This document discusses masked ion beam lithography (MIBL), which uses a focused ion beam to pattern biomaterials. MIBL allows for selective patterning without multiple processing steps like photolithography. Common ion sources for MIBL include ions of calcium, magnesium, sodium, and phosphorus. The setup involves an ion source, mass separation unit, and electrostatic system to produce a parallel ion beam, along with a cooled mask and substrate. MIBL has applications in nanofabrication, circuit editing, and biomaterial patterning without complex processing. Its advantages over other techniques include reduced steps, tailored surface chemistry, and independent patterning of material strength and composition.

1. MASKED ION BEAM
LITHOGRAPHY
ARUNBALAJI.S

2. MIBL - INTRODUCTION
• Successing technology of Ion Beam Lithography
• New approach for Biomaterial Patterning
• It allows selected Ion beam to be allowed to fall on
the mask
• Ions of Ca,Mg,Na,P are used as Sources
• Technique of implanting the dopants in the
manufacturing process of semiconductors.

3. MIBL- Setup

4. Techniques in Ion Beam
Lithography

5. • Hydrogen and helium ion beams a extracted from
the suitable ion source.
• M X B mass separation unit is included.
• Proper electrostatic setup is arranged to get the
parallel ion beam
• The Mask is made up of Silicon, copper.
• Ion Beam Induced heating on the mask is avoided
by arrangement of cooling setup for mask

6. MAJOR TYPES OF ION
SOURCES
 Liquid metal ion sources
 Gas field ion sources
 Volume Plasma sources

7. Liquid metal ion source

8. GAS FIELD ION
SOURCE

9. Volume plasma Source
• Mostly used in ion implanters, ion milling machines
and other ion accelerators
• Sources of desired ions are introduced as gas.
• Electron bombardment is used to ionize it.

10. Importance of ion beam
over other techniques
• Nanofabrication without multistep process.
• When a focused beam of ions is traced over a
surface, it removes material to form a trench
approximately equal to the beam diameter.
• rewire integrated circuits by cutting or depositing
metal film conductors.
• useful in the pre-production development phase to
alter a circuit that may not be working because of
a design or fabrication error

11. Advantages of using ions
over electrons
 Ions are larger than electrons, so less change in
chemical nature of substrate,no x- ray emissions in
the sample.
 Ions are heavier than electrons . So ions gain high
momentum.
 Ion beam milling depends on the how much ions
needed to remove the material, it is independent of
the material’s chemical nature and material
strength.
 Material deposition on the specific sites of the
circuit.

12. MIBL - ADVANTAGES
• This method overcomes the problems of beam
dispersion and diffraction in the Optical and X-ray
lithographic systems
• It reduces the multiple steps like film
casting, exposure, developing and etching process
as in photolithography.
• The surface chemistry of substrate is tailored better
compared to photolithography.
• PMMA surface modification by calcium and
phosphorous ions are used to create microwells for
biomems devices
•

13. MIBL -APPLICATIONS
• High Volume gate level printing of Field emitter
Displays(FED).
• Fabrication of surface acousting wave and
microoptic devices.
• Deep trenching reactive ion beam etching in MEMS
and in particular for silicon Microsystems

14. THANK YOU