This document discusses thermal challenges in LED applications and introduces SinkPAD technology as a solution. SinkPAD PCB technology provides a direct thermal path that conducts heat from the LED chip more efficiently than conventional metal core PCBs. This allows LEDs to run cooler, last longer, and achieve higher brightness compared to traditional solutions. The document compares SinkPAD to metal back PCBs and outlines the benefits SinkPAD provides, such as lower junction temperatures, thinner designs, and reduced costs. Potential applications of SinkPAD include lighting fixtures, displays, and any application requiring high-power LEDs.

1. Presented BY
Gaikwad Sunil S.
Guided By
Mrs. Jayashree Patil

2. 
Thermal Challenges In The LED Applications
How it is Addressed? Metal Back PCB
Technology
Is There a Better Way? SinkPAD Technology
What Would I Gain Using SinkPAD?
Comparisons Of “Metal Back” & “SinkPAD”
Potential Applications
Conclusion
PRESENTATION OUTLINE

3. 
Increasing Trend For LED Power
Increasing Trend For Higher Brightness
Primary Thermal Path: Conduction Cooling
Higher Thermal Resistance
Power Density Increasing – more LEDs in a
small area
Long Life Expectation
THERMAL CHALLANGES

4. 
How Heat Issues Addressed Historically?

5. 
YES
SinkPAD Technology
Is There a Better Way to Remove Heat?

6. 
SinkPAD technology is a thermal management
Printed Circuit Board (PCB) technology that makes it
possible to conduct heat out of a LED and into the
atmosphere faster and more efficiently than a
conventional MCPCB. SinkPAD provides superior
thermal performance for medium to high power LEDs.
This is the most economical & scalable "Direct Thermal
Path" MCPCB solution available for the LED
application.
What is SinkPAD Technology?

7. 
 SinkPAD metal substrate sectional view:
“SinkPADTM” TECHNOLOGY

8.  To understand how SinkPAD technology works let's
first review the primary thermal path found in LED
applications. In a LED the heat originates at the chip
(die) in the same way that in a normal light bulb heat
originates at the filament. The key difference is that
in the case of a light bulb the heat is radiated into the
atmosphere and in the case of a LED heat must be
conducted through a series of mediums before it
reaches the atmosphere. A high rate of thermal
conduction means cooler running LEDs while a low
rate means very hot and potentially self destructive
LEDs.
How SinkPAD Works?

9. 
 SinkPAD technology makes it possible to increase the
thermal conduction rate from the slug (i.e. thermal pad
within the LED package) to the metal base of a PCB from
the industry standards of 1 - 4 W/m.K to that of the metal
base itself which ranges between 135 W/m.K and 385
W/m.K. In essence SinkPAD PCB technology provides
Direct Thermal Path to the LED by eliminating dielectric
from the thermal path.
How SinkPAD Works?

10. 
 SinkPAD Showing practical example of Direct Heat Transfer
Path:
“SinkPADTM” TECHNOLOGY

11. 
 SinkPAD PCB will Lower LED Junction Temperature
Which means :
1) Option to run LED at lower junction temperature
i.e. Increase Life of the LED Fixture
2) Option to run LED at higher power / maintain
temperature
i.e. Get more lumens per LED
3) Reduce number of LEDs to get same light
i.e. Reduces Fixture Cost
4) Higher drive currents, brighter light, fewer components
What would I gain using SinkPAD?

12. 
COMPARISION OF “METAL BACK” &
“SinkPAD” PCB
“Metal Back PCB”
 Higher Thermal Resistance
 Slow Heat Transfer Rate i.e. 1-
5 W/m.k.
 Special Dielectric Required
 Thick Base Metal Required
 Limited to Epoxy dielectric
only
 Metal is Insulated Thermally
From The Component
“SinkPAD PCB”
 Direct Thermal Path
 Fast Heat Transfer Rate i.e.210
to 385 W/m.K
 Standard Dielectric Used
 Thinner Base Metal Options
 Epoxy, Polyimide or any
typical dielectric can be used
 Metal is Connected Thermally
to the Component

13. Following Video Shows Thermal Test of Sinkpad
PCB Vs MCPCB

14. 
THERMAL PATHS IN “SinkPAD” PCB
AND “MCPCB”

15. 
POTENTIALAPPLICATIONS

16. 
Potential Applications of SinkpadTM is as
Following:

17. 
 Higher Thermal Transfer Rate, Lower Junction Temperature.
 Multilayer Possible Without Increase In Thermal Resistance.
 Weight Saving i.e. Possibly thinner profile.
 Most Economical Direct Thermal Path Solution.
 Maximum LED life .
 Maximum lumens output .
 Improved color stability .
 Same light output with fewer LEDs means reduced cost .
MERITS OF SinkPAD PCB

18. 
 SinkPAD corporation’s new thermal management PCB are
a complete and effective solution to the challenges faced
by the solid state lighting industry, specifically those with
high power LED PCB applications available now. The
new SinkPAD technology significantly improves LED
thermal management in all LED systems. It is most
effective in high-power high-bright surface mount LED
systems for commercial applications.
CONCLUSION

20. Any Queries