IMT is a leading MEMS foundry and contract manufacturer with a 130,000 square foot facility. It has a 30,000 square foot class 100 clean room for processing 6-inch wafers using fully automated, comprehensive equipment. IMT has a proven track record in developing complex MEMS such as those involving microfluidics, actuation, and multi-wafer stacks. It is also a leader in wafer-level packaging (WLP) with high-yielding through-silicon via technology to enable customers' highest performance devices in a cost-effective package. IMT has the capability to significantly scale its manufacturing capacity.

1. MEMS Today
Innovative Micro Technology
Michael Shillinger
75 Robin Hill Road
Santa Barbara, CA 93117
Phone: 805.681.2852
Fax: 805.967.2677
info@imtmems.com
www.imtmems.com
IMT Confidential and Proprietary, Rev. 07.01.13

2. MEMS (Micro-Electro-Mechanical Systems)
• MEMS are very small
machines on Chips
Chamber 1
Valve 2
Valve 1
• MEMS are not an industry,
but a diverse technology
base for virtually all
industries
Valve 3
Valve 4
Chamber 2
– Smaller, lower cost for
replacing/enhancing
existing technologies
– Enabling for new technologies
• Innovation is required to
Make MEMS Work
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3. MEMS are in an Explosive Market
MEMS market by application
Source: iSuppli
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4. MEMS Development and Manufacturing
Technology Development
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Prototype and
Proof of Concept
MEMS Process Customization
Design Implementation
Design for Manufacturing
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Quick Wafer TAT
Staged Wafers
“Single Roof” Co-Location
with engineering
High Volume Manufacturing
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Smooth Transition from Development to Production
Scalable Manufacturing Capacity and Small Lot Flexibility
Manufacturing Control Systems
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5. Innovative Micro Technology (IMT)
• Established in 2000, IMT is a privately-held,
profitable company
• Acknowledged leader in complex MEMS
foundry/contract manufacturing
• Offering flexible turn-key services and
custom solutions:
– Cooperative design for manufacturability
– Process development
– Prototyping
– Volume manufacturing
– Testing
– Metrology/analytical services
• ISO 9001 certified – Industry-leading statistical
quality and process control (SQC/SPC)
• History of developing new technologies and materials
• Close customer collaboration in all
aspects of development and production
• IMT’s Mission: To enable the shortest time to market
and greatest overall value while leading our customers
into volume production
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6. We see the Entire Industry - Strong Diversification
Business Segment
Description
Automotive
Accelerometers, pressure sensors, IR sensors
Biotech
Cell filter, microfluidics, DNA detection, gene testing,
protein detection, mass sensor, hematology,
chromatography, gene sequencing
Computer Servers
Embedded optical networking
Consumer
Projector micromirrors, motion sensors, batteries
Industrial
Accelerometers, seismic drilling gyros, particle
metrology, magnetic sensors
LED Lighting
Micromirrors
Medical
Cell sorter, cardiac implant pressure sensor, diagnostics,
ear infection treatment, IV drug safety
Military
Wafer-level packaging, IR imagers, IR emitters,
microfluidics, phased array antenna, nav-grade gyro
Optical telecommunications
Micromirrors, optical switches, router and switch
transceiver modules, active optical cables
Precision Manufacturing
RF communications
LED-based mobile displays, probe cards, EUV lithography
Capacitors
Solar
Inverters
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7. IMT Staffing
• Total Staff: 100+ and Growing
• Operations
– Process and equipment engineering specialists in photolithography,
etching, and vacuum areas
– Experienced operations and maintenance staff with high-volume
manufacturing backgrounds
• Dedicated Program Managers
– With decades of cumulative industry experience to oversee customer’s
projects from conception to production
• Technical Professionals
– PhD chemists, physicists, biologists, biochemists, mechanical, electrical,
and test engineers
– PhD process development and design engineers specializing in MEMS
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8. Leadership in MEMS
• Leadership in Volume Manufacturing
– 62M+ MEMS switches shipped
– 6M/month magnetic sensors
– Multiple other programs with 10’s to 100’s of
thousands per month quantities
– Leadership in hermetic wafer-level packaging
• > 99% hermeticity yields in production
• Specialty gases and high vacuum
– Isolated metal-filled thru-wafer vias
• World’s Most Precise MEMS
– 1M holes/chip
– 22nm s precision
• World’s Fastest MEMS
– 0 to 1.4 meters/sec to 0 in 15 microseconds
– Average acceleration 12,000 Gs, 22µm stroke
• World’s Most Sensitive MEMS
– Femtogram mass sensor in fluid with Q > 10,000
• World’s Most Complex MEMS
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Programs with 4 and 5 wafer bonded stack
On board reflective and refractive optics
3D microfluidics
Magnetically-driven actuators
– Materials – metals, polymers, glass, silicon…
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9. IMT MEMS Manufacturing Center
• 130,000 sq. ft. facility built for
production
• 30,000 sq. ft. cleanroom
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Class 100
+/- 1 degree F temperature control
+/- 3 % relative humidity control
Additional space fully facilitized and
available for expansion
• 4,000 sq. ft. assembly/packaging area
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10. Foundry Manufacturing Capability
Turn-key MEMS manufacturing services
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Photolithography
Deposition
Wet chemical etch/electroplating
Reactive Ion Etching
Ion milling
CMP planarization and
wafer grinding/polishing
Wafer bonding
Cleaning
Die slice
Assembly/packaging
Testing
Metrology/analysis
Design/Modeling
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11. IMT’s MEMS Technology Modules
• Through-silicon vias and interconnects
– Isolated metal-filled Through-Silicon Vias
– Multilayer metals in polymer or glass
– Ultra-high-yield metal-metal contact
• Wafer-level packaging
– Hermeticity yield > 99% in production
– Sub-mTorr high-vacuum
– 100% hermeticity verification
– Low temperature metal alloy bonding, fusion,
anodic, thermal compression
• 3-D microfluidics, metal inlays in SOI,
and engineered substrates
• Robust anti-reflective IR
• Vast materials flexibility,
including magnetics
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12. IMT Through-Silicon Vias (TSV)
• TSV’s can be used to provide electrical
connectivity from outside to inside of chip
– Low-resistance copper vias
– Polysilicon vias
• 99.96% yield
• Copper vias offer extreme performance
– DC resistance: < 0.01 ohms per via
– IL: -0.01dB @ 6Ghz
– 15 mm diameter vias
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13. Optical Switching
• Wavelength-selectable switch (WSS)
– 96 x 1
– 48 x 1
– 12 x 1
• Planar Lightwave Circuits (PLC)
– FTTx
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Variable Optical Attenuators (VOA)
Optical Cross-Connect (OXC)
Adaptive Optics
Micromirror fabrication
– Photolithography precision
– Small and large mirror sizes
– High quality mirror surface
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14. DC to Millimeter-Wave Switch Platforms
• 62M+ MEMS switches shipped
– Wafer-level packaging using low
temperature alloy bonding
– Hermeticity yields > 99% in production
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Millimeter-Wave switches
RF relays
Telecom cross-connect
Customer platforms
IMT CenFire® platform
IMT Bolt™ platform
MEMtronics platform
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IMT Innovian® platform
(MIT-LL technology)
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15. Case Study 1: Cell Sorter
• Enables High Purity Cell Therapy
 High-speed, massively parallel sorting
for cancer, autoimmune treatment,
and radiation exposure
 World’s fastest MEMS at 0 to 1.4 m/sec
back to 0 in 15 microseconds
 Leverages IMT process modules
 IMT design and specifications that incorporates 3D
microfluidics, actuators and 4 wafers bonded at
wafer-level
World’s fastest MEMS
(actuator for cell sorting)
Laser input, reflective and
refractive optics on-board
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NanoSorter Rare Cell
Purification System
3D Microfluidics enabled by
Deep Reactive Ion Etch
(DRIE)
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16. Case Study 2: Mass/Particle Detection in Fluid
• Resonant mass detection co-developed
with MIT and Affinity Biosensors
– World’s most sensitive detector of mass in fluid:
attogram sensitivity
“The ability to measure samples in liquid is essential in
many biological applications…they have improved the
performance of their system further to achieve a mass
resolution of 27 attograms.”
Nature Nanotechnology, July 2010
– Leverages IMT technology modules
Bypass Channels
Drive Electrode
Cantilever Tip
• Integrated microfluidics
• 3 wafers bonded stack – 1 mTorr vacuum w/getter
– Q >10,000
– Applications include:
• Particle metrology
• Diagnostics
• Global health
• Cytometry
• Proteomics
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17. Case Study 3: IR Emitter and Gas Sensor
• IR Emitter/Sensor for ICx Photonics:
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
In mass production
1 million holes/chip
22nm s precision
Sensing of gases for biomedical, air-conditioning,
and hazard detection/industrial safety applications
 Tight wavelength emission for identification of
friend-or-foe for military field applications
 Leverages IMT technology modules
 3 wafers bonded stack
Photonic crystal
technology
 1 mTorr vacuum with getter
Traditional packaging
Wafer-level packaging
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18. Summary
• MEMS are complex micro machines that are all around us today
– Cell phones, gaming consoles, automobiles, biomedical, among others
• High volume MEMS manufacturer with ability to significantly
scale capacity
– 30,000 sq. ft. Class 100 clean room with the most comprehensive, fully
automated equipment for 6” wafer processing
– ISO 9001 certified
• Proven experience in design and development of microfluidics,
actuation and complex MEMS
• Leaders in WLP with best-in-class Through Silicon Via
technology, enabling customers to achieve highest performance
in most cost-effective package
• Extensive non-CMOS materials flexibility (metals, magnetics,
polymers, etc.)
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19. Questions ?
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