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Thin films

Thin films are layers of material ranging from fractions of a nanometer to several micrometers thick. Thin film technology involves precisely depositing individual atoms or molecules onto a substrate through various deposition techniques, including physical vapor deposition (PVD) and chemical vapor deposition (CVD). Key properties of thin films like thickness, roughness, and chemical composition must be carefully controlled. Thin films have many applications, such as in solar cells, batteries, medical device coatings, and more. Emerging areas of thin film application include biodegradable and flexible energy storage devices.

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PRESENTED BY: NISCHITH B S THIN FILMS
Define Thin Films! A thin film is a layer of materialranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Thin film technology is a "self organizing" structural evolution. Ex:In ancient times, people already knew how to beat gold into a thin film (< 1 μm thickness) with hammers and knew how use this "gold leaf" for coating allkinds of stuff. 2
Purpose of Thin Film development! o To maintain surface uniformity. o To reduce the amount (or mass) of light absorbing material. o Spray Coating Technology for Superior Functional Medical Coatings. o To decrease the weight and bulkiness of the materials. 3
Thin Film Technology Thin film technology involves deposition of individual molecules or atoms. Uniform ultra-thin film coatings onto stents, catheters, balloons, endoscopic instruments, pacemakers, heart valves, glucose monitors, sensors, medical textiles, blood collection tubes, surgical implants, orthopedic implants, and diagnostic devices. Example for industrial thin films produced are: 1. 1.Amorphous Silicon (a-Si) 2. 2.Cadmium Telluride (CdTe) 4
Properties to be considered!  FILM THICKNESS : The physical properties of a thin film are highly dependent on their thickness. Thickness measurement methods are applied during deposition ("in situ") and methods by which the thickness can be determined after finishing a coating run ("ex situ"). a) Gravimetric Method b) Optical Method  ROUGHNESS : In Ultrathin Films, it can influence all film properties such as mechanical, electrical, magnetical or optical properties. roughness types, the mechanisms of their origin, roughness measurement and roughness quantification needs to be taken into consideration. 5
 CHEMICAL PROPERTIES: Conventional methods of chemical analysis as atomic emission, atomic absorption spectral analysis, X-ray fluorescence and mass spectrometry play an important role for the production of the coating materials. Interaction of photons, electrons, ions or other particles with the coating or surface has to be analyzed. 6
Deposition Techniques DEPOSITION TECHNIQUES EVAPORATIVE METHODS GLOW-DISCHARGE TECHNOLOGIES GAS-PHASE CHEMICAL PROCESSES LIQUID-PHASE CHEMICAL FORMATION 7 Deposition processes is done to controllably transfer atoms from a source to a substrate
Chemical Vapour Deposition(CVD) Gaseous compounds react to form a dense layer on a heated substrate. The most widely deposited wear- resistant coatings are TiC, TiN, chromium carbide and alumina. Deposition temperatures are generally in the range 800-1000C. Thicknesses are limited to about 10mm due to the thermal expansion mismatch stresses which develop on cooling which also restrict the coating of sharp edged components. Advantages  High coating hardness  Good adhesion (if the coating is not too thick)  Good throwing power (i.e. uniformity of coating) Disadvantages  High temperature process (distortion)  Sharp edge coating is difficult (thermal expansion mismatch stresses)  Limited range of materials can be coated  Environmental concerns about process gases 8
Physical Vapour Deposition (PVD) Advantages  Excellent process control  Low deposition temperature  Dense, adherent coatings  Elemental, alloy and compound coatings possible Disadvantages  Vacuum processes with high capital cost  Limited component size treatable  Relatively low coating rates  Poor throwing power without manipulation of components Low pressure coating processes in which the coating flux is produced by a physical process. There are two main types:- 1. Evaporation 2. Sputtering  In both cases the source material is a solid (metal or ceramic). A reactive gas may be used in the deposition chamber to deposit compound coatings from an elemental source or maintain the stoichiometry of coatings from compound sources, though thinner layers are used in microelectronics and thicker layers are used for high temperature . 9
Ultrasonic Nozzle Technology Low velocity, soft spray with minimal overspray saves up to 80% in coating material Independent control of process parameters including flow rate, spray velocity, drop size and deposition  Precise control over a wide range of flow rates  Non-clogging, repeatable performance Choice of drop size depending on nozzle frequency (drop sizes range from 18 - 49 microns)  Deagglomeration of particles in suspension due to ultrasonic vibration 10
Thin Film Advantages o Simple fabrication o Requires low fabrication temp (300 C) o Manufacturing requires little materials. -thin cell to crystalline thickness= 1 to 300 o Flexible/ non-breakable o High voltage can be obtained o No infrastructure needed to support cells o Cell can double as building material (roofing tiles, walls, etc) 11
Where can we apply it ??  Thin-filmBatteries: Thin-filmprintingtechnologyis beingused to apply solid-statelithiumpolymers to a variety of substrates to create uniquebatteries for specialized applications. Thin-film batteries can be deposited directly onto chips or chip packages in any shape or size. Flexiblebatteries can be made by printing onto plastic, thinmetalfoil, or paper. 12
Thin-film solar cells: alsocalleda thin-film photovoltaic cell (TFPV), is a second generation solar cell that is made by depositing one or more thin layers,or thin film (TF)ofphotovoltaic materialona substrate, such as glass, plastic or metal. Thin-film solar cellsare commerciallyused in several technologies, including cadmium telluride(CdTe), copper indium galliumdiselenide (CIGS),and amorphousandother thin-film silicon 13
Blood Collection Tubes Targeted coating of side walls, layering of chemistries, polymers, or clotting agents. Common materials sprayed include Heparin, Silicone and EDTA. Nozzle design allows atomizing surface to reach inner diameter lengths. Fully automated control of electronics. Custom multiple nozzle systems for high volume production. Soft, low velocity spray will not collect on base of tubes. 14
Orthopedic Implants Thin film coatings of antimicrobial agents or bone growth enhancing solutions onto rods, screws, plates, or joint replacements. Low velocity spray readily adheres to all surfaces. Ability to adjust coating morphology characteristics. Tight drop distribution uniformly coats any shape. 15
Micro encapsulation This include targeted drug delivery, slow release pharmaceuticals, and nanoencapsulation. 16
http://electrical-engineering-portal.com/solar-energy-expands-escapes-the-power-grid Thin-Film market demand 17
Future of Thin Films 18 Natures solution to thin film cells. Developing molecules out of organic compounds like carbon and hydrogen Super-thin film about 100 nanometers thick, can be applied as a paint. Replaces heavy metals currently being used in cells. Creates a biodegradable, almost natural cell.
References  Barna, P. B. (2005). HISTORY OF THIN FILMS. In P. B. Barna, HISTORY OF THIN FILMS (p. 37). Budapest, Hungary: Research Institute for Technical Physics and Materials Science of HAS.  IFP TUWEIN. (2009, September 30). Retrieved from http://static.ifp.tuwien.ac.at: http://static.ifp.tuwien.ac.at/homepages/Personen/duenne_schichten/pdf /t_p_dschapter1.pdf  Jiang, P. D. (2008). Introduction to Thin Film Technology. LOT , 28.  Ohring, M. (2001). Materials Science of Thin Films . Boston: Academic Press.  Seshan, K., & McGuire, G. (2002). HANDBOOK OF THIN-FILM DEPOSITION PROCESSES. Norwich, New York, U.S.A.: NOYES PUBLICATIONS.  (2007, October). Retrieved from en.wikipedia.org: http://en.wikipedia.org/wiki/Thin_film 19
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