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MEMS capability @ CSEM
1. MEMS Technology Development powerhouse
Combine a rigorous industrial approach with flexibility and innovative spirit
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• From proof-of-concept studies to small series production
• CSEM has a long track record of MEMS projects in multiple industrial
domains including:
• Watchmaking
• Medical
• Industrial & Instrumentation
• Automotive & Aerospace
• Telecommunication
• Clean room details:
• Newly built and equipped in 2015
• 1200 m² clean room class 100 / ISO5
• Fully dedicated experienced engineering staff
• 150 mm wafers & 100mm possible
• Wide range of process technologies & materials
• First level of packaging
• Preferential access to extended MEMS foundry Network
MEMS technology development powerhouse
Infrastructure - 1
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MEMS Process Technology
• Photolithography
• Thicknesses: 700nm to 50 µm
• Resolution: 800nm & stepper
• Photolithography SU8
• Thicknesses: 10 to 250 µm
• Resolution: 2 µm
• Etching
• Wet etching KOH, SiO2, Metals, …
• Dry etching RIE
• Thin film deposition
• Metal and metal oxides (sputtering,
evaporation, ALD, ..)
• Dielectrics (Thermal Oxidation, LPCVD,
APCVD, PECVD, MVD, ALD)
• Parylene coating
• Structural Dry resist lamination
• N-type / P-type junctions / Ion implants
Standard processes Special processes
• Deep-RIE
• Depth up to 700µm / Verticality: < 0.1°
• Silicon Carbide
• Wafer level bonding
• Anodic, fusion, eutectic
• Piezo Thin Film (AlN, AlScN, PZT, …)
• Galvanic processes (Au, Ni, NiP, Cu, ..)
• Electroless metal deposition
• Diamond & Diamond-Like Carbon deposition
• Precise Diamond Machining
• Laser cutting
• SACE – Glass wafer patterning
• SEM / TEM / FIB / HD-XRD Failure mode and
reliability analysis
Infrastructure - 1
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MEMS development cycle
• CSEM can handle very complex projects from conceptual phase to system integration,
from component to application with emphasis on watch components, gas sensors,
micro mirrors, inertial sensors, pressure sensors, bio-interacting & optical microsystems
With its
unique
experience in
high end
MEMS
products and
system know-
how …
Design & Simulation
Foundry
Technology services
Wafer processing
Engineering &
production scale-up
Testing electrical, mechanical & Characterization
microscopy, spectroscopy, X-ray diffraction
Packaging
Feasibility to small series,
industrialization processes &
development
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Quality system
• ISO 9001:2008 certified
• ISO 13485 capable
• Library of technological blocks
• Electronic lot documentation and WIP (CFAB)
• Process flow and lot traveler
• Lot tracking
• Wafer stock
• Industrial cost model
• Rush lot with expedited turn-around time
MEMS process technology