Skip to main content
UploadLanguage (EN)Support
BusinessMobileSocial MediaMarketingTechnologyArt & PhotosCareerDesignEducationPresentations & Public SpeakingGovernment & NonprofitHealthcareInternetLawLeadership & ManagementAutomotiveEngineeringSoftwareRecruiting & HRRetailSalesServicesScienceSmall Business & EntrepreneurshipFoodEnvironmentEconomy & FinanceData & AnalyticsInvestor RelationsSportsSpiritualNews & PoliticsTravelSelf ImprovementReal EstateEntertainment & HumorHealth & MedicineDevices & HardwareLifestyle
Uploaded byjitendrahemwani
20,268 views

Physical Vapour Deposition (PVD)

Physical vapor deposition (PVD) is a process that deposits thin films of material onto a substrate through the physical vaporization of source material and subsequent condensation. There are two main PVD techniques - thermal evaporation and sputtering. Thermal evaporation uses resistive heating to vaporize the source material in a vacuum, while sputtering uses plasma to bombard the source material and eject atoms through momentum transfer. PVD is used to deposit films ranging from nanometers to micrometers thick for applications such as decorative coatings, electronic devices, and wear-resistant tool coatings.

Engineering◦
PHYSICAL VAPOUR DEPOSITION J.Hemwani, G.P.C. Betul (M.P.) 46001
Deposition  Applying a thin film on a surface ranges from nano meters to micro meters is called deposition.  Different techniques used for deposition are as follows  Physical Vapour Deposition  Chemical Vapour Deposition J.Hemwani, G.P.C. Betul (M.P.) 46001
Physical Vapor deposition  PVD is formation of film at atomic and molecular level and thus it is used for high melting point & low vapor pressure materials.  Physical Vapour Deposition is a collective set of processes used to deposit thin layers of material typically in the range of few microns to some micrometers.few microns to some micrometers.  Physical coating (deposition) process involve, vaporization, transportation & condensation of the material to be deposited.  Vaporization of the material is done from a solid source assisted by high temperature and vacuum. J.Hemwani, G.P.C. Betul (M.P.) 46001
Physical Vapor deposition  Transportation of the vapour is carried out in the vacuum towards the substrate surface. For this vacuum of different ranges is used which depends on the mean free path required in the system.  Condensation of the vapours is done onto the substrate to generate thin films. The chemical composition of the deposited film depends on the type of source material.  Some times film is obtained by multiple sources or introducing a reactive gas during transportation of vapours, or post deposition modifications through thermal or mechanical processing.  Different PVD techniques utilize the same three fundamental steps but differ in the method used to vaporize and deposit the material. J.Hemwani, G.P.C. Betul (M.P.) 46001
Physical Vapor deposition  The two most common PVD processes are thermal evaporation and Sputtering.  The third type Ion-plating is mix of the two processes thermal evaporation & sputtering.  In thermal evaporation Resistive heating method is used. The deposition is performed at high temperature & low vacuum. Vacuum decreases the content of Contamination. Voltage & current are manually controlled. J.Hemwani, G.P.C. Betul (M.P.) 46001
THERMAL EVAPORATION J.Hemwani, G.P.C. Betul (M.P.) 46001
Physical Vapor deposition  Sputtering is a plasma assisted technique that creates a vapour from the source through bombardment with the accelerated gaseous ions (Plasma). The gas used is generally Argon.  Sputtering works on the basis of momentum principle, formed by the collision of the atoms and molecules. Plasmaformed by the collision of the atoms and molecules. Plasma glow, ion accelerator or radio active emitting is used to evaporate material. J.Hemwani, G.P.C. Betul (M.P.) 46001
SPUTTERING J.Hemwani, G.P.C. Betul (M.P.) 46001
Advantages PVD  High film deposition rates can be achieved in PVD.  PVD gives high strength and Durability.  PVD provides high adhesion and Hardness.  As the film is formed in PVD, there is less substrate surface As the film is formed in PVD, there is less substrate surface damage from the impinging atoms.  Because of the high vacuum condition PVD has excellent quality of film.  PVD has less tendency for unintentional heating of the substrate surface. J.Hemwani, G.P.C. Betul (M.P.) 46001
Disadvantages PVD  Control of the film composition is very difficult in PVD.  Cleaning of the subtract surface is not possible.  Electron Beam evaporation in PVD may cause X-Ray damage. J.Hemwani, G.P.C. Betul (M.P.) 46001
Applications PVD  Thin decorative coatings on plastics and metals may be done by PVD.  PVD is used to apply anti-reflection coatings of magnesium fluoride.  PVD is applied in fabrication of electronic devices like integrated circuits.integrated circuits.  PVD is used to coat titanium nitride on the cutting tools and injection moulds for wear resistance. J.Hemwani, G.P.C. Betul (M.P.) 46001
https://www.youtube.com/watch?v=I_RnlLafVt0 2:29 M PVD principle https://www.youtube.com/watch?v=Cvytnxc4g6w 3:54 m PVD of small metallic parts https://www.youtube.com/watch?v=nigB-2al0S4 5:25 m PVD of small tools J.Hemwani, G.P.C. Betul (M.P.) 46001 https://www.youtube.com/watch?v=l7ClYSOp2ig 12:40 m PVD of metal sheets 3:54 m PVD of small metallic parts https://www.youtube.com/watch?v=YAMM3kmx9uk 2:32 Various applications of PVD
J.Hemwani, G.P.C. Betul (M.P.) 46001