Physical vapor deposition (PVD) involves evaporating or sputtering material in vacuum chambers to form thin films or coatings on surfaces. Different PVD techniques include evaporative deposition using resistive heating or electron beams, sputter deposition using plasma or ion beams, and pulsed laser deposition. PVD is commonly used for circuit fabrication, aerospace coatings, and optics due to its ability to deposit thin, uniform coatings of various materials at high temperatures and precise thicknesses. Some advantages of PVD include producing environmentally friendly coatings without requiring post-deposition treatments, while disadvantages include high energy and vacuum requirements.

1. By Muhammad Ali Asghar
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

2. Michael Faraday used PVD in 1838
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

3. Deposition
 Applying a thin film on a surface ranges from nano
meters to micro meters.
 Thin film is deposited on Substrates.
 Different techniques are used for deposition PVD,
CVD, sputtering, electroplating & coating.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

4. Physical vapor deposition
 Physical coating process involve,
condensation & evaporation of material
 PVD is used for high melting point & low
vapor pressure materials.
 PVD is carried out at high temperature and
vacuum.
 In contrary to PVD, CVD is a method in which
chemical adhesion or chemical deposition occurs.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

5. High temperature
is required to
vaporize the material
Vacuum of different
ranges is used which
depends on the mean
free path required in
the system.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

6. PVD methods are commonly used in followings:
Circuit & IC fabrications.
Aerospace in TBC & transparent coatings.
Reflectors and optics
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

7. Evaporative deposition
Electron beam vapor deposition
Pulsed laser deposition
Sputter deposition
Ion induced deposition
Cathode Arc Deposition
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

8. Evaporative deposition
 Resistive heating method is used.
 deposition is performed at high
temperature & low vacuum
 Vacuum decreases the content
of Contamination
 Voltage & current is manually
controlled.
 Material is kept in boats.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

9. Resistive heating unit
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

10. Electron beam is generated
by tungsten filament.
Material is placed in
Graphite or tungsten crucible
Deposition mechanism is same
 deposition is carried out
under high vacuum.
Deposition is controlled, and
Uniform
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

11. MUHAMMAD ALI ASGHAR
VC&ML NINVAST

12. Pulsed laser deposition
 High power laser is used for deposition.
 Argon or neon is used for inert atmosphere.
 High vacuum is formed
 laser is focused by lens, target decides the position of
the deposition .
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

13. Sputter deposition
 Sputtering works on the bases of momentum principle,
formed by the collision of the atoms and molecules.
 Plasma glow, ion accelerator or radioactive emitting is
used to evaporate material.
 argon gas is used for inert atmosphere.
 Types of sputtering
 Chemical and etching sputtering
 Electronic sputtering
 Potential sputtering
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

14.  In this process ions are deposited
on the substrates.
 This process is used for IC
fabrication, micro circuit printing
nano printing or pattering . &
lithography.
 It will be discussed in detail with
nano pattering.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

15. PVD advantages & Disadvantages
 Environment friendly then  Cooling systems are required.
paint & electroplating.
 Mostly high temperature and
 more than one PVD
vacuum control needs skill &
technique can be used for
experience.
coating.
 PVD coated materials has no
 Usually topcoats are not
chemical interaction with the
required.
surface that
 Good strength and
durability.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

16. MUHAMMAD ALI ASGHAR
VC&ML NINVAST

17. MUHAMMAD ALI ASGHAR
VC&ML NINVAST