This document discusses design considerations for 3D-specific systems. It outlines the benefits of 3D integration, such as shorter wires consuming less power, and heterogeneous integration allowing different layers. Barriers to 3D deployment include thermal management, testing, and cost/yield challenges. The document proposes open-source 3D interface IP and CAD interchange standards to address these barriers. Overall, 3D integration could enable higher memory bandwidth and system power efficiency through optimized codesign, while challenges remain in scaling the technology and managing integrity issues.