This document summarizes a technical seminar on 3D IC technology. It defines 3D ICs as having two or more layers of electronic components integrated vertically and horizontally. 3D ICs offer performance benefits like reduced timing/delays and energy usage due to shorter interconnects compared to conventional 2D chip designs. However, 3D ICs also present challenges like increased costs, handling issues during manufacturing, heat dissipation, complex design/testing, and lack of standards.

1. Technical seminar on
3D IC Technology
Under guidance by
Mr. R. Gopi Reddy
submitted by…
P.Naresh
107Q1A0417

2. What is 3D IC Technology?
 In electronics, a three-dimensional
integrated circuit (3D IC) is a chip in
which two or more layers of active
electronic components are integrated
both vertically and horizontally into a
single circuit.
 The chip was manufactured with two dies
using face-to-face stacking, which allowed
a dense via structure.

3. Could be Heterogeneous…
“Stacked” 2D (Conventional) ICs

4. Performance Characteristics:
 Timing.
 Energy.
 With shorter interconnects in 3D ICs,
both switching energy and cycle time are
expected to be reduced.

5. Timing:
 In current technologies, timing is
interconnect driven.
 Reducing interconnect length in designs
can dramatically reduce RC delays and
increase chip performance
 The graph below shows the results of a
reduction in wire length due to 3D
routing
 Discussed more in detail later in the
slides

6. Timing graph:

7. Energy performance:
 Wire length reduction has an impact on
the cycle time and the energy dissipation
 Energy dissipation decreases with the
number of layers used in the design
 Following graphs are based on the 3D
tool described later in the presentation

8. Energy performance graphs:

9. Comparison of 3D and 2D IC’S:
 with higher speed and smaller footprint
than the ones designed by the traditional
2D IC design technologies.
 The length of global wires can be reduced
by as much as 50%.
 limited clock frequency can be increased.
 limited area and power can be reduced

10. Image for 3D and 2D IC’S

11. Implications on Circuit Design
and Architecture:
 Buffer Insertion
 Layout of Critical Paths
 Microprocessor Design
 Mixed Signal IC’s
 Physical design and Synthesis

12. Advantages of 3D IC’S:
 Expanded memory capacity
 Load reduction ; Higher frequency
 Bus turn around time will reduce
(Improved bus efficiency)
 Active termination power reduction ;
Lower power consumption

13. Disadvantages:
 Higher cost Drill holes/Fill plug by
metal/Put bumps
 Thinning
 Handling/Align
 2 types of die (Master and Slave)

14. Applications:
 physical limitations for classic 2D
electronics
 addressing all important issues, such as
wafer processing
 applications of mixed signal designs.

15. Challenges:
 Heat
 Design complexity
 Testing
 Lack of standards
 Heterogeneous integration supply chain