Richards 1st TRIZ Patent


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This is the patent that started it all, and for which I am eternally grateful to Ellen Domb for 1st teaching me TRIZ in 1999.

Thank you Ellen, you Rock

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Richards 1st TRIZ Patent

  1. 1. Integrated System Level Solution: Embedded Silicon within Rigid Core with Heat-pipe Technology By Richard Platt (Former) Technology Development Program Manager Server Board & System Technology
  2. 2. Why the Need for this Concept? Inventor’s Comment: Intel has many researchers, engineers & Intel Fellows working on evolving the technologies for the silicon device and component level. However I did not see the same amount and level of investment of R&D resources being allocated at the board or system level. • This is especially of concern to the inventor since coming to understand TRIZ (Theory of Inventive Problem Solving) that evolving the technology in the super-system direction is just as an important technology vector to pursue as the sub-system level (where the primary focus is occurring within Intel today[1999]). This concept is one of many potential concepts that attempts to address evolvement of the technology to the super-system. (Hopefully to block our competitors from potentially outmaneuvering Intel in the marketplace.)
  3. 3. Technology Trends Driving the Market (1999) #1 TREND: The Increasing # of I/O in IA; according to Moore’s Law* states that # of transistors doubles on silicon devices every 18-24 months. This trend is driving the need for a enabling technologies to be developed for the individual device, (i.e. wafer level), as well as at the component level, board level and system levels to address the scaling challenges. – INVENTIVE SOLUTION NEEDED TO ADDRESS: • Increasing complexity & decrease in size vs. Thermal management and Manufacturability – [(I): Device Complexity vs. (W): Use of energy by stationary Object]. And/Or combinations – [(I): Area of Stationary Object vs. (W): Object Generated Harmful Factors]. ‘Moore’s Law’ correlates to the ‘Law of Ideality’ in TRIZ; Law of Ideality = All engineering systems, evolve over time, providing greater performance, functionality and benefit at lower cost and have less detrimental aspects as a part of their design and manufacture.
  4. 4. Technology Trends Driving the Market #2 TREND: With the increase in the # of I/O in IA; there are greater demands for more power for supporting the devices, especially in the Server and Desktop product spaces (inventor’s background), as well as in the mobile and networking product spaces. – INVENTIVE SOLUTION NEEDED TO ADDRESS: • Increase in speed vs. Increased need to dissipate thermal energy – [(I): Speed vs. (W): Temperature] • Increase in thermal energy dissipation vs. small volumetric area. – [(I): Use of energy by a Stationary Object vs. (W): Area of Stationary Object] #3 TREND: With the increase in the # of I/O in IA; the pitch of I/O balls both from die-to-package and package-to-board is shrinking – INVENTIVE SOLUTION NEEDED TO ADDRESS: • Decrease in size vs. Manufacturability – [(I): Area of Stationary Object vs. (W): Manufacturing Precision or Ease of Manufacture]. – [(I): Quantity of a substance vs. (W): Ease of Manufacture or Manufacturing Precision]
  5. 5. Double-Sided Silicon Devices-In-Board (DSSDIB) – Embedded processors (current component designs using gold bumps or gold wire) in Imprinted Circuit Boards w/ rigid cores. MLB: Multi-Layer Board Bump contact pads Std Via (10mil drill/ 13mil fin) Embedded Thermal µ-Via (4-6mil buried & blind) Heat-pipe Cu thermal transfer plate Silicon Device (Processor) Silicon Device (Processor) Rigid Core – Al ? Silicon device Thermal conductive Adhesive/Grease Conductive Adhesive Silver filled Resin or Epoxy Standard trace for routing on outer layer Intel Patent Holder: Richard Platt Technology Development Intel Program Manager
  6. 6. Double-Sided Silicon Devices-In-Board (DSSDIB) 1. The processor is embedded w/in the PCB through the machining/molding process of the rigid core and then imprinting the underside of the multi layer substrate to create a routing cavity. 2. Silver filled epoxy is used on the top side of the component between the rigid core material lining, (likely nickel plated copper for the lining due to thermal transfer capabilities and aluminum for the rigid core). 3. The bottom of the imprinted cavity with the trace connections and the metal contact pads come in contact with the gold bumps of the silicon device is coated with a electrically conductive adhesive. 3. The heat-pipe running through the rigid core, essentially acts as a radiator close to the processor thermally heat-sinking the thermal energy into the liquid w/in the heat-pipe. Then through osmotic process of the thermal heat-pipe itself it transfers the heated liquid/gas to an external cooling source, (i.e. fan) that vents the thermal energy out of the system. This technology is already in use on laptops today. 4. This approach integrates all those technologies together along w/ the rigid core which provides additional rigidity and strength to already heavy and dense PCBs. The rigid core acts as stabilizer. 5. Traces (I/O), can then route out on the same layer as where the ball pads connect, and then using μ-vias the design engineer can then route to the primary side, (top surface), of the PCB. 6. Instead of needing the package to manage the environment, now the PCB can be the protective package around the silicon. 7. Cost savings are significant w/ integrating the silicon directly into the substrate &/or the rigid core. 8. The rigid core is coated w/ a non-conductive film to prevent electrical shorts. 9. Opportunity to do side access fiber optics integrated into silicon and edge of substrate. (not shown).
  7. 7. Rigid Core 2 Plates A & B > Aligned with Pins > R.C. Through Holes Drilled or molded > Heat Pipe Cavity > Retainer Rails > Silicon Device Cavity Through Holes Drilled into Rigid Core Silicon Cavity Alignment Pins Retainer Rails Heat Pipe Cavity Note: NOT TO SCALE -- R.C. Thickness TBD Cutaway Drawing Set—Not a manufacturing Flow!
  8. 8. Embedded Components Cu Thermal Plate > Silver Epoxy > Silicon Device Silicon Device (Gold Bumped) Silver Epoxy Cu Thermal
  9. 9. High Density Interconnect Printed Circuit Board (HDI PCB) PCB Constructed > PCB mounted to respective half of Rigid Core via alignment Pins and PCB registration holes Note: Surface Mount Components Only (includes I/O Connectors) Bare HDI Foil PCB mounts to Rigid Core
  10. 10. Final Assembly All Components are S.M.T. > Heat Pipe & Condenser > Side A/B Joined S.M. Connectors w/ Attachment into R.C. Side A/B Join (Registration Apparatus TBD) Heat Pipe / Condenser Assembled into core S.M. I/O Connectors
  11. 11. Final Assembled Unit Enhanced electrical performance Efficient thermal solution Increased reliability Low Profile Lowest Total Cost product Total Solution space = 70% Mfg & Assy process technologies + 30% product technology
  12. 12. Risk Assessment of Technology Effort Technology Evaluation Criteria Metric Multiplier Ranking Notes / Comments need to bring in New Processes, such as HDI-PCB capability, rigid core technology w/ integrated heat pipes, all SMT solutions Ease of Manufacturability for connectors would need to be developed. Specialty Manufacturing (I have new IP I am generating for that.) Process Yes = 1; No = 10 1 1 would need to develop a prototype line 1st Materials stage: lab, lab = 1, prototype = 3, in house to get the capability up and prototype, development or development = 5, production = determine what the costs and issues would production? 7 1 1 be to develop into a HVM line. HDI is standard technology readily available Is material specialty or today. Aluminum rigid core can be done commodity? specialty = 5, commodity = outside --outsourced in the short term. 10 1 10 Comaparitive against one Do not personnaly know of any other project versus another. approach that attempts a higher level of Practical (least amount of Multiplier of other metrics w/in integration with the exception of Sun and effort for gain achieved) the technology evaluation IBM as comparitive systems criteria 1 1 Vendor known yes = 10, no = Grohmann Engineering known vendor - sole supplier 5. Sole supplier = 5, multiple suppliers = 10 1 10 Intel IP Y = 10; N = 1. Have IDF's already submitted last year to x-license from someone licensing or legal issues else = 5 Ability to x-license to others = 10 1 20 Total system cost would be lower and POR cost = 5, more than enables a more efficient thermal x-fer cost POR cost = 1, less than POR mechanism than what is used today. No cost = 10 1 10 need to entertain refrigeration as a solution Grohmann Engineering, Fraunhofer Insititute availability of engineering and others have seen this and believe that it know-how (internal /external / is a viable approach with the manufacturing none availale) internal = 10, external = 5, capabilities that exist today. none available = 0 1 5 This would have to be a path pursued for a integration w/ VF Y = 10, No = 5 1 10 FOF model R&D resources available Extremely controversial approach, and (internal/external/none internal = 10, external = 5, requires an new perspective on architecture available) none available = 0 1 0 and business model Characteristics of Disruptive Technology are: simpler, Is it disruptive technology? cheaper & lower perfoming. (Will this provide signifcant Yes = 1; No = 0, Generally competitive promise lower margins, not advantage/compelling value higher profits. Yes = 1; No = add to feature set) 0, Intel's main customer's can't use the technology and don't want it Yes = 1; No = 0, 5 X 5 25 IDF submitted Yes = 10; No = 1 1 10
  13. 13. Technology Evaluation Criteria Metric Multiplier Ranking Notes / Comments No cost benefit to BOM, process, test, silicon or platform costs = 1 Potential Unit Cost Impact cost reduction to BOM, process, test, silicon or platform costs = 5 Clear cost benefit to BOM, process, test, silicon or platform costs = 10 1 10 Technology dramtically changes the way Intel does business or introduces more business risk = 1 Implication to Business Manageable risks and Model changes to business model = 5 Technology leverage or improves business model or represetns low / mitigateable business risk =10 1 1 Technology does not Unknown. Would need a full in depth demonstrate a return on finance analyst to investigate this. No investment = 1 Technology resources currently allocated to support demonstrates a potential Return on Investment return on investment = 5 Technology demonstrates a clear return on investment = 10 Yes, since you would develop this in-house and only select one of your customersw to work with on this to develop the prototypes Reasonable business risk to prove out the business model and the technology. Business model now moves to entire PCB being delivered to OEM, end- Yes = 10; No = 1 1 10 user, Technology is limited to 1 or 2 products and/or market segments = 1 ; Technology can be applied across market Applicability segments but is limited to either cpu or non cpu.= 5 Technology can be applied across market segments and cpu and non cpu.= 10 1 10 Technology is limited to 1 generation = 1 ; Technology can be applied across multiple generations but limited Scaleability segments = 5 ; Technology can be applied across multiple generations and segments = 10 1 10 Intel has very little control of I/P = 1 Intel will share I/P control technology I/P with supplier = 5 Intel owns I/P = 10 1 10
  14. 14. Technology Evaluation Criteria Metric Multiplier Ranking Notes / Comments Technology will take 3 to 5 years to develop = 1 Technology maturity/ Time to Technology will take 2 to 4 development years to develop = 5 Technology will take 1 to 3 years to develop = 10 1 1 Technology will have limited benefit and is really an extension of existing technology =1 Technology Potential benefit will provide performance or cost benefit = 5 Technology will provide performance and cost benefit = 10 1 10 Technology may have significant reliable issues. Will require significant effort and >4 years develop = 1 Technology may have some Risk reliable issues. Will require moderate effort and 2 to 4 years to develop = 5 Technology may has no apparent reliable 1 1 52
  15. 15. (Quick) Patent Strength Analysis Backward Forward View Patent Details Patent View Patent Details Citations Citations Cooling device with thermally 6292366 7294529 Method for embedding a component in a base 5793611 separated electronic parts on a monolithic substrate Printed circuit 7286359 Use of thermally conductive vias to extract heat from board with microelectronic chips and method of manufacturing Cooling multi-chip modules using 5355942 embedded embedded heat pipes integrated circuit 7176382 Electrical circuit board and method for making the 5306866 Module for electronic package same Heat pipe-electrical interconnect 7165321 Method for manufacturing printed wiring board with 5199165 embedded electric device integration method for chip modules Apparatus for mounting a 6991966 Method for embedding a component in a base and 4774630 semiconductor chip and making forming a contact electrical connections thereto 4739443 Thermally conductive module 6788537 Heat pipe circuit board 6680441 Printed wiring board with embedded electric device 4734315 Low power circuitry components and method for manufacturing printed wiring board with embedded electric device High density packaging technique for 6490159 Electrical circuit board and method for making the 4631636 electronic systems same 4327399 Heat pipe cooling arrangement for integrated circuit chips