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Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 1
Lecture 25
Built-In Self-Testing
Pattern Generation
and Response
CompactionMotivation and economics
Definitions
Built-in self-testing (BIST)
process
BIST pattern generation (PG)
BIST response compaction
(RC)
Aliasing probability
Example
Summary
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 2
BIST Motivation
Useful for field test and diagnosis
(less expensive than a local
automatic test equipment)
Software tests for field test and
diagnosis:
 Low hardware fault coverage
 Low diagnostic resolution
 Slow to operate
Hardware BIST benefits:
 Lower system test effort
 Improved system maintenance and
repair
 Improved component repair
 Better diagnosis
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 3
Costly Test Problems
Alleviated by BIST
Increasing chip logic-to-pin ratio – harder
observability
Increasingly dense devices and faster
clocks
Increasing test generation and application
times
Increasing size of test vectors stored in
ATE
Expensive ATE needed for 1 GHz clocking
chips
Hard testability insertion – designers
unfamiliar with gate-level logic, since they
design at behavioral level
In-circuit testing no longer technically
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 4
Typical Quality
Requirements
98% single stuck-at fault
coverage
100% interconnect fault
coverage
Reject ratio – 1 in 100,000
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 5
Design
and test
+ / -
+ / -
+ / -
Fabri-
cation
+
+
+
Manuf.
Test
-
-
-
Level
Chips
Boards
System
Maintenance
test
-
Diagnosis
and repair
-
-
Service
interruption
-
+ Cost increase
- Cost saving
+/- Cost increase may balance cost reduction
Benefits and Costs of
BIST with DFT
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 6
Economics – BIST Costs
 Chip area overhead for:
Test controller
Hardware pattern generator
Hardware response compacter
Testing of BIST hardware
 Pin overhead -- At least 1 pin needed to
activate BIST operation
 Performance overhead – extra path
delays due to BIST
 Yield loss – due to increased chip area
or more chips In system because of BIST
 Reliability reduction – due to increased
area
 Increased BIST hardware complexity –
happens when BIST hardware is made
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 7
BIST Benefits
Faults tested:
 Single combinational / sequential stuck-
at faults
 Delay faults
 Single stuck-at faults in BIST hardware
BIST benefits
 Reduced testing and maintenance cost
 Lower test generation cost
 Reduced storage / maintenance of test
patterns
 Simpler and less expensive ATE
 Can test many units in parallel
 Shorter test application times
 Can test at functional system speed
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 8
Definitions
BILBO – Built-in logic block observer,
extra hardware added to flip-flops so they
can be reconfigured as an LFSR pattern
generator or response compacter, a scan
chain, or as flip-flops
Concurrent testing – Testing process that
detects faults during normal system
operation
CUT – Circuit-under-test
Exhaustive testing – Apply all possible 2n
patterns to a circuit with n inputs
Irreducible polynomial – Boolean
polynomial that cannot be factored
LFSR – Linear feedback shift register,
hardware that generates pseudo-random
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 9
More Definitions
Primitive polynomial – Boolean
polynomial p (x) that can be used to
compute increasing powers n of xn
modulo p (x) to obtain all possible non-
zero polynomials of degree less than p (x)
Pseudo-exhaustive testing – Break circuit
into small, overlapping blocks and test
each exhaustively
Pseudo-random testing – Algorithmic
pattern generator that produces a subset
of all possible tests with most of the
properties of randomly-generated
patterns
Signature – Any statistical circuit
property distinguishing between bad and
good circuits
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 10
BIST Process
Test controller – Hardware that activates
self-test simultaneously on all PCBs
Each board controller activates parallel
chip BIST Diagnosis effective only if very
high fault coverage
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 11
BIST Architecture
Note: BIST cannot test wires and
transistors:
 From PI pins to Input MUX
 From POs to output pins
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 12
BILBO – Works as
Both a PG and a RC
Built-in Logic Block Observer (BILBO) -- 4
modes:
1. Flip-flop
2. LFSR pattern generator
3. LFSR response compacter
4. Scan chain for flip-flops
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 13
Complex BIST
Architecture
Testing epoch I:
 LFSR1 generates tests for CUT1 and
CUT2
 BILBO2 (LFSR3) compacts CUT1
(CUT2)
Testing epoch II:
 BILBO2 generates test patterns for
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 14
Bus-Based BIST
Architecture
Self-test control broadcasts patterns to
each CUT over bus – parallel pattern
generation
Awaits bus transactions showing CUT’s
responses to the patterns: serialized
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 15
Pattern Generation
Store in ROM – too expensive
Exhaustive
Pseudo-exhaustive
Pseudo-random (LFSR) – Preferred
method
Binary counters – use more hardware
than LFSR
Modified counters
Test pattern augmentation
 LFSR combined with a few patterns
in ROM
 Hardware diffracter – generates
pattern cluster in neighborhood of
pattern stored in ROM
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 16
Exhaustive Pattern
Generation
Shows that every state and transition
works
For n-input circuits, requires all 2n
vectors
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 17
Pseudo-Exhaustive
Method
Partition large circuit into fanin cones
 Backtrace from each PO to PIs
influencing it
 Test fanin cones in parallel
Reduced # of tests from 28
= 256 to 25
x 2
= 64
 Incomplete fault coverage
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 18
Pseudo-Exhaustive
Pattern Generation
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 19
Random Pattern
Testing
Bottom:
Random-
Pattern
Resistant
circuit
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 20
Pseudo-Random
Pattern Generation
Standard Linear Feedback Shift Register
(LFSR)
 Produces patterns algorithmically –
repeatable
 Has most of desirable random #
properties
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 21
Matrix Equation for
Standard LFSR
X0 (t + 1)
X1 (t + 1)
.
.
.
Xn-3 (t + 1)
Xn-2 (t + 1)
Xn-1 (t + 1)
1
0
.
.
.
0
0
h1
0
1
.
.
.
0
0
h2
0
0
.
.
.
0
0
1
…
…
…
…
…
0
0
.
.
.
1
0
hn-2
0
0
.
.
.
0
1
hn-1
X0 (t)
X1 (t)
.
.
.
Xn-3 (t)
Xn-2 (t)
Xn-1 (t)
=
X (t + 1) = Ts X (t) (Ts is companion matrix)
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 22
LFSR Implements a
Galois Field
 Galois field (mathematical system):
 Multiplication by x same as right shift
of LFSR
 Addition operator is XOR ( )
 Ts companion matrix:
 1st
column 0, except nth element which
is always 1 (X0 always feeds Xn-1)
 Rest of row n – feedback coefficients hi
 Rest is identity matrix I – means a right
shift
Near-exhaustive (maximal length) LFSR
 n
⊕
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 23
Standard n-Stage
LFSR Implementation
Autocorrelation – any shifted sequence
same as original in 2n-1
– 1 bits, differs in
2n-1
bits
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 24
LFSR Theory
Cannot initialize to all 0’s – hangs
If X is initial state, progresses
through states X, Ts X, Ts
2
X, Ts
3
X, …
Matrix period:
Smallest k such that Ts
k
= I
 k LFSR cycle length
Described by characteristic
polynomial:
f (x) = |Ts – I X |
≡
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 25
LFSR Fault Coverage
Projection
Fault detection probability by a random
number
p (x) dx = fraction of detectable faults
with detection probability between x
and x + dx
 p (x) dx 0 when 0 x 1
 p (x) dx = 1
Exist p (x) dx faults with detection
probability x
Mean coverage of those faults is x p (x) dx
Mean fault coverage yn of 1st
n vectors:
n
total faults
≤≤
∫0
1
∫0
1
≥
≡
I (n) = (1 – x)n
p (x) dxwhere
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 26
LFSR Fault Coverage &
Vector Length
EstimationRandom-fault-detection (RFD) variable:
 Vector # at which fault first detected
 wi # faults with RFD variable i
So p (x) = Σ wi pi (x)
ns size of sample simulated; N # test
vectors
w0 ns - Σ wi
Method:
 Estimate random first detect variables
wi from fault simulator using fault
sampling

i = 1
N
≈
≡
≡
i = 1
N
1
ns
≡
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 27
Example External
XOR LFSR
Characteristic polynomial f (x) = 1 +
x + x3
(read taps from right to left)
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 28
External XOR LFSR
Pattern sequence for example LFSR
(earlier):
Always have 1 and xn
terms in polynomial
Never repeat an LFSR pattern more than 1
time –Repeats same error vector, cancels
fault effect
X0 (t + 1)
X1 (t + 1)
X2 (t + 1)
0
0
1
1
0
1
0
1
0
X0 (t)
X1 (t)
X2 (t)
=
X0
X1
X2
1
0
0
0
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
0
1
0
0
0
0
1
…
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 29
Generic Modular
LFSR
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 30
Modular Internal XOR
LFSR
Described by companion matrix Tm = Ts
T
Internal XOR LFSR – XOR gates in
between D flip-flops
Equivalent to standard External XOR
LFSR
 With a different state assignment
 Faster – usually does not matter
 Same amount of hardware
X (t + 1) = Tm x X (t)
f (x) = | Tm – I X |
= 1 + h1 x + h2 x2
+ … + hn-1 xn-1
+ xn
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 31
Modular LFSR Matrix
X0 (t + 1)
X1 (t + 1)
X2 (t + 1)
.
.
.
Xn-3 (t + 1)
Xn-2 (t + 1)
Xn-1 (t + 1)
0
0
1
.
.
.
0
0
0
0
0
0
.
.
.
0
1
0
0
1
0
.
.
.
0
0
0
…
…
…
…
…
…
0
0
0
.
.
.
0
0
1
1
h1
h2
.
.
.
hn-3
hn-2
hn-1
X0 (t)
X1 (t)
X2 (t)
.
.
.
Xn-3 (t)
Xn-2 (t)
Xn-1 (t)
=
0
0
0
.
.
.
0
0
0
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 32
Example Modular
LFSR
f (x) = 1 + x2
+ x7
+ x8
Read LFSR tap coefficients from left
to right
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 33
Primitive
Polynomials
Want LFSR to generate all possible 2n
– 1
patterns (except the all-0 pattern)
Conditions for this – must have a
primitive polynomial:
 Monic – coefficient of xn
term must be 1
Modular LFSR – all D FF’s must right
shift through XOR’s from X0 through
X1, …, through Xn-1, which must feed
back directly to X0
Standard LFSR – all D FF’s must right
shift directly from Xn-1 through Xn-2, …,
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 34
 Characteristic polynomial must
divide the polynomial 1 – xk
for k =
2n
– 1, but not for any smaller k
value
 See Appendix B of book for tables
of primitive polynomials
If p (error) = 0.5, no difference
between behavior of primitive & non-
primitive polynomial
But p (error) is rarely = 0.5 In that
case, non-primitive polynomial LFSR
takes much longer to stabilize with
Primitive
Polynomials
(continued)
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 35
Weighted Pseudo-
Random Pattern
Generation
If p (1) at all PIs is 0.5, pF (1) = 0.58
=
Will need enormous # of random
patterns to test a stuck-at 0 fault on F --
LFSR p (1) = 0.5
 We must not use an ordinary LFSR to
test this
IBM – holds patents on weighted pseudo-
random pattern generator in ATE
1
256
255
256
1
256pF (0) = 1 – =
f
F
s-a-0
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 36
Weighted Pseudo-
Random Pattern
Generator
LFSR p (1) = 0.5
Solution: Add programmable weight
selection and complement LFSR bits to
get p (1)’s other than 0.5
Need 2-3 weight sets for a typical
circuit
Weighted pattern generator drastically
shortens pattern length for pseudo-
random patterns
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 37
Weighted Pattern
Gen.
w1
0
0
0
0
w2
0
0
1
1
Inv.
0
1
0
1
p (output)
½
½
¼
3/4
w1
1
1
1
1
w2
0
0
1
1
p (output)
1/8
7/8
1/16
15/16
Inv
.
0
1
0
1
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 38
Cellular Automata
(CA)
Superior to LFSR – even “more” random
 No shift-induced bit value correlation
 Can make LFSR more random with linear
phase shifter
Regular connections – each cell only
connects to local neighbors
xc-1 (t) xc (t) xc+1 (t)
Gives CA cell connections
111 110 101 100 011 010
001 000
xc (t + 1) 0 1 0 1 1 0
1 0
6 4 3 1
⊕
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 39
Cellular Automaton
Five-stage hybrid cellular automaton
Rule 150: xc (t + 1) = xc-1 (t) xc (t) xc+1
(t)
Alternate Rule 90 and Rule 150 CA
⊕ ⊕
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 40
Test Pattern
Augmentation
Secondary ROM – to get LFSR to 100%
SAF coverage
 Add a small ROM with missing test
patterns
 Add extra circuit mode to Input MUX
– shift to ROM patterns after LFSR
done
 Important to compact extra test
patterns
Use diffracter:
 Generates cluster of patterns in
neighborhood of stored ROM pattern
Transform LFSR patterns into new
vector set
Put LFSR and transformation hardware
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 41
Response
Compaction
Severe amounts of data in CUT response
to LFSR patterns – example:
 Generate 5 million random patterns
 CUT has 200 outputs
 Leads to: 5 million x 200 = 1 billion
bits response
Uneconomical to store and check all of
these responses on chip
Responses must be compacted
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 42
Definitions
Aliasing – Due to information loss,
signatures of good and some bad
machines match
Compaction – Drastically reduce # bits
in original circuit response – lose
information
Compression – Reduce # bits in original
circuit response – no information loss –
fully invertible (can get back original
response)
Signature analysis – Compact good
machine response into good machine
signature. Actual signature generated
during testing, and compared with good
machine signature
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 43
Transition Counting
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 44
Transition Counting
Details
Transition count:
C (R) = Σ (ri ri-1) for all m primary
outputs
To maximize fault coverage:
 Make C (R0) – good machine transition
count – as large or as small as
possible
i = 1
m
⊕
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 45
LFSR for Response
Compaction
Use cyclic redundancy check code (CRCC)
generator (LFSR) for response compacter
Treat data bits from circuit POs to be
compacted as a decreasing order
coefficient polynomial
CRCC divides the PO polynomial by its
characteristic polynomial
 Leaves remainder of division in LFSR
 Must initialize LFSR to seed value
(usually 0) before testing
After testing – compare signature in LFSR
to known good machine signature
Critical: Must compute good machine
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 46
Example Modular
LFSR Response
Compacter
LFSR seed value is
“00000”
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 47
Polynomial Division
Logic simulation: Remainder = 1 + x2
+ x3
0 1 0 1 0 0 0 1
0 x0
+ 1 x1
+ 0 x2
+ 1 x3
+ 0 x4
+ 0 x5
+ 0
x6
+ 1 x7
Inputs
Initial State
1
0
0
0
1
0
1
0
X0
0
1
0
0
0
1
1
1
1
X1
0
0
1
0
0
0
0
1
0
X2
0
0
0
1
0
0
0
0
1
X3
0
0
0
0
1
0
1
0
1
X4
0
0
0
0
0
1
0
1
0
.
.......
Logic
Simulation:
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 48
Symbolic Polynomial
Division
x2
x7
x7
+ 1
+ x5
x5
x5
+ x3
+ x3
+ x3
x3
+ x2
+ x2
+ x2
+ x
+ x
+ x + 1
+ 1
x5
+ x3
+ x +
1
remainder
Remainder matches that from logic simulation
of the response compacter!
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 49
Multiple-Input
Signature Register
(MISR)
Problem with ordinary LFSR response
compacter:
 Too much hardware if one of these is
put on each primary output (PO)
Solution: MISR – compacts all outputs
into one LFSR
 Works because LFSR is linear – obeys
superposition principle
 Superimpose all responses in one LFSR
– final remainder is XOR sum of
remainders of polynomial divisions of
each PO by the characteristic
polynomial
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 50
MISR Matrix Equation
di (t) – output response on POi at
time t
X0 (t + 1)
X1 (t + 1)
.
.
.
Xn-3 (t + 1)
Xn-2 (t + 1)
Xn-1 (t + 1)
1
0
.
.
.
0
0
h1
0
0
.
.
.
0
0
1
…
…
…
…
…
0
0
.
.
.
1
0
hn-2
0
0
.
.
.
0
1
hn-1
X0 (t)
X1 (t)
.
.
.
Xn-3 (t)
Xn-2 (t)
Xn-1 (t)
=
d0 (t)
d1 (t)
.
.
.
dn-3 (t)
dn-2 (t)
dn-1 (t)
+
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 51
Modular MISR
Example
X0 (t + 1)
X1 (t + 1)
X2 (t + 1)
0
0
1
0
1
0
1
1
0
=
X0 (t)
X1 (t)
X2 (t)
d0 (t)
d1 (t)
d2 (t)
+
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 52
Multiple Signature
Checking
Use 2 different testing epochs:
 1st
with MISR with 1 polynomial
 2nd
with MISR with different
polynomial
Reduces probability of aliasing –
 Very unlikely that both polynomials
will alias for the same fault
Low hardware cost:
 A few XOR gates for the 2nd
MISR
polynomial
 A 2-1 MUX to select between two
feedback polynomials
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 53
Aliasing Probability
Aliasing – when bad machine
signature equals good machine
signature
Consider error vector e (n) at POs
 Set to a 1 when good and faulty
machines differ at the PO at time t
Pal aliasing probability
p probability of 1 in e (n)
Aliasing limits:
 0 < p ½, pk
Pal (1 – p)k
 ½ p 1, (1 – p)k
Pal pk
≡
≤
≤≤
≤≤≤
≤
≡
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 54
Aliasing Probability
Graph
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 55
Additional MISR
Aliasing
MISR has more aliasing than LFSR on
single PO
 Error in CUT output dj at ti, followed
by error in output dj+h at ti+h,
eliminates any signature error if no
feedback tap in MISR between bits Qj
and Qj+h.
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 56
Aliasing Theorems
Theorem 15.1: Assuming that each circuit
PO dij has probability p of being in error,
and that all outputs dij are independent, in
a k-bit MISR, Pal = 1/(2k
), regardless of
initial condition of MISR. Not exactly
true – true in practice.
Theorem 15.2: Assuming that each PO dij
has probability pj of being in error, where
the p probabilities are independent, and
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 57
Experiment Hardware
3 bit exhaustive binary counter for
pattern
generator
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 58
Transition Counting vs.
LFSRLFSR aliases for f sa1, transition
counter for a sa1
Pattern
abc
000
001
010
011
100
101
110
111
Transition Count
LFSR
Good
0
1
0
0
0
1
1
1
3
001
a sa1
0
1
1
1
0
1
1
1
Signatures
3
101
f sa1
1
1
1
1
1
1
1
1
0
001
b sa1
0
0
0
0
1
1
1
1
1
010
Responses
Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 59
Summary
LFSR pattern generator and MISR
response compacter – preferred BIST
methods
BIST has overheads: test controller,
extra circuit delay, Input MUX, pattern
generator, response compacter, DFT to
initialize circuit & test the test
hardware
BIST benefits:
 At-speed testing for delay & stuck-at
faults
 Drastic ATE cost reduction
 Field test capability
 Faster diagnosis during system test
 Less effort to design testing process
 Shorter test application times

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testing

  • 1. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 1 Lecture 25 Built-In Self-Testing Pattern Generation and Response CompactionMotivation and economics Definitions Built-in self-testing (BIST) process BIST pattern generation (PG) BIST response compaction (RC) Aliasing probability Example Summary
  • 2. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 2 BIST Motivation Useful for field test and diagnosis (less expensive than a local automatic test equipment) Software tests for field test and diagnosis:  Low hardware fault coverage  Low diagnostic resolution  Slow to operate Hardware BIST benefits:  Lower system test effort  Improved system maintenance and repair  Improved component repair  Better diagnosis
  • 3. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 3 Costly Test Problems Alleviated by BIST Increasing chip logic-to-pin ratio – harder observability Increasingly dense devices and faster clocks Increasing test generation and application times Increasing size of test vectors stored in ATE Expensive ATE needed for 1 GHz clocking chips Hard testability insertion – designers unfamiliar with gate-level logic, since they design at behavioral level In-circuit testing no longer technically
  • 4. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 4 Typical Quality Requirements 98% single stuck-at fault coverage 100% interconnect fault coverage Reject ratio – 1 in 100,000
  • 5. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 5 Design and test + / - + / - + / - Fabri- cation + + + Manuf. Test - - - Level Chips Boards System Maintenance test - Diagnosis and repair - - Service interruption - + Cost increase - Cost saving +/- Cost increase may balance cost reduction Benefits and Costs of BIST with DFT
  • 6. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 6 Economics – BIST Costs  Chip area overhead for: Test controller Hardware pattern generator Hardware response compacter Testing of BIST hardware  Pin overhead -- At least 1 pin needed to activate BIST operation  Performance overhead – extra path delays due to BIST  Yield loss – due to increased chip area or more chips In system because of BIST  Reliability reduction – due to increased area  Increased BIST hardware complexity – happens when BIST hardware is made
  • 7. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 7 BIST Benefits Faults tested:  Single combinational / sequential stuck- at faults  Delay faults  Single stuck-at faults in BIST hardware BIST benefits  Reduced testing and maintenance cost  Lower test generation cost  Reduced storage / maintenance of test patterns  Simpler and less expensive ATE  Can test many units in parallel  Shorter test application times  Can test at functional system speed
  • 8. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 8 Definitions BILBO – Built-in logic block observer, extra hardware added to flip-flops so they can be reconfigured as an LFSR pattern generator or response compacter, a scan chain, or as flip-flops Concurrent testing – Testing process that detects faults during normal system operation CUT – Circuit-under-test Exhaustive testing – Apply all possible 2n patterns to a circuit with n inputs Irreducible polynomial – Boolean polynomial that cannot be factored LFSR – Linear feedback shift register, hardware that generates pseudo-random
  • 9. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 9 More Definitions Primitive polynomial – Boolean polynomial p (x) that can be used to compute increasing powers n of xn modulo p (x) to obtain all possible non- zero polynomials of degree less than p (x) Pseudo-exhaustive testing – Break circuit into small, overlapping blocks and test each exhaustively Pseudo-random testing – Algorithmic pattern generator that produces a subset of all possible tests with most of the properties of randomly-generated patterns Signature – Any statistical circuit property distinguishing between bad and good circuits
  • 10. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 10 BIST Process Test controller – Hardware that activates self-test simultaneously on all PCBs Each board controller activates parallel chip BIST Diagnosis effective only if very high fault coverage
  • 11. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 11 BIST Architecture Note: BIST cannot test wires and transistors:  From PI pins to Input MUX  From POs to output pins
  • 12. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 12 BILBO – Works as Both a PG and a RC Built-in Logic Block Observer (BILBO) -- 4 modes: 1. Flip-flop 2. LFSR pattern generator 3. LFSR response compacter 4. Scan chain for flip-flops
  • 13. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 13 Complex BIST Architecture Testing epoch I:  LFSR1 generates tests for CUT1 and CUT2  BILBO2 (LFSR3) compacts CUT1 (CUT2) Testing epoch II:  BILBO2 generates test patterns for
  • 14. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 14 Bus-Based BIST Architecture Self-test control broadcasts patterns to each CUT over bus – parallel pattern generation Awaits bus transactions showing CUT’s responses to the patterns: serialized
  • 15. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 15 Pattern Generation Store in ROM – too expensive Exhaustive Pseudo-exhaustive Pseudo-random (LFSR) – Preferred method Binary counters – use more hardware than LFSR Modified counters Test pattern augmentation  LFSR combined with a few patterns in ROM  Hardware diffracter – generates pattern cluster in neighborhood of pattern stored in ROM
  • 16. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 16 Exhaustive Pattern Generation Shows that every state and transition works For n-input circuits, requires all 2n vectors
  • 17. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 17 Pseudo-Exhaustive Method Partition large circuit into fanin cones  Backtrace from each PO to PIs influencing it  Test fanin cones in parallel Reduced # of tests from 28 = 256 to 25 x 2 = 64  Incomplete fault coverage
  • 18. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 18 Pseudo-Exhaustive Pattern Generation
  • 19. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 19 Random Pattern Testing Bottom: Random- Pattern Resistant circuit
  • 20. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 20 Pseudo-Random Pattern Generation Standard Linear Feedback Shift Register (LFSR)  Produces patterns algorithmically – repeatable  Has most of desirable random # properties
  • 21. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 21 Matrix Equation for Standard LFSR X0 (t + 1) X1 (t + 1) . . . Xn-3 (t + 1) Xn-2 (t + 1) Xn-1 (t + 1) 1 0 . . . 0 0 h1 0 1 . . . 0 0 h2 0 0 . . . 0 0 1 … … … … … 0 0 . . . 1 0 hn-2 0 0 . . . 0 1 hn-1 X0 (t) X1 (t) . . . Xn-3 (t) Xn-2 (t) Xn-1 (t) = X (t + 1) = Ts X (t) (Ts is companion matrix)
  • 22. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 22 LFSR Implements a Galois Field  Galois field (mathematical system):  Multiplication by x same as right shift of LFSR  Addition operator is XOR ( )  Ts companion matrix:  1st column 0, except nth element which is always 1 (X0 always feeds Xn-1)  Rest of row n – feedback coefficients hi  Rest is identity matrix I – means a right shift Near-exhaustive (maximal length) LFSR  n ⊕
  • 23. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 23 Standard n-Stage LFSR Implementation Autocorrelation – any shifted sequence same as original in 2n-1 – 1 bits, differs in 2n-1 bits
  • 24. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 24 LFSR Theory Cannot initialize to all 0’s – hangs If X is initial state, progresses through states X, Ts X, Ts 2 X, Ts 3 X, … Matrix period: Smallest k such that Ts k = I  k LFSR cycle length Described by characteristic polynomial: f (x) = |Ts – I X | ≡
  • 25. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 25 LFSR Fault Coverage Projection Fault detection probability by a random number p (x) dx = fraction of detectable faults with detection probability between x and x + dx  p (x) dx 0 when 0 x 1  p (x) dx = 1 Exist p (x) dx faults with detection probability x Mean coverage of those faults is x p (x) dx Mean fault coverage yn of 1st n vectors: n total faults ≤≤ ∫0 1 ∫0 1 ≥ ≡ I (n) = (1 – x)n p (x) dxwhere
  • 26. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 26 LFSR Fault Coverage & Vector Length EstimationRandom-fault-detection (RFD) variable:  Vector # at which fault first detected  wi # faults with RFD variable i So p (x) = Σ wi pi (x) ns size of sample simulated; N # test vectors w0 ns - Σ wi Method:  Estimate random first detect variables wi from fault simulator using fault sampling  i = 1 N ≈ ≡ ≡ i = 1 N 1 ns ≡
  • 27. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 27 Example External XOR LFSR Characteristic polynomial f (x) = 1 + x + x3 (read taps from right to left)
  • 28. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 28 External XOR LFSR Pattern sequence for example LFSR (earlier): Always have 1 and xn terms in polynomial Never repeat an LFSR pattern more than 1 time –Repeats same error vector, cancels fault effect X0 (t + 1) X1 (t + 1) X2 (t + 1) 0 0 1 1 0 1 0 1 0 X0 (t) X1 (t) X2 (t) = X0 X1 X2 1 0 0 0 0 1 0 1 0 1 0 1 0 1 1 1 1 1 1 1 0 1 0 0 0 0 1 …
  • 29. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 29 Generic Modular LFSR
  • 30. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 30 Modular Internal XOR LFSR Described by companion matrix Tm = Ts T Internal XOR LFSR – XOR gates in between D flip-flops Equivalent to standard External XOR LFSR  With a different state assignment  Faster – usually does not matter  Same amount of hardware X (t + 1) = Tm x X (t) f (x) = | Tm – I X | = 1 + h1 x + h2 x2 + … + hn-1 xn-1 + xn
  • 31. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 31 Modular LFSR Matrix X0 (t + 1) X1 (t + 1) X2 (t + 1) . . . Xn-3 (t + 1) Xn-2 (t + 1) Xn-1 (t + 1) 0 0 1 . . . 0 0 0 0 0 0 . . . 0 1 0 0 1 0 . . . 0 0 0 … … … … … … 0 0 0 . . . 0 0 1 1 h1 h2 . . . hn-3 hn-2 hn-1 X0 (t) X1 (t) X2 (t) . . . Xn-3 (t) Xn-2 (t) Xn-1 (t) = 0 0 0 . . . 0 0 0
  • 32. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 32 Example Modular LFSR f (x) = 1 + x2 + x7 + x8 Read LFSR tap coefficients from left to right
  • 33. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 33 Primitive Polynomials Want LFSR to generate all possible 2n – 1 patterns (except the all-0 pattern) Conditions for this – must have a primitive polynomial:  Monic – coefficient of xn term must be 1 Modular LFSR – all D FF’s must right shift through XOR’s from X0 through X1, …, through Xn-1, which must feed back directly to X0 Standard LFSR – all D FF’s must right shift directly from Xn-1 through Xn-2, …,
  • 34. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 34  Characteristic polynomial must divide the polynomial 1 – xk for k = 2n – 1, but not for any smaller k value  See Appendix B of book for tables of primitive polynomials If p (error) = 0.5, no difference between behavior of primitive & non- primitive polynomial But p (error) is rarely = 0.5 In that case, non-primitive polynomial LFSR takes much longer to stabilize with Primitive Polynomials (continued)
  • 35. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 35 Weighted Pseudo- Random Pattern Generation If p (1) at all PIs is 0.5, pF (1) = 0.58 = Will need enormous # of random patterns to test a stuck-at 0 fault on F -- LFSR p (1) = 0.5  We must not use an ordinary LFSR to test this IBM – holds patents on weighted pseudo- random pattern generator in ATE 1 256 255 256 1 256pF (0) = 1 – = f F s-a-0
  • 36. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 36 Weighted Pseudo- Random Pattern Generator LFSR p (1) = 0.5 Solution: Add programmable weight selection and complement LFSR bits to get p (1)’s other than 0.5 Need 2-3 weight sets for a typical circuit Weighted pattern generator drastically shortens pattern length for pseudo- random patterns
  • 37. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 37 Weighted Pattern Gen. w1 0 0 0 0 w2 0 0 1 1 Inv. 0 1 0 1 p (output) ½ ½ ¼ 3/4 w1 1 1 1 1 w2 0 0 1 1 p (output) 1/8 7/8 1/16 15/16 Inv . 0 1 0 1
  • 38. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 38 Cellular Automata (CA) Superior to LFSR – even “more” random  No shift-induced bit value correlation  Can make LFSR more random with linear phase shifter Regular connections – each cell only connects to local neighbors xc-1 (t) xc (t) xc+1 (t) Gives CA cell connections 111 110 101 100 011 010 001 000 xc (t + 1) 0 1 0 1 1 0 1 0 6 4 3 1 ⊕
  • 39. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 39 Cellular Automaton Five-stage hybrid cellular automaton Rule 150: xc (t + 1) = xc-1 (t) xc (t) xc+1 (t) Alternate Rule 90 and Rule 150 CA ⊕ ⊕
  • 40. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 40 Test Pattern Augmentation Secondary ROM – to get LFSR to 100% SAF coverage  Add a small ROM with missing test patterns  Add extra circuit mode to Input MUX – shift to ROM patterns after LFSR done  Important to compact extra test patterns Use diffracter:  Generates cluster of patterns in neighborhood of stored ROM pattern Transform LFSR patterns into new vector set Put LFSR and transformation hardware
  • 41. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 41 Response Compaction Severe amounts of data in CUT response to LFSR patterns – example:  Generate 5 million random patterns  CUT has 200 outputs  Leads to: 5 million x 200 = 1 billion bits response Uneconomical to store and check all of these responses on chip Responses must be compacted
  • 42. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 42 Definitions Aliasing – Due to information loss, signatures of good and some bad machines match Compaction – Drastically reduce # bits in original circuit response – lose information Compression – Reduce # bits in original circuit response – no information loss – fully invertible (can get back original response) Signature analysis – Compact good machine response into good machine signature. Actual signature generated during testing, and compared with good machine signature
  • 43. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 43 Transition Counting
  • 44. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 44 Transition Counting Details Transition count: C (R) = Σ (ri ri-1) for all m primary outputs To maximize fault coverage:  Make C (R0) – good machine transition count – as large or as small as possible i = 1 m ⊕
  • 45. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 45 LFSR for Response Compaction Use cyclic redundancy check code (CRCC) generator (LFSR) for response compacter Treat data bits from circuit POs to be compacted as a decreasing order coefficient polynomial CRCC divides the PO polynomial by its characteristic polynomial  Leaves remainder of division in LFSR  Must initialize LFSR to seed value (usually 0) before testing After testing – compare signature in LFSR to known good machine signature Critical: Must compute good machine
  • 46. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 46 Example Modular LFSR Response Compacter LFSR seed value is “00000”
  • 47. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 47 Polynomial Division Logic simulation: Remainder = 1 + x2 + x3 0 1 0 1 0 0 0 1 0 x0 + 1 x1 + 0 x2 + 1 x3 + 0 x4 + 0 x5 + 0 x6 + 1 x7 Inputs Initial State 1 0 0 0 1 0 1 0 X0 0 1 0 0 0 1 1 1 1 X1 0 0 1 0 0 0 0 1 0 X2 0 0 0 1 0 0 0 0 1 X3 0 0 0 0 1 0 1 0 1 X4 0 0 0 0 0 1 0 1 0 . ....... Logic Simulation:
  • 48. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 48 Symbolic Polynomial Division x2 x7 x7 + 1 + x5 x5 x5 + x3 + x3 + x3 x3 + x2 + x2 + x2 + x + x + x + 1 + 1 x5 + x3 + x + 1 remainder Remainder matches that from logic simulation of the response compacter!
  • 49. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 49 Multiple-Input Signature Register (MISR) Problem with ordinary LFSR response compacter:  Too much hardware if one of these is put on each primary output (PO) Solution: MISR – compacts all outputs into one LFSR  Works because LFSR is linear – obeys superposition principle  Superimpose all responses in one LFSR – final remainder is XOR sum of remainders of polynomial divisions of each PO by the characteristic polynomial
  • 50. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 50 MISR Matrix Equation di (t) – output response on POi at time t X0 (t + 1) X1 (t + 1) . . . Xn-3 (t + 1) Xn-2 (t + 1) Xn-1 (t + 1) 1 0 . . . 0 0 h1 0 0 . . . 0 0 1 … … … … … 0 0 . . . 1 0 hn-2 0 0 . . . 0 1 hn-1 X0 (t) X1 (t) . . . Xn-3 (t) Xn-2 (t) Xn-1 (t) = d0 (t) d1 (t) . . . dn-3 (t) dn-2 (t) dn-1 (t) +
  • 51. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 51 Modular MISR Example X0 (t + 1) X1 (t + 1) X2 (t + 1) 0 0 1 0 1 0 1 1 0 = X0 (t) X1 (t) X2 (t) d0 (t) d1 (t) d2 (t) +
  • 52. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 52 Multiple Signature Checking Use 2 different testing epochs:  1st with MISR with 1 polynomial  2nd with MISR with different polynomial Reduces probability of aliasing –  Very unlikely that both polynomials will alias for the same fault Low hardware cost:  A few XOR gates for the 2nd MISR polynomial  A 2-1 MUX to select between two feedback polynomials
  • 53. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 53 Aliasing Probability Aliasing – when bad machine signature equals good machine signature Consider error vector e (n) at POs  Set to a 1 when good and faulty machines differ at the PO at time t Pal aliasing probability p probability of 1 in e (n) Aliasing limits:  0 < p ½, pk Pal (1 – p)k  ½ p 1, (1 – p)k Pal pk ≡ ≤ ≤≤ ≤≤≤ ≤ ≡
  • 54. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 54 Aliasing Probability Graph
  • 55. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 55 Additional MISR Aliasing MISR has more aliasing than LFSR on single PO  Error in CUT output dj at ti, followed by error in output dj+h at ti+h, eliminates any signature error if no feedback tap in MISR between bits Qj and Qj+h.
  • 56. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 56 Aliasing Theorems Theorem 15.1: Assuming that each circuit PO dij has probability p of being in error, and that all outputs dij are independent, in a k-bit MISR, Pal = 1/(2k ), regardless of initial condition of MISR. Not exactly true – true in practice. Theorem 15.2: Assuming that each PO dij has probability pj of being in error, where the p probabilities are independent, and
  • 57. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 57 Experiment Hardware 3 bit exhaustive binary counter for pattern generator
  • 58. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 58 Transition Counting vs. LFSRLFSR aliases for f sa1, transition counter for a sa1 Pattern abc 000 001 010 011 100 101 110 111 Transition Count LFSR Good 0 1 0 0 0 1 1 1 3 001 a sa1 0 1 1 1 0 1 1 1 Signatures 3 101 f sa1 1 1 1 1 1 1 1 1 0 001 b sa1 0 0 0 0 1 1 1 1 1 010 Responses
  • 59. Copyright 2001, Agrawal & Bushnell VLSI Test: Lecture 25 59 Summary LFSR pattern generator and MISR response compacter – preferred BIST methods BIST has overheads: test controller, extra circuit delay, Input MUX, pattern generator, response compacter, DFT to initialize circuit & test the test hardware BIST benefits:  At-speed testing for delay & stuck-at faults  Drastic ATE cost reduction  Field test capability  Faster diagnosis during system test  Less effort to design testing process  Shorter test application times