MEMS = Micro Electro Mechanical System
Any engineering system that performs electrical (switching ,deciding) and mechanical functions (sensing,moving,heating) with components in micrometers is a MEMS.
MEMS = Micro Electro Mechanical System
Any engineering system that performs electrical (switching ,deciding) and mechanical functions (sensing,moving,heating) with components in micrometers is a MEMS.
MEMS technology consist of micro electronic elements actuators, sensors and mechanical structures built onto a substrate which is usually “Silicon”. They are developed using microfabrication techniques : deposition, patterning, etching.
The most common forms of MEMS production are :
Bulk micromachine, surface micromachine etc.
The benefits of this small scale integrated device brings the technology of nanometers to a vast no. of devices.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements that are made using the techniques of micro fabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters.
MEMS is a technique of combining electrical and mechanical components together on a chip. It produces a system of miniature dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
Microelectromechanical Systems (MEMS) are miniature devices comprising of integrated mechanical (levers, springs, deformable membranes, vibrating structures, etc.) and electrical (resistors, capacitors, inductors, etc.) components designed to work in concert to sense and report on the physical properties of their immediate or local environment, or, when signaled to do so, to perform some kind of controlled physical interaction or actuation with their immediate or local environment
Piezoresistive pressure sensors are one of the very-first products of MEMS technology. Those products are widely used in biomedical applications, automotive industry and household appliances.
The sensing material in a piezoresistive pressure sensor is a diaphragm formed on a silicon substrate, which bends with applied pressure. A deformation occurs in the crystal lattice of the diaphragm because of that bending. This deformation causes a change in the band structure of the piezoresistors that are placed on the diaphragm, leading to a change in the resistivity of the material. This change can be an increase or a decrease according to the orientation of the resistors.
MEMS technology consist of micro electronic elements actuators, sensors and mechanical structures built onto a substrate which is usually “Silicon”. They are developed using microfabrication techniques : deposition, patterning, etching.
The most common forms of MEMS production are :
Bulk micromachine, surface micromachine etc.
The benefits of this small scale integrated device brings the technology of nanometers to a vast no. of devices.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements that are made using the techniques of micro fabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters.
MEMS is a technique of combining electrical and mechanical components together on a chip. It produces a system of miniature dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
Microelectromechanical Systems (MEMS) are miniature devices comprising of integrated mechanical (levers, springs, deformable membranes, vibrating structures, etc.) and electrical (resistors, capacitors, inductors, etc.) components designed to work in concert to sense and report on the physical properties of their immediate or local environment, or, when signaled to do so, to perform some kind of controlled physical interaction or actuation with their immediate or local environment
Piezoresistive pressure sensors are one of the very-first products of MEMS technology. Those products are widely used in biomedical applications, automotive industry and household appliances.
The sensing material in a piezoresistive pressure sensor is a diaphragm formed on a silicon substrate, which bends with applied pressure. A deformation occurs in the crystal lattice of the diaphragm because of that bending. This deformation causes a change in the band structure of the piezoresistors that are placed on the diaphragm, leading to a change in the resistivity of the material. This change can be an increase or a decrease according to the orientation of the resistors.
Captronic séminaire électronique imprimée - 20/09/2017 - Présentation du Laboratoire IMS / Université de Bordeaux - En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.
Overcurrent and Distance Protection in DigSilent PowerFactoryAreeb Abdullah
This project involves the theoretical study of Protection Devices, Protection Schemes, Analysis of Control and Logical Blocks of relays being used in the project and practical implementation of both schemes in DigSilent PowerFactory.
The world’s smallest MEMS barometer for smartphone and smartwatch, with a lot of innovation
The LPS22HB Nano Pressure Sensor is the world’s smallest barometric sensor, incorporating the VENSENS process and the new BASTILLE process, featuring abundant design innovation. Targeting altitude and weather forecasting applications in portable devices, this MEMS sensor positions STMicroelectronics for double-digit growth in the pressure sensor market.
STMicroelectronics LPS22HB pressure- sensing device is manufactured using a proprietary MEMS technology called “VENSENS”, which allows the pressure sensor to be fabricated on a monolithic silicon chip. The LPS22HB’s sensing element is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is tiny compared to traditional silicon micro-machined membranes. The device is allowing some waterproof functionalities, detailed in the report.
For the LPS22HB, STMicroelectronics has introduced two significant innovations. The first one is a holed cap in silicon, bonded on the sensor to integrate the pressure sensor into a small molded package of 2x2x0.76mm HLGA. This package resembles the one used for the HTS221 humidity sensor. The second one is a spring structure to increase the sensor’s sensitivity and reliability. These two innovations are the core of the new “Bastille” MEMS technology.
This report presents a detailed analysis of the sensor structure and cost, as well as a characteristics comparison with the 1st-generation STMicroelectronics LPS331AP pressure sensor and the Bosch Sensortec BMP280, highlighting differences in each company’s technical choices.
More information on that report at http://www.i-micronews.com/reports.html
Hierarchical Digital Twin of a Naval Power SystemKerry Sado
A hierarchical digital twin of a Naval DC power system has been developed and experimentally verified. Similar to other state-of-the-art digital twins, this technology creates a digital replica of the physical system executed in real-time or faster, which can modify hardware controls. However, its advantage stems from distributing computational efforts by utilizing a hierarchical structure composed of lower-level digital twin blocks and a higher-level system digital twin. Each digital twin block is associated with a physical subsystem of the hardware and communicates with a singular system digital twin, which creates a system-level response. By extracting information from each level of the hierarchy, power system controls of the hardware were reconfigured autonomously. This hierarchical digital twin development offers several advantages over other digital twins, particularly in the field of naval power systems. The hierarchical structure allows for greater computational efficiency and scalability while the ability to autonomously reconfigure hardware controls offers increased flexibility and responsiveness. The hierarchical decomposition and models utilized were well aligned with the physical twin, as indicated by the maximum deviations between the developed digital twin hierarchy and the hardware.
CFD Simulation of By-pass Flow in a HRSG module by R&R Consult.pptxR&R Consult
CFD analysis is incredibly effective at solving mysteries and improving the performance of complex systems!
Here's a great example: At a large natural gas-fired power plant, where they use waste heat to generate steam and energy, they were puzzled that their boiler wasn't producing as much steam as expected.
R&R and Tetra Engineering Group Inc. were asked to solve the issue with reduced steam production.
An inspection had shown that a significant amount of hot flue gas was bypassing the boiler tubes, where the heat was supposed to be transferred.
R&R Consult conducted a CFD analysis, which revealed that 6.3% of the flue gas was bypassing the boiler tubes without transferring heat. The analysis also showed that the flue gas was instead being directed along the sides of the boiler and between the modules that were supposed to capture the heat. This was the cause of the reduced performance.
Based on our results, Tetra Engineering installed covering plates to reduce the bypass flow. This improved the boiler's performance and increased electricity production.
It is always satisfying when we can help solve complex challenges like this. Do your systems also need a check-up or optimization? Give us a call!
Work done in cooperation with James Malloy and David Moelling from Tetra Engineering.
More examples of our work https://www.r-r-consult.dk/en/cases-en/
About
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Technical Specifications
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
Key Features
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface
• Compatible with MAFI CCR system
• Copatiable with IDM8000 CCR
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
Application
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Student information management system project report ii.pdfKamal Acharya
Our project explains about the student management. This project mainly explains the various actions related to student details. This project shows some ease in adding, editing and deleting the student details. It also provides a less time consuming process for viewing, adding, editing and deleting the marks of the students.
Water scarcity is the lack of fresh water resources to meet the standard water demand. There are two type of water scarcity. One is physical. The other is economic water scarcity.
1. ME407 MECHATRONICS
SUKESH O P
Assistant Professor
Dept. of Mechanical Engineering
JECC
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SUKESH O P/ APME/ME407- MR-2018
2. ME407 MECHATRONICS
Course Objectives:
To introduce the features of various sensors used in CNC machines and
robots
To study the fabrication and functioning of MEMS pressure and inertial
sensors
To enable development of hydraulic/pneumatic circuit and PLC
programs for simple applications
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3. Expected outcome:
The students will be able to
i. Know the mechanical systems used in mechatronics ii. Integrate
mechanical, electronics, control and computer engineering in the
design of mechatronics systems
ME407 MECHATRONICS
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4. Expected outcome:
The students will be able to
i. Know the mechanical systems used in mechatronics ii. Integrate
mechanical, electronics, control and computer engineering in the
design of mechatronics systems
ME407 MECHATRONICS
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5. SYLLABUS
Introduction to Mechatronics, sensors, Actuators, Micro Electro
Mechanical Systems (MEMS), Mechatronics in Computer Numerical
Control (CNC) machines, Mechatronics in Robotics-Electrical drives,
Force and tactile sensors, Image processing techniques, Case studies
of Mechatronics systems.
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6. MODULE-III
Micro Electro Mechanical Systems (MEMS): Fabrication:
Deposition, Lithography, Micromachining methods for
MEMS, Deep Reactive Ion Etching (DRIE) and LIGA processes.
Principle, fabrication and working of MEMS based pressure
sensor, accelerometer and gyroscope
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7. MEMS
It is a technology that in its most general form can be defi
ned as miniatured mechanical and electro-mechanical ele
ments that are made using techniques of micromachining.
Made up of components between 1-100 micrometers in si
ze (i.e., 0.001 to 0.1mm) and MEMS devices range in size
from 20micrometers to millimeter(0.02 to 1.0mm)
Used for sensing, actuation or are passive micro-structures
Usually integrated with electronic circuitry for control and
/or information processing
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8. Components of MEMS
Microelectronics:
• “brain” that receives, processes, and makes decisions
• data comes from microsensors
Microsensors:
• constantly gather data from environment
• pass data to microelectronics for processing
• can monitor mechanical, thermal, biological, chemical
optical, and magnetic readings
Microactuator:
• acts as trigger to activate external device
• microelectronics will tell microactuator to activate device
Microstructures:
• extremely small structures built onto surface of chip
• built right into silicon of MEMS
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10. Advantages of MEMS
Better stability and higher accuracy in the performance.
Miniaturization.
Integration of sensors and electronics on the same
device.
Mass fabrication at low cost.
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13. Fabrication of MEMS
The basic techniques used in the fabrication of
MEMS is deposition of one material over
another material then, patterning using
photolithography and then by etching the
required shape.
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16. PVD
In PVD deposition technology, the material is removed from the source/
target and is deposited/transferred to the substrate.
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17. PVD
Physical vapor deposition ("PVD") consists of a process in which
a material is removed from a target, and deposited on a
surface.
Techniques to do this include the process of sputtering, in
which an ion beam liberates atoms from a target, allowing
them to move through the intervening space and deposit on
the desired substrate, and evaporation, in which a material is
evaporated from a target using either heat (thermal
evaporation) or an electron beam (e-beam evaporation) in a
vacuum system.
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22. CVD
Chemical vapor deposition (CVD) is a deposition method used
to produce high quality, high-performance, solid materials,
typically under vacuum. The process is often used in
the semiconductor industry to produce thin films.
Chemical deposition techniques include chemical vapor
deposition ("CVD"), in which a stream of source gas reacts on
the substrate to grow the material desired.
This can be further divided into categories depending on the
details of the technique, for example, LPCVD (Low Pressure
chemical vapor deposition) and PECVD (Plasma-enhanced
chemical vapor deposition).
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23. SUKESH O P/ APME/ME407- MR-2018
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25. SUKESH O P/ APME/ME407- MR-2018
SUKESH O P/ APME/ME407- MR-2018
26. 2. Patterning
• transfer of a pattern into a material after deposition in order to prepare for
etching .( like printing on a paper).
• techniques include some type of lithography, photolithography is common
LITHOGRAPHY
Lithography in the MEMS context is typically the transfer of a pattern to a
photosensitive material by selective exposure to a radiation source such as
light.
A photosensitive material is a material that experiences a change in its
physical properties when exposed to a radiation source.
If photosensitive material is selectively expose to radiation light (e.g. by
masking some of the radiation) the pattern of the radiation on the material is
transferred to the material exposed and the properties of the exposed and
unexposed regions different.
This exposed region can then be removed or treated by providing a mask for
the underlying substrate.
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27. LITHOGRAPHY
Lithography in the MEMS context is typically the transfer of a
pattern to a photosensitive material by selective exposure to a
radiation source such as light.
A photosensitive material is a material that experiences a
change in its physical properties when exposed to a radiation
source.
If photosensitive material is selectively expose to radiation light
(e.g. by masking some of the radiation) the pattern of the
radiation on the material is transferred to the material exposed
and the properties of the exposed and unexposed regions
different.
This exposed region can then be removed or treated by
providing a mask for the underlying substrate.
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29. In lithography for micromachining, the photosensitive material
used is typically a photoresist (also called resist, other
photosensitive polymers are also used).
When resist is exposed to a radiation source of a specific a
wavelength, the chemical resistance of the resist to developer
solution changes. If the resist is placed in a developer solution
after selective exposure to a light source, it will etch away one
of the two regions (exposed or unexposed).
If the exposed material is etched away by the developer and
the unexposed region is resilient, the material is considered to be
a positive resist. If the exposed material is resilient to the
developer and the unexposed region is etched away, it is
considered to be a negative resist.
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39. Few lithography techniques are:
Ion beam lithography
Ion track technology
X-ray lithography
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40. 3. Etching
Etching is a process which makes it possible to
selectively remove the deposited films or parts of the
substrate in order to prepare a desired patterns,
shapes, features, or structures.
Etching is used in micro fabrication to chemically
remove layers from the surface of a wafer during
manufacturing.
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42. Wet etching
Wet etching removes the material selectively through chemical
reaction.
The material is immersed in a chemical solution, which reacts and
subsequently dissolves the portion of the material, which is in
contact with the solution.
Materials not covered by the masks are left undissolved.
Dipping substrate into chemical solution that selectively removes
material.
Process provides good selectivity, etching rate of target material
higher that mask material
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43. Wet etching process fall under three sub-activities.
Diffusion of the etchant to the surface for removal. The operation
is carried out at room temp. or slightly above, but preferably
below 50C.
Establishment of reaction b/w the etchant and the material
being removed.
Diffusion of the reaction by products from the reacted surface.-
cleaning
The dissolution of material due to chemical reaction may not be
uniform in all directions. This characteristic of etching is called
directionality.
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44. Anisotropic materials, the etch rates are not same in all directions.
Anisotropic etching is considerably a highly directional etching process
with different directions.
The name isotropic material will dissolve uniformly in all directions. In
isotropic etching materials are removed uniformly from all directions and
it is independent of the plane of orientation of the crystal lattice.
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45. Dry etching
A dry etching doesnot utilize any liquid chemicals or etchants to
remove materials.
This etching process is primarily used in surface micromachining
process. The main adv of dry etching are that the process
eliminates handling of dangerous acids and solvents, uses small
amounts of chemicals.
In dry etching sputter the material using reactive ions or a vapor
etchant.
Material sputtered or dissolved from substrate with plasma or
gas variations
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46. Deep Reactive Ion Etching (DRIE)
In DRIE, the substrate is placed inside a reactor, and several gases are
introduced.
Chemical part : A plasma is struck in the gas mixture which breaks the
gas molecules into ions. The ions accelerate towards, and react with the
surface of the material being etched, forming another gaseous material.
Physical part : if the ions have high enough energy, they can knock
atoms out of the material to be etched without a chemical reaction.
Major techniques are :-
Cryogenic process
Bosch process
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47. Deep Reactive Ion Etching (DRIE)
Cryogenic process: low temperature slows down the chemical
reaction that produces isotropic etching. How ever, ions
continuous to bombard upward facing surface and etch them
away. This process produces trenches with highly vertical side
walls.
Bosch process : also known as pulse (or) time multiplexed
etching. It oscillates repeatedly between two modes to achieve
nearly vertical structure.
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48. Relatively new technology.
Enables very high aspect ratio etches.
Uses high density plasma to alternately
etch and deposit etch resistant polymer
on sidewalls.
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Deep Reactive Ion Etching (DRIE)
SUKESHOP/APME/ME407-MR-2018
49. Micro Machining
Fabrication of products deals with making of machines, structures
or process equipment by casting, forming, welding, machining &
assembling.
Classified into: Macro & micro
Macro: fabrication of structures/parts/products that are
measurable observable by naked eye( ≥ 1mm in size) .
Micro: fabrication of miniature structures/parts/products that
are not visible with naked eye(1 µm ≤ dimension ≤ 1000 µm in
size).
Methods of Micro Fabrication: Material deposition & Material
Removal
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50. Why Micro Machining?
Present day High-tech Industries, Design requirements are
stringent.
Extraordinary Properties of Materials (High Strength, High heat
Resistant, High hardness, Corrosion resistant etc).
Complex 3D Components (Turbine Blades)
Miniature Features (filters for food processing and textile
industries having few tens of microns as hole diameter and
thousands in number)
Nano level surface finish on Complex geometries (thousands of
turbulated cooling holes in a turbine blade)
Making and finishing of micro fluidic channels (in electrically
conducting & non conducting materials, say glass, quartz,
&ceramics)
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51. Bulk Micromaching
Bulk and surface micromachining are processes used to
create microstructures on microelectromechanical MEMS
devices.
While both wet and dry etching techniques are
available to both bulk and surface micromachining,
bulk micromachining typically uses wet etching
techniques while surface micromachining primarily uses
dry etching techniques.
Bulk micromachining selectively etches the silicon
substrate to create microstructures on MEMS devices.
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52. SUKESH O P/ APME/ME407- MR-2018
Bulk Micromachining
Bulk micromachining involves the removal of part of the
bulk substrate. It is a subtractive process that uses wet
anisotropic etching or a dry etching method such as
reactive ion etching (RIE), to create large pits, grooves
and channels. Materials typically used for wet etching
include silicon and quartz, while dry etching is typically
used with silicon, metals, plastics and ceramics.
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Bulk Micromachining- Advantages/Disadvantages
Can be done much
faster
Can make high aspect
ratio parts
Cheaper
Not easily integrated
with microelectronics
Part complexity must be
relatively simple
Part size is limited to
being larger
54. Surface Micromachining
Unlike Bulk micromachining, where a silicon substrate (wafer) is
selectively etched to produce structures, surface micromachining
builds microstructures by deposition and etching of different
structural layers on top of the substrate.
Generally polysilicon is commonly used as one of the layers and
silicon dioxide is used as a sacrificial layer which is removed or
etched out to create the necessary void in the thickness direction.
The main advantage of this machining process is the possibility
of realizing monolithic microsystems in which the electronic and
the mechanical components(functions) are built in on the same
substrate
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56. Newer than Bulk Micromachining
Uses single sided wafer processing
Involves use of sacrificial and structural layers
Provides more precise dimensional control
Involves use of sacrificial and structural layers
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57. Surface Micromachining- Applications
Used in manufacturing of flat panel television screen.
Used in production of thin solar cells.
Used in making bimetal cantilever used for monitoring mercury
vapour, moisture, protein conformational changes in antigen
antibody binding.
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58. SUKESH O P/ APME/ME407- MR-2018
Surface Micromachining Advantages/Disadvantages
Possible to integrate
mechanical and electrical
components on same
substrate
Can create structures
that Bulk Micromachining
cannot
Cheaper glass or plastic
substrates can be used
Mechanical properties of
most thin-films are usually
unknown and must be
measured
Reproducibility of
mechanical properties can
be difficult
More expensive
60. HIGH-ASPECT-RATIO ICROMACHINING
High-aspect-ratio micromachining (HARM) is a process
that involves micromachining as a tooling step followed
by injection moulding or embossing and, if required, by
electroforming to replicate microstructures in metal
from moulded parts. It is one of the most attractive
technologies for replicating microstructures at a high
performance-to-cost ratio and includes techniques
known as LIGA.
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61. LIGA Process
Developed in Germany in the early 1980s.
LIGA stands for the German words
LIthographie (in particular X-ray lithography)
Galvanoformung (translated electrodeposition or
electroforming)
Abformtechnik (plastic molding)
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64. Popular high aspect ratio micromachining technology
Primarily non-Silicon basted and requires use of x-ray radiation
Special mask and x-ray radiation makes process expensive
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66. Advantages of LIGA
LIGA is a versatile process – it can produce parts by several
different methods
High aspect ratios are possible (large heightto-width ratios in
the fabricated part)
Wide range of part sizes is feasible - heights ranging from
micrometers to centimeters
Close tolerances are possible
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67. Disadvantages of LIGA
LIGA is a very expensive process
Large quantities of parts are usually required to justify its application
LIGA uses X-ray exposure
Human health hazard
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79. MEMS-based accelerometer
MEMS-based accelerometer with capacitors is typically a
structure that uses two capacitors formed by a moveable plate
held between two fixed plates.
Under zero net force the two capacitors are equal but a change
in force will cause the moveable plate to shift closer to one of
the fixed plates, increasing the capacitance, and further away
from the other fixed reducing that capacitance.
This difference in capacitance is detected and amplified to
produce a voltage proportional to the acceleration
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SUKESHOP/APME/ME407-MR-2018