This document discusses flexible electronics and OLED displays. It begins with an introduction to advances in thin-film materials and flexible electronics. It then covers the basic OLED structure, materials used including substrates and backplane electronics, and technologies for flexible displays. The document discusses fabrication methods like batch and roll-to-roll processing. It outlines applications in areas like healthcare, automotive, and displays. Advantages of flexible electronics are listed as well as limitations that need to be addressed.

1. Presented By:
Roshan Mani
11ECTEC047
B.Tech. VIII Sem
E.C.E. Deptt.
GCET Bikaner
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2. OUTLINE
 Introduction
 Basic OLED Structure
 Materials for flexible electronics
 Technologies involved in processing
 Technologies for Flexible Displays
 Degree of flexibility
 Applications
 Advantages and Limitations
 Conclusion
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3. INTRODUCTION
Ever evolving advances in thin-film
materials and devices have fueled many of
the developments in the field of flexible
electronics.
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4. Basic OLED structure
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5. Materials for Flexible Electronics
A generic large-area electronic structure is
composed of :
Substrate
Back-plane
Front-plane
Encapsulation
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6. Substrates
Flexible substrates that are to serve as drop-in
replacements for plate glass substrates must meet
many requirements:
Optical properties
Surface roughness
 Thermal and thermo-mechanical properties
Chemical properties
Mechanical properties
Electrical and magnetic properties
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7. Backplane electronics
Backplanes provide or collect power and signal to or
from front-planes. Backplanes may be passive or
active.
Silicon Thin-Film Transistors
Organic Thin-Film Transistors
Materials for Interconnects and Contacts
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8. Backplane Electronics
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9. Front plane technologies
Front plane carry the specific optoelectronic
application.
Liquid Crystal Displays
 Electro-phoretic Displays
Organic Light-Emitting Displays
Sensors
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10. TECHNOLOGIES AND INTEGRATION
PROCESSES
Any manufacturable device has four essential
characteristics:
 Superior and pre-specified performance, with
reproducibility, uniformity, and reliability
 High yield to acceptable tolerance
 Simulations exist for both reverse engineering during
development and right-first-time design
Proven adequate in-service lifetime.
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12. FABRICATION TECHNOLOGY FOR FLEXIBLE
ELECTRONICS
 Fabrication on sheets by Batch Processing..
 On a rigid carrier, facing up and loose;
 In a tensioning frame, facing up or down;
 In a frame, facing down and loose
 Fabrication On Web by roll-to-roll Processing
 Additive Printing
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13. Batch and roll to roll fabrication
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15. Degree of flexibility
Flexibility can mean many different properties to
manufacturers and users.
Degree of flexibility is given by ε = d/2r.
Bendable or rollable
Permanently shaped
Elastically stretchable
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16. Examples…
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17. APPLICATIONS
Holistic system design
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18. Health Care
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19. Other applications
Automotive Industries
Displays and Human- machine interaction
Energy management and mobile devices
Wireless systems
Electronics Embedded in the living environment
Electronics for hostile environment etc..,
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21. ADVANTAGES AND LIMITATIONS
Advantages:
 Size and weight
 Self luminous
 Low cost & easy fabrication
 Increased circuitry density
 Bounadaries of design and packaging
 Shape or to flex during its use
 Wide Viewing Angle
Limitations:
 Lifetime
 Manufacturing
 Water
 Battery
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22. CONCLUSION
Based on the current socio-economic trends, we
outlined some of the most likely technological future
needs and discussed the potential exploits of thin-film
flexible electronics in various market sectors.
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