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ISSN : 2581-7175
©IJSRED: All Rights are Reserved Page 276
International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019
Available at www.ijsred.com
RESEARCH ARTICLE OPEN ACCESS
Advantages of 64 Bit 5T SRAM
Supriya Raj *, Vishal Shrivastava**
*(Department of ECE, Global Engineering College, Jabalpur MP Email: swastiksir13@gmail.com)
*(Department of ECE, Global Engineering College, Jabalpur MP Email: vs.ec@global.org.in)
----------------------------------------************************----------------------------------
Abstract:
It is seemed that we have to focus to minimize the power due to leakage current through a huge
number of transistors and the large memory substance. This dissertation gives 5 Transistors future SoC
(System on Chip) devices SRAM concept. Hence SRAM may be utilized in the place of 6 Transistors
SRAM. By using DSCH2 and Microwind 2.6K we are designing a layout of SRAM in 2.5µm and 1.5µm
technology by using 5 transistors and perform various operations on it. By using Microwind 2.6K software
we are designing a layout diagram and checked it through DRC rule checker and after that simulate the
layout and do the analysis. It helps to decrease the memory size.
Keywords — VLSI, SoC, SRAM, IC, DSCH2, DRC.
----------------------------------------************************----------------------------------
I. INTRODUCTION
Power Dissipation contains static component and
dynamic component [5]. Static components of Power
Dissipation are very low and caused by leakage
current. Dynamic power or switching power is
mainly power dissipated when charging or
discharging capacitors. If the circuit isn’t in the
charge state and all the inputs are at some logic level
then Dynamic power consumption occurs. It
increases by the charging of output capacitance and
by the charging of output capacitance. Sometimes it
can significantly contribute to the entire power
consumption [6].
II. POWER DISSIPATION IN CMOS
There are 3 facts responsible for power
consumption-
i. Static power
ii. Dynamic power
iii. Short circuit power
PMOS device is ON and NMOS device is OFF (as
shown in figure) if the input is at logic 0 and gives
the output voltage logic 1 or VCC. Similarly NMOS
device is ON and PMOS device is OFF (as shown in
figure) if the input is at logic 1 and gives the output
voltage logic 0 or ground. By this study, we show
that in this logic input there is one transistor is always
in OFF condition. Hence because gate terminal has
no current flowing in it, the static power dissipation
is 0. Also between VCC to ground there is no any dc
path exist [8]. However, due to reverse-bias leakage
between diffused regions and the substrate, a small
amount of consumption is there.
III. SRAM DESIGN
Static random access memory is the basic building
block of CPU in a computer. In the IC all the
contents of different circuit are integrated in a single
chip. With the introduction of the integrated circuit,
microprocessor and all other devices was put in a
monolithic device which is called microcontroller. In
microcontroller all necessary components are built
together. Microcontroller also store data by using
SRAM. Microcontroller has basic registers, RAM,
memory and circuitry for control. Static Random
Access Memory (SRAM) is a type of Random
Access Memory in which the word static means the
date which is stored can be retained indefinitely,
without any demand for periodically refresh
Page 277ISSN :2581-7175 ©IJSRED: All Rights are Reserved
International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019
Available at www.ijsred.com
operation as long as a sufficient voltage is provided.
The traditional SRAM has six MOSFETs (2 PMOS
and 4 NMOS) to store a bit in the memory. This
system uses 2 CMOS Invertors, connecting back-to-
back and known as Storage Cell. 0 and 1 are the 2
stable states. NMOS-5 and NMOS-6 are controlled
from WL. NMOS-5 and NMOS-6 are known as
Access Transistors. (BL) ̅ and BL are the bit lines.
SRAM is faster than DRAM because its commercial
chips accept all address bits at a time. 2 strong ways
are used for saving leakage and active current. First,
lowering the operating voltage and secondly
reduction in the capacitance of bit line and word line.
Because by survey it is found that up to 70% power
is consumed due to bit lines discharging or charging
during reading and writing modes. [25].
IV. PROBLEM STATEMENT
Flow Chart for 5T bit SRAM
Fig. 1 Flow Chart for 5T SRAM
H. Mangalam and K.Gunavathi et al [2006, 7] this
paper shows that in the deep submicron regimes the
high leakage current may be majorly contribute to the
total power consumption in CMOS circuits as the
channel length, thickness of the gate oxide and
threshold voltage. This paper proposed an
Asymmetric SRAM (SA) cell with the extra
transistor that reduced the gate leakage as compared
to the conventional 6T SRAM cell. Further to reduce
the leakage an Adaptive voltage level was added that
controlled the effective voltage across SRAM cell in
the inactive mode.
Fig. 2 5T 1Bit SRAM (proposed)
Chetan Sharma et al [2011, 17] he was presented a
paper that gives low power at the different levels of
VLSI Designs and clock distribution methods. This
paper reviews different low power techniques at gate
level, architecture level and tradeoffs between
different clock distribution methods such as single
driver clock method and the distributed buffers clock
methods. He also observed various effects of
particular clock distribution method, such as clock
jitter and clock skew etc.
Both the invertors perform as the storage elements
whereas both the Access transistors perform the
communication with the BL. The access transistors
perform communication with the bit lines and the
invertors perform the storage element. Because by
survey it is found that up to 70% power is consumed
due to bit lines discharging or charging during
reading and writing modes. [25]. So that in proposed
work we are using only BL in SRAM and reduce one
Page 278ISSN :2581-7175 ©IJSRED: All Rights are Reserved
International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019
Available at www.ijsred.com
NMOS transistor. Therefore lower power is
consumed due to only one bit line discharging or
charging during reading and writing modes. But
challenge is this which Transistor should be
eliminated. Since Q is the desired output and it is
obtained by T5 so that T6 is the best choice. Now I
will describe the SRAM by using 5 Transistors. Here
I have proposed a 64 bits SRAM in 2.5µm
technology and 1.5µm technology and compare with
this by a conventional 1bit 6T SRAM and also
construct a 64 bit SRAM for 6T SRAM.
Firstly I have proposed 5 transistors SRAM cell for
one bit only in which leakage power reduce because
of the absent of the charging capacitor and the
discharging capacitor of one bit line (BL) ̅. Figure 5.2
shows the schematic of designing of 5 transistors
SRAM cell for one bit. Then in next state I am
selecting 0 for WL again. Hence SRAM is in write
state. In the proposed steps, we write 0→1. Now it is
reading 1. In the second step we write 1→0 and then
reading 0, whereas BL signal is controlled by the
pulse.
V. 64-BIT SRAM
Fig. 3 64-BIT 6 T SRAM
In this section I am giving the detailed simulation
analysis of the 64-bits SRAM. I am here also
estimating the effects on the power dissipation while
using my idea. I am designing schematic diagram of
the 5 transistors SRAM cell for 64 bits and then
implementing it by Microwind 2.6K. This designing
is based on the VLSI software of CMOS technology.
I will design the 5 transistors SRAM cell for 64 bits
and compare the result with the conventional 6
transistors SRAM cell for 64 bits. Transistors reduce
the dynamic power consumption during the writing
operation through proper discharging and charging of
bit line.
In 6 transistors SRAM cell, either BL or ̅ ̅̅ ̅ must
be discharged; hence during writing either 0 or 1 the
power consumption is more, whereas in the proposed
5 transistors SRAM cell I am presenting a single BL
from being discharge during the writing logic 1 and
logic 0.
Fig 4 Block diagram of 5T 64-bit SRAM
Page 279ISSN :2581-7175 ©IJSRED: All Rights are Reserved
International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019
Available at www.ijsred.com
Motoi Ichihashi, Youngtag Woo, Muhammed
Ahosan U Karim, Vivek Joshi and David Burnett et
al [2018, 1] compared to 6T SRAM, a larger number
of transistors are required for one cell resulting in
larger cell area. The 10T SRAM shows promising
performance improvement over the 8T cell with the
drawback of larger cell size.
Fig 5 Comparison of Cell area between different SRAM made by 6T SRSM
Let, take some area from the above work:
6T_HD=6T SRAM HD =1
6T_HC=6T SRAM HC =1.25
8T= 8T SRAM TP / 8T SRAM DP =2.13
10T_2_fin= 10T SRAM 2-fin =2.63
10T_3_fin = 10T SRAM 3-fin = 2.88
10T_4_fin = 10T SRAM 4-fin = 3.13
By applying the proposed methodology, in each of
the structures one Transistor is removed. It means
each of the area will be multiplied by 5/6.
6T_HD= 6T_HD x (5/6) =1 x (5/6) = 0.83
6T_HC= 6T_HC x (5/6) =1.25 x (5/6) = 1.0375
8T= 8T x (5/6) = 2.13 x (5/6) = 1.7679
10T_2_fin= 10T_2_fin x (5/6) =2.63 x (5/6) = 2.1829
10T_3_fin= 10T_3_fin x (5/6) = 2.88 x (5/6) = 2.3904
10T_4_fin= 10T_4_fin x (5/6) = 3.13 x (5/6) = 2.5979
Fig 6 Comparison of Cell area between different SRAM made by 5T SRSM
VI. 64-BIT SRAM
Fig 7 Layout Design of 64-Bit 5T SRAM Using 90nm Technology
Figure 7 shows Layout design of 64-bit 5T SRAM
by using 90nm technology. The 64-bit SRAM is
designed by using 1-bit SRAM in which all 1-bit
SRAM are arranged in row and column.
In this layout-
Power consumption is = 0.125*64 mW = 8 mW
Layout area is = (5362.5)μ 2*64 = 343200μ 2
No. of transistor = 6*64 = 384
Leakage currents ( ) = 0.031 ∗ 64 = 1.984
VII. CONCLUSION
Fig 8 Comparison between 64 BIT 6T and 5T SRAM
Page 280ISSN :2581-7175 ©IJSRED: All Rights are Reserved
International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019
Available at www.ijsred.com
In this work we conclude that we have implement
64 bit 5T SRAM which reduce 36.2% of power
dissipation in 2.5µm and 37.2% in 1.5µm
technologies over the 64 bit 6T SRAM. Also leakage
current reduction in 5T SRAM over the 6T SRAM is
( )=35% and ( )=36.6% in 2.5µm and
1.5µm respectively. As well as area reduction in 5T
SRAM over the 6T SRAM is 30.2% in both 2.5µm
and 1.5µm.
REFERENCES
[1] Qadeer Ahmad Khan, Sanjay Kumar Wadhwa and Kulbhushan Misri,”
A Low Voltage Switched-Capacitor Current Reference Circuit with
low dependence on Process, Voltage and Temperature,” Proceedings of
the 16th International Conference on VLSI Design (VLSI’03) 2003
IEEE.
[2] Sung-Mo (Steve) Kang,”Elements of Low Power Design for
Integrated,” ISLPED, August 25-27, 2003, Seoul, Korea.
[3] Huifang Qin, Yu Cao, Dejan Markovic, Andrei Vladimirescu, and Jan
Rabaey,” SRAM Leakage Suppression by Minimizing Standby Supply
Voltage,” Department of EECS, University of California at Berkeley,
Berkeley, CA 94720, USA, 2004.
[4] Mahadevan Gomathisankaran and Akhilesh Tyagi.”WARM SRAM: A
Novel Scheme to Reduce Static Leakage Energy in SRAM Arrays”
Proceedings of the IEEE Computer Society Annual Symposium on
VLSI Emerging Trends in VLSI Systems Design (ISVLSI’04) 2004
IEEE.
[5] G.Anjaneyulu and S. Karun Teja, “ A New Low Power Technology for
Power Reduction in Srams Using Read Stability with Reduced
Transistors for Future Caches”, International Journal of Emerging
Technology and Advanced Engineering, ISSN 2250-2459, Volume 3,
Issue 8, August 2013.
[6] Lalitha Sowmya.M, S. Jagadeesh and Lakavath.Mohan, “ Low power/
Low Voltage Cross Coupled SRAM – Based on Schmitt Trigger,”
(IOSR-JVSP) Volume 3, Issue 2 (Sep. – Oct. 2013), e-ISSN: 2319 –
4200, p-ISSN: 2319 – 4197.
[7] P. Sai Raghava Reddy Arra Ashok and J. Ravibabu, “Reduction of
Dynamic Power in Hazards for low voltage CMOS Architectures”
IOSR Journal of VLSI and Signal Processing (IOSR- JVSP) Volume 4,
Issue 2, Ver. IV (Mar-Apr. 2014).
[8] Prathyusha Konduri and Magesh Kannan. P, Low Power RAM using
Gate-Diffusion-Input Technique. International Journal Of Advanced
Engineering Sciences And Technologies Vol No. 5, Issue No. 2, 2017.
[9] Motoi Ichihashi, Youngtag Woo, Muhammed Ahosan U Karim, Vivek
Joshi and David Burnett, "10T Differential-Signal SRAM Design in a
14-nm FinFET Technology for High-Speed Application", IEEE 2018.

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Advantages of 64 Bit 5T SRAM

  • 1. ISSN : 2581-7175 ©IJSRED: All Rights are Reserved Page 276 International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019 Available at www.ijsred.com RESEARCH ARTICLE OPEN ACCESS Advantages of 64 Bit 5T SRAM Supriya Raj *, Vishal Shrivastava** *(Department of ECE, Global Engineering College, Jabalpur MP Email: swastiksir13@gmail.com) *(Department of ECE, Global Engineering College, Jabalpur MP Email: vs.ec@global.org.in) ----------------------------------------************************---------------------------------- Abstract: It is seemed that we have to focus to minimize the power due to leakage current through a huge number of transistors and the large memory substance. This dissertation gives 5 Transistors future SoC (System on Chip) devices SRAM concept. Hence SRAM may be utilized in the place of 6 Transistors SRAM. By using DSCH2 and Microwind 2.6K we are designing a layout of SRAM in 2.5µm and 1.5µm technology by using 5 transistors and perform various operations on it. By using Microwind 2.6K software we are designing a layout diagram and checked it through DRC rule checker and after that simulate the layout and do the analysis. It helps to decrease the memory size. Keywords — VLSI, SoC, SRAM, IC, DSCH2, DRC. ----------------------------------------************************---------------------------------- I. INTRODUCTION Power Dissipation contains static component and dynamic component [5]. Static components of Power Dissipation are very low and caused by leakage current. Dynamic power or switching power is mainly power dissipated when charging or discharging capacitors. If the circuit isn’t in the charge state and all the inputs are at some logic level then Dynamic power consumption occurs. It increases by the charging of output capacitance and by the charging of output capacitance. Sometimes it can significantly contribute to the entire power consumption [6]. II. POWER DISSIPATION IN CMOS There are 3 facts responsible for power consumption- i. Static power ii. Dynamic power iii. Short circuit power PMOS device is ON and NMOS device is OFF (as shown in figure) if the input is at logic 0 and gives the output voltage logic 1 or VCC. Similarly NMOS device is ON and PMOS device is OFF (as shown in figure) if the input is at logic 1 and gives the output voltage logic 0 or ground. By this study, we show that in this logic input there is one transistor is always in OFF condition. Hence because gate terminal has no current flowing in it, the static power dissipation is 0. Also between VCC to ground there is no any dc path exist [8]. However, due to reverse-bias leakage between diffused regions and the substrate, a small amount of consumption is there. III. SRAM DESIGN Static random access memory is the basic building block of CPU in a computer. In the IC all the contents of different circuit are integrated in a single chip. With the introduction of the integrated circuit, microprocessor and all other devices was put in a monolithic device which is called microcontroller. In microcontroller all necessary components are built together. Microcontroller also store data by using SRAM. Microcontroller has basic registers, RAM, memory and circuitry for control. Static Random Access Memory (SRAM) is a type of Random Access Memory in which the word static means the date which is stored can be retained indefinitely, without any demand for periodically refresh
  • 2. Page 277ISSN :2581-7175 ©IJSRED: All Rights are Reserved International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019 Available at www.ijsred.com operation as long as a sufficient voltage is provided. The traditional SRAM has six MOSFETs (2 PMOS and 4 NMOS) to store a bit in the memory. This system uses 2 CMOS Invertors, connecting back-to- back and known as Storage Cell. 0 and 1 are the 2 stable states. NMOS-5 and NMOS-6 are controlled from WL. NMOS-5 and NMOS-6 are known as Access Transistors. (BL) ̅ and BL are the bit lines. SRAM is faster than DRAM because its commercial chips accept all address bits at a time. 2 strong ways are used for saving leakage and active current. First, lowering the operating voltage and secondly reduction in the capacitance of bit line and word line. Because by survey it is found that up to 70% power is consumed due to bit lines discharging or charging during reading and writing modes. [25]. IV. PROBLEM STATEMENT Flow Chart for 5T bit SRAM Fig. 1 Flow Chart for 5T SRAM H. Mangalam and K.Gunavathi et al [2006, 7] this paper shows that in the deep submicron regimes the high leakage current may be majorly contribute to the total power consumption in CMOS circuits as the channel length, thickness of the gate oxide and threshold voltage. This paper proposed an Asymmetric SRAM (SA) cell with the extra transistor that reduced the gate leakage as compared to the conventional 6T SRAM cell. Further to reduce the leakage an Adaptive voltage level was added that controlled the effective voltage across SRAM cell in the inactive mode. Fig. 2 5T 1Bit SRAM (proposed) Chetan Sharma et al [2011, 17] he was presented a paper that gives low power at the different levels of VLSI Designs and clock distribution methods. This paper reviews different low power techniques at gate level, architecture level and tradeoffs between different clock distribution methods such as single driver clock method and the distributed buffers clock methods. He also observed various effects of particular clock distribution method, such as clock jitter and clock skew etc. Both the invertors perform as the storage elements whereas both the Access transistors perform the communication with the BL. The access transistors perform communication with the bit lines and the invertors perform the storage element. Because by survey it is found that up to 70% power is consumed due to bit lines discharging or charging during reading and writing modes. [25]. So that in proposed work we are using only BL in SRAM and reduce one
  • 3. Page 278ISSN :2581-7175 ©IJSRED: All Rights are Reserved International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019 Available at www.ijsred.com NMOS transistor. Therefore lower power is consumed due to only one bit line discharging or charging during reading and writing modes. But challenge is this which Transistor should be eliminated. Since Q is the desired output and it is obtained by T5 so that T6 is the best choice. Now I will describe the SRAM by using 5 Transistors. Here I have proposed a 64 bits SRAM in 2.5µm technology and 1.5µm technology and compare with this by a conventional 1bit 6T SRAM and also construct a 64 bit SRAM for 6T SRAM. Firstly I have proposed 5 transistors SRAM cell for one bit only in which leakage power reduce because of the absent of the charging capacitor and the discharging capacitor of one bit line (BL) ̅. Figure 5.2 shows the schematic of designing of 5 transistors SRAM cell for one bit. Then in next state I am selecting 0 for WL again. Hence SRAM is in write state. In the proposed steps, we write 0→1. Now it is reading 1. In the second step we write 1→0 and then reading 0, whereas BL signal is controlled by the pulse. V. 64-BIT SRAM Fig. 3 64-BIT 6 T SRAM In this section I am giving the detailed simulation analysis of the 64-bits SRAM. I am here also estimating the effects on the power dissipation while using my idea. I am designing schematic diagram of the 5 transistors SRAM cell for 64 bits and then implementing it by Microwind 2.6K. This designing is based on the VLSI software of CMOS technology. I will design the 5 transistors SRAM cell for 64 bits and compare the result with the conventional 6 transistors SRAM cell for 64 bits. Transistors reduce the dynamic power consumption during the writing operation through proper discharging and charging of bit line. In 6 transistors SRAM cell, either BL or ̅ ̅̅ ̅ must be discharged; hence during writing either 0 or 1 the power consumption is more, whereas in the proposed 5 transistors SRAM cell I am presenting a single BL from being discharge during the writing logic 1 and logic 0. Fig 4 Block diagram of 5T 64-bit SRAM
  • 4. Page 279ISSN :2581-7175 ©IJSRED: All Rights are Reserved International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019 Available at www.ijsred.com Motoi Ichihashi, Youngtag Woo, Muhammed Ahosan U Karim, Vivek Joshi and David Burnett et al [2018, 1] compared to 6T SRAM, a larger number of transistors are required for one cell resulting in larger cell area. The 10T SRAM shows promising performance improvement over the 8T cell with the drawback of larger cell size. Fig 5 Comparison of Cell area between different SRAM made by 6T SRSM Let, take some area from the above work: 6T_HD=6T SRAM HD =1 6T_HC=6T SRAM HC =1.25 8T= 8T SRAM TP / 8T SRAM DP =2.13 10T_2_fin= 10T SRAM 2-fin =2.63 10T_3_fin = 10T SRAM 3-fin = 2.88 10T_4_fin = 10T SRAM 4-fin = 3.13 By applying the proposed methodology, in each of the structures one Transistor is removed. It means each of the area will be multiplied by 5/6. 6T_HD= 6T_HD x (5/6) =1 x (5/6) = 0.83 6T_HC= 6T_HC x (5/6) =1.25 x (5/6) = 1.0375 8T= 8T x (5/6) = 2.13 x (5/6) = 1.7679 10T_2_fin= 10T_2_fin x (5/6) =2.63 x (5/6) = 2.1829 10T_3_fin= 10T_3_fin x (5/6) = 2.88 x (5/6) = 2.3904 10T_4_fin= 10T_4_fin x (5/6) = 3.13 x (5/6) = 2.5979 Fig 6 Comparison of Cell area between different SRAM made by 5T SRSM VI. 64-BIT SRAM Fig 7 Layout Design of 64-Bit 5T SRAM Using 90nm Technology Figure 7 shows Layout design of 64-bit 5T SRAM by using 90nm technology. The 64-bit SRAM is designed by using 1-bit SRAM in which all 1-bit SRAM are arranged in row and column. In this layout- Power consumption is = 0.125*64 mW = 8 mW Layout area is = (5362.5)μ 2*64 = 343200μ 2 No. of transistor = 6*64 = 384 Leakage currents ( ) = 0.031 ∗ 64 = 1.984 VII. CONCLUSION Fig 8 Comparison between 64 BIT 6T and 5T SRAM
  • 5. Page 280ISSN :2581-7175 ©IJSRED: All Rights are Reserved International Journal of Scientific Research and Engineering Development-– Volume 2 Issue 6, Nov- Dec 2019 Available at www.ijsred.com In this work we conclude that we have implement 64 bit 5T SRAM which reduce 36.2% of power dissipation in 2.5µm and 37.2% in 1.5µm technologies over the 64 bit 6T SRAM. Also leakage current reduction in 5T SRAM over the 6T SRAM is ( )=35% and ( )=36.6% in 2.5µm and 1.5µm respectively. As well as area reduction in 5T SRAM over the 6T SRAM is 30.2% in both 2.5µm and 1.5µm. REFERENCES [1] Qadeer Ahmad Khan, Sanjay Kumar Wadhwa and Kulbhushan Misri,” A Low Voltage Switched-Capacitor Current Reference Circuit with low dependence on Process, Voltage and Temperature,” Proceedings of the 16th International Conference on VLSI Design (VLSI’03) 2003 IEEE. [2] Sung-Mo (Steve) Kang,”Elements of Low Power Design for Integrated,” ISLPED, August 25-27, 2003, Seoul, Korea. [3] Huifang Qin, Yu Cao, Dejan Markovic, Andrei Vladimirescu, and Jan Rabaey,” SRAM Leakage Suppression by Minimizing Standby Supply Voltage,” Department of EECS, University of California at Berkeley, Berkeley, CA 94720, USA, 2004. [4] Mahadevan Gomathisankaran and Akhilesh Tyagi.”WARM SRAM: A Novel Scheme to Reduce Static Leakage Energy in SRAM Arrays” Proceedings of the IEEE Computer Society Annual Symposium on VLSI Emerging Trends in VLSI Systems Design (ISVLSI’04) 2004 IEEE. [5] G.Anjaneyulu and S. Karun Teja, “ A New Low Power Technology for Power Reduction in Srams Using Read Stability with Reduced Transistors for Future Caches”, International Journal of Emerging Technology and Advanced Engineering, ISSN 2250-2459, Volume 3, Issue 8, August 2013. [6] Lalitha Sowmya.M, S. Jagadeesh and Lakavath.Mohan, “ Low power/ Low Voltage Cross Coupled SRAM – Based on Schmitt Trigger,” (IOSR-JVSP) Volume 3, Issue 2 (Sep. – Oct. 2013), e-ISSN: 2319 – 4200, p-ISSN: 2319 – 4197. [7] P. Sai Raghava Reddy Arra Ashok and J. Ravibabu, “Reduction of Dynamic Power in Hazards for low voltage CMOS Architectures” IOSR Journal of VLSI and Signal Processing (IOSR- JVSP) Volume 4, Issue 2, Ver. IV (Mar-Apr. 2014). [8] Prathyusha Konduri and Magesh Kannan. P, Low Power RAM using Gate-Diffusion-Input Technique. International Journal Of Advanced Engineering Sciences And Technologies Vol No. 5, Issue No. 2, 2017. [9] Motoi Ichihashi, Youngtag Woo, Muhammed Ahosan U Karim, Vivek Joshi and David Burnett, "10T Differential-Signal SRAM Design in a 14-nm FinFET Technology for High-Speed Application", IEEE 2018.