SinkPADTM is the LED Thermal Management PCB Technology reduces LED junction temperature. It’s an alternative technology to the Aluminum PCB or MCPCB providing superior thermal performance for medium to high powered LEDs. It reduces LED junction temp, increases LED life, and increases lumens per LED. SinkPAD Corporation is a manufacturing company offering a thermal management printed circuit board technology specifically manufactured for the Solid State Lighting Industry (LED’s). SinkPAD is an alternative technology to the conventional Aluminum PCB or MCPCB providing superior thermal performance for medium to high powered LEDs. SinkPAD Corporation is now part of a conglomerate of companies which have serviced the printed circuit board industry for over 30yrs. SinkPAD has leveraged the strengths of those companies in terms of finance, global logistics, and manufacturing capacity to propel its rapid growth from technology development phase to a full service volume manufacturer. Developing the SinkPADTM technology is our company’s passion, manufacturing printed circuit boards is our strength. Our patent pending SinkPADTM technology is a PCB technology that makes it possible to conduct heat out of the LED system and into the atmosphere at a much greater rate. While the primary focus of the SinkPADTM technology is to solve thermal problems of the rapidly evolving high power LED market there are other applications for which SinkPADTM can be an ideal candidate. SinkPADTM technology can have a dramatic effect on the customer’s ability to improve upon and revolutionize their high power LED products. We enable our customers to be the first to market with the most efficient thermally managed LED systems. The SinkPAD promise is to reduce LED junction temperature allowing users to increase LED life, increase reliability, increase brightness, increase lumens per LED and reduce dollar per lumens and that is a promise SinkPAD definitely delivers on.

1. Patent Pending
SinkPADTM
Thermally Effi i t PCB Technology for
Th ll Efficient T h l f
the LED Application
Sinkpad Corporation
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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be
accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes
no warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind. 1

2. PRESENTATION OUTLINE
 Thermal Challenges In The LED Applications
 How it is Addressed? Metal Back PCB Technology
 Is There a Better Way? SinkPADTM Technology
y gy
 What Would I Gain Using SinkPADTM?
 Comparisons Of “Metal Back & “SinkPADTM”
Metal Back” SinkPAD
 Potential Applications
 Test Data
 Conclusion
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3. THERMAL CHALLANGES
 Increasing Trend For LED Power
 Increasing Trend For Higher Brightness
 Primary Thermal Path: Conduction Cooling
 Higher Thermal Resistance
 Power Density Increasing – more LEDs in a small area
 Long Life Expectation
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4. How Heat Issues Addressed Historically?
 Metal Back PCB Technology THERMALLY CONDUCTIVE DIELECTRICS
Example: MCPCB, Aluminum PCB etc…type products  Arlon 92ML – 2.0W/m.k
 Bergquist – 2.2-3.0W/m.k
 Doosan – 2.0W/m.k
 Denka Hit Plate – 2.0-8.0 W/m.k
 DuPont CoolLam – Polyimide based – 0.80W/m.k
 ITEQ- IT859 GTA – 2.0W/m.k
 Laird Technology HKA – 3 0W/m k
3.0W/m.k
 Polytronics – 2.7W/m.k
 Sekisui – 2.0W/m.k
 Ventec - VT 4A1 – 1.6W/m.k
Thermally Conductive Dielectric
(TC~ 1 to 4 W/m.k)
Thermal Pad
or Bond Pad
Z-axis Heat
Transfer rate:
Metal Thermal Conductivity (TC)
Al ~135-180W/m.k Only 1-4 W/m.k
Cu ~385W/m.k
Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material
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5. Is There a Better Way to Remove Heat?
YES
SinkPADTM Technology
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6. What is SinkPAD?
SinkPADTM is a MCPCB Technology
gy
Which Provides
Direct Thermal Path to Hot LED
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7. “SinkPADTM” TECHNOLOGY
Patent Pending
 Direct Heat Transfer
To view & download this info
“Register” below
Register below.
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before; click on “login” below
Or send an email request at
q
eng@sinkpad.com
Z-axis Heat
Transfer rate:
Metal Thermal Conductivity (TC)
Al ~135-180W/m.k 150-385 W/m.k
Cu ~385W/m.k
385W/m.k
Z-axis heat transfer is same as the TC of the base material used
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8. What would I gain using SinkPAD?
SinkPAD PCB will Lower LED Junction Temperature
Which means :
1) O ti to run LED at lower junction temperature
Option t tl j ti t t
 i.e Increase Life of the LED Fixture
2) Option to run LED at higher power / maintain temperature
 i.e. Get more lumens per LED
3) R d
Reduce number of LED to get same li h
b f LEDs light
 i.e. Reduces Fixture Cost
4) Hi h Drive Currents, B i ht Li ht Fewer Components
Higher D i C t Brighter Light, F C t
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9. “SinkPADTM” TECHNOLOGY
Patent Pending
 Top View of a SinkPADTM PCB
SinkPAD
Circuit pad
Circuit traces
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10. SinkPADTM Product Family
Patent Pending
SinkPAD P/N Base Metal Base Metal thickness
SP-A530 ALUMINUM 5052 ~0.032” (~0.80mm)
SP-A540* ALUMINUM 5052 ~0.040” (~1.0mm)
SP-A560* ALUMINUM 5052 ~0.063” (~1.60mm)
SP-A630 ALUMINUM 6061 ~0.032” (~0.80mm)
SP A640
SP-A640 ALUMINUM 6061 ~0.040” (~1.0mm)
0.040 ( 1.0mm)
SP-A660 ALUMINUM 6061 ~0.059” (~1.50mm)
SP-C40 COPPER ~0.040” (~1.0mm)
SP-C60 COPPER ~0.059” (~1.50mm)
* Most running product
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11. COMPARISION OF “METAL BACK” & “SinkPAD”
Patent Pending
“Metal Back PCB” “SinkPADTM PCB”
To view & download this info
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before; click on “login” below
Or send an email request at
eng@sinkpad.com
 Higher Thermal Resistance  Direct Thermal Path
 Slow Heat Transfer Rate  Fast Heat Transfer Rate
 Special Dielectric Required  Standard Dielectric Used
 Thick Base Metal Required
q  Thinner Base Metal Options
p
 Limited to Epoxy dielectric only  Epoxy, Polyimide or any typical dielectric can be
 Metal is Insulated Thermally From The used
Component  Metal is Connected Thermally to the Component
 “No” PCB Design Change Required
No
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12. “SinkPADTM” TECHNOLOGY
Patent Pending
 Multilayer Examples
“Metal Back PCB”
“ l k C ” “SinkPADTM PCB”
SinkPAD PCB
Substantial increase in thermal resistance Does not increase thermal resistance
To view & download this info
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before; click on “login” below
Or send an email request at
eng@sinkpad.com
eng@sinkpad com
Limitation: Components can be assembled only on one side of the PCB
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13. REQUIREMENT TO USE SinkPADTM
To i
T view & ddownload thi i f
l d this info
“Register” below.
If you already have Registered
before; click on “login” below
Or send an email request at
eng@sinkpad.com
13

14. POTENTIAL APPLICATIONS
 Commercial / Industrial lights
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15. POTENTIAL APPLICATIONS
 Street lights
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16. POTENTIAL APPLICATIONS
 Back lights
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17. POTENTIAL APPLICATIONS
 PAR38 bulbs
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18. POTENTIAL APPLICATIONS
 Residential down lights
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19. POTENTIAL APPLICATIONS
 LED Packaging Substrate
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20. TEST DATA
 SinkPAD v/s MCPCB thermal data
SinkPAD Rth: 0.45 0C/W
MCPCB Rth : 1.75 0C/W
dT *deg C)
Power (W)
SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be
driven up to 3A. At this power level, It can be a big difference in junction temp
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21. TEST DATA, Cree 1-XPG
 SinkPAD v/s Typical Aluminum back PCB thermal data
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22. TEST DATA, Cree XP-G
 SinkPAD v/s Conventional MCPCB thermal data (IR Camera)
- Cree XPG 9 LEDs
- Current: 1 Amp.
- Power: 3W each MCPCB SinkPAD PCB
- PCB ~ 1”x1” To view & download this info
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before; click on “login” below
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eng@sinkpad.com
1410 C 1190 C
SinkPADTM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPADTM pcb running
~220C cooler than on the conventional MCPCB
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23. TEST DATA, Luxeon Rebel at 700mA
 SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)
- Luxeon Rebel at 700mA
MCPCB Type 1
Type-1
MCPCB Type-24
MCPCB 1
MCPCB-1
MCPCB-2
Test was conducted by Quadica Developments Inc
LED on a SinkPADTM PCB running ~290C cooler than on the MCPCB-1 and 100C cooler than the MCPCB-2
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24. TEST DATA, Luxeon Rebel at 1A
 SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)
- Luxeon Rebel at 1000mA
MCPCB Type-1
MCPCB Type-24
MCPCB-1
MCPCB-2
Test was conducted by Quadica Developments Inc
LED on a SinkPADTM PCB running ~470C cooler than on the MCPCB-1 and 160C cooler than the MCPCB-2
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25. Other Available Test Data
Nichia N219
Luxeon Rebel
Cree MTG
Osram Oslon SSL
Cree XML
Customize Your Test
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26. Highlights and Q&A
Patent Pending
 Magnitude Higher Thermal Transfer Rate
 Direct Thermal Path
 135 to 385W/m.k vs. 1 to 4 W/m.k
 LOWER JUNCTION TEMPERATURE
 High Tg (Up to 225oC)
 Multilayer Possible Without Increase In Thermal Resistance
 Weight Saving
 Possibly thinner profile
 Di t Replacement for MCPCB, M t l B k PCB & Al i
Direct R l t f MCPCB Metal Back Aluminum PCB
 Most Economical Direct Thermal Path Solution
 Any Questions….. Contact us
yQ
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27. THANK YOU
For more information contact
eng@sinkpad.com
Visit us at www.sinkpad.com
714-660-2944
R3
Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be
accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes
no warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind. 27