Lithography is a process that uses light to transfer geometric patterns from a photomask to a light-sensitive chemical "photoresist" on a semiconductor substrate. The key steps in the lithography process include cleaning and preparing the wafer surface, depositing and spinning photoresist, soft baking to evaporate solvents, aligning the mask and exposing the photoresist to light, developing to remove exposed or unexposed areas of photoresist, hard baking to harden the photoresist, plasma etching or depositing additional layers, cleaning, and inspecting the final patterned wafer. Lithography is critical for manufacturing integrated circuits and is capable of printing ever smaller semiconductor features.
This presentation includes basis of lithography i.e. (photo-lithography e-beam lithography) in nano-lithography includes (AFM, Soft, NIL and DPN lithography)
Photolithography, also called optical lithography or UV lithography, is a process used in microfabrication to pattern parts on a thin film or the bulk of a substrate (also called a wafer). It uses light to transfer a geometric pattern from a photomask (also called an optical mask) to a photosensitive (that is, light-sensitive) chemical photoresist on the substrate. A series of chemical treatments then either etches the exposure pattern into the material or enables deposition of a new material in the desired pattern upon the material underneath the photoresist. In complex integrated circuits, a CMOS wafer may go through the photolithographic cycle as many as 50 times.
Photolithography shares some fundamental principles with photography in that the pattern in the photoresist etching is created by exposing it to light, either directly (without using a mask) or with a projected image using a photomask. This procedure is comparable to a high precision version of the method used to make printed circuit boards. Subsequent stages in the process have more in common with etching than with lithographic printing. This method can create extremely small patterns, down to a few tens of nanometers in size. It provides precise control of the shape and size of the objects it creates and can create patterns over an entire surface cost-effectively. Its main disadvantages are that it requires a flat substrate to start with, it is not very effective at creating shapes that are not flat, and it can require extremely clean operating conditions. Photolithography is the standard method of printed circuit board (PCB) and microprocessor fabrication. Directed self-assembly is being evaluated as an alternative to photolithography
This presentation includes basis of lithography i.e. (photo-lithography e-beam lithography) in nano-lithography includes (AFM, Soft, NIL and DPN lithography)
Photolithography, also called optical lithography or UV lithography, is a process used in microfabrication to pattern parts on a thin film or the bulk of a substrate (also called a wafer). It uses light to transfer a geometric pattern from a photomask (also called an optical mask) to a photosensitive (that is, light-sensitive) chemical photoresist on the substrate. A series of chemical treatments then either etches the exposure pattern into the material or enables deposition of a new material in the desired pattern upon the material underneath the photoresist. In complex integrated circuits, a CMOS wafer may go through the photolithographic cycle as many as 50 times.
Photolithography shares some fundamental principles with photography in that the pattern in the photoresist etching is created by exposing it to light, either directly (without using a mask) or with a projected image using a photomask. This procedure is comparable to a high precision version of the method used to make printed circuit boards. Subsequent stages in the process have more in common with etching than with lithographic printing. This method can create extremely small patterns, down to a few tens of nanometers in size. It provides precise control of the shape and size of the objects it creates and can create patterns over an entire surface cost-effectively. Its main disadvantages are that it requires a flat substrate to start with, it is not very effective at creating shapes that are not flat, and it can require extremely clean operating conditions. Photolithography is the standard method of printed circuit board (PCB) and microprocessor fabrication. Directed self-assembly is being evaluated as an alternative to photolithography
Lithography is the process of transferring patterns of geometric shapes in a mask to a radiation sensitive material called resist,which cover the surface of semiconductor wafer.
Electron beam lithography (often abbreviated as e-beam lithography or EBL) is the process of transferring a pattern onto the surface of a substrate by first scanning a thin layer of organic film (called resist) on the surface by a tightly focused and precisely controlled electron beam (exposure) and then selectively removing the exposed or nonexposed regions of the resist in a solvent (developing). The process allows patterning of very small features, often with the dimensions of submicrometer down to a few nanometers, either covering the selected areas of the surface by the resist or exposing otherwise resist-covered areas. The exposed areas could be further processed for etching or thin-film deposition while the covered parts are protected during these processes. The advantage of e-beam lithography stems from the shorter wavelength of accelerated electrons compared to the wavelength of ultraviolet (UV) light used in photolithography.
In EBL, a resist layer is directly patterned by scanning with an electron beam electronically. Modern EBL systems have very good depth of focus (several hundred nanometres) and are able to correct for large-scale height variations of the wafer (of several hundred microns), and so are able to cope well with the rough surface topology of typical GaN wafers and associated wafer bow. EBL also has the advantage of allowing multiple designs to be fabricated together on one wafer. EBL is, however, a slow and expensive process, which is not practical for production. Substrate charging and proximity error effects must be taken into account to get good quality devices. Charging effects can be overcome by application of a sub-nanoscale removable conductive layer on top of the resist. Proximity error correction effects are overcome using specialised design correction software.
1.Silicon Manufacturing
a) Czochralski method.
b) Wafer Manufacturing
c) Crystal structure
2.Photolithography
a) Photoresists
b) Photomask and Reticles
c) Patterning
Lithographic photomasks are typically transparent fused silica blanks covered with a pattern defined with a chrome metal-absorbing film. Photomasks are used at wavelengths of 365 nm, 248 nm, and 193 nm. Photomasks have also been developed for other forms of radiation such as 157 nm, 13.5 nm (EUV), X-ray, electrons, and ions; but these require entirely new materials for the substrate and the pattern film.
Lithography is the process of transferring patterns of geometric shapes in a mask to a radiation sensitive material called resist,which cover the surface of semiconductor wafer.
Electron beam lithography (often abbreviated as e-beam lithography or EBL) is the process of transferring a pattern onto the surface of a substrate by first scanning a thin layer of organic film (called resist) on the surface by a tightly focused and precisely controlled electron beam (exposure) and then selectively removing the exposed or nonexposed regions of the resist in a solvent (developing). The process allows patterning of very small features, often with the dimensions of submicrometer down to a few nanometers, either covering the selected areas of the surface by the resist or exposing otherwise resist-covered areas. The exposed areas could be further processed for etching or thin-film deposition while the covered parts are protected during these processes. The advantage of e-beam lithography stems from the shorter wavelength of accelerated electrons compared to the wavelength of ultraviolet (UV) light used in photolithography.
In EBL, a resist layer is directly patterned by scanning with an electron beam electronically. Modern EBL systems have very good depth of focus (several hundred nanometres) and are able to correct for large-scale height variations of the wafer (of several hundred microns), and so are able to cope well with the rough surface topology of typical GaN wafers and associated wafer bow. EBL also has the advantage of allowing multiple designs to be fabricated together on one wafer. EBL is, however, a slow and expensive process, which is not practical for production. Substrate charging and proximity error effects must be taken into account to get good quality devices. Charging effects can be overcome by application of a sub-nanoscale removable conductive layer on top of the resist. Proximity error correction effects are overcome using specialised design correction software.
1.Silicon Manufacturing
a) Czochralski method.
b) Wafer Manufacturing
c) Crystal structure
2.Photolithography
a) Photoresists
b) Photomask and Reticles
c) Patterning
Lithographic photomasks are typically transparent fused silica blanks covered with a pattern defined with a chrome metal-absorbing film. Photomasks are used at wavelengths of 365 nm, 248 nm, and 193 nm. Photomasks have also been developed for other forms of radiation such as 157 nm, 13.5 nm (EUV), X-ray, electrons, and ions; but these require entirely new materials for the substrate and the pattern film.
When employees are trained to work safely they should be able to anticipate and avoid injury from job-related hazards.
• Surface Preparation
• Coating (Spin Casting)
• Pre-Bake (Soft Bake)
• Alignment
• Exposure
• Development
• Post-Bake (Hard Bake)
• Processing Using the Photoresist as a Masking Film
• Stripping
• Post Processing Cleaning (Ashing)
Nanoimprint Lithography head points:
Approaches: thermal and UV NIL
Properties of NIL
Overview. of NIL
Thermal NIL resists.
Residual layer after NIL.
NIL for large features (more difficult than small one).
Room temperature NIL, reverse NIL, inking.
NIL of bulk resist (polymer sheet, pellets).
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Radiation-Cured Components & Their Use in Hard, Scratch Resistant Coating App...Sartomer
This presentation covers the following topics:
- Current and potential hard coat applications
- Description of products tested and their attributes
- Taber haze and Taber abrasion resistance
- Weathering resistance
- Barrier properties of a typical hard coat formulation
- Polyurethane dispersion products (PUDs)
You can visit Sartomer at Sartomer.com and follow them on Twitter @SartomerGlobal and on LinkedIn.
Discusses about Microsystems Technologies ,Micro Stereolithography.Basic concepts and terminology such as Selected traditional micromachining photolithography and mask design, wet and dry bulk etching, bonding, thin film deposition and removal, metallization, sacrificial processes, other inorganic processes, electroplating
Final project report on grocery store management system..pdfKamal Acharya
In today’s fast-changing business environment, it’s extremely important to be able to respond to client needs in the most effective and timely manner. If your customers wish to see your business online and have instant access to your products or services.
Online Grocery Store is an e-commerce website, which retails various grocery products. This project allows viewing various products available enables registered users to purchase desired products instantly using Paytm, UPI payment processor (Instant Pay) and also can place order by using Cash on Delivery (Pay Later) option. This project provides an easy access to Administrators and Managers to view orders placed using Pay Later and Instant Pay options.
In order to develop an e-commerce website, a number of Technologies must be studied and understood. These include multi-tiered architecture, server and client-side scripting techniques, implementation technologies, programming language (such as PHP, HTML, CSS, JavaScript) and MySQL relational databases. This is a project with the objective to develop a basic website where a consumer is provided with a shopping cart website and also to know about the technologies used to develop such a website.
This document will discuss each of the underlying technologies to create and implement an e- commerce website.
Water scarcity is the lack of fresh water resources to meet the standard water demand. There are two type of water scarcity. One is physical. The other is economic water scarcity.
CFD Simulation of By-pass Flow in a HRSG module by R&R Consult.pptxR&R Consult
CFD analysis is incredibly effective at solving mysteries and improving the performance of complex systems!
Here's a great example: At a large natural gas-fired power plant, where they use waste heat to generate steam and energy, they were puzzled that their boiler wasn't producing as much steam as expected.
R&R and Tetra Engineering Group Inc. were asked to solve the issue with reduced steam production.
An inspection had shown that a significant amount of hot flue gas was bypassing the boiler tubes, where the heat was supposed to be transferred.
R&R Consult conducted a CFD analysis, which revealed that 6.3% of the flue gas was bypassing the boiler tubes without transferring heat. The analysis also showed that the flue gas was instead being directed along the sides of the boiler and between the modules that were supposed to capture the heat. This was the cause of the reduced performance.
Based on our results, Tetra Engineering installed covering plates to reduce the bypass flow. This improved the boiler's performance and increased electricity production.
It is always satisfying when we can help solve complex challenges like this. Do your systems also need a check-up or optimization? Give us a call!
Work done in cooperation with James Malloy and David Moelling from Tetra Engineering.
More examples of our work https://www.r-r-consult.dk/en/cases-en/
About
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Technical Specifications
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
Key Features
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface
• Compatible with MAFI CCR system
• Copatiable with IDM8000 CCR
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
Application
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Cosmetic shop management system project report.pdfKamal Acharya
Buying new cosmetic products is difficult. It can even be scary for those who have sensitive skin and are prone to skin trouble. The information needed to alleviate this problem is on the back of each product, but it's thought to interpret those ingredient lists unless you have a background in chemistry.
Instead of buying and hoping for the best, we can use data science to help us predict which products may be good fits for us. It includes various function programs to do the above mentioned tasks.
Data file handling has been effectively used in the program.
The automated cosmetic shop management system should deal with the automation of general workflow and administration process of the shop. The main processes of the system focus on customer's request where the system is able to search the most appropriate products and deliver it to the customers. It should help the employees to quickly identify the list of cosmetic product that have reached the minimum quantity and also keep a track of expired date for each cosmetic product. It should help the employees to find the rack number in which the product is placed.It is also Faster and more efficient way.
Student information management system project report ii.pdfKamal Acharya
Our project explains about the student management. This project mainly explains the various actions related to student details. This project shows some ease in adding, editing and deleting the student details. It also provides a less time consuming process for viewing, adding, editing and deleting the marks of the students.
Hybrid optimization of pumped hydro system and solar- Engr. Abdul-Azeez.pdffxintegritypublishin
Advancements in technology unveil a myriad of electrical and electronic breakthroughs geared towards efficiently harnessing limited resources to meet human energy demands. The optimization of hybrid solar PV panels and pumped hydro energy supply systems plays a pivotal role in utilizing natural resources effectively. This initiative not only benefits humanity but also fosters environmental sustainability. The study investigated the design optimization of these hybrid systems, focusing on understanding solar radiation patterns, identifying geographical influences on solar radiation, formulating a mathematical model for system optimization, and determining the optimal configuration of PV panels and pumped hydro storage. Through a comparative analysis approach and eight weeks of data collection, the study addressed key research questions related to solar radiation patterns and optimal system design. The findings highlighted regions with heightened solar radiation levels, showcasing substantial potential for power generation and emphasizing the system's efficiency. Optimizing system design significantly boosted power generation, promoted renewable energy utilization, and enhanced energy storage capacity. The study underscored the benefits of optimizing hybrid solar PV panels and pumped hydro energy supply systems for sustainable energy usage. Optimizing the design of solar PV panels and pumped hydro energy supply systems as examined across diverse climatic conditions in a developing country, not only enhances power generation but also improves the integration of renewable energy sources and boosts energy storage capacities, particularly beneficial for less economically prosperous regions. Additionally, the study provides valuable insights for advancing energy research in economically viable areas. Recommendations included conducting site-specific assessments, utilizing advanced modeling tools, implementing regular maintenance protocols, and enhancing communication among system components.
2. What is Lithography?
2
Lithography(Greek word) means printing is done
on stone.
Photo-litho-graphy: light-silicon wafer-printing.
Components in photolithography:
(1)Mask (2)Photoresist (3)UV exposure system
4. Steps Used in Photolithography
Surface cleaning
Spin coating with photoresist
Soft baking
Mask alignment
Exposure
Development
Hard baking
Plasma Etch-Or Add Layer
Post process cleaning
Final Inspection
4
5. Surface Cleaning
5
Typical contaminants that must be removed prior to
photoresist coating: dust from scribing or cleaving
(minimized by laser scribing)
photoresist residue from previous photolithography
(minimized by performing oxygen plasma ashing)
atmospheric dust (minimized by good clean room
practice)
bacteria (minimized by good DI water system)
6. 6
films from other sources:
-solvent residue
-H2 O residue
-photoresist or developer residue
-silicone
For particularly troublesome grease, oil, or wax
stains: Start with 2-5 min. soak in 1,1,1-
trichloroethane (TCA) or trichloroethylene (TCE)
with ultrasonic agitation prior to acetone
7. Spin coating with photoresist
7
Wafer is held on a spinner chuck by vacuum and
resist is coated to uniform thickness by spin coating.
Typically 3000 - 6000 rpm for 15-30 seconds.
Resist thickness is set by: primarily resist viscosity
secondarily spinner rotational speed
Most resist thicknesses are 1-2 μm for commercial Si
processes.
8. 8
Resist thickness is given by
t =square of( kp)/root of(w1),
where,
k = spinner constant, typically 80-100
p = resist solids content in percent
w = spinner rotational speed in rpm/1000
10. Soft baking
10
Used to evaporate the coating solvent.
Typical thermal cycles:90-100°C for 20 min. in a
convection oven 75-85°C for 45 sec. on a hot plate
Microwave heating or IR lamps are also used
Optimizes light absorbance characteristics of
photoresist
14. 14
Contact printing capable of high resolution but has
unacceptable defect densities. May be used in
Development but not manufacturing.
Proximity printing cannot easily print features below
a few mm in line width. Used in nano-technolgy.
Projection printing provides high resolution and low
defect densities and dominates today.They print » 50
wafers/hour.
16. Development
16
Soluble areas of photoresist are dissolved by
developer chemical
Visible patterns appear on wafer
Quality measures:
–line resolution
–uniformity
–particles & defects
17. Hard baking
17
Used to stabilize and harden the developed
photoresist prior to processing steps that the resist
will mask.
Postbake removes any remaining traces of the
coating solvent or developer.
Higher temperature than soft bake (120-150 degree)