The document summarizes research on using MEMS (Micro-Electro-Mechanical Systems) technology for seismology applications. It provides an overview of MEMS, discusses MEMS accelerometers and their commercial availability. It also describes the noise and detection requirements for seismology and current R&D efforts funded by DOE to develop low-noise MEMS seismometers, including projects using inductive, optical, and fluidic sensing techniques with proof masses up to 2 grams.
The document is an illustrated guide to the process of manufacturing computer chips. It describes 12 key steps: (1) Silicon is extracted from sand and purified into crystal ingots; (2) The ingots are sliced into wafers and polished; (3) Photolithography is used to etch circuit patterns on the wafers; (4) The wafers undergo doping through ion implantation; (5) Copper is electroplated to form connections; (6) Multiple metal layers are added through deposition and polishing; (7) The wafers are tested and sorted before being sliced into dies; (8) The dies are packaged with a substrate and heatspreader; (9)
1. The document describes the key steps in the manufacturing process for computer chips, including transforming silicon ingots into wafers and fabricating transistors on the wafers through photolithography, etching, ion implantation, and other processes.
2. It provides illustrations at the scale of an entire 300mm wafer and also zoomed in to the individual transistor level to show how features are patterned down to 50-200nm in size.
3. The process involves hundreds of precise steps to create layered structures through techniques like thermal oxidation, deposition of materials like silicon dioxide and polysilicon, and selective removal of portions by etching.
[Ultracode Munich Meetup #9] From Sand to Silicon by Christian AnderkaBeMyApp
The document summarizes the key steps in manufacturing computer chips from raw silicon to finished processors:
1) Silicon is purified from sand and melted into crystal ingots, then sliced into wafers and polished.
2) Photolithography is used to etch circuit patterns on the wafers by applying photoresist, exposing it to UV light through masks, and removing the exposed resist.
3) Impurities are implanted through ion implantation to dope the silicon and alter conductivity in specific areas.
4) Multiple layers of conductors and insulators are deposited and patterned to create transistors, connect them, and build logic circuits.
5) The finished wafer is tested, cut into dies
The document discusses the shift to 3D integrated circuit structures and the manufacturing and process control challenges involved. It describes how 3D NAND flash memory uses a vertically stacked structure to increase density in a cost-effective manner. Implementing FinFET transistors also builds vertically by using fin-shaped gates on three sides to improve performance. Significant challenges include precise control over multiple thin film depositions and complex etch processes needed for these 3D structures. Advanced metrology and inspection is required to monitor critical dimensions, material properties, defects and other parameters in three dimensions.
Roll-to roll printing; making new forms of displays, solar cells and other te...Jeffrey Funk
This document discusses roll-to-roll printing as a technology for manufacturing electronic devices. It notes that roll-to-roll printing has advantages over other techniques like photolithography in that it can achieve very low production costs due to its continuous, high-throughput process. However, it has lower resolution. Key challenges include developing materials that can be easily printed from a roll and that have the necessary electronic properties. The document provides examples of how roll-to-roll printing could be applied to products like organic displays, solar cells, and integrated circuits. It also compares the scaling and costs of roll-to-roll equipment to traditional manufacturing methods.
The document summarizes photonics research activities at IIT Madras across various laboratories and departments. It discusses current funding sources, national and international collaborations, and future opportunities in areas such as telecommunications, fiber lasers, biophotonics, and silicon photonics. Key research includes high power fiber lasers, tunable MEMS gratings, all-optical signal processing, integrated photonic devices, fiber Bragg gratings, STED microscopy, and plasmon-enhanced fluorescence. The activities span basic research through commercialization.
Track e the road from 2 d to 3d integration -synopsyschiportal
This document discusses the transition from 2D to 3D integrated circuit design. It provides a brief history of stacking and through-silicon vias. While 3D integration provides benefits like higher bandwidth and smaller footprint, there are also challenges to address like cost overhead, yield loss, and complex design tools/flows. Key issues discussed are the large number and placement of through-silicon vias, and their impact on performance, power, and yield through stress proximity effects. Overall the document outlines both the promise and challenges of 3D design.
The document is an illustrated guide to the process of manufacturing computer chips. It describes 12 key steps: (1) Silicon is extracted from sand and purified into crystal ingots; (2) The ingots are sliced into wafers and polished; (3) Photolithography is used to etch circuit patterns on the wafers; (4) The wafers undergo doping through ion implantation; (5) Copper is electroplated to form connections; (6) Multiple metal layers are added through deposition and polishing; (7) The wafers are tested and sorted before being sliced into dies; (8) The dies are packaged with a substrate and heatspreader; (9)
1. The document describes the key steps in the manufacturing process for computer chips, including transforming silicon ingots into wafers and fabricating transistors on the wafers through photolithography, etching, ion implantation, and other processes.
2. It provides illustrations at the scale of an entire 300mm wafer and also zoomed in to the individual transistor level to show how features are patterned down to 50-200nm in size.
3. The process involves hundreds of precise steps to create layered structures through techniques like thermal oxidation, deposition of materials like silicon dioxide and polysilicon, and selective removal of portions by etching.
[Ultracode Munich Meetup #9] From Sand to Silicon by Christian AnderkaBeMyApp
The document summarizes the key steps in manufacturing computer chips from raw silicon to finished processors:
1) Silicon is purified from sand and melted into crystal ingots, then sliced into wafers and polished.
2) Photolithography is used to etch circuit patterns on the wafers by applying photoresist, exposing it to UV light through masks, and removing the exposed resist.
3) Impurities are implanted through ion implantation to dope the silicon and alter conductivity in specific areas.
4) Multiple layers of conductors and insulators are deposited and patterned to create transistors, connect them, and build logic circuits.
5) The finished wafer is tested, cut into dies
The document discusses the shift to 3D integrated circuit structures and the manufacturing and process control challenges involved. It describes how 3D NAND flash memory uses a vertically stacked structure to increase density in a cost-effective manner. Implementing FinFET transistors also builds vertically by using fin-shaped gates on three sides to improve performance. Significant challenges include precise control over multiple thin film depositions and complex etch processes needed for these 3D structures. Advanced metrology and inspection is required to monitor critical dimensions, material properties, defects and other parameters in three dimensions.
Roll-to roll printing; making new forms of displays, solar cells and other te...Jeffrey Funk
This document discusses roll-to-roll printing as a technology for manufacturing electronic devices. It notes that roll-to-roll printing has advantages over other techniques like photolithography in that it can achieve very low production costs due to its continuous, high-throughput process. However, it has lower resolution. Key challenges include developing materials that can be easily printed from a roll and that have the necessary electronic properties. The document provides examples of how roll-to-roll printing could be applied to products like organic displays, solar cells, and integrated circuits. It also compares the scaling and costs of roll-to-roll equipment to traditional manufacturing methods.
The document summarizes photonics research activities at IIT Madras across various laboratories and departments. It discusses current funding sources, national and international collaborations, and future opportunities in areas such as telecommunications, fiber lasers, biophotonics, and silicon photonics. Key research includes high power fiber lasers, tunable MEMS gratings, all-optical signal processing, integrated photonic devices, fiber Bragg gratings, STED microscopy, and plasmon-enhanced fluorescence. The activities span basic research through commercialization.
Track e the road from 2 d to 3d integration -synopsyschiportal
This document discusses the transition from 2D to 3D integrated circuit design. It provides a brief history of stacking and through-silicon vias. While 3D integration provides benefits like higher bandwidth and smaller footprint, there are also challenges to address like cost overhead, yield loss, and complex design tools/flows. Key issues discussed are the large number and placement of through-silicon vias, and their impact on performance, power, and yield through stress proximity effects. Overall the document outlines both the promise and challenges of 3D design.
Seismic sensors and networks in Hawaii monitor earthquakes and volcanoes on the Big Island. The USGS operates several types of seismic stations, including short period and broadband sensors. Other groups also operate stations, and data is shared. The network helps track earthquake activity and volcanic processes like movement of magma. Hawaii experiences large, damaging quakes due to active faults and volcanism. Better seismic coverage could help provide faster warnings for events and tsunamis, and protect infrastructure like the Mauna Kea observatories. The USGS works to modernize statewide monitoring through the ANSS program.
Seismic sensors and networks in Hawaii monitor earthquakes and volcanoes on the Big Island. The USGS operates several types of seismic stations, including short period and broadband sensors. Other groups also operate stations, and data is shared. The network helps track earthquake activity and volcanic processes. Hawaii experiences large earthquakes that can cause tsunamis, making seismic monitoring important for hazards assessment and early warning. Efforts aim to expand the network and coordination to improve earthquake reporting and monitoring statewide.
This document discusses various seismic methods and concepts. It begins by defining the critical angle and Snell's law for refraction seismology. It then distinguishes between the reflection and refraction seismic methods. The refraction method involves keeping the source fixed while spacing receivers further from the source, resulting in an x-t plot. Various seismic arrivals are described like direct waves, reflections, and refractions. Factors that affect seismic waves like attenuation and energy partitioning are also summarized. The document concludes by covering seismic sources, instruments, and refraction seismic methods.
This document provides an overview of wireless sensor networks. It discusses what sensor networks are and their applications in areas like military, industry, science and more. It describes the constraints of sensor networks like limited battery power, storage and processing. It outlines several research challenges in sensor networks including energy efficiency, scalability, heterogeneity and self-configuration. The document also discusses various layers in the sensor network protocol stack from the physical layer to the application layer and highlights issues at each layer.
This document discusses the potential applications of embedded networked sensing systems. It outlines several motivating applications including monitoring seismic structure response, tracking contaminant transport, and monitoring ecosystems and biocomplexity. For each application, it describes the relevant science goals and how embedded networked sensing could provide data to advance understanding. It also discusses some of the research challenges for these applications and outlines initial steps being taken. The document concludes by discussing enabling technologies for embedded networked sensing systems.
This document provides a short overview of the RAYFRACT seismic refraction data interpretation software. It lists the main functions of the software such as creating new profiles, importing seismic data, reviewing first breaks, smoothing inversions, automatic and manual refractor mapping, wavefront modeling, automatic picking, and ASCII data import. More detailed instructions are available in the software manual and PDF help files on the company's website.
The document discusses seismic data networks, instruments, and data centers. It describes the different types of seismic networks including global, regional, local, temporary, and seismic arrays. It also discusses several major seismic data centers such as NEIC, ORFEUS, IRIS, ISC, GEOFON, EMSC, and EarthScope. Finally, it covers various seismic observables including translations measured as displacement, velocity, and acceleration. It also discusses strain, rotations, and the ranges of measurements for different seismic phenomena.
IP. Lacharmoise - InnovativeThin Film Devices for Photovoltaic Automotive App...ponencias.eurosurfas2011
Cetemmsa is a technology center specialized in applied research in flexible surface treatments for printed electronics. It aims to transfer technology to companies through device integration, prototyping, and industrial engineering to provide a competitive edge. Its capabilities include materials and printing research, as well as the development of printed sensors, circuits, photovoltaics, and solid state lighting through techniques like inkjet printing, screen printing, and roll-to-roll processing. One project focuses on developing flexible organic photovoltaic modules for automotive applications using printing methods.
Micro-electro-mechanical systems (MEMS) integrate sensors, actuators and electronics onto a silicon chip through microfabrication. Silicon is commonly used due to its availability and ability to incorporate electronics. MEMS fabrication uses processes like deposition, lithography, etching and bonding. They are used in applications like switches and tunable devices. MOEMS merges MEMS with micro-optics to sense and manipulate optical signals on a small scale. SOI technology uses a layered silicon-insulator-silicon substrate to improve device performance over conventional silicon substrates. Optical switching provides high switching capacity needed for high bit rate transmission.
This document provides an overview of micro-electro-mechanical systems (MEMS). MEMS are tiny devices between 1 to 100 micrometers in size that combine electrical and mechanical components. They are fabricated using modified semiconductor manufacturing processes. Common MEMS applications include inkjet printer heads, accelerometers in vehicles and electronics, gyroscopes, microphones, pressure sensors, displays, and biosensors. Materials used in MEMS include silicon, polymers, metals, and ceramics. Key MEMS processes are thin film deposition, patterning, and die preparation. Current challenges to developing MEMS include limited access to fabrication facilities and expertise.
This document discusses innovation and collaboration at IBM Research. It provides an overview of IBM Research, highlighting its legacy of world-class research achievements dating back to 1944. It emphasizes IBM Research's culture of innovation through external recognition such as Nobel Prizes and national medals. The document also discusses how IBM Research collaborates globally with partners to develop new technologies and solutions that impact products, scientific communities, and society. It outlines IBM Research's multidisciplinary approach and strategies to drive innovative research through technology, systems, software, and services.
This is a presentation I gave about MEMS processing at Tyndall in 2008. It goes over the various fabrication possibilities at Tyndall.
I personally like slide 3 and 4 trying to hook the history of watch making in with MEMS fabrication. This drive to go smaller and smaller with watch making can also be seen in electronics. Coincidentally, the first MEMS device was a time-keeping pendulum.
This document discusses Micro Electro Mechanical Systems (MEMS). It defines MEMS as engineering systems that perform electrical and mechanical functions using components measured in micrometers. The document outlines the timeline of MEMS development. It describes common MEMS components, applications in automotive, healthcare, aerospace and more. Finally, it explains key MEMS fabrication processes like photolithography, deposition, etching and different micromachining techniques.
MEMS (micro-electro-mechanical systems) combine mechanical and electrical functions on a single chip using microfabrication technology. The fabrication process for MEMS is similar to that used for making electronic circuits and involves steps such as chemical deposition, physical deposition, lithography, and etching. MEMS can be used to develop microsensors using materials like metals, polymers, ceramics, semiconductors, and composites. Common applications of MEMS include accelerometers, which have advantages over conventional accelerometers such as lower cost, smaller size, and lower power requirements.
MEMS (micro-electro-mechanical systems) combine mechanical and electrical functions on a single chip using microfabrication technology. The fabrication process for MEMS is similar to that used for making electronic circuits and involves steps such as chemical deposition, physical deposition, lithography, and etching. MEMS can be used to create microsensors, micromachines, and microactuators from materials like metals, polymers, ceramics, and semiconductors. Some applications of MEMS technology include accelerometers in devices like game controllers and communications equipment.
This document provides a review of MEMS (Microelectromechanical Systems) and NEMS (Nanoelectromechanical Systems) technology. It discusses the history and components of MEMS/NEMS, including sensors, actuators, and fabrication processes like deposition, lithography, and etching. The document notes that MEMS businesses are currently estimated to be around $50 billion and include applications in automobiles, phones, and printers. MEMS/NEMS allow the development of very small sensor systems that can impart intelligence everywhere. In conclusion, the author states that MEMS/NEMS have significant potential and may create an industry that exceeds the size and impact of the integrated circuit industry.
MEMS manufacturing involves three basic processes:
1) Deposition processes are used to deposit thin films and include techniques like CVD, PVD, electrodeposition, and thermal oxidation.
2) Patterning techniques like photolithography are used to define specific areas for etching or deposition.
3) Etching processes like wet and dry etching are used to remove material and leave behind the desired patterns.
MEMS can be made from materials like silicon, polymers and metals using these processes and are widely used in applications like sensors, actuators and displays.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. The term used to define MEMS varies in different parts of the world. In the United States they are predominantly called MEMS, while in some other parts of the world they are called “Microsystems Technology” or “micromachined devices”.
Micro-electromechanical systems (MEMS) combine electrical and mechanical components on a small scale, ranging from sub-micrometers to millimeters. MEMS are fabricated using integrated circuit processes like deposition, lithography, and etching to create structures out of silicon, polymers, and metals. They have a variety of applications as sensors, including in pressure sensors, accelerometers, and tire pressure monitors. MEMS provide advantages like low cost and improved performance compared to macro-scale components.
IRJET- Fabrication, Sensing and Applications of NEMS/MEMS TechnologyIRJET Journal
1. The document discusses various fabrication methods for MEMS/NEMS devices, including surface micromachining, silicon on insulator (SOI) technology, and LIGA.
2. Surface micromachining provides a CMOS-compatible technique using sacrificial layers to create free-standing structures. SOI technology simplifies the fabrication process and improves device isolation using a buried oxide layer.
3. LIGA is an alternative non-silicon process that uses X-ray lithography to define thick resist patterns for high aspect ratio metal or ceramic microstructures.
4. Potential applications of MEMS/NEMS devices discussed include sensors for automotive, consumer products, RF systems, displays, bi
This document discusses the history and characteristics of microelectromechanical systems (MEMS). It outlines major developments in MEMS from the 1950s to the 2000s, including the first silicon strain gauges and pressure sensors, as well as the invention of surface micromachining. The document also describes three key characteristics of MEMS: miniaturization which allows for small, sensitive devices; microelectronics integration which combines mechanical and electronic components; and parallel fabrication which uses lithography to precisely pattern multiple identical structures.
Seismic sensors and networks in Hawaii monitor earthquakes and volcanoes on the Big Island. The USGS operates several types of seismic stations, including short period and broadband sensors. Other groups also operate stations, and data is shared. The network helps track earthquake activity and volcanic processes like movement of magma. Hawaii experiences large, damaging quakes due to active faults and volcanism. Better seismic coverage could help provide faster warnings for events and tsunamis, and protect infrastructure like the Mauna Kea observatories. The USGS works to modernize statewide monitoring through the ANSS program.
Seismic sensors and networks in Hawaii monitor earthquakes and volcanoes on the Big Island. The USGS operates several types of seismic stations, including short period and broadband sensors. Other groups also operate stations, and data is shared. The network helps track earthquake activity and volcanic processes. Hawaii experiences large earthquakes that can cause tsunamis, making seismic monitoring important for hazards assessment and early warning. Efforts aim to expand the network and coordination to improve earthquake reporting and monitoring statewide.
This document discusses various seismic methods and concepts. It begins by defining the critical angle and Snell's law for refraction seismology. It then distinguishes between the reflection and refraction seismic methods. The refraction method involves keeping the source fixed while spacing receivers further from the source, resulting in an x-t plot. Various seismic arrivals are described like direct waves, reflections, and refractions. Factors that affect seismic waves like attenuation and energy partitioning are also summarized. The document concludes by covering seismic sources, instruments, and refraction seismic methods.
This document provides an overview of wireless sensor networks. It discusses what sensor networks are and their applications in areas like military, industry, science and more. It describes the constraints of sensor networks like limited battery power, storage and processing. It outlines several research challenges in sensor networks including energy efficiency, scalability, heterogeneity and self-configuration. The document also discusses various layers in the sensor network protocol stack from the physical layer to the application layer and highlights issues at each layer.
This document discusses the potential applications of embedded networked sensing systems. It outlines several motivating applications including monitoring seismic structure response, tracking contaminant transport, and monitoring ecosystems and biocomplexity. For each application, it describes the relevant science goals and how embedded networked sensing could provide data to advance understanding. It also discusses some of the research challenges for these applications and outlines initial steps being taken. The document concludes by discussing enabling technologies for embedded networked sensing systems.
This document provides a short overview of the RAYFRACT seismic refraction data interpretation software. It lists the main functions of the software such as creating new profiles, importing seismic data, reviewing first breaks, smoothing inversions, automatic and manual refractor mapping, wavefront modeling, automatic picking, and ASCII data import. More detailed instructions are available in the software manual and PDF help files on the company's website.
The document discusses seismic data networks, instruments, and data centers. It describes the different types of seismic networks including global, regional, local, temporary, and seismic arrays. It also discusses several major seismic data centers such as NEIC, ORFEUS, IRIS, ISC, GEOFON, EMSC, and EarthScope. Finally, it covers various seismic observables including translations measured as displacement, velocity, and acceleration. It also discusses strain, rotations, and the ranges of measurements for different seismic phenomena.
IP. Lacharmoise - InnovativeThin Film Devices for Photovoltaic Automotive App...ponencias.eurosurfas2011
Cetemmsa is a technology center specialized in applied research in flexible surface treatments for printed electronics. It aims to transfer technology to companies through device integration, prototyping, and industrial engineering to provide a competitive edge. Its capabilities include materials and printing research, as well as the development of printed sensors, circuits, photovoltaics, and solid state lighting through techniques like inkjet printing, screen printing, and roll-to-roll processing. One project focuses on developing flexible organic photovoltaic modules for automotive applications using printing methods.
Micro-electro-mechanical systems (MEMS) integrate sensors, actuators and electronics onto a silicon chip through microfabrication. Silicon is commonly used due to its availability and ability to incorporate electronics. MEMS fabrication uses processes like deposition, lithography, etching and bonding. They are used in applications like switches and tunable devices. MOEMS merges MEMS with micro-optics to sense and manipulate optical signals on a small scale. SOI technology uses a layered silicon-insulator-silicon substrate to improve device performance over conventional silicon substrates. Optical switching provides high switching capacity needed for high bit rate transmission.
This document provides an overview of micro-electro-mechanical systems (MEMS). MEMS are tiny devices between 1 to 100 micrometers in size that combine electrical and mechanical components. They are fabricated using modified semiconductor manufacturing processes. Common MEMS applications include inkjet printer heads, accelerometers in vehicles and electronics, gyroscopes, microphones, pressure sensors, displays, and biosensors. Materials used in MEMS include silicon, polymers, metals, and ceramics. Key MEMS processes are thin film deposition, patterning, and die preparation. Current challenges to developing MEMS include limited access to fabrication facilities and expertise.
This document discusses innovation and collaboration at IBM Research. It provides an overview of IBM Research, highlighting its legacy of world-class research achievements dating back to 1944. It emphasizes IBM Research's culture of innovation through external recognition such as Nobel Prizes and national medals. The document also discusses how IBM Research collaborates globally with partners to develop new technologies and solutions that impact products, scientific communities, and society. It outlines IBM Research's multidisciplinary approach and strategies to drive innovative research through technology, systems, software, and services.
This is a presentation I gave about MEMS processing at Tyndall in 2008. It goes over the various fabrication possibilities at Tyndall.
I personally like slide 3 and 4 trying to hook the history of watch making in with MEMS fabrication. This drive to go smaller and smaller with watch making can also be seen in electronics. Coincidentally, the first MEMS device was a time-keeping pendulum.
This document discusses Micro Electro Mechanical Systems (MEMS). It defines MEMS as engineering systems that perform electrical and mechanical functions using components measured in micrometers. The document outlines the timeline of MEMS development. It describes common MEMS components, applications in automotive, healthcare, aerospace and more. Finally, it explains key MEMS fabrication processes like photolithography, deposition, etching and different micromachining techniques.
MEMS (micro-electro-mechanical systems) combine mechanical and electrical functions on a single chip using microfabrication technology. The fabrication process for MEMS is similar to that used for making electronic circuits and involves steps such as chemical deposition, physical deposition, lithography, and etching. MEMS can be used to develop microsensors using materials like metals, polymers, ceramics, semiconductors, and composites. Common applications of MEMS include accelerometers, which have advantages over conventional accelerometers such as lower cost, smaller size, and lower power requirements.
MEMS (micro-electro-mechanical systems) combine mechanical and electrical functions on a single chip using microfabrication technology. The fabrication process for MEMS is similar to that used for making electronic circuits and involves steps such as chemical deposition, physical deposition, lithography, and etching. MEMS can be used to create microsensors, micromachines, and microactuators from materials like metals, polymers, ceramics, and semiconductors. Some applications of MEMS technology include accelerometers in devices like game controllers and communications equipment.
This document provides a review of MEMS (Microelectromechanical Systems) and NEMS (Nanoelectromechanical Systems) technology. It discusses the history and components of MEMS/NEMS, including sensors, actuators, and fabrication processes like deposition, lithography, and etching. The document notes that MEMS businesses are currently estimated to be around $50 billion and include applications in automobiles, phones, and printers. MEMS/NEMS allow the development of very small sensor systems that can impart intelligence everywhere. In conclusion, the author states that MEMS/NEMS have significant potential and may create an industry that exceeds the size and impact of the integrated circuit industry.
MEMS manufacturing involves three basic processes:
1) Deposition processes are used to deposit thin films and include techniques like CVD, PVD, electrodeposition, and thermal oxidation.
2) Patterning techniques like photolithography are used to define specific areas for etching or deposition.
3) Etching processes like wet and dry etching are used to remove material and leave behind the desired patterns.
MEMS can be made from materials like silicon, polymers and metals using these processes and are widely used in applications like sensors, actuators and displays.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. The term used to define MEMS varies in different parts of the world. In the United States they are predominantly called MEMS, while in some other parts of the world they are called “Microsystems Technology” or “micromachined devices”.
Micro-electromechanical systems (MEMS) combine electrical and mechanical components on a small scale, ranging from sub-micrometers to millimeters. MEMS are fabricated using integrated circuit processes like deposition, lithography, and etching to create structures out of silicon, polymers, and metals. They have a variety of applications as sensors, including in pressure sensors, accelerometers, and tire pressure monitors. MEMS provide advantages like low cost and improved performance compared to macro-scale components.
IRJET- Fabrication, Sensing and Applications of NEMS/MEMS TechnologyIRJET Journal
1. The document discusses various fabrication methods for MEMS/NEMS devices, including surface micromachining, silicon on insulator (SOI) technology, and LIGA.
2. Surface micromachining provides a CMOS-compatible technique using sacrificial layers to create free-standing structures. SOI technology simplifies the fabrication process and improves device isolation using a buried oxide layer.
3. LIGA is an alternative non-silicon process that uses X-ray lithography to define thick resist patterns for high aspect ratio metal or ceramic microstructures.
4. Potential applications of MEMS/NEMS devices discussed include sensors for automotive, consumer products, RF systems, displays, bi
This document discusses the history and characteristics of microelectromechanical systems (MEMS). It outlines major developments in MEMS from the 1950s to the 2000s, including the first silicon strain gauges and pressure sensors, as well as the invention of surface micromachining. The document also describes three key characteristics of MEMS: miniaturization which allows for small, sensitive devices; microelectronics integration which combines mechanical and electronic components; and parallel fabrication which uses lithography to precisely pattern multiple identical structures.
MEMS (micro-electro-mechanical systems) are microscopic devices and integrated systems that combine electrical and mechanical components between 1-100 micrometers in size. They integrate sensors, actuators and electronics on a common silicon substrate through microfabrication technology. MEMS originated in the 1980s and are now used in automotive, biomedical, industrial and consumer applications. Some key advantages of MEMS include lower manufacturing costs, reduced size, and lower power consumption compared to macro-scale devices. Challenges include developing robust packaging and manufacturing processes for commercialization.
This document discusses microelectromechanical systems (MEMS) fabrication methods. It covers common MEMS fabrication processes like deposition, lithography, and etching. Deposition methods include chemical vapor deposition and physical vapor deposition to deposit thin films. Lithography involves transferring patterns to photosensitive materials using masks and radiation exposure. Etching is used to selectively remove materials, including wet etching using chemicals and dry etching using reactive ions. The document also discusses challenges with MEMS packaging, limited prototyping and manufacturing options, and the need for improved design tools.
MEMS stands for micro-electro-mechanical systems, which involves integrating sensors, actuators, and electronics onto a common silicon substrate using microfabrication technology. MEMS can be made from materials like gallium arsenide, titanium nickel, and piezoelectric materials. The main steps in fabricating MEMS are deposition, lithography, and etching - which allow for creating thin films and precisely etching patterns. In the future, MEMS technology is expected to enable cost reduction, increased functionality, improved reliability, decreased size, and decreased mass compared to conventional technologies.
Micro-electro-mechanical systems (MEMS) are tiny devices that convert electrical energy to mechanical motion and vice versa. There are three key steps to fabricating MEMS: deposition of thin films, patterning of the films, and etching to remove unwanted material. MEMS are commonly used in sensors and actuators due to their small size, low power consumption, and ability to integrate electronics and mechanical elements on a single chip. Common applications include accelerometers in smartphones, pressure sensors in cars, and medical devices.
This document provides a short overview of the RAYFRACT seismic refraction data interpretation software. It lists the main functions of the software such as creating new profiles, importing seismic data, reviewing first breaks, smoothing inversions, automatic and manual refractor mapping, wavefront modeling, automatic picking, and ASCII data import. More detailed instructions are available in the software manual and PDF help files on the company's website.
This document provides an overview of wireless sensor networks. It discusses what sensor networks are and their applications in areas like military, industry, science and more. It describes the constraints of sensor networks like limited battery power, storage and processing. It outlines several research challenges in areas like medium access control, routing, time synchronization and localization. The document discusses different aspects of designing sensor network protocols and architectures to address issues of energy efficiency, scalability, heterogeneity and self-configuration.
This document discusses the potential applications of embedded networked sensing systems. It outlines three main applications: 1) seismic structure monitoring to better understand building and soil responses, 2) contaminant transport monitoring to track contaminant movement, and 3) ecosystem monitoring to study wildlife populations over time. The document also discusses enabling technologies, challenges, and a taxonomy for classifying different embedded sensing systems.
The document summarizes research on using MEMS (Micro-Electro-Mechanical Systems) technology for seismology applications. It provides an overview of MEMS, discusses MEMS accelerometers and their commercial availability. It also covers noise and detection theory, current R&D efforts funded by DOE to develop low-noise MEMS seismometers, and the outlook for using MEMS in seismology. Key challenges include achieving large proof masses, weak springs, and low noise at low frequencies needed for weak motion seismology.
The document discusses seismic data networks, instruments, and data centers. It describes the different types of seismic networks including global, regional, local, temporary, and seismic arrays. It also discusses several major seismic data centers such as NEIC, ORFEUS, IRIS, ISC, GEOFON, EMSC, and EarthScope. Finally, it covers various seismic observables including translations (displacement, velocity, acceleration), strain, and rotations that seismometers are capable of measuring.
The document describes a wireless GPS wristwatch tracking solution called TIDGET. TIDGET is a low power GPS tracking device developed by NAVSYS for the US Army. It uses a client/server approach to send raw GPS data through a ZigBee wireless link to a LocatorNet server for processing. The server uses software defined radio to compute positions from the GPS data. TIDGET can operate for over 30 days on a wristwatch battery by offloading GPS processing to the server. A web portal allows users to access location data from the tracking devices.
This document provides a tutorial about a seismic sensor network. It discusses:
1) The special demands of seismic and acoustic applications including large-scale deployment, challenged networks, and remote monitoring requirements.
2) An overview of the software and hardware used in the network including the CDCCs, Q330 data loggers, Duiker data collection software, and DTS remote management software.
3) How to assemble a seismic node in 30 minutes by connecting sensors, data loggers, and wireless nodes together and reprogramming the nodes.
The HP MEMS sensor demonstrates potential for use in seismic imaging applications by providing a flat frequency response down to DC and low noise floor of less than 10 ng/√Hz. Testing at the USGS confirmed noise levels matching the lowest levels on Earth and matching signals down to 25 mHz compared to a reference sensor. A custom ASIC integrated circuit is being developed to enable low power sensors for dense wireless arrays to further improve seismic image resolution.
This document provides an overview of seismic waves:
1) It describes the three main types of seismic waves - P waves, S waves, and surface waves - and how they propagate through the Earth.
2) Key concepts discussed include body waves that travel through the Earth's interior and surface waves that travel along the Earth's surface.
3) The document also discusses seismic wave properties like velocity, period, wavelength, and attenuation as they travel through different Earth layers and are affected by geological structures.
The document discusses various sensor technologies and considerations for sensing systems. It covers topics such as phase linearity, transducer terminology, sensor categorization based on physical phenomena and measuring mechanism, specifications of sensors including accuracy and resolution, strain gauges, acceleration sensing, force sensing, displacement sensing, velocity sensing, shock sensing, angular motion sensing, MEMS technology, and considerations for designing sensing systems. The key aspects covered are the operating principles, advantages, and limitations of different sensor types.
This document provides an overview of seismic waves:
1) It describes the three main types of seismic waves - P waves, S waves, and surface waves - and how they propagate through the Earth.
2) Key concepts discussed include body waves that travel through the Earth's interior and surface waves that travel along the Earth's surface.
3) The document also discusses seismic wave properties like velocity, period, wavelength, and attenuation as they travel through different Earth layers and are affected by subsurface structures.
An illumination is a decorative embellishment added to handwritten manuscripts before the invention of the printing press. It enhances pages with gold leaf, silver, or other colors. Illuminated letters were enlarged and colored at the start of paragraphs to draw attention. Images of animals, plants, or mythical creatures were sometimes incorporated into the letters. Monks and nuns created illuminated manuscripts in monasteries, adding illuminations to important documents by request of royalty or religious leaders to make them appear more significant. The tradition originated in ancient Egypt and continued for hundreds of years in medieval Europe. Creating illuminations required specialized roles of parchment maker, scribe, illuminator, and bookbinder working together. Illuminations highlighted a time when reading
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive function. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms.
This document discusses methods for calculating illumination levels in indoor spaces. It describes the lumen method, which uses calculations involving flux, illumination levels, room dimensions, and reflectance values to determine lighting requirements. It also covers utilization factors, maintenance factors, glare indices, and considerations for lighting layout and control of glare. The goal is to provide uniform illumination while avoiding discomfort glare through analytical lighting design methods.
This document summarizes a lecture on power system protection and transient stability. It discusses radial and networked power system protection schemes, including inverse-time overcurrent relays, directional relays, impedance relays, and differential relays. It also covers sequence of events recording, fault location using GPS, and an overview of power system transient stability.
This document provides information on advanced lighting controls and mandatory control requirements for lighting systems. It discusses why lighting control is important, including user needs, legal codes, and energy efficiency. The document outlines mandatory control requirements from energy codes, including automatic shutoff controls, space controls, and occupancy sensor requirements. It also discusses control requirements for exterior lighting, additional controls for special applications, and considerations for green building projects. The document provides an overview of passive and active lighting control strategies and examples of sensor specifications and room layout diagrams.
Instrument to measure the bidirectional reflectanceajsatienza
This instrument measures the bidirectional reflectance distribution function (BRDF) of surfaces with the following properties:
1. It measures the BRDF for eight illumination angles from 0 to 65 degrees, three colors (475, 570, 658 nm), and over 100 selected viewing angles.
2. The viewing zenith angles range from 5 to 65 degrees, and the azimuth angles range from 0 to ±180 degrees relative to the illumination direction.
3. Tests show it can measure the BRDF of flat surfaces with a precision of 1-5% and an accuracy of 10% of the measured reflectance.
This document provides an overview of wound healing, its functions, stages, mechanisms, factors affecting it, and complications.
A wound is a break in the integrity of the skin or tissues, which may be associated with disruption of the structure and function.
Healing is the body’s response to injury in an attempt to restore normal structure and functions.
Healing can occur in two ways: Regeneration and Repair
There are 4 phases of wound healing: hemostasis, inflammation, proliferation, and remodeling. This document also describes the mechanism of wound healing. Factors that affect healing include infection, uncontrolled diabetes, poor nutrition, age, anemia, the presence of foreign bodies, etc.
Complications of wound healing like infection, hyperpigmentation of scar, contractures, and keloid formation.
Philippine Edukasyong Pantahanan at Pangkabuhayan (EPP) CurriculumMJDuyan
(𝐓𝐋𝐄 𝟏𝟎𝟎) (𝐋𝐞𝐬𝐬𝐨𝐧 𝟏)-𝐏𝐫𝐞𝐥𝐢𝐦𝐬
𝐃𝐢𝐬𝐜𝐮𝐬𝐬 𝐭𝐡𝐞 𝐄𝐏𝐏 𝐂𝐮𝐫𝐫𝐢𝐜𝐮𝐥𝐮𝐦 𝐢𝐧 𝐭𝐡𝐞 𝐏𝐡𝐢𝐥𝐢𝐩𝐩𝐢𝐧𝐞𝐬:
- Understand the goals and objectives of the Edukasyong Pantahanan at Pangkabuhayan (EPP) curriculum, recognizing its importance in fostering practical life skills and values among students. Students will also be able to identify the key components and subjects covered, such as agriculture, home economics, industrial arts, and information and communication technology.
𝐄𝐱𝐩𝐥𝐚𝐢𝐧 𝐭𝐡𝐞 𝐍𝐚𝐭𝐮𝐫𝐞 𝐚𝐧𝐝 𝐒𝐜𝐨𝐩𝐞 𝐨𝐟 𝐚𝐧 𝐄𝐧𝐭𝐫𝐞𝐩𝐫𝐞𝐧𝐞𝐮𝐫:
-Define entrepreneurship, distinguishing it from general business activities by emphasizing its focus on innovation, risk-taking, and value creation. Students will describe the characteristics and traits of successful entrepreneurs, including their roles and responsibilities, and discuss the broader economic and social impacts of entrepreneurial activities on both local and global scales.
Temple of Asclepius in Thrace. Excavation resultsKrassimira Luka
The temple and the sanctuary around were dedicated to Asklepios Zmidrenus. This name has been known since 1875 when an inscription dedicated to him was discovered in Rome. The inscription is dated in 227 AD and was left by soldiers originating from the city of Philippopolis (modern Plovdiv).
ISO/IEC 27001, ISO/IEC 42001, and GDPR: Best Practices for Implementation and...PECB
Denis is a dynamic and results-driven Chief Information Officer (CIO) with a distinguished career spanning information systems analysis and technical project management. With a proven track record of spearheading the design and delivery of cutting-edge Information Management solutions, he has consistently elevated business operations, streamlined reporting functions, and maximized process efficiency.
Certified as an ISO/IEC 27001: Information Security Management Systems (ISMS) Lead Implementer, Data Protection Officer, and Cyber Risks Analyst, Denis brings a heightened focus on data security, privacy, and cyber resilience to every endeavor.
His expertise extends across a diverse spectrum of reporting, database, and web development applications, underpinned by an exceptional grasp of data storage and virtualization technologies. His proficiency in application testing, database administration, and data cleansing ensures seamless execution of complex projects.
What sets Denis apart is his comprehensive understanding of Business and Systems Analysis technologies, honed through involvement in all phases of the Software Development Lifecycle (SDLC). From meticulous requirements gathering to precise analysis, innovative design, rigorous development, thorough testing, and successful implementation, he has consistently delivered exceptional results.
Throughout his career, he has taken on multifaceted roles, from leading technical project management teams to owning solutions that drive operational excellence. His conscientious and proactive approach is unwavering, whether he is working independently or collaboratively within a team. His ability to connect with colleagues on a personal level underscores his commitment to fostering a harmonious and productive workplace environment.
Date: May 29, 2024
Tags: Information Security, ISO/IEC 27001, ISO/IEC 42001, Artificial Intelligence, GDPR
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Leveraging Generative AI to Drive Nonprofit InnovationTechSoup
In this webinar, participants learned how to utilize Generative AI to streamline operations and elevate member engagement. Amazon Web Service experts provided a customer specific use cases and dived into low/no-code tools that are quick and easy to deploy through Amazon Web Service (AWS.)
LAND USE LAND COVER AND NDVI OF MIRZAPUR DISTRICT, UPRAHUL
This Dissertation explores the particular circumstances of Mirzapur, a region located in the
core of India. Mirzapur, with its varied terrains and abundant biodiversity, offers an optimal
environment for investigating the changes in vegetation cover dynamics. Our study utilizes
advanced technologies such as GIS (Geographic Information Systems) and Remote sensing to
analyze the transformations that have taken place over the course of a decade.
The complex relationship between human activities and the environment has been the focus
of extensive research and worry. As the global community grapples with swift urbanization,
population expansion, and economic progress, the effects on natural ecosystems are becoming
more evident. A crucial element of this impact is the alteration of vegetation cover, which plays a
significant role in maintaining the ecological equilibrium of our planet.Land serves as the foundation for all human activities and provides the necessary materials for
these activities. As the most crucial natural resource, its utilization by humans results in different
'Land uses,' which are determined by both human activities and the physical characteristics of the
land.
The utilization of land is impacted by human needs and environmental factors. In countries
like India, rapid population growth and the emphasis on extensive resource exploitation can lead
to significant land degradation, adversely affecting the region's land cover.
Therefore, human intervention has significantly influenced land use patterns over many
centuries, evolving its structure over time and space. In the present era, these changes have
accelerated due to factors such as agriculture and urbanization. Information regarding land use and
cover is essential for various planning and management tasks related to the Earth's surface,
providing crucial environmental data for scientific, resource management, policy purposes, and
diverse human activities.
Accurate understanding of land use and cover is imperative for the development planning
of any area. Consequently, a wide range of professionals, including earth system scientists, land
and water managers, and urban planners, are interested in obtaining data on land use and cover
changes, conversion trends, and other related patterns. The spatial dimensions of land use and
cover support policymakers and scientists in making well-informed decisions, as alterations in
these patterns indicate shifts in economic and social conditions. Monitoring such changes with the
help of Advanced technologies like Remote Sensing and Geographic Information Systems is
crucial for coordinated efforts across different administrative levels. Advanced technologies like
Remote Sensing and Geographic Information Systems
9
Changes in vegetation cover refer to variations in the distribution, composition, and overall
structure of plant communities across different temporal and spatial scales. These changes can
occur natural.
1. MEMS Applications
in
Seismology
Nov 11, 2009
Seismic Instrumentation Technology Symposium
B. John Merchant
Technical Staff
Sandia National Laboratories
Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company,
for the United States Department of Energy!s National Nuclear Security Administration
under contract DE-AC04-94AL85000.
2. Outline
• Overview of MEMS Technology
• MEMS Accelerometers
• Seismic Requirements
• Commercial Availability
• Noise & Detection Theory
• Current R & D Efforts
• Outlook
3. What are MEMS?
Micro-Electro-Mechanical Systems (MEMS)
Features range from 1 to 100 microns.
Similar fabrication techniques as Integrated
Circuits (IC). However, MEMS fabrication
is a trickier process due to the
incorporation of mechanical features
Distinguished from traditional mechanical
systems more by their materials and Courtesy of Sandia National Laboratories,
SUMMiTTM Technologies, www.mems.sandia.gov
methods of fabrication than by feature size.
4. What are MEMS?
Materials Fabrication Applications
Silicon Deposition Automotive air bags
Single-crystal silicon Electroplating Inkjet printers
makes a nearly Evaporation
perfect spring with
DLP projectors
Sputtering
very stable material Consumer Electronics
properties. (Cell phone, Game
Lithography Controllers, etc)
Photo, Electronic, Sensors (pressure,
Polymers Ion, X-ray
motion, RF,
magnetic, etc)
Metals Etching
gold, nickel, chromium, Wet Etching:
titanium, tungsten, Bathed in a
platinum, silver. chemical
solvent
Dry Etching:
Vapor/Plasma
5. Three Dominant MEMS
Microfabrication Technologies
Surface Bulk
LIGA
Micromachining Micromachining
Structures formed by Structures formed by wet Structures formed by
deposition and etching of and/or dry etching of mold fabrication,
sacrificial and structural thin silicon substrate followed by injection
films molding
Silicon
Groove Nozzle Membrane Substrate
p++ (B)
Wet Etch Patterns
Poly Si Silicon
Channels Holes Substrate
Silicon Substrate Metal Mold
Courtesy of SNL MEMS Technology short course Dry Etch Patterns
6. MEMS History
1989 – Lateral Comb drive
at Sandia National
Laboratories
1970’s - IBM develops 1986 – LIGA process 1991 – Analog Devices Decreasing Increasing
a micro-machined for X-ray lithography develops the first commercial Costs Commercialization
pressure sensor used in enable more refined MEMS accelerometer for air
blood pressure cuffs structures bag deployment (ADXL50)
1979 - HP develops 1988 – first rotary 1994 – Deep Reactive-
inkjet cartridges electro-static drive Ion Etching (DRIE)
using micro- motors developed at process developed by
machined nozzles UC Berkley Bosch.
1993 – Texas
Instruments begins
selling DLP Projectors
with Digital Mirrors.
7. MEMS Commercial Applications
Digital Mirror Device
Texas Instruments
Accelerometer
Analog Devices
Ink Jet Cartridge
Hewlett Packard
Micromirror switch Pressure Sensor
Lucent Technologies
Bosch MEMS
Courtesy of SNL MEMS Technology short course
8. MEMS Accelerometer History
2002 – Applied MEMS
(now Colibrys) releases
1991 – Air Bag low-noise Si-Flex 2006 – Nintendo Wii
Sensor Analog Accelerometer: Controller (Analog
Devices (ADXL50) +/- 3 g Peak Devices ADXL330).
+/- 50 g Peak 300 ng/!"z Noise +/- 3 g Peak
6.6 mg/!"z Noise
350 ug/!"z Noise
2004 – Colibrys 2005 – Sercel 428XL-
VectorSeis Digital 3 DSU3
Channel Accelerometer 2 – 800 Hz
2 – 1000 Hz +/- 0.5 g Peak
+/- 0.335 g Peak ~40 ng/!"z Noise
~50 ng/!"z Noise
9. What makes a MEMS Seismometer
A MEMS Accelerometer with:
• Low noise floor (ng’s/!"z)
• ~1 g upper range
• High sensitivity
Modeled as a spring-mass system
Proof mass measured in milli-grams
Bandwidth below the springs resonant mode
(noise and response flat to acceleration)
10. Seismology Requirements
• Noise floor
(relative to the LNM)
• Peak acceleration High
Noise
Model Low
(Strong vs weak motion) Noise
Model
Current Best MEMS
• Sensitivity
• Linear dynamic range
SP Target Region
• Bandwidth KS54000
GS13
(short-period, long-period,
broadband)
Requirements are ultimately application dependent
11. Strong Motion Requirements
Many of the strong motion requirements may be
met by today’s MEMS Acclerometers:
Noise < 1 ug/!"z
Bandwidth > 1-2 Hz
Peak 1-2 g’s
Acceleration
Dynamic Range ~100 dB
12. Weak Motion Requirements
Weak motion requirements are more demanding:
Noise < 1 ng/!"z
Bandwidth SP: 0.1 Hz to 10’s Hz
LP: < 0.01 Hz to 1’s Hz
BB: 0.01 Hz to 10’s Hz
Peak Acceleration < 0.25 g
Dynamic Range >120 dB
There are no MEMS accelerometers available today
that meet the weak motion requirements.
13. Commercially Availability
There are many manufacturer’s of Manufacturers
Analog Devices
MEMS Accelerometers. Bosch-Sensortec
*Colibrys
*Endevco
Freescale
Most are targeted towards consumer, *GeoSIG
*Kinemetrics
automotive, and industrial Kionix
MEMSIC
applications. *PCB
*Reftek
Silicon Designs
STMicroelectronics
Summit Instruments
Only a few approach the noise levels *Sercel
*Wilcoxon
necessary for strong-motion *Noise Floor < 1 ug/!"z
seismic applications
14. Colibrys
Manufacturer Colibrys Colibrys Colibrys Colibrys
Formerly Applied MEMS, I/O.
Model SF 1500 SF 2005 SF3000 Digital-3*
Oil & Gas Exploration Technology Capacitive Capacitive Capacitive Capacitive
Force Feedback
Output Analog Analog Analog Digital
Produces VectorSeis which is Format Chip Chip Module Module
Axis 1 1 3 3
sold through ION Power 100 mW 140 mW 200 mW 780 mW
Acceleration +/- 3 g +/- 4 g +/- 3 g +/- 0.2 g
(www.iongeo.com) Range
Frequency 0 – 1500 Hz 0 – 1000 Hz 0 – 1000 Hz 0 – 1000 Hz
Response
Sensitivity 1.2 V/g 500 mV/g 1.2 V/g 58 ng/bit
Self Noise 300 – 500 800 ng/!Hz 300 - 500 100 ng/!Hz
ng/!Hz ng/!Hz
Weight Not Specified Not Specified Not Specified Not Specified
Size 24.4 x 24.4 x 24.4 x 24.4 x 15 80 x 80 x 57 mm 40 x 40 x 127
16.6 mm mm mm
Shock Range 1500 g 1500 g 1000 g 1500 g
Temperature -40 to 125 "C -40 to 85 "C -40 to 85 "C -40 to 85 "C
*discontinued
15. Endevco, PCB, Wilcoxon
Manufacturer Endevco Endevco
Model Model 86 Model 87
Technology Piezoelectric Piezoelectric
Not strictly MEMS, but they are small Output
Format
Analog
Module
Analog
Module
and relatively low-noise. Axis 1 1
Power 200 mW 200 mW
Acceleration Range +/- 0.5 g +/- 0.5 g
Frequency Response 0.003 – 200 Hz 0.05 – 380 Hz
All three companies make fairly Sensitivity 10 V/g 10 V/g
39 ng/!Hz @ 2 Hz 90 ng/!Hz @ 2 Hz
similar Piezoelectric accelerometers Self Noise 11 ng/!Hz @ 10 Hz 25 ng/!Hz @ 10 Hz
4 ng/!Hz @ 100 Hz 10 ng/!Hz @ 100 Hz
Weight 771 grams 170 grams
Industrial and Structural applications Size 62 x 62 x 53 mm 29.8 x 29.8 x 56.4 mm
Shock Range 250 g 400 g
Temperature -10 to 100 "C -20 to 100 "C
16. Kinemetrics
Manufacturer Kinemetrics Kinemetrics
Strong motion, seismic measurement Model
Technology
EpiSensor ES-T
Capacitive MEMS
EpiSensor ES-U2
Capacitive MEMS
Output Analog Analog
Format Module Module
Force Balance Accelerometer Axis 3 1
Power 144 mW 100 mW
Acceleration
+/- 0.25 g +/- 0.25 g
Range
Available in single and three axis Frequency
0 – 200 Hz 0 – 200 Hz
configurations Response
Sensitivity 10 V/g 10 V/g
Self Noise 60 ng/!Hz 60 ng/!Hz
Weight Not Specified 350 grams
Size 133 x 133 x 62 mm 55 x 65 x 97mm
Shock Range Not Specified Not Specified
Temperature -20 to 70 "C -20 to 70 "C
17. Reftek
Manufacturer Reftek
Strong motion measurement for Model 131A*
seismic, structural, industrial Technology Capacitive MEMS
Output Analog
monitoring Format Module
Axis 3
Power 600 mW
Available in single, three axis, and Acceleration
+/- 3.5 g
borehole configurations Range
Frequency
0 – 400 Hz
Response
Sensitivity 2 V/g
Self Noise 200 ng/!Hz
Weight 1000 grams
Size 104 x 101 x 101 mm
Shock Tolerance 500 g
Temperature -20 to 60 "C
* uses Colibrys Accelerometers
18. Sercel
Manufacturer Sercel
Used in tomography studies for Oil & Gas Exploration Model DSU3-428
Technology Capacitive MEMS
Sold as complete turn-key systems and not available Output Digital
for individual sales Format Module
Axis 3
Power 265 mW
Acceleration
+/- 0.5 g
Range
Frequency
0 – 800 Hz
Response
Sensitivity Not Specified
Self Noise 40 ng/!Hz
Weight 430 grams
Size 159.2 x 70 x 194 mm
Shock Range Not Specified
Temperature -40 to 70 "C
19. MEMS accelerometers
Advantages
• Small
• Can be low power, for less sensitive sensors.
• High frequency bandwidth (~ 1 kHz)
Disadvantages
• Active device, requires power
• Poor noise and response at low frequencies (< 1 Hz), largely due to
small mass, 1/f noise, or feedback control corner.
• Noise floor flat to acceleration, exacerbates noise issues at low
frequency (< 1 Hz)
20. Theoretical Noise
Thermo-mechanical noise for a cantilevered spring
Two main sources of noise:
• Thermo-mechanical 4kbT"0 1
an =
– Brownian motion Q!m Hz
– Spring imperfections
• Electronic
– Electronics
– Detection of mass position
– Noise characteristics unique to
detection technique
Traditional MEMS Accelerometer
Seismometer
Large mass (100’s of Small mass (milligrams)
grams)
Thermo-mechanical noise Thermo-mechanical
is small noise dominates
Electronic noise Same electronic noise
dominates issue as traditional
21. Detection of mass position
Variety of ways to determine mass-position
– Piezoelectric / Piezoresistive
– Capacitive
– Inductive
– Magnetic
– Fluidic
– Optical (diffraction, fabry-perot, michelson)
22. Capacitive Detection
The most common method of mass
position detection for current MEMS
accelerometers is capacitive.
Colibrys bulk-micromachined proof mass
sandwiched between differential capacitive
Capacitance is a weak sensing plates
mechanism and force (for feedback
contrl) which necessitates small
masses (milligrams) and small
distances (microns).
Feedback control employed for
quietest solutions. Differential
sampling for noise cancelation.
Silicon Designs capacitive plate with a
pedestal and torsion bar.
23. R&D Challenges
• Large proof mass and weak springs required. This
makes for a delicate instrument.
• Capacitance less useful as a detection and feedback
mechanism for larger masses.
• Feedback control required to achieve desired
dynamic range and sensitivity.
• R&D requires access to expensive MEMS fabrication
facility
• 1/f electronic noise could limit low-frequency
24. DOE Funded R&D Projects
• Several posters on display
• Additional details and proceedings available at
http://www.monitoringresearchreview.com/
• Characteristics:
– Significantly larger proof mass (0.25 – 2 grams)
– Non-capacitive mass position sensing (inductive,
optical, fluidic)
– Feedback control
25. DOE Funded R&D Projects
Kinemetrics / Imperial College
• Inductive coil with force feedback
• Proof mass of 0.245 grams
• 0.1 - 40 Hz bandwidth, resonant mode at 11.5 Hz
• Demonstrated noise performance of 2-3 ng/!Hz
over 0.04 – 0.1 Hz, higher noise at frequencies >
0.1 Hz
Symphony Acoustics
• Fabry-Perot optical cavity
• Proof mass of 1 gram
• 0.1 - 100Hz bandwidth
• Demonstrated noise performance of 10 ng/!Hz
• Theoretical noise performance of 0.5 ng/!Hz
26. DOE Funded R&D Projects
Photo Reflective Folded
Sandia National Laboratories Diodes Surface Springs
• Large proof mass (1 gram, tungsten)
• Meso-scale proof mass with MEMS
diffraction grating and springs.
• Optical diffraction grating
• Theoretical thermo-mechanical
noise 0.2 ng/!Hz over 0.1 to 40 Hz Optical Proof Mass Proof Fixed
Grating Frame Mass Frame
Silicon Audio
• Large proof mass (2 gram)
• Meso-scale construction with MEMS
diffraction grating
• Optical diffraction grating
• 0.1 to 100 Hz target bandwidth
• Theoretical thermo-mechanical noise
0.5 ng/!Hz over 1 to 100 Hz
27. DOE Funded R&D Projects
PMD Scientific, Inc.
• Electrochemical fluid passing through
a membrane
• Theoretical noise 0.5 ng/!Hz over 0.02
to 16 Hz
Michigan Aerospace Corp.
• Whispering Gallery Seismometer
• Optical coupling between a strained
dielectric microsphere and an optical
fiber
• Theoretical noise of 10 ng/!Hz
28. 5 year outlook
• Over the next 5 years, there is a strong potential
for at least one of the DOE R&D MEMS
Seismometer projects to reach the point of
commercialization.
• This would mean a MEMS Accelerometer with:
– a noise floor under the < LNM (~ 0.4 ng/!Hz)
– Bandwidth between 0.1 and 100 Hz,
– > 120 dB of dynamic range
– small ( < 1 inch^3).
– Low power (10’s mW)
29. Enabling Applications
• Flexible R&D deployments
• Why simply connect a miniaturized transducer
onto a traditional seismic system?
• Will require highly integrated packages:
Power Antenna
Source
– Digitizer Battery Radio /
– Microcontroller Backup Ethernet
– GPS orientation Storage
Compass Microprocessor •Waveforms
– Flash storage •Data Retrieval •Parameters
•Algorithms
– Communications GPS
location, •Communications
•Detection
templates
– Battery time
waveform
time series
3-axis
Accelerometer
30. 10 year outlook
• MEMS Accelerometers have
only been commercially
available for ~18 years.
• Where were things 10 years
ago?
• Further expansion into long period (~ 0.01 Hz)
• Small, highly integrated seismic systems