This document discusses integrated circuits (ICs) and their manufacturing. It describes how ICs are miniature circuits on semiconductor chips that contain components like transistors and diodes. The two main techniques for manufacturing ICs are the bipolar technique and metal oxide semiconductor (MOS) technique. It also discusses different categories of digital ICs based on their scale of integration, including small-scale, medium-scale, large-scale, and very-large scale integration circuits. Factors that influence IC technology choices are also summarized.

2. INTRODUCTION
 Miniature circuits on the surface of a small piece of
semi conductor material is called chip or an IC.
 Integrated circuit has components such as
transistor, diode, resistor.

3. IC ‘S

4. MANUFACTURING
 Two basic techniques for manufacturing Ics are
Bipolar
technique
Metal oxide
semiconductor
technique(MOS)

5. Bipolar technique
 It fabricates bipolar transistor on chip.
 Short for Metal Oxide Semiconductor, MOS is a
method of creating transistors. MOS consists of three
layers, a metal conductor, insulating silicon layer, and
a semiconductor silicon layer.

6. Digital integrated circuits
Integrated circuit is a small silicon semiconductor
crystal called chip containing the electronic
components for digital gates.

7. Scale integration
 Different categories of IC according to technology
advancement are
 Small scale integration (SSI)
 Medium scale integration (MSI)
 Large scale integration (LSI)
 Very large scale integration (VLSI)

8. SSI, MSI,LSI,VLSI,
SSI MSI LSI VLSI
SSI:
Independent
gates in single
package ,has less
than 10 gates and
it is limited
Input and
output gates are
connected
directly to the
pins in package.
MSI:have 10 to
200 gates in
single package
Performs digital
functions like
decoders,adders,
registers
LSI :it contains
between 200
and few
thousand
gates in single
package.
Include digital
systems such
as processors,
memory chips,
and
programmable
modules.
VLSI: contain
thousands of
gate in a single
package
Include large
memory arrays
and complex
microcomputer
chips.
Low cost and
small in size.

9. Logic families
 Ic technology changes from time to time. The
technology depends on following factors
 Speed
 Power dissipation
 Noise immunity
 Input/output interface compatibility
 Cost

10. Logic families
 Single output should be obtained from many inputs.
 Compatibility : connecting the output of one device
to input of other.
 Interfacing: design of interconnection between
circuits that shift the voltage levels and current levels
to make them compatible.