MIBL - INTRODUCTION
• Successing technology of Ion Beam Lithography
• New approach for Biomaterial Patterning
• It allows selected Ion beam to be allowed to fall on
• Ions of Ca,Mg,Na,P are used as Sources
• Technique of implanting the dopants in the
manufacturing process of semiconductors.
• Hydrogen and helium ion beams a extracted from
the suitable ion source.
• M X B mass separation unit is included.
• Proper electrostatic setup is arranged to get the
parallel ion beam
• The Mask is made up of Silicon, copper.
• Ion Beam Induced heating on the mask is avoided
by arrangement of cooling setup for mask
MAJOR TYPES OF ION
Liquid metal ion sources
Gas field ion sources
Volume Plasma sources
Volume plasma Source
• Mostly used in ion implanters, ion milling machines
and other ion accelerators
• Sources of desired ions are introduced as gas.
• Electron bombardment is used to ionize it.
Importance of ion beam
over other techniques
• Nanofabrication without multistep process.
• When a focused beam of ions is traced over a
surface, it removes material to form a trench
approximately equal to the beam diameter.
• rewire integrated circuits by cutting or depositing
metal film conductors.
• useful in the pre-production development phase to
alter a circuit that may not be working because of
a design or fabrication error
Advantages of using ions
Ions are larger than electrons, so less change in
chemical nature of substrate,no x- ray emissions in
Ions are heavier than electrons . So ions gain high
Ion beam milling depends on the how much ions
needed to remove the material, it is independent of
the material’s chemical nature and material
Material deposition on the specific sites of the
MIBL - ADVANTAGES
• This method overcomes the problems of beam
dispersion and diffraction in the Optical and X-ray
• It reduces the multiple steps like film
casting, exposure, developing and etching process
as in photolithography.
• The surface chemistry of substrate is tailored better
compared to photolithography.
• PMMA surface modification by calcium and
phosphorous ions are used to create microwells for
• High Volume gate level printing of Field emitter
• Fabrication of surface acousting wave and
• Deep trenching reactive ion beam etching in MEMS
and in particular for silicon Microsystems