The document discusses the manufacturing and process control challenges of 3D integrated circuit structures. It describes how 3D architectures are being implemented in vertical NAND flash memory and FinFET transistors. The key challenges for 3D manufacturing include precise control of thin film deposition, etch profiles, and detection of defects embedded deep within complex multi-layer stacks. Semiconductor metrology and inspection tools will need to advance to allow 3D imaging and measurement of features located in the third dimension.
How Applied Materials Deploys Faster SAP® Projects and Boosts Quality with Wo...Worksoft
How Applied Materials Deploys Faster SAP® Projects and Boosts Quality with Worksoft Test Automation
https://www.worksoft.com/events/how-applied-materials-deploys-faster-sap-projects-and-boosts-quality-with-test-automation
Ultra-thin body SOI MOSFETs: Term Paper_class presentation on Advanced topics...prajon
This slide describes one of the technology n the field of semiconductor devices, Ultra thin body SOI (Silicon on Insulator) MOSFETs and its various uses and characteristics.
NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/
Benjamin Wohlfeil's presentation at the EPIC Online Technology Meeting explored how innovation in co-packaged optics is addressing key data center interconnect challenges.
This presentation contains various aspects of Graphene like synthesis techniques, characterization, commercialization, mechanical and electrical properties and present and future application.
How Applied Materials Deploys Faster SAP® Projects and Boosts Quality with Wo...Worksoft
How Applied Materials Deploys Faster SAP® Projects and Boosts Quality with Worksoft Test Automation
https://www.worksoft.com/events/how-applied-materials-deploys-faster-sap-projects-and-boosts-quality-with-test-automation
Ultra-thin body SOI MOSFETs: Term Paper_class presentation on Advanced topics...prajon
This slide describes one of the technology n the field of semiconductor devices, Ultra thin body SOI (Silicon on Insulator) MOSFETs and its various uses and characteristics.
NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/
Benjamin Wohlfeil's presentation at the EPIC Online Technology Meeting explored how innovation in co-packaged optics is addressing key data center interconnect challenges.
This presentation contains various aspects of Graphene like synthesis techniques, characterization, commercialization, mechanical and electrical properties and present and future application.
Achieving Power Noise Reliability Sign-off for FinFET based DesignsAnsys
As the industry shifts to FinFET devices, designs are more sensitive to noise, have higher power density, and interconnects are more susceptible to EM and thermal issues. To ensure robustness of these designs, today's methodology needs to include design for reliability. This presentation describes how RedHawk and Totem platforms enable accurate power noise and reliability sign off for standard cell and analog / mixed-signal IP all the way to SoC. Learn more on our website: https://bit.ly/1CW3FRT and https://bit.ly/1qk5Juj
Analog Mixed-Signal Design in FinFET Processes Design World
While industry pundits have forecasted the end of analog design in the next leading edge process, the reality is that the practice is still going strong, and there’s no end in sight. Not only are teams still designing data converters, PLLs, filters, and other analog goodies in the latest processes (including FinFET), but design teams are reaching higher levels of performance than they did in yesterday’s processes. The new processes have, without a doubt, changed the task of analog design, and the designer’s toolkit has had to undergo a major revision. Many of our old techniques have become a lot less relevant, and today’s designer needs to have a good handle on a broad set of new techniques.
Some of the changes are a result of designers targeting processes for very digital applications (supply voltages of 0.8V and less). Others are a result of the size of the devices (matching of small devices is poor, matching of very small devices is worse). Changes are also a result of the new fabrication techniques that must be used to make the devices (unit-sized devices and no mixing of different device types - resistor and I/O device ghettos are required). Of course, there’s great news: the transistors are wonderfully fast and the digital is almost free.
View this webinar to:
-Gain an understanding of the challenges of analog design in the new world of leading-edge processes
-Learn about design techniques that take advantage of the characteristics of today’s design reality
Thermal reliability faces critical challenges from emerging FinFET-based designs. As designs transition from planar MOS to FinFET transistors, current density increases by 25% and that combined with lower thermal conductivity substrate and 3-D narrow fin structure, local heat gets trapped resulting in thermal-aware EM issues. This presentation introduces Sentinel-TI™, a thermal integrity platform and demonstrates how Chip Thermal Model (CTM™) based power-thermal convergence and interconnect-driven methodology help address the thermal reliability challenges associated with these design. Learn more on our website: https://bit.ly/1sh7I8p, https://bit.ly/1CW3FRT, https://bit.ly/1qk5Juj and (https://bit.ly/1rtrGat)
3D IC Presented by Tripti Kumari, School of Engineering, CUSATthevijayps
A 3D Integrated Circuit is a chip that has active electronic components stacked on one or more layers that are integrated both vertically and horizontally forming a single circuit.
In the 3-D design architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
In a generic 3D IC structure, each die is stacked on top of another and communicated by Through-Silicon Vias (TSVs).
Architectural issues
Traditional shared buses do not scale well – bandwidth saturation
Chip IO is pad limited
Physical issues
On-chip Interconnects become increasingly slower w.r.t. logic
IOs are increasingly expensive
Consequences
Performance losses
Power/Energy cost
Design closure issues or infeasibility
Reduced wire length
Total wire length
Larger circuits produce more improvement
Lower power per transistor
Decreased interconnect delay
Higher transistor packing densities
Smaller chip areas
There are four ways to build a 3D IC:
Monolithic
Wafer-on-Wafer
Die-on-Wafer
Die On Die
At runtime, thermal variations will introduce additional time-varying clock skew, further increasing design uncertainty
2 - Thermal Issues In 3-D ICs
Due to reduction in chip size of a 3D implementation, 3D circuits exhibit a sharp increase in power density
Analysis of Thermal problems in 3D is necessary to evaluate thermal robustness of different 3D technology and design options.
3 - Reliability Issues In 3-D ICs
Electro thermal and Thermo-mechanical effects between various active layers can influence electro-migration and chip performance
Die yield issues may arise due to mismatches between die yields of different layers, which affect net yield of 3D chips.
TSV check on reset
Control use dedicated Vias in order to establish which vias are corrupted.
If 1, 2 and 3 TSVs are OK, the control set the enable signal set_to and set_from: broken path are skipped!
Pads routing shift as show in the figure
Need to define The handling protocol during the TSVs check
3D IC design is a relief to interconnect driven IC design.
Still many manufacturing and technological difficulties
Physical Design needs to consider the multiple layers of Silicon available.
Optimization of both temperature and wirelength
Placement and routing algorithms need to be modified
[1] J. Davis, et al., "Interconnect limits on gigascale integration (GSI) in the 21st century," Proceedings of the IEEE , vol.89, no.3, pp.305-324, Mar 2001.
[2] Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C.; , "3-D ICs: a novel chip design for improving deep- submicrometer interconnect performance and systems-on-chip integration," Proceedings of the IEEE , vol.89, no.5, pp.602-633, May 2001.
We are professional PCB design & fabrication in Taiwan and India. We manufacture high precision, high density, and high reliability PCB up to complex multi-layered boards. We PARTNER with our customers and suppliers to provide a total test/design solution.
Moldex3D, Structural Analysis, and HyperStudy Integrated in HyperWorks Platfo...Altair
In recent years, with the increasing variety, complexity, and precision requirement on plastic products, CAE tools have been widely used for solving product design and manufacturing issues. The structural designs or molding process parameters for products can be optimized efficiently through CAE analyses. Plus the reliable and correct verification with experiments, the directions or guidance in designs or process condition settings can be provided prior to the real moldings. However, sometimes it is not efficient to find an optimized set of parameters through traditional CAE analyses. A novel integration between Moldex3D and HyperStudy allows for more quick and efficient parameter optimization which will save time, increase product quality, and increase productivity.
Also, traditional CAE analyses do not consider the molding properties influence on structural analysis, such as material property variations caused by fiber orientation and residual stresses. Accordingly, an integrated technology is proposed to bridge molding and structural analysis. Through the integration of Moldex3D and structural analysis in HyperWorks platform, the important effects from molding process can be transferred to structural analysis for more accurate and realistic predictions of the product behaviors. This integration provides a virtual product development platform for users to increase profits as well as enhance productivity.
3D Packaging: A Key Enabler for Further Integration and Performance at Europe...Yole Developpement
LANDSCAPE OF SENSORS USED IN SMARTPHONE MARKET
Since the advent of smartphones and tablets, the landscape of sensors integrated has really changed…
Manage all the chain is a key advantage…that’s why all OEMs develop their own APU
Package type
InFO
1178-ball PoPBGA
PoP
PoP Process
Pin pitch (mm)
Foundry
TSMC (e)
Samsung
Shinko
TSMC ?
Co-processor (for Sensor fusion)
M10 (e)
ARM Cortex M4
LGA package
WLP
WLCSP
Driven by IoT WLP will be one of the next key trend for MEMS and Sensors devices!
Source: mCube
70% reductionin package size enabledby 3D TSV and WLP
More information on that report at http://www.i-micronews.com/reports.html
zkStudyClub - Reef: Fast Succinct Non-Interactive Zero-Knowledge Regex ProofsAlex Pruden
This paper presents Reef, a system for generating publicly verifiable succinct non-interactive zero-knowledge proofs that a committed document matches or does not match a regular expression. We describe applications such as proving the strength of passwords, the provenance of email despite redactions, the validity of oblivious DNS queries, and the existence of mutations in DNA. Reef supports the Perl Compatible Regular Expression syntax, including wildcards, alternation, ranges, capture groups, Kleene star, negations, and lookarounds. Reef introduces a new type of automata, Skipping Alternating Finite Automata (SAFA), that skips irrelevant parts of a document when producing proofs without undermining soundness, and instantiates SAFA with a lookup argument. Our experimental evaluation confirms that Reef can generate proofs for documents with 32M characters; the proofs are small and cheap to verify (under a second).
Paper: https://eprint.iacr.org/2023/1886
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Maruthi Prithivirajan, Head of ASEAN & IN Solution Architecture, Neo4j
Get an inside look at the latest Neo4j innovations that enable relationship-driven intelligence at scale. Learn more about the newest cloud integrations and product enhancements that make Neo4j an essential choice for developers building apps with interconnected data and generative AI.
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Generative AI Deep Dive: Advancing from Proof of Concept to ProductionAggregage
Join Maher Hanafi, VP of Engineering at Betterworks, in this new session where he'll share a practical framework to transform Gen AI prototypes into impactful products! He'll delve into the complexities of data collection and management, model selection and optimization, and ensuring security, scalability, and responsible use.
Communications Mining Series - Zero to Hero - Session 1DianaGray10
This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
• Communication Mining Overview
• Why is it important?
• How can it help today’s business and the benefits
• Phases in Communication Mining
• Demo on Platform overview
• Q/A
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
Goodbye Windows 11: Make Way for Nitrux Linux 3.5.0!SOFTTECHHUB
As the digital landscape continually evolves, operating systems play a critical role in shaping user experiences and productivity. The launch of Nitrux Linux 3.5.0 marks a significant milestone, offering a robust alternative to traditional systems such as Windows 11. This article delves into the essence of Nitrux Linux 3.5.0, exploring its unique features, advantages, and how it stands as a compelling choice for both casual users and tech enthusiasts.
GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
How to Get CNIC Information System with Paksim Ga.pptxdanishmna97
Pakdata Cf is a groundbreaking system designed to streamline and facilitate access to CNIC information. This innovative platform leverages advanced technology to provide users with efficient and secure access to their CNIC details.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
GridMate - End to end testing is a critical piece to ensure quality and avoid...ThomasParaiso2
End to end testing is a critical piece to ensure quality and avoid regressions. In this session, we share our journey building an E2E testing pipeline for GridMate components (LWC and Aura) using Cypress, JSForce, FakerJS…
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
The Shift to 3D-IC Structures - Manufacturing and Process Control Challenges
1. The Shift to 3D IC Structures -
Manufacturing and
Process Control Challenges
Ehud Tzuri
Chief Marketing Officer
ChipEx-2012, May 2012
External Use
2. 300mmNOR NAND PVD Metal CVD
Single-wafer E-beam New materials:
III-V, Ge
inspection
MORE Processing CVD: hidden films
INFLECTIONS DRAM 8F2 6F2 Atomic precision CMP Deposited
resist
IN
NEXT Bumping Flowable films Advanced
5 YEARS THAN
Wafer-level interconnect
packaging Dry chemical
Advanced patterning
cleans
350nm 250nm 180nm 130nm 90nm 65nm 45nm 32nm 22nm 14nm 10nm
Double Patterning LAST
Deep-UV Laser
Lithography Epi
Cu damascene
15 YEARS
High aspect ratio Etch
Laser-based
processing
Patterning Films Low-k dielectric 450mm
Lamp-based Interface 3D
Hi-K ALD Processing CMP
Sacrificial
films management NAND
DPN SiON gate Advanced Universal ALD
Reflow HPD transistor
2 External Use
4. Complying with Moore’s Law
Maintaining Cost-Performance
Shrink the feature size: ArF Immersion EUV
Increase wafer size: 200mm 300mm 450mm
Build vertically: 2D 3D
4 External Use
5. Where is 3D Architecture Implemented?
3D
Wafer level
Memory Transistor
packaging
V-NAND FinFET TSV
5 External Use
6. Where is 3D Architecture Implemented?
3D
Wafer level
Memory Transistor
packaging
V-NAND FinFET TSV
6 External Use
7. Flash Roadmap*
* The future is coming sooner than we thought
Source: J.Choi, Samsung, The 2nd International Memory Workshop, May.16, 2010
External Use 7
8. From 2D to 3D Flash NAND
Sourceline
Wordlines
Select gate
A folded, vertically stacked NAND string
Cells are generated inside a high-aspect-ratio (HAR) contact hole
Benefits:
– Memory density is less dependent on patterning
– Reduced coupling between memory cells
– Cost scalability
Image Sources:
Left:IMFT 25-nm MLC NAND: technology scaling barriers broken, DONG YI Technology Group, Published Date:2010-3-23
Right: Pipe-shaped BiCS Flash Memory with 16 Stacked Layers…/Ryota Katsumata - 2009 Symposium on VLSI Technology
External Use
9. 3D NAND Process Challenges
TEM Image of 69-Layer Oxide/Nitride Stack
Surface / interface roughness
Top
Film stress control for low wafer bow
Fastest cycle time
Bottom
Excellent stacked particle
performance
Etch profile - ability to open HAR SEM X-section of double etched stack
stacks
Complex multi-stack requires
precise process monitoring –
thickness, RI, etch profile and defects Source:
Pipe-shaped BiCS Flash Memory with 16 Stacked Layers…/Ryota
Katsumata - 2009 Symposium on VLSI Technology
9 External Use
10. 3D NAND Metrology & Inspection Challenges
Imaging of HAR
contact hole
Slit & plate etch
along its depth
inspection &
imaging
Charge Trap Embedded defects:
material thickness Deep in the stack
& uniformity along
contact depth
10 External Use
11. Where is 3D Architecture Implemented?
3D
Wafer level
Memory Transistor
packaging
V-NAND FinFET TSV
11 External Use
12. Planar vs. Trigate (FinFET) Transistor
Benefits
– Gate surrounds Si from 3 directions, thus,
increasing control of over channel
reduced leakage
– Can operate at lower voltage with good
performance, reducing active power by
>50%
Source: Intel 22nm Trigate announcement , 4/19/2011
External Use
13. FinFet – Process Challenges
Spacer Gate Stack (high-k & metal gate)
• Complete spacer removal from fin area • Material selectivity
• Material deposition thickness
uniformity on vertical walls
• Metal gate composition uniformity/stability
Fin
Fin Formation:
• Precision etch
STI
• Structural integrity (collapse, Oxide
erosion, thermal shock)
• Precise Recess to control fin Fin Junctions:
height • Conformal doping
• Channel materials to increase on sidewalls
mobility
13 External Use
14. FinFET – Process Control Challenges
Lg
Measurement of
Lg gate CD across the
Fin height
Lg
Detection & Review of
defects on Fin sidewalls after
gate etch
Measurement of Fin
sidewall angle to
control the 3D
transistor width
14 External Use
15. Transistor Roadmap: Applied Materials View
Planar CMOS FinFET III-V FinFET
New Fin
Gate Material
Fin
STI STI
Oxide
Oxide
No end in sight for Moore’s Law – for the next decade
15 External Use
16. Where is 3D Architecture Implemented?
3D
Wafer level
Memory Transistor
packaging
V-NAND FinFET TSV
16 External Use
17. 3D Integration & TSV
TSV is a process in which wafers are: thinned, stacked & interconnected
All flows include creation of deep holes and filling them with Cu
interconnect
Source: DAC, 2½D Integrated Circuits, Wednesday, January 26, 2011 , Paul McLellan / Source: “Through-Silicon Via (TSV)””, Vol. 97, 0018-9219/$25.00 2009
IEEE No. 1, January 2009 | Proceedings of the IEEE
17 External Use
18. TSV – Process Control Challenges
Ta/TaN/Au CVD-SiO2 Wafer inspection for surface
defects on TSV sidewalls and
bottom
Si substrate
Interlayer
Passivation layer
Bonding pad
Adhesive
Handle wafer
HAR SEM-based defect review for
sidewall and bottom defects;
including over-etch
18 External Use
19. Common Challenges
Defects of importance are located in the 3rd dimension;
they need to be found & imaged
Measurements of the 3rd dimension (HAR, SWA) need to
be performed
Current state of the art M&I tools have limitations to do so
19 External Use
20. Possible Solutions
SEM-based imaging
Optical metrology
X-ray
Destructive technologies
20 External Use
21. Possible Solutions – The Leading Candidate
SEM-based imaging
3D imaging E-beam inspection
techniques with SEM (Voltage Contrast)
(Resolution)
21 External Use
22. Summary
The future is here… 3D transistors and TSV are already a
reality, VNAND is just around the corner
3D Key challenges are related (mainly) to process
integration and process control
Traditional process control solutions might not be sufficient
E-Beam based techniques have the potential to become the
process control enablers
22 External Use