This document provides an overview of a presentation on MEMS (Micro-Electro-Mechanical Systems) technology. It defines MEMS as tiny integrated devices that can sense, control, and actuate. The document outlines the presentation sections on MEMS sensors, fabrication methods like bulk micromachining and surface micromachining, packaging, advantages like small size and low power consumption, and applications in medical, industrial, and communication fields. It concludes that MEMS is an effective technique for producing low-cost, high-quality sensors and will help improve lives by enabling real-time data collection and a better understanding of the physical world.

1. Welcome
to
Paper Presentation on
MEMS TECHNOLOGY
By
Chavan Mayuri Sanjay
Department of Electronics and Telecommunication Engineering
Annasaheb Dange College of Engineering and Technology, Ashta

2. OUTLINE
• MEMS Introduction
• Sensor
• Fabrication
• MEMS manufacturing technology
• Packaging
• Advantages
• Disadvantages
• Application
• Conclusion
• Reference

3. INTRODUCTION
• MEMS is a acronym for micro-electro-mechanical system
• It is used to create tiny integrated devices
• Ability to scence, control and actuate
• MEMS is the promising technology in 21th century

4. WHY MEMS SENSOR?
• It measures physical quantity and convert into it into
electronic signal
• Used to scence changing parameter
• Small in size
• Have lower power consumption
• More sensitivity to input variation
• Less invasive due to mass production

5. FABRICATION
Material used are:
• Silicon
• Polymer
• Metal
• Ceramic
Basic Process
Deposition Patterning Etching

6. MEMS MANUFACTURING TECHNOLOGY
• Bulk Micromachining
• Surface Micromachining
• LIGA

7. BULK MICROMACHINING
• This technique involves removal of substrate material
• Bulk micromachining techniques are:
Wet etching
Dry etching

8. SURFACE MICROMACHINING
• It enables fabrication of complex integrated structure
• Widely used technique is Polysilicon surface
micromachining
• Structure thickness is smaller than 10 μm

9. LIGA
• LIGA is a German acronym standing for lithographie,
galvanoformung (plating), and abformung (molding).

10. PACKAGING
• Protect the sensor from external influences and
environmental effect
• Protect the environment from presence of the sensor
• Provide controlled interface between sensors
• Standard IC Packages:
Ceramic Packages, Plastic Package, Metal Packages

11. ADVANTAGES
• Smaller package size
• Less power consumption
• Easy to integrate into system or modify
• Lighter weight
• Higher output signal

12. LIMITATIONS
• It is very small to trace out
• Expensive and Complex Packaging

13. APPLICATIONS
 In medical science
• Pressure sensor
• Inertial sensor
• Sight for the blind
 In marine science

14. CONTINUE….
 Applications in marine military operation
 Industrial Market
 Communication

15. FUTURE SCOPE
• Access to Foundries
• Design, Simulation and Modeling
• Packaging and Testing
• Standardization
• Education and Training

16. CONCLUSION
• MEMS promises to be an effective technique of
producing sensors of high quality, at lower costs.
• Thus I can conclude that the MEMS can create a
proactive computing world, connected computing nodes
automatically, acquire and act on real-time data about a
physical environment, helping to improve lives,
promoting a better understanding of the world and
enabling people to become more productive.

17. REFERENCE
1. Microsensors , Muller, R.S., Howe, R.T., Senturia , S.D.,
Smith, R.L., and White, R.M. [Eds.], IEEE Press, New York,
NY, 1991.
2. Micromechanics and MEMS: Classic and Seminal Paper
to 1990, Trimmer, W.S., IEEE Press, New York, NY, 1997.
3. Journal of Micro-electro-mechanical-Systems
(http://www.ieee.org/pub_preview/mems_toc.html)
4. Journal of Micromechanics and Microengineering
(http://www.iop.org/Journals/jm)