver Electronics




LED 101 | LED System Design | Page 18
LED drivers

     LED driver requirements
                    q
     • High efficiency (> 0.85 % for TRIAC dimmable)
     • High PFC (Energy Star: > 90 % commercial, > 70 % residential)
     • TRIAC dimming: Driver has to p
                      g                provide a hold current ( (bleeder)
                                                                        )
     • Low Bill of Material
     • UL approval required
     • Energy Star approval p
            gy       pp       preferred
     • Aim for 100 k hours of life (avoid electrolytic capacitors)
     • Compact enough to fit in the light fixture
     • Easy to replace
          y       p




LED 101 | LED System Design | Page 19
PWM dimming

    • Fixed current levels
    • LED current switched on and off (> 200 Hz)
    • Light output defined by duty cycle
    • (linear relationship)




Visble light output



                            50% D t C l
                                Duty Cycle   80% D t C l
                                                 Duty Cycle   Ramping d
                                                              R   i   down



   LED 101 | LED System Design | Page 20
LED D i
      Drivers: G
               Generic concept for a f d back system
                    i        tf      feed b k    t

                                                                           Advantages :
       Vcc 2 5 V t 5 5 V
           2.5 to 5.5                                                 5V   • IF independent of VCC,
                                    IF           Measuring of light        • VF and temperature
                     VF                          Measuring of temp
                                                 M     i    ft             • LED d
                                                                                 degradation compensation
                                                                                      d ti           ti
                                           NTC
                                                             ADC           • PWM for dimming as well

                                                         Micro
                                                         Mi
      LED               Enable               PWM
                                                        Controller
      Driver


                                        Rsense




LED 101 | LED System Design | Page 21
Driver design


As power, voltage and / or current ratings of driver components might
depend on load and duty cycle, use driver chip manufacturer’s web tools:
• to calculate the efficiency of driver
• to define the circuit schematics and find components with suitable performance




 LED 101 | LED System Design | Page 22
Conclusion

 In order to reach high wall plug efficacy, all of the following
 components of an LED lamp system need to be optimized:
 • LED
 • LED drive current
 • Secondary optics
 • Driver
 • Heat sink




LED 101 | LED System Design | Page 23
Disclaimer


   All information contained in this document has been checked with the greatest care.
    OSRAM Opto Semiconductors GmbH can however, not be made liable for any damage
    that occurs in connection with the use of these contents.


  OSRAM Opto Semiconductor GmbH makes no representations and warranties as to a
   possible interference with third parties' intellectual property rights in view of products
   originating from one of OSRAM Opto Semiconductor GmbH's partners, or in view of
   products being a combination of an OSRAM Opto Semiconductor GmbH's product and
   a product of one of OSRAM Opto Semiconductor GmbH's partners. Furthermore,
   OSRAM Opto Semiconductors GmbH cannot be made liable for any damage that
   occurs in connection with the use of a product of one of OSRAM Opto Semiconductor
   GmbH's partners, or with the use of a combination of an OSRAM Opto Semiconductor
   GmbH's product and a product of one of OSRAM Opto Semiconductor GmbH's
   partners.




LED 101 | LED System Design | Page 24
Disclaimer
   This document constitutes neither an offer to sell nor a solicitation to buy or subscribe for securities.
     Any such offer will be made solely on the basis of the Securities Prospectus y to be approved by
       y                              y                                    p      yet      pp       y
     the German Financial Supervisory Authority (BaFin) and published thereafter. The information legally
     required to be provided to investors will be contained only in the Securities Prospectus. The
     information contained herein is not for distribution, directly or indirectly, in or into the United States of
                                                                  y             y
     America (including its territories and possessions of any State of the United States of America or the
     District of Columbia) and must not be distributed to U.S. persons (as defined in Regulation S under
     the U.S. Securities Act of 1933, as amended ("Securities Act")) or publications with a general
     circulation in the United States of America. This document is not an offer of securities for sale in the
     United States of America. The securities have not been and will not be registered under the
     Securities Act and may not be offered or sold in the United States of America absent registration or
     an exemption from registration under the Securities Act. The Issuer does not intend to register any
     portion of the offering in the United States of America or to conduct a public offering of the securities
     in the United States of America. This document is not an offer of securities for sale in the United
     Kingdom, Canada, Japan or Australia.

LED 101 | LED System Design | Page 25
Thank you for your attention.

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LEDs System Introduction: LED Fundamentals

  • 2. LED System Topics LED Optics LED Thermal System Driver Electronics LED 101 | LED System Design | Page 2
  • 3. LED System Design Steps Estimate: E ti t • lumens, max ambient temp. & available space => LED type • CRI / CCT or color, heat sinking, LED current => LED light output • O ti l l Optical losses, l lumens, production di t ib ti d ti distribution => amount of LEDs > t f LED Test setup to check: • Li ht output, j Light t t junction t ti temp / solder j i t t ld joint temp => confirm amount of fi t f LEDs Mechanical d i M h i l design, heat sink and optics optimization: h t i k d ti ti i ti • Driver design with high efficiency and PFC => LED electrical arrangement LED 101 | LED System Design | Page 3
  • 4. Color Temperature and Color Rendering Guidelines Follow new Energy Star (Oct. 1, 2011) requirements like (Oct 1 • Indoor: CRI ≥ 80 for indoor, ∆ in u’, v’ CIE 1976 ≤ 0.007 after 6,000 h. • Indoor: Stable light output after 1 min • CCT: 2700 K, 3000 k, 3500 K, 4000 k and 5000 K (commercial only) • L70 lumen maintenance: ≥ 25,000 h for residential indoor ≥ 35 000 h f residential outdoor / commercial 35,000 for id ti l td i l • Defines PFC > 0.7 (residential) or > 0.9 (commercial) • For example non directional residential: p • till 09/01/2013: ≥ 65 lm / W non directional residential • after that: ≥ 70 lm / W non directional residential • > 800 lm LED 101 | LED System Design | Page 4
  • 5. LED Light Engine Goals to look for • Low power consumption • High LED efficiency • Low optical l L ti l losses • High driver efficiency • Low junction temperature f longer life (if an issue). for f (f ) • High LED efficiency • Lower LED current • Low thermal resistance • Costs LED 101 | LED System Design | Page 5
  • 6. LED Efficacy Example: OSRAM OSLON CW, 4000 K: • 350 mA • 95 lm, Vf = 3.2 V • 85 lm / W • ∆Tja = 9.4 º 94 • 700 mA • 162 lm , Vf = 3.45 V 3 45 • 67 lm / W • ∆Tja = 29º Rth LED = 7 K / W Rth PCB + Rth Heatsink = 5 K / W -0.2 % / K thermal degradation 30 % blue light conversion at 350 mA and Ts = 25º C LED 101 | LED System Design | Page 6
  • 7. LED Optics LED 101 | LED System Design | Page 7
  • 8. Secondary Optics S d O ti TIR Lens Reflector TIR lens to collect light Reflector to collect light & shape beam Optics/Diffuser to further shape beam Facets to diffuse beam (avoid imaging of LED) LED 101 | LED System Design | Page 8
  • 9. Secondary Optics – Stock  St k optic suppliers: Stock ti li – Fraen – Gaggione – Ledil – Ledlink – Khatod – Polymer Optics – Showin LED 101 | LED System Design | Page 9
  • 10. Secondary Optics – Custom/Other LED 101 | LED System Design | Page 10
  • 11. Thermal System Thermal System LED PCB Interface Material Heat sink LED 101 | LED System Design | Page 11
  • 12. Heat H t power = electrical power – emitted light l ti l itt d li ht Tjunction = Tambient + Rth total Pthermal where P thermal = P electric – P light Bond Wire Solder TJunction Die Molding Compound Leads Die Attach Rth JS Component Dielectric Solder Pads TSolder Point Rth SB Substrate gy Technology Aluminium Plate TBoard Rth BA Cooling System Tambient Heat Sink LED 101 | LED System Design | Page 12
  • 13. PCB Board layout Board Layout: • 1 sq. inch • 35 μm of Cu • 1 Dragon LED (1 W of heat) Metal core FR4 with filled vias with enhanced dielectric Rth 9.7 K / W 3.4 K / W Solder joint 9.7 9 7 K above heat sink 3.4 3 4 K above heat sink temperature If LEDs are spread, FR4 w. vias can b a good choice LED d i be d h i LED 101 | LED System Design | Page 13
  • 14. Interface Material Thermal resistance of interface with interface material Rth for square inch = 0.5 K / W = 64.5 K / W for 10 mm2 Sufficient thermal contact area is key LED 101 | LED System Design | Page 14
  • 15. Heat Sinks H t Si k Heat sinks Convection: Airflow / heat sink orientation seriously alter Rth K/W W ∆T heat sink (18 W) = 40ºC to 60ºC depending on orientation LED 101 | LED System Design | Page 15
  • 16. Heat Sinks Influencing Factors Inflfl encing Factors Influencing F t I i • Air flow conditions • Material of heat sink • Orientation with respect to gravity • Base plate thickness • Cross sectional geometry • Fin geometry • Number of fins • Spacing of fins A steel lamp house is not a good heat conductor! LED 101 | LED System Design | Page 16
  • 17. Thermal Imager: Reveals hot spots in seconds Th lI R l h t t i d FR4: ∆ T = 8 ºC over 1 mm ∆ T = 18 ºC over 3 mm C 1 mm LED 101 | LED System Design | Page 17
  • 18. Driver Electronics Driver Electronics LED 101 | LED System Design | Page 18
  • 19. LED drivers LED driver requirements q • High efficiency (> 0.85 % for TRIAC dimmable) • High PFC (Energy Star: > 90 % commercial, > 70 % residential) • TRIAC dimming: Driver has to p g provide a hold current ( (bleeder) ) • Low Bill of Material • UL approval required • Energy Star approval p gy pp preferred • Aim for 100 k hours of life (avoid electrolytic capacitors) • Compact enough to fit in the light fixture • Easy to replace y p LED 101 | LED System Design | Page 19
  • 20. PWM dimming • Fixed current levels • LED current switched on and off (> 200 Hz) • Light output defined by duty cycle • (linear relationship) Visble light output 50% D t C l Duty Cycle 80% D t C l Duty Cycle Ramping d R i down LED 101 | LED System Design | Page 20
  • 21. LED D i Drivers: G Generic concept for a f d back system i tf feed b k t Advantages : Vcc 2 5 V t 5 5 V 2.5 to 5.5 5V • IF independent of VCC, IF Measuring of light • VF and temperature VF Measuring of temp M i ft • LED d degradation compensation d ti ti NTC ADC • PWM for dimming as well Micro Mi LED Enable PWM Controller Driver Rsense LED 101 | LED System Design | Page 21
  • 22. Driver design As power, voltage and / or current ratings of driver components might depend on load and duty cycle, use driver chip manufacturer’s web tools: • to calculate the efficiency of driver • to define the circuit schematics and find components with suitable performance LED 101 | LED System Design | Page 22
  • 23. Conclusion In order to reach high wall plug efficacy, all of the following components of an LED lamp system need to be optimized: • LED • LED drive current • Secondary optics • Driver • Heat sink LED 101 | LED System Design | Page 23
  • 24. Disclaimer All information contained in this document has been checked with the greatest care. OSRAM Opto Semiconductors GmbH can however, not be made liable for any damage that occurs in connection with the use of these contents. OSRAM Opto Semiconductor GmbH makes no representations and warranties as to a possible interference with third parties' intellectual property rights in view of products originating from one of OSRAM Opto Semiconductor GmbH's partners, or in view of products being a combination of an OSRAM Opto Semiconductor GmbH's product and a product of one of OSRAM Opto Semiconductor GmbH's partners. Furthermore, OSRAM Opto Semiconductors GmbH cannot be made liable for any damage that occurs in connection with the use of a product of one of OSRAM Opto Semiconductor GmbH's partners, or with the use of a combination of an OSRAM Opto Semiconductor GmbH's product and a product of one of OSRAM Opto Semiconductor GmbH's partners. LED 101 | LED System Design | Page 24
  • 25. Disclaimer This document constitutes neither an offer to sell nor a solicitation to buy or subscribe for securities. Any such offer will be made solely on the basis of the Securities Prospectus y to be approved by y y p yet pp y the German Financial Supervisory Authority (BaFin) and published thereafter. The information legally required to be provided to investors will be contained only in the Securities Prospectus. The information contained herein is not for distribution, directly or indirectly, in or into the United States of y y America (including its territories and possessions of any State of the United States of America or the District of Columbia) and must not be distributed to U.S. persons (as defined in Regulation S under the U.S. Securities Act of 1933, as amended ("Securities Act")) or publications with a general circulation in the United States of America. This document is not an offer of securities for sale in the United States of America. The securities have not been and will not be registered under the Securities Act and may not be offered or sold in the United States of America absent registration or an exemption from registration under the Securities Act. The Issuer does not intend to register any portion of the offering in the United States of America or to conduct a public offering of the securities in the United States of America. This document is not an offer of securities for sale in the United Kingdom, Canada, Japan or Australia. LED 101 | LED System Design | Page 25
  • 26. Thank you for your attention.