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Physical vapor deposition

Physical vapor deposition (PVD) involves evaporating or sputtering material in vacuum chambers to form thin films or coatings on surfaces. Different PVD techniques include evaporative deposition using resistive heating or electron beams, sputter deposition using plasma or ion beams, and pulsed laser deposition. PVD is commonly used for circuit fabrication, aerospace coatings, and optics due to its ability to deposit thin, uniform coatings of various materials at high temperatures and precise thicknesses. Some advantages of PVD include producing environmentally friendly coatings without requiring post-deposition treatments, while disadvantages include high energy and vacuum requirements.

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By Muhammad Ali Asghar MUHAMMAD ALI ASGHAR VC&ML NINVAST
Michael Faraday used PVD in 1838 MUHAMMAD ALI ASGHAR VC&ML NINVAST
Deposition  Applying a thin film on a surface ranges from nano meters to micro meters.  Thin film is deposited on Substrates.  Different techniques are used for deposition PVD, CVD, sputtering, electroplating & coating. MUHAMMAD ALI ASGHAR VC&ML NINVAST
Physical vapor deposition  Physical coating process involve, condensation & evaporation of material  PVD is used for high melting point & low vapor pressure materials.  PVD is carried out at high temperature and vacuum.  In contrary to PVD, CVD is a method in which chemical adhesion or chemical deposition occurs. MUHAMMAD ALI ASGHAR VC&ML NINVAST
High temperature is required to vaporize the material Vacuum of different ranges is used which depends on the mean free path required in the system. MUHAMMAD ALI ASGHAR VC&ML NINVAST
PVD methods are commonly used in followings: Circuit & IC fabrications. Aerospace in TBC & transparent coatings. Reflectors and optics MUHAMMAD ALI ASGHAR VC&ML NINVAST
Evaporative deposition Electron beam vapor deposition Pulsed laser deposition Sputter deposition Ion induced deposition Cathode Arc Deposition MUHAMMAD ALI ASGHAR VC&ML NINVAST
Evaporative deposition  Resistive heating method is used.  deposition is performed at high temperature & low vacuum  Vacuum decreases the content of Contamination  Voltage & current is manually controlled.  Material is kept in boats. MUHAMMAD ALI ASGHAR VC&ML NINVAST
Resistive heating unit MUHAMMAD ALI ASGHAR VC&ML NINVAST
Electron beam is generated by tungsten filament. Material is placed in Graphite or tungsten crucible Deposition mechanism is same  deposition is carried out under high vacuum. Deposition is controlled, and Uniform MUHAMMAD ALI ASGHAR VC&ML NINVAST
MUHAMMAD ALI ASGHAR VC&ML NINVAST
Pulsed laser deposition  High power laser is used for deposition.  Argon or neon is used for inert atmosphere.  High vacuum is formed  laser is focused by lens, target decides the position of the deposition . MUHAMMAD ALI ASGHAR VC&ML NINVAST
Sputter deposition  Sputtering works on the bases of momentum principle, formed by the collision of the atoms and molecules.  Plasma glow, ion accelerator or radioactive emitting is used to evaporate material.  argon gas is used for inert atmosphere.  Types of sputtering  Chemical and etching sputtering  Electronic sputtering  Potential sputtering MUHAMMAD ALI ASGHAR VC&ML NINVAST
 In this process ions are deposited on the substrates.  This process is used for IC fabrication, micro circuit printing nano printing or pattering . & lithography.  It will be discussed in detail with nano pattering. MUHAMMAD ALI ASGHAR VC&ML NINVAST
PVD advantages & Disadvantages  Environment friendly then  Cooling systems are required. paint & electroplating.  Mostly high temperature and  more than one PVD vacuum control needs skill & technique can be used for experience. coating.  PVD coated materials has no  Usually topcoats are not chemical interaction with the required. surface that  Good strength and durability. MUHAMMAD ALI ASGHAR VC&ML NINVAST
MUHAMMAD ALI ASGHAR VC&ML NINVAST
MUHAMMAD ALI ASGHAR VC&ML NINVAST