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The document discusses advancements in 3D microelectronics platforms, particularly focusing on Multi-Chip Modules (MCMs) which combine different functions into a single device, thus optimizing space and costs. MCMs provide significant advantages, including improved performance, rapid design, and reduced development costs, making them suitable for competitive markets like smartphones and portable computers. The widespread adoption of MCM technology is transforming the microelectronics industry by allowing design houses to outsource manufacturing while maximizing market opportunities.



