Inter-DCI and co-packaged optics

NITHEESH KUMAR CHITUMALLA

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inside-BigData.com

Today at Hot Chips 2019, Intel engineers presented technical details on hybrid chip packaging technology, Intel Optane DC persistent memory and chiplet technology for optical I/O. "To get to a future state of ‘AI everywhere,’ we’ll need to address the crush of data being generated and ensure enterprises are empowered to make efficient use of their data, processing it where it’s collected when it makes sense and making smarter use of their upstream resources," said Naveen Rao, Intel vice president and GM, Artificial Intelligence Products Group. "Data centers and the cloud need to have access to performant and scalable general purpose computing and specialized acceleration for complex AI applications. In this future vision of AI everywhere, a holistic approach is needed—from hardware to software to applications.” Learn more: https://www.intel.ai/accelerating-for-ai/?elq_cid=1192980 Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter

Optical Switching

Mahima Shastri

Optical switching

Optical switches enable signals in optical fibers or integrated optical circuits to be selectively switched from one circuit to another. They operate using mechanical means such as physically shifting fibers, or electro-optic, magneto-optic, or other methods. Optical switches can be slow, for alternate routing around faults, or fast, for logic operations using electro-optic or magneto-optic effects. Optical networks transmit data digitally as light through connected fiber strands and include SDH/SONET, opaque, partially transparent, and all-optical networks. All-optical networks perform all operations and functions optically without opto-electronics conversion.

6G Training Course Part 1: Introduction

3G4G

This document provides an introduction to 6G mobile wireless communications. It outlines that 6G is still in the early research phase, with standardization not expected until around 2025. Several organizations are involved in 6G research and standardization, including ITU, 3GPP, IEEE and ETSI. The document also presents a tentative timeline for 6G and an outline of topics to be covered in the introduction to 6G training.

Thin-Film Integrated Passive Devices

Driven by application diversification, IPDs (integrated passive devices) continue their promising growth. Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components. More information on that report at http://www.i-micronews.com/reports.html

Scaling Beyond 100G With 400G and 800G

APNIC

This document discusses scaling network bandwidth beyond 100G and into the 400G and 800G era. It summarizes the emerging 400G and 800G form factors of CFP8, QSFP-DD, and OSFP. It also outlines the transition from 10/40G switching ports to 25/100G and then to 100/400G ports. The growth of bandwidth needs from 2X per year is driving this transition. Standards like 400G Ethernet are emerging to support these higher speeds. Migration to 25Gbps using SFP28 is presented as the initial step to maximize port density and efficiency within existing infrastructure.

Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...

Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth? Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...

GaN RF Market Applications, players, devices & substrates 2016 - 2022, Marc...

The GaN RF market enjoyed a healthy increase in 2015. 2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M. Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%... More information on that report at http://www.i-micronews.com/reports.html Compound Semiconductors,RF, Power Electronics

Concepts of optical fiber communication

Naveen Jakhar, I.T.S

The document discusses the history and development of optical fiber communication. It describes the key windows of operation in optical fiber spectrum - the first window around 800-900nm, the second window around 1310nm, and the third window from 1510-1625nm. The third window has the lowest fiber attenuation of around 0.26dB/km and is used for most modern communication systems. The document also discusses ITU-T recommendations for optical fiber characterization and provides background on the principles and advantages of optical fiber communication.

Optical modulator (8,12,17,29)

boneychatterjee

An optical modulator is a device that modulates or varies the amplitude of an optical signal in a controlled manner. It generates desired intensity and color in light by changing optical parameters like transmission, refractive index, or reflection according to an input signal. Common types of optical modulators include electroabsorption modulators, electro-optic modulators, acousto-optic modulators, and Mach-Zehnder interferometric modulators. Optical modulators are important for applications like optical communication systems.

VCSELs – Market and Technology Trends 2019 by Yole Développement

Graphene -Applications in Electronics

Zaahir Salam

Graphene is a single layer of carbon atoms arranged in a hexagonal lattice. It has many unique properties making it promising for electronics applications. Some key properties include high electron mobility, flexibility, strength and thermal conductivity. Current prototypes using graphene include transistors, solar cells, sensors, memory and transparent displays. Graphene transistors have been developed but achieving a bandgap remains a challenge. Non-volatile memory devices have been made using layered structures of reduced graphene oxide as the electrodes and active material.

【Junior新趨勢_矽光子】

Collaborator

矽光子技術能解決現有資料傳輸的訊號、熱量損耗等痛點，隨著傳輸數據量成長快速增加，矽光子技術也被不斷推進。除此之外矽光子具有小尺寸、低成本、低功耗等優勢，也能應用在多個領域，如：5G、Data Center、光達和保健醫療。不過，矽光子技術發展會一路順遂嗎？還是有什麼尚未突破的困境嗎？一起來看看Collaborator的Junior們：魏晨洋、歐陽昱弘、賴志銘、楊旻璇、杜沛蓉，詳細整理的矽光子新趨勢報告吧！

Laser communication

NARAHARISRUTHI1

This document discusses laser communication systems. It begins with an introduction that explains laser communication works similarly to fiber optic links but through free space. It then covers the principles and working of lasers including absorption, spontaneous emission, pumping, and stimulated emission. The document describes different types of lasers such as solid-state, gas, liquid, and semiconductor lasers. It provides diagrams of the laser communication system components including the transmitter, receiver, and their functions. Advantages are high speeds and interference immunity while disadvantages include beam dispersion and atmospheric effects. Applications discussed are space communication, free space optical communication, defense, airports, data transmission, and medicine.

InnoLight’s 400G QSFP-DD Optical Transceiver

system_plus

Photonic crystal fibers

ajay singh

This document discusses photonic crystal fibers (PCFs). PCFs are composed of nanostructures that affect photon propagation through periodic refractive indices, similar to how semiconductor crystals affect electron motion. PCFs can guide light through two mechanisms: index guiding and photonic bandgap guiding. They have properties like endless single mode operation, large mode areas, and tunable dispersion. Special PCFs include double core fibers, highly birefringent fibers, and hollow core bandgap fibers. PCFs offer advantages over standard fibers like flexibility in core size and wavelengths used. Challenges include difficult fabrication and limited operating frequencies.

Status of the Advanced Packaging Industry 2018 Report by Yole Developpement

OIF Workshop at NGON & DCI World 2022

Leah Wilkinson

OIF experts presented project updates, discussed overcoming implementation challenges through interoperability and open optical networking and disaggregation at NGON & DCI World 2022 held in Barcelona, Spain June 21–23, 2022. Speakers gave an overview of OIF’s 400ZR work, including results from a recent interoperability demonstration, co-packaging, Common Management Interface Specification (CMIS), common electrical interfaces (112G and 224G) and Transport Software Defined Networking (SDN) Application Program Interface (API).

Optical Network Infrastructure for Grid, Draft-ggf-ghpn-opticalnets-1

Tal Lavian Ph.D.

During the past years it has become evident to the technical community that computational resources cannot keep up with the demands generated by some applications. As an example, particle physics experiments [1,2] produce more data than can be realistically processed and stored in one location (i.e. several Petabytes/year). In such situations where intensive computation analysis of shared large scale data is needed, one can try to use accessible computing resources distributed in different locations (combined data and computing Grid).

IRJET- Under Water Optical Wireless Communication

This document discusses underwater optical wireless communication (UWOC). It begins with an abstract that outlines the challenges of UWOC such as attenuation, scattering, and turbulence. It then provides an introduction to different modulation techniques used in UWOC like on-off keying, digital pulse interval modulation, and polarized digital pulse interval modulation. The rest of the document describes a simulation of a UWOC link using different parameters like bit rate, distance, power, and wavelength. It analyzes the impact of distance on the quality factor and bit error rate. The conclusion is that increasing distance leads to more signal distortion and lower quality communication.

What's hot

Silicon Photonics and datacenter

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Silicon Photonics 2021

NITHEESH KUMAR CHITUMALLA

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Optical Switching

Mahima Shastri

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Naveen Jakhar, I.T.S

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boneychatterjee

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Zaahir Salam

【Junior新趨勢_矽光子】

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Laser communication

NARAHARISRUTHI1

InnoLight’s 400G QSFP-DD Optical Transceiver

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Photonic crystal fibers

ajay singh

Status of the Advanced Packaging Industry 2018 Report by Yole Developpement

OIF Workshop at NGON & DCI World 2022

Leah Wilkinson

What's hot (20)

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Optical Switching

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Optical modulator (8,12,17,29)

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【Junior新趨勢_矽光子】

Laser communication

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Similar to Inter-DCI and co-packaged optics

Optical Network Infrastructure for Grid, Draft-ggf-ghpn-opticalnets-1

Tal Lavian Ph.D.

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On-chip Optical Communication Using Graphene

IJERA Editor

Advancement in technology is increasing day by day. Accordance to Moore‟s Law, the number of transistors per square inch on integrated circuits had doubled every year. In this way, Graphene research so far has focused on electronics and photonic applications, in spite of its impressive optical properties, graphene can be used as optical communication devices which are more efficient than any other materials. It has as unique photonic and electronic extraordinary properties. This leads to remarkable high bandwidth, zero source-drain bias, better modulation of light, and good internal quantum efficiency.

On-chip ESD protection for Silicon Photonics

Sofics

In the past, Fiber-optic communication was used only for long distance communication (50 km and beyond). Only a limited number of these high-end interface products were required worldwide. More recently, companies running large data centers (Facebook, Google, Amazon,...) like to replace the traditional cabling between server racks. The copper-based approach is considered a bottleneck for further improvements in data transfer capacity. Optical fiber can dramatically increase the bandwidth between servers and reduce complexity. Thus, the optical interconnect suppliers now need to produce a large number of their products. To reduce the cost, they separate the optical parts (laser diodes, photo detectors) from the digital controller circuits. That allows to rely on advanced, standard CMOS technology for those controller circuits, enabling a cost-effective high-volume production. Both elements are combined within a single IC package using advanced packing techniques. The 25-56Gbps interfaces consist of SerDes-type circuits and are integrated into advanced CMOS technology like 28nm CMOS. To create such high-speed differential I/O circuits, designers utilize the thin oxide transistors. However, those transistors are very sensitive and can be easily damaged during transient events like electrostatic discharge (ESD). Despite the fact that the sensitive pads are not connected outside of the package, they could still receive ESD stress during assembly. Therefore, adequate protection clamps need to be inserted at the bond pads. On the other hand, for signal integrity, it is important to limit the capacitance between the interface pads and the supply lines. Sofics has worked with several companies developing these optical interconnect interfaces. Sofics developed ESD protection with parasitic capacitance below 15fF, ten times lower than the typical low-cap ESD protection devices in TSMC 28nm CMOS.

Ppt laser 1.16.pptx for laser communication

NikhilNagaraju

Sharing is caring: Real-life shared infrastructure experience

Under Water Optical Wireless Communication

This document discusses underwater wireless optical communication (UWOC). It begins by introducing some key challenges of UWOC, such as attenuation and fading caused by absorption, scattering, and turbulence in water. It then discusses different modulation techniques that have been used for UWOC, including on-off keying (OOK), digital pulse interval modulation (DPIM), and polarization shift keying (Polk). The document proposes a new modulation scheme called polarized DPIM (P-DPIM) that combines PPM and Polk to improve power efficiency and error performance over long distances. It presents the results of a simulation comparing P-DPIM to other modulation schemes at different transmission distances, finding that P-DPIM provides better performance

Design and Analysis of Fractal Antenna

The document discusses the design and analysis of three fractal antennas. The first is a hybrid fractal antenna combining elements of the Sierpinski carpet and Giuseppe Peanu fractals, allowing for narrow-band operation in the S-band. The second is a multi-band fractal antenna created through an iterative process of cutting circles out of squares, enabling it to resonate at five frequencies from 3-12 GHz. The third is an ultra-wide band fractal antenna made by cutting hexagonal holes in a circular patch through five iterations, optimized using parametric analysis. Dimensions, resonant frequencies, radiation patterns, and gains are analyzed for each antenna. Fractal geometry is shown to increase electrical length while

Trends in next-generation data center interconnects (DCI)

Losses of Slot Mode Devices by Dr.Maithem Salih

hussein Jweead

The document summarizes an experiment measuring the transmission losses of 200 silicon slot waveguide devices with varying parameters, such as slot width and length. Both uncoated and polymer-coated devices were tested on cleaved chips using an optical spectrum analyzer. Simulation results agreed well with experiments and showed that surface scattering from sidewall roughness is the primary cause of excess loss in slot waveguides compared to ridge waveguides. The increased electromagnetic field density at slot waveguide surfaces leads to higher sensitivity to surface roughness.

Photonic integrated circuits for data center interconnects

IRJET- Designing and Characterization of Graphene-on-Silicon Waveguides

The document describes a method for designing and characterizing graphene-on-silicon waveguides. The waveguides consist of a silicon core covered by a thin graphene layer that matches the width of the silicon core. Simulations using OptiFDTD software showed that the graphene layer retained its properties after processing and the waveguides had lower propagation losses for transverse electric and magnetic modes than bare silicon waveguides. Measurements found the losses were higher for the TM mode than the TE mode. The method provides a simple way to integrate graphene with silicon photonics without requiring precise alignment of the graphene.

Silicon Photonics: A Solution for Ultra High Speed Data Transfer

IDES Editor

Silicon photonics is the integration of integrated optics and photonics IC technologies in silicon. Silicon photonics has recently attracted a great deal of attention since it offers an opportunity for low cost solutions for various applications ranging from telecommunications to chip-chip inter connects. Two keys to this advancement are the increased speed of communications (now at the speed of light) and the increased amount of data that can be transmitted at once (i.e., bandwidth). Silicon photonics is the study and application of photonic systems which use silicon as an optical medium. The silicon is usually patterned with sub-micrometer precision, into microphotonic components. These operate in the infrared, most commonly at the 1.55 micrometer wavelength used by most fiber optic telecommunication systems. The silicon typically lies on top of a layer of silica in what (by analogy with a similar construction in microelectronics) is known as silicon on insulator (SOI). Today the problems associated with multi-core processors with copper interconnect are Latency, Bandwidth, Power dissipation, Electromagnetic interference and Signal integrity. Micro processor designers use the integration of number of transistors that could be squeezed onto each chip to boost computational horsepower. That in turn caused the amount of waste heat that had to be dissipated from each square millimeter of silicon to go up. One problem we are facing in this effort is that micro processors with large numbers of cores are not yet being manufactured. Fiber optics has a reputation as an expensive solution because of high cost of hardware and Fabrication is done using exotic materials which are costly. The methods used in assembly and package of these components are also expensive. A recent break through in silicon photonics is in the development of a laser modulator that encodes optical data at 40 billion bits per second. Finally reached the goal of data transmission at 40 Gbps speed, matching the fastest devices deployed today with least cost of processing and showing the ultimate solutions to the problems associated with copper interconnects in multi-core processors and expensive fiber optics.

Fiber Technology Trends for Next Generation Networks

CPqD

This document summarizes Christopher Towery's presentation on optical networking technologies towards achieving terabit per second capacities. The presentation discusses recent experiments that have extended transmission distances and capacities. It also covers topics like quasi-single mode fibers, submarine network evolution, extending terrestrial networks through challenging terrain, and extending reach in legacy networks. Experimental results are presented to demonstrate technologies for high capacity transmission over long distances.

DCI: It's a Brave New World

The Optical Reboot: Radical Changes in Service Provider Transport Networks

Infinera

1) The document discusses how service provider transport networks are undergoing radical changes as traditional networks are no longer sustainable. 2) Optical network choices have long-term cost impacts, and total cost of ownership is impacted by technology and network architecture. 3) The optical network is at an inflection point, driven by innovations like flexible grid, flexible coherent modulation, multi-carrier superchannels, and photonic integrated circuits. This enables scaling of optical layer capacity to terabits.

ghazi2021.pdf

DrSrinivasBabu2

This paper proposes a hybrid WDM and optical-CDMA transmission system using optical vortex over multi-mode fiber. At the transmitter, an optical-CDMA multiplexer combines four data streams encoded with a 1D zero-cross-correlation code. A WDM multiplexer combines the encoded streams using four Laguerre-Gaussian modes at different wavelengths. The optical vortex reduces mode coupling when propagating over 8 km of multi-mode fiber. Simulation results show the hybrid system using optical vortex improves bit error rate and Q-factor compared to a system without optical vortex. This demonstrates optical vortex can increase the capacity and security of the optical communication system.

AEN089.pdf

Mohamedshabana38

1. Optical fiber termination methods like no-epoxy-no-polish connectors, epoxy and polish connectors, and pigtail splicing impact the insertion loss and return loss of telecommunications systems. The precision of polishing and minimizing the air gap at connector interfaces is important for low loss. 2. Factory-controlled termination processes provide more consistent optical performance than field installations. No-epoxy-no-polish connectors and pigtails have insertion loss and reflectance measured during manufacturing. 3. Field installers must measure insertion loss but typically do not measure reflectance, which is impractical. The proper termination method should be chosen to meet loss budget and industry standard specifications.

New optical cesium

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Sharing is caring: Real-life shared infrastructure experience

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Trends in next-generation data center interconnects (DCI)

Losses of Slot Mode Devices by Dr.Maithem Salih

Photonic integrated circuits for data center interconnects

IRJET- Designing and Characterization of Graphene-on-Silicon Waveguides

Silicon Photonics: A Solution for Ultra High Speed Data Transfer

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Open optical edge connecting mobile access networks

Generic optics, developed for applications different from RANs, may not fit the requirements of the mobile transport network. Optical components natively conceived for radio access and based on technologies driven by its requirements (right optics at the right time and the right cost) would accelerate the pace at which RANs are deployed and decrease the relative cost of the optics as part of the total RAN solution. In this session, Jim Zou looked at how emerging innovation is enhancing networking energy efficiency. While today’s solutions focus on high-end performance and end user experience, tomorrow’s infrastructure must also balance energy efficiency with varying traffic loads, and designs focused on sustainability.

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