Micro-electromechanical systems (MEMS) combine electrical and mechanical components on a small scale, ranging from sub-micrometers to millimeters. MEMS are fabricated using integrated circuit processes like deposition, lithography, and etching to create structures out of silicon, polymers, and metals. They have a variety of applications as sensors, including in pressure sensors, accelerometers, and tire pressure monitors. MEMS provide advantages like low cost and improved performance compared to macro-scale components.

1. Micro-Electromechanical
System (MEMS)
K. Bharath Kanna, B.E Mech
Project Associate,
NITTTR Chennai.

2. Introduction
 Micro-electromechanical systems
(MEMS) are small integrated devices or
systems that combine electrical and
mechanical components.
 They range in size from the sub
micrometer level to the millimetres level.

3. The legs of a spider mite standing on
gears from a micro-engine.
A MEMS silicon motor together with a
strand of human hair.

4. Different names for MEMS
 USA: Micro- Electro Mechanical
System.
 Europe: Micro system Technology.
 Japan: Micro machines.

5. MEMS Technology
 Micro fabrication Technology.
 The electronics are fabricated using
integrated circuit (IC) process
sequences.
 The micromechanical components are
fabricated using compatible
"micromachining" processes

6. Material
 Silicon
 Polymer
 Metals (gold, nickel, aluminum,
chromium, titanium, tungsten, platinum
and silver)

7. Micro fabrication
There are three basic building blocks in MEMS
technology.
 Deposition: The ability to deposit thin
film of material on substrate.
 Lithography: To apply a patterned mask on
top of the films by photolithographic imaging.
 Etching: To etch the films selectively to the
mask.

8. Deposition Technology
Deposition technology can be classified
into two groups:
Deposition by Chemical Reaction:
 Chemical Vapor Deposition.
 Electro deposition.
 Epitaxy
 Thermal oxidation.

9. Deposition Technology
Deposition by Physical Reaction:
 Physical Vapor Deposition
 Casting

10. Lithography Technology
Lithography can be classified into two
groups:
 Pattern Transfer
 Lithographic Module

11. Etching Technology
There are two classifications for etching process:
 Wet Etching: The material is dissolved in chemical
solution.
 Dry Etching: the material is sputtered or dissolved
using reactive ions or vapour phase etchants.

12. Designing Process

13. Applications
 Pressure Sensor
 Accelerometers
 Inertial Sensors
 Micro engines

14. Commercial Application
 Inkjet printers
 Airbag Inflation system
 Tire Pressure Sensor
 Disposal Blood Pressure Sensor
 Dynamic Stability Control in Cars
 DMD chip in DLP Projectors

15. Advantages
 Minimize energy and materials use in
manufacturing
 Cost/performance advantages
 Improved reproducibility
 Improved accuracy and reliability
 Increased selectivity and sensitivity

16. Disadvantages
 Farm establishment requires huge
investments
 Micro-components are Costly compare
to macro-components
 Design includes very much complex
procedures
 Prior knowledge is needed to integrate
MEMS devices

17. Thank You