The document presents an overview of Micro-Optical-Electro-Mechanical Systems (MOEMS) and their integration with microelectronic components to create microsensors and actuators. It discusses the manufacturing, design parameters, methodologies, and applications of MOEMS in various fields such as biomedical, automotive, and communication technologies. Additionally, it highlights the benefits of MOEMS, including cost-effectiveness, reliability, and miniaturization.

1. 1
MOEMS simulation
Presented
By
Ramesh Kumar
Professor, BIT, Durg

2. 2
MOEMS microstructures are manufactured in
batch methodologies similar to computer
microchips. The photolithographic techniques
that mass-produce millions of complex
microchips can also be used simultaneously to
develop and produce mechanical sensors and
actuators integrated with electronic circuitry.
Most MOEMS devices are built on wafers of
silicon, adopting micromachining technologies
from integrated circuit (IC) manufacturing and
batch fabrication techniques.
MOEMS and ICs

3. 3
MEMS Introduction
•Physical actions require mechanical by
actuation of electrical actions.
•Automation and technological competence are
the basic goals of development
•Integration of Electrical & Mechanical system
result in complete system:Both Electrical and
Mechanical components embedded on same
substrate

4. 4
MEMS Introduction Contd.
The basic approaches are
•Miniaturization
•Multiplicity
•Microelectronics
•The dimension of Electrical devices is in milli
to micro meter & some times nano mt.
•The dimension of mechanical devices is 3 to 6
times that of electronics devices

5. 5
Micro-Optical-Electro-Mechanical-Systems
(MOEMS)
If in the MEMS technology, optical components is
combined with mechanisms to allow motion with
electrical structures to provide actuation then the
system developed is termed as MOEMS

6. 6
Input Signal Microsensing Element Transduction
Unit
Output
signal
Power supply
MOEMS as Microsensor

7. 7
•Acoustic Wave sensor
•Humidity sensor
•Displacement sensor
•Biomedical sensor
•Biosensor
•Chemical Sensor
•Optical Sensor
•Pressure Sensor
•Thermal Sensor
Types of Microsensors

8. 8
Output action Microactuating Element Transduction
Unit
Power supply
MOEMS as Microactuator

9. 9
•Actuation Using Thermal Forces
•Actuation using shape memory alloys
•Actuation Using Piezoelectric Crystals
•Actuation Using Electrostatic Forces
Microactuation

10. 10
Advantages
•To provide general solution
•To make cost effective approach
•For teaching & Demonstration
•Analyze & verify theoretical model
•Research tool
•Complexity of problems easily understood
•Lowers time & cost in designing

11. 11
•Light weight, Small size
• No induce impulse
•No effect in explosive environments
•Immunity to adverse temp. and moisture
•Low cost
•No additional protection
•No problem in space radiation
•No electromagnetic interference
•No crosstalk interference
Benefits of Optics

12. 12
Need of SimulationDifferent level of Abstraction
Alternative solution
Practical feedback at time of designing
Real life solution
Trade offs between accurate modeling
Cost
Teaching & demonstration
Time
Large data handling
Debugging and tuning in Design
Visualize data
Virtual prototype

13. 13
Earlier work
•Data and Materials model
•Prediction of MEMS assemblies
•Thermo Mechanical behavior
•SESES – Electrical, Thermal & Mechanical
•NODAS – Nodal design of actuators and Sensors
•Mach Zehnder interferometer
•Switching Device etc.

14. 14
Optical Design
Electro
Mechanical
Design
Process Design
Choosing Geometry
Optical Characteristics
Electronics
Mechanics
Stiffness
Material Parameters
Electrostatics
Thermal
Patterning
Material Deposition
Etching

15. 15
Design
Parameters

16. 16
Design Parameters of MOEMS under interest
Mechanical: Shape and dimension / Stress distribution / Strength /
Stiffness /Rigidity and distribution /Weight and distribution /Hardness/Wear
resistance/Abrasion resistance/Ductility /Coefficient of
friction/lubricity/Damping/Creep/Fatigue/Toughness
Electrical: Conductivity /Resistance /Dielectric Strength /Dielectric loss
/Magnetic permeability and saturation /Eddy current loss Skin Effect /Electro
magnetic forces /Electro static voltages /Corrosion from leakage currents
Thermal: Thermal Expansion /Temperature coefficient of resistance
/Specific Heat / Thermal Conductivity
Ecological: Effect of discharges on the environment /Effect of the product
on the environment when scrapped
Biological: Toxicity /Carcinogenesis /Fungus resistance /Other Microorganism
Resistance
Optical: Transparency /Translucence /Opacity /Color /Refractive Index
Chemical: Chemical Resistance including Corrosion /Chemical
harmfulness including pollution by manufacturing process and by-
product /Adhesive bondability /Hygroscopic /Porosity /fading

17. 17
DESIGN
MANUFACTURE
TESTING
USE
no
yes

18. 18
Methodology

19. 19
Methodology
•Modeling of MOEMS as Sensor
•Modeling based on different substrates
•Modeling of MOEMS as Actuator
•Beam Propagation Technique
•Computational OptoElectroMechanics ( High
Fidelity Modeling )
•High Fidelity Modeling of Electromagnetic Field

20. 20
Laguerre Gaussian Equation
•Single
•Two
•Multimode Differential Equation Modeling
Vertical Cavity Surface Emitting
Surface

21. 21
Maxwell’s Equation
•Boundary Conditions
•Fast Fourier Transformation
(1) div D = ρ, (2) div B = 0, (3) curl E = -dB/dt,
and (4) curl H = dD/dt + J.
rho, ρ, is charge density, J is current density,
E is the electric field, and B is the magnetic
field; here, D and H are field quantities that
are proportional to E and B, respectively.

22. 22
Helmholtz Equation
•Free Space
•Guided wave propagation
•FD-BMP
•FFT-BMP
Helmholtz (time-independent
diffusion) equation

23. 23
•VHDL Very High Speed Integrated
Circuit Descriptor Language
•Verilog
•ABEL HDL
•SPICE Simulator
•Electrical
•Mechanical
•Thermal
•Fluid

24. 24
Simulation outcome
•Modeling and Analysis based on different parameter.
•Parameters effect
•Variations of refractive index
Modeling & Simulation for the optical & electro-
mechanical parts is usually done separately, But here
it is tried to integrate in one.

25. 25
•Accuracy in distance measurements
•EMI insensitivity in harsh environments
•Security in exploding fields
•Selectivity in chemical detection
•Miniaturization
•Reliability
•Mass and size reduction
•Mass production capability
•Low manufacturing costs
Benefits of using MOEMS

26. 26
•Sand-sized machines
•chip to think, act, and communicate
•intelligent Microsystems
•systems-on-a-chip
•Sensing and acting
•potentially quite inexpensive
•millimeters to a dozen microns
•miniature parts
•use little power, occupy a small volume
Advantages

27. 27
•Limited Options
•Packaging
•Fabrication Knowledge Required
•Expermintal data
•Technological barrier
• Acceptence
• Less Fabrication center
Limitation

28. 28
smart dust
Smart roads
sensors in automobile airbags
Medical
 aviation
Defense
Wireless communication
and optical communications systems.
automobile-mounted global positioning systems
Today & Future

29. 29
Outstanding industrial applications of MOEMS are
•Peripherals and Telecom
•Biomedical
•Automotive
•Industrial maintenance and control
•Demotic
•Space and astronomy
•Environmental monitoring
MOEMS applications

30. 30
Applications

31. 31
•Inertial Measurements - Accelerometers, gyroscopes, rate
sensors, vibration sensors.
•Pressure Measurements - TPMS (Tire Pressure Monitoring
System) , disposable blood pressure sensors and various
industrial applications.
•Display Technology - Optical MEMS in projectors, plasma
displays.
•RF Technology - Tunable filters, RF switches, antennas,
phase shifters, passive components (capacitors,
inductors).
• Chemical Measurements - Microfluidics: Lab-On-Chip
devices, DNA test structures, micro-dispensing pumps,
hazardous chemical and biological agent detectors
Typical Device Applications

32. 32
Optical MEMS Communication Link

33. 33
MEMS-Based Optical Identification and
Communication Systems (MOICS

34. 34
Rotary Millimotor

35. 35
Thanks