This document discusses flexible electronics. It begins with an introduction to advances in thin-film materials and devices that have enabled developments in flexible electronics. It then outlines various materials used in flexible electronics like substrates, backplane electronics, frontplanes and encapsulation. It discusses technologies involved in processing flexible electronics like batch and roll-to-roll fabrication. The document covers applications in various fields like healthcare, displays, energy and more. It concludes by discussing advantages like size/weight reductions and increased circuitry density, while noting limitations like lifetime and manufacturing challenges.

1. FLEXIBLE ELECTRONICS
SEMINAR ON
Presented by:
YALAGOUDA PATIL

2. OUTLINE
 Introduction
 Materials for flexible electronics
 Technologies involved processing
 Degree of flexibility
 Applications
 Advantages and Limitations
 Conclusion

3. INTRODUCTION
Ever evolving advances in thin-film
materials and devices have fueled
many of the developments in the
field of flexible electronics.

4. MATERIALS FOR FLEXIBLE
ELECTRONICS
A generic large-area electronic structure
is composed of
 Substrate
 backplane electronics
 Frontplane
 encapsulation

5. SUBSTRATES
Flexible substrates that are to serve as drop-in
replacements for plate glass substrates must meet
many requirements:
 Optical properties
 Surface roughness
 Thermal and thermomechanical properties
 Chemical properties
 Mechanical properties
 Electrical and magnetic properties

6. BACKPLANE ELECTRONICS
Backplanes provide or collect power and signal to
or from frontplanes. Backplanes may be passive or
active.
 Silicon Thin-Film Transistors
 Organic Thin-Film Transistors
 Materials for Interconnects and Contacts

7. BACKPLANE ELECTRONICS

8. FRONT PLANE TECHNOLOGIES
Frontplanes carry the specific optoelectronic
application.
 Liquid Crystal Displays
 Electrophoretic Displays
 Organic Light-Emitting Displays
 Sensors

9. TECHNOLOGIES AND
INTEGRATION PROCESSES
Any manufacturable device has four essential
characteristics:
 Superior and pre-specified performance, with
reproducibility, uniformity, and reliability;
 High yield to acceptable tolerance;
 Simulations exist for both reverse engineering
during development and right-first-time design;
 Proven adequate in-service lifetime.

11. FABRICATION TECHNOLOGY FOR
FLEXIBLE ELECTRONICS
 Fabrication on sheets by Batch Processing..
 On a rigid carrier, facing up and loose;
 In a tensioning frame, facing up or down;
 In a frame, facing down and loose
 Fabrication On Web by roll-to-roll Processing
 Additive Printing

12. BATCH AND ROLL TO ROLL FABRICATION

13. DEGREE OF FLEXIBILITY
Flexibility can mean many different properties
to manufacturers and users.
 Degree of flexibility is given by ε = d/2r.
 bendable or rollable
 permanently shaped
 elastically stretchable

14. EXAMPLES…

15. APPLICATIONS
 Holistic system design

16.  Health Care

17. OTHER APPLICATIONS
 Automotive Industries
 Displays and Human- machine interaction
 Energy management and mobile devices
 Wireless systems
 Electronics Embedded in the living environment
 Electronics for hostile environment etc..,

18. ADVANTAGES AND LIMITATIONS
Advantages:
 Size and weight
 Increased circuitry density
 Boundries of design and packaging
 Shape or to flex during its use
Limitations:
 Lifetime
 Manufacturing
 Water
 Battery

19. CONCLUSION
Based on the current socioeconomic trends, we
outlined some of the more likely technological
future needs and discussed the potential exploits of
thin-film flexible electronics in various market
sectors.