LANDSCAPE OF SENSORS USED IN SMARTPHONE MARKET Since the advent of smartphones and tablets, the landscape of sensors integrated has really changed… Manage all the chain is a key advantage…that’s why all OEMs develop their own APU Package type InFO 1178-ball PoPBGA PoP PoP Process Pin pitch (mm) Foundry TSMC (e) Samsung Shinko TSMC ? Co-processor (for Sensor fusion) M10 (e) ARM Cortex M4 LGA package WLP WLCSP Driven by IoT WLP will be one of the next key trend for MEMS and Sensors devices! Source: mCube 70% reductionin package size enabledby 3D TSV and WLP More information on that report at http://www.i-micronews.com/reports.html