The document describes the specifications of various logic integrated circuits (ICs), including their fan-in, fan-out, input, and output characteristics. It defines common digital IC terminology related to voltage levels, current parameters, propagation delays, and noise immunity. It then examines the characteristics of different logic families, specifically TTL and CMOS. TTL families include standard TTL, low power TTL, high speed TTL, and others. CMOS families include 4000 series and 74C/HC/HCT series. Key specifications like voltage levels, noise margins, and power dissipation are compared between TTL and CMOS logic families.
This document discusses different digital logic families and characteristics. It describes Resistor-Transistor Logic (RTL) which consists of resistors and transistors, with the emitters connected to ground and collectors tied through a resistor. Transistor-Transistor Logic (TTL) is also discussed, which depends solely on transistors. TTL uses multiple emitter transistors for inputs and a totem-pole output for high speed and low impedance. The document provides details on RTL and TTL gate operations.
This document discusses CMOS logic circuits. It begins by explaining that CMOS is the dominant technology for digital circuits due to its low power dissipation. It then discusses the structure and operation of the basic CMOS inverter circuit. Key points include that CMOS circuits use complementary NMOS and PMOS transistors to switch the output between power and ground with very low static power. The document also discusses parameters for characterizing logic circuits like propagation delay and noise margins. It describes how to synthesize more complex CMOS gates from their Boolean expressions by constructing pull-down and pull-up networks. Specific gates like NOR, NAND, and XOR are analyzed. Transistor sizing is also covered to ensure adequate driving capability.
NMOS is nothing but negative channel metal oxide semiconductor; it is pronounced as en-moss. It is a type of semiconductor that charges negatively.
NMOS advantages, disadvantage, TTL, DTL
The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is a type of field-effect transistor (FET). It has an insulated gate, whose voltage determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. Although FET is sometimes used when referring to MOSFET devices, other types of field-effect transistors also exist.
The document discusses MOSFETs (metal-oxide-semiconductor field-effect transistors). It provides information on:
1) The structure of MOSFETs including typical dimensions of the gate length and width. It operates by using a voltage applied to the gate to control the conductivity between the drain and source.
2) The operation of n-channel and p-channel MOSFETs. In an n-channel MOSFET, applying a positive voltage to the gate creates an n-type inversion channel between the source and drain allowing current to flow.
3) Biasing techniques for MOSFET amplifiers including fixing the gate voltage, connecting a resistor in the source,
This document provides an overview of sequential circuits such as latches and flip-flops. It defines sequential circuits and explains that they produce outputs based on current and previous inputs. The basic types of latches and flip-flops are described as SR, D, JK, and T. Characteristics of synchronous and asynchronous sequential circuits are also summarized. Common applications of sequential circuits include shift registers, counters, clocks, and storing temporary information in microprocessors. The document concludes by discussing specific sequential circuit components like SR latches, D flip-flops, and JK flip-flops in more detail.
This document describes an R-2R ladder digital-to-analog converter (DAC). It explains that an R-2R ladder DAC uses only two resistor values, R and 2R, to convert a binary input signal into an analog output voltage. The circuit diagram and working of the R-2R ladder is provided. A 4-bit R-2R ladder DAC is simulated showing the output combinations. Advantages like only needing two resistor values and ability to expand bits are discussed. Applications like audio amplifiers and motor control are also listed.
This document discusses different digital logic families and characteristics. It describes Resistor-Transistor Logic (RTL) which consists of resistors and transistors, with the emitters connected to ground and collectors tied through a resistor. Transistor-Transistor Logic (TTL) is also discussed, which depends solely on transistors. TTL uses multiple emitter transistors for inputs and a totem-pole output for high speed and low impedance. The document provides details on RTL and TTL gate operations.
This document discusses CMOS logic circuits. It begins by explaining that CMOS is the dominant technology for digital circuits due to its low power dissipation. It then discusses the structure and operation of the basic CMOS inverter circuit. Key points include that CMOS circuits use complementary NMOS and PMOS transistors to switch the output between power and ground with very low static power. The document also discusses parameters for characterizing logic circuits like propagation delay and noise margins. It describes how to synthesize more complex CMOS gates from their Boolean expressions by constructing pull-down and pull-up networks. Specific gates like NOR, NAND, and XOR are analyzed. Transistor sizing is also covered to ensure adequate driving capability.
NMOS is nothing but negative channel metal oxide semiconductor; it is pronounced as en-moss. It is a type of semiconductor that charges negatively.
NMOS advantages, disadvantage, TTL, DTL
The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is a type of field-effect transistor (FET). It has an insulated gate, whose voltage determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. Although FET is sometimes used when referring to MOSFET devices, other types of field-effect transistors also exist.
The document discusses MOSFETs (metal-oxide-semiconductor field-effect transistors). It provides information on:
1) The structure of MOSFETs including typical dimensions of the gate length and width. It operates by using a voltage applied to the gate to control the conductivity between the drain and source.
2) The operation of n-channel and p-channel MOSFETs. In an n-channel MOSFET, applying a positive voltage to the gate creates an n-type inversion channel between the source and drain allowing current to flow.
3) Biasing techniques for MOSFET amplifiers including fixing the gate voltage, connecting a resistor in the source,
This document provides an overview of sequential circuits such as latches and flip-flops. It defines sequential circuits and explains that they produce outputs based on current and previous inputs. The basic types of latches and flip-flops are described as SR, D, JK, and T. Characteristics of synchronous and asynchronous sequential circuits are also summarized. Common applications of sequential circuits include shift registers, counters, clocks, and storing temporary information in microprocessors. The document concludes by discussing specific sequential circuit components like SR latches, D flip-flops, and JK flip-flops in more detail.
This document describes an R-2R ladder digital-to-analog converter (DAC). It explains that an R-2R ladder DAC uses only two resistor values, R and 2R, to convert a binary input signal into an analog output voltage. The circuit diagram and working of the R-2R ladder is provided. A 4-bit R-2R ladder DAC is simulated showing the output combinations. Advantages like only needing two resistor values and ability to expand bits are discussed. Applications like audio amplifiers and motor control are also listed.
This document discusses different logic families including Resistor Transistor Logic (RTL), Diode Transistor Logic (DTL), Transistor-Transistor Logic (TTL), and Emitter Coupled Logic (ECL). It provides circuit diagrams and explanations of the working principles for each logic family. Key characteristics like fan-in, fan-out, propagation delay, noise immunity, and power dissipation are compared for each logic family.
This document discusses different types of field effect transistors (FETs). It describes the junction field effect transistor (JFET) and its construction, advantages, and applications. The metal-oxide-semiconductor field effect transistor (MOSFET) is also discussed, including its construction, depletion and enhancement modes of operation, working principle, and applications such as switching and signal amplification. The document also briefly mentions other semiconductor devices like zener diodes, varactor diodes, and their applications.
This document discusses CMOS logic circuits. It begins by defining logic values and how bits are encoded using voltage levels. It then discusses different logic gates like inverters, NAND, NOR and buffers. It explains that logic gates are made from MOS transistors and describes the characteristics of N-type and P-type MOSFETs. The rest of the document discusses various electrical characteristics of CMOS logic circuits like logic levels, noise margins, input/output currents, fan-in, fan-out, propagation delay and power consumption. It also briefly mentions different CMOS logic families and issues around interfacing CMOS and TTL logic standards.
1. A multistage amplifier achieves greater voltage and power gain by using multiple amplification stages connected in cascade. The overall voltage gain is equal to the product of the individual stage gains.
2. Gain is often expressed in decibels (dB) which allows both small and large quantities to be conveniently represented on a logarithmic scale corresponding to human perception. The overall multistage amplifier gain in dB is the sum of the individual stage gains in dB.
3. Common types of coupling between stages include RC coupling using capacitors, direct coupling without coupling elements, and transformer coupling. RC coupling is inexpensive but limits low frequency response while direct coupling can amplify low frequencies without coupling elements.
Operational amplifiers (op-amps) are high-gain amplifiers used as building blocks in analog electronic design. Key characteristics of op-amps include high input impedance, low output impedance, and very high voltage gain. Op-amps are often used in negative feedback configurations which allow the closed-loop gain to be determined by external resistors independently of the op-amp's open-loop gain. Common op-amp configurations include inverting, non-inverting, difference amplifier, integrator, and differentiator circuits.
The document discusses different types of filters including low pass, high pass, band pass, and band reject filters. It provides details on passive and active low pass and high pass filters. For low pass filters, it explains that they pass low frequencies and attenuate high frequencies, with the cutoff frequency determining where signals start to be reduced. For high pass filters, it describes that they pass high frequencies and attenuate low frequencies below the cutoff point. Examples are given of simple passive RC low and high pass filter circuits and how to create active versions using op-amps for amplification and gain control while maintaining the same frequency response.
The document describes a multistage transistor amplifier. It defines a multistage amplifier as having multiple amplifier stages connected in series using coupling devices. It discusses different types of coupling devices like RC, RL, LC and transformer coupling. It explains the working of a typical multistage amplifier including how the gain is calculated as the product of individual stage gains. It describes how the frequency response varies with lower gains at very low and very high frequencies. Advantages include low cost and good frequency response. Disadvantages include increased noise over time and poor impedance matching. Multistage amplifiers are widely used as voltage amplifiers in audio applications.
The document discusses Programmable Logic Arrays (PLAs) and Programmable Array Logic (PALs). It explains that a PLA is similar to a PROM but does not provide full decoding and generates only some minterms. It has three sets of fuses to program the AND gates, OR gates, and output function. A PAL has a fixed OR array and programmable AND array, making it easier to program but less flexible than a PLA. The differences between PLA and PAL are described, along with an example and implementation details.
This Presentation is useful to study Digital Electronics subject about D and T Flip-Flop. This Presentation is also useful to make Presentation on Flip-Flop.
This document discusses MOSFETs and JFETs. It introduces MOSFETs, describing the metal oxide layer and how the electric field controls current. It describes types of MOSFETs and their applications, particularly as switches. Characteristic curves of MOSFETs are also mentioned. The document then introduces JFETs, describing their structure and operation. Applications of JFETs as switches are provided. Advantages and disadvantages of JFETs are listed. Finally, characteristics curves of JFETs, including output and transfer characteristics, are described.
This document provides an overview of phase locked loops (PLL) including:
1. The basic components of a PLL including a phase detector, low pass filter, and voltage controlled oscillator that work together in a closed loop to lock the output frequency and phase to the input signal.
2. Examples of PLL applications such as frequency multiplication, FM demodulation, and motor speed control.
3. A more detailed description of the 565 PLL IC including its pin configuration and characteristics such as operating frequency range and drift with temperature/voltage.
This is a ppt of a college project of the topic kvl and kcl ..do read this..i have such interest in science projects and do maake aa lot of money by doing freelancing in embedded system so make sure to check this ppt for more updtes
This document discusses MOSFETs and CMOS technology scaling. It begins with an introduction to electronics and transistors before discussing MOSFET structure and operation. The MOSFET I-V characteristics and effects like body effect and channel length modulation are covered. The use of SPICE models to simulate MOSFET behavior is also summarized. The document then addresses challenges with scaling CMOS technology to smaller nodes and how approaches like high-k dielectrics and FinFETs helped overcome these challenges. FinFET structure and advantages over planar MOSFETs are briefly outlined.
This document discusses latches and flip flops, which are types of sequential logic circuits. It describes the basic components and functioning of latches like SR latches, D latches, and gated latches. For flip flops, it covers SR flip flops, D flip flops, JK flip flops, and master-slave flip flops. The key differences between latches and flip flops are that latches do not have a clock input while flip flops are edge-triggered by a clock signal. Latches and flip flops are used as basic storage elements in more complex sequential circuits and in computer components like registers and RAM.
The document discusses Boolean algebra laws, which are used to simplify Boolean expressions. It outlines several important laws including:
1) Identity laws - A variable combined with 1 or 0 is equal to itself
2) Annulment laws - A variable combined with 0 under AND or 1 under OR is always equal to 0 or 1, respectively
3) Idempotent laws - A variable combined with itself under AND or OR is equal to itself
4) Complement laws - A variable combined with its complement under AND or OR is always equal to 0 or 1, respectively
5) De Morgan's laws - Allow transforming expressions containing negation, AND, and OR operations.
The document discusses different logic families used in integrated circuits. It describes the 7 main logic families: RTL, DTL, IIL, TTL, ECL, MOS, and CMOS. RTL and DTL are no longer used in new designs. TTL is a modified form of DTL using transistors instead of diodes. IIL, MOS are used in large scale integration. ECL is used for high speed operations. CMOS is used where low power is required. The document provides information on characteristics like fan-out, power dissipation, propagation delay, and noise margin for each logic family.
This article discusses different power electronics devices that are in use like power diodes, power thyristors, power transistors, IGBT, GTO, IGCT and others. This article will give a basic view of these devices and their operations.
This document provides an overview of digital logic families and integrated circuits (ICs). It discusses common logic families like TTL and CMOS, comparing their characteristics such as speed, power consumption, and noise immunity. It also describes common IC packages and the numbering systems used to identify standardized small-scale and medium-scale integrated circuits. Furthermore, it defines important electrical characteristics of logic families like voltage and current levels as well as timing parameters.
This document provides information about logic families and semiconductors. It discusses the characteristics of different logic families including logic levels, power dissipation, propagation delay, noise margin, and fan-out. It describes transistor types used to implement logic circuits like BJT, MOSFET, NMOS, and PMOS. It discusses concepts like Moore's Law, transistor size scaling, TTL, CMOS logic families. It defines electrical parameters for logic gates like voltage and current levels, noise margins, propagation delay, power dissipation, and fan-out. It provides comparisons of different logic families and an overview of logic gate integration levels from SSI to VLSI.
This document discusses different logic families including Resistor Transistor Logic (RTL), Diode Transistor Logic (DTL), Transistor-Transistor Logic (TTL), and Emitter Coupled Logic (ECL). It provides circuit diagrams and explanations of the working principles for each logic family. Key characteristics like fan-in, fan-out, propagation delay, noise immunity, and power dissipation are compared for each logic family.
This document discusses different types of field effect transistors (FETs). It describes the junction field effect transistor (JFET) and its construction, advantages, and applications. The metal-oxide-semiconductor field effect transistor (MOSFET) is also discussed, including its construction, depletion and enhancement modes of operation, working principle, and applications such as switching and signal amplification. The document also briefly mentions other semiconductor devices like zener diodes, varactor diodes, and their applications.
This document discusses CMOS logic circuits. It begins by defining logic values and how bits are encoded using voltage levels. It then discusses different logic gates like inverters, NAND, NOR and buffers. It explains that logic gates are made from MOS transistors and describes the characteristics of N-type and P-type MOSFETs. The rest of the document discusses various electrical characteristics of CMOS logic circuits like logic levels, noise margins, input/output currents, fan-in, fan-out, propagation delay and power consumption. It also briefly mentions different CMOS logic families and issues around interfacing CMOS and TTL logic standards.
1. A multistage amplifier achieves greater voltage and power gain by using multiple amplification stages connected in cascade. The overall voltage gain is equal to the product of the individual stage gains.
2. Gain is often expressed in decibels (dB) which allows both small and large quantities to be conveniently represented on a logarithmic scale corresponding to human perception. The overall multistage amplifier gain in dB is the sum of the individual stage gains in dB.
3. Common types of coupling between stages include RC coupling using capacitors, direct coupling without coupling elements, and transformer coupling. RC coupling is inexpensive but limits low frequency response while direct coupling can amplify low frequencies without coupling elements.
Operational amplifiers (op-amps) are high-gain amplifiers used as building blocks in analog electronic design. Key characteristics of op-amps include high input impedance, low output impedance, and very high voltage gain. Op-amps are often used in negative feedback configurations which allow the closed-loop gain to be determined by external resistors independently of the op-amp's open-loop gain. Common op-amp configurations include inverting, non-inverting, difference amplifier, integrator, and differentiator circuits.
The document discusses different types of filters including low pass, high pass, band pass, and band reject filters. It provides details on passive and active low pass and high pass filters. For low pass filters, it explains that they pass low frequencies and attenuate high frequencies, with the cutoff frequency determining where signals start to be reduced. For high pass filters, it describes that they pass high frequencies and attenuate low frequencies below the cutoff point. Examples are given of simple passive RC low and high pass filter circuits and how to create active versions using op-amps for amplification and gain control while maintaining the same frequency response.
The document describes a multistage transistor amplifier. It defines a multistage amplifier as having multiple amplifier stages connected in series using coupling devices. It discusses different types of coupling devices like RC, RL, LC and transformer coupling. It explains the working of a typical multistage amplifier including how the gain is calculated as the product of individual stage gains. It describes how the frequency response varies with lower gains at very low and very high frequencies. Advantages include low cost and good frequency response. Disadvantages include increased noise over time and poor impedance matching. Multistage amplifiers are widely used as voltage amplifiers in audio applications.
The document discusses Programmable Logic Arrays (PLAs) and Programmable Array Logic (PALs). It explains that a PLA is similar to a PROM but does not provide full decoding and generates only some minterms. It has three sets of fuses to program the AND gates, OR gates, and output function. A PAL has a fixed OR array and programmable AND array, making it easier to program but less flexible than a PLA. The differences between PLA and PAL are described, along with an example and implementation details.
This Presentation is useful to study Digital Electronics subject about D and T Flip-Flop. This Presentation is also useful to make Presentation on Flip-Flop.
This document discusses MOSFETs and JFETs. It introduces MOSFETs, describing the metal oxide layer and how the electric field controls current. It describes types of MOSFETs and their applications, particularly as switches. Characteristic curves of MOSFETs are also mentioned. The document then introduces JFETs, describing their structure and operation. Applications of JFETs as switches are provided. Advantages and disadvantages of JFETs are listed. Finally, characteristics curves of JFETs, including output and transfer characteristics, are described.
This document provides an overview of phase locked loops (PLL) including:
1. The basic components of a PLL including a phase detector, low pass filter, and voltage controlled oscillator that work together in a closed loop to lock the output frequency and phase to the input signal.
2. Examples of PLL applications such as frequency multiplication, FM demodulation, and motor speed control.
3. A more detailed description of the 565 PLL IC including its pin configuration and characteristics such as operating frequency range and drift with temperature/voltage.
This is a ppt of a college project of the topic kvl and kcl ..do read this..i have such interest in science projects and do maake aa lot of money by doing freelancing in embedded system so make sure to check this ppt for more updtes
This document discusses MOSFETs and CMOS technology scaling. It begins with an introduction to electronics and transistors before discussing MOSFET structure and operation. The MOSFET I-V characteristics and effects like body effect and channel length modulation are covered. The use of SPICE models to simulate MOSFET behavior is also summarized. The document then addresses challenges with scaling CMOS technology to smaller nodes and how approaches like high-k dielectrics and FinFETs helped overcome these challenges. FinFET structure and advantages over planar MOSFETs are briefly outlined.
This document discusses latches and flip flops, which are types of sequential logic circuits. It describes the basic components and functioning of latches like SR latches, D latches, and gated latches. For flip flops, it covers SR flip flops, D flip flops, JK flip flops, and master-slave flip flops. The key differences between latches and flip flops are that latches do not have a clock input while flip flops are edge-triggered by a clock signal. Latches and flip flops are used as basic storage elements in more complex sequential circuits and in computer components like registers and RAM.
The document discusses Boolean algebra laws, which are used to simplify Boolean expressions. It outlines several important laws including:
1) Identity laws - A variable combined with 1 or 0 is equal to itself
2) Annulment laws - A variable combined with 0 under AND or 1 under OR is always equal to 0 or 1, respectively
3) Idempotent laws - A variable combined with itself under AND or OR is equal to itself
4) Complement laws - A variable combined with its complement under AND or OR is always equal to 0 or 1, respectively
5) De Morgan's laws - Allow transforming expressions containing negation, AND, and OR operations.
The document discusses different logic families used in integrated circuits. It describes the 7 main logic families: RTL, DTL, IIL, TTL, ECL, MOS, and CMOS. RTL and DTL are no longer used in new designs. TTL is a modified form of DTL using transistors instead of diodes. IIL, MOS are used in large scale integration. ECL is used for high speed operations. CMOS is used where low power is required. The document provides information on characteristics like fan-out, power dissipation, propagation delay, and noise margin for each logic family.
This article discusses different power electronics devices that are in use like power diodes, power thyristors, power transistors, IGBT, GTO, IGCT and others. This article will give a basic view of these devices and their operations.
This document provides an overview of digital logic families and integrated circuits (ICs). It discusses common logic families like TTL and CMOS, comparing their characteristics such as speed, power consumption, and noise immunity. It also describes common IC packages and the numbering systems used to identify standardized small-scale and medium-scale integrated circuits. Furthermore, it defines important electrical characteristics of logic families like voltage and current levels as well as timing parameters.
This document provides information about logic families and semiconductors. It discusses the characteristics of different logic families including logic levels, power dissipation, propagation delay, noise margin, and fan-out. It describes transistor types used to implement logic circuits like BJT, MOSFET, NMOS, and PMOS. It discusses concepts like Moore's Law, transistor size scaling, TTL, CMOS logic families. It defines electrical parameters for logic gates like voltage and current levels, noise margins, propagation delay, power dissipation, and fan-out. It provides comparisons of different logic families and an overview of logic gate integration levels from SSI to VLSI.
Logic families are collections of integrated circuits that have similar characteristics. The key parameters for comparing logic families include logic levels, power dissipation, propagation delay, noise margin, and fan-out. Common logic families are TTL and CMOS. TTL gates are faster but consume more power, while CMOS gates have lower power consumption but slower speeds. Noise margin indicates a family's noise immunity and is calculated using the input and output voltage ranges. Propagation delay and power consumption determine a family's speed-power product, with lower values indicating better performance.
Lec 4 digital electronics - interated circuit technology -characteristics o...priyankatabhane
This document discusses the characteristics of integrated circuits (ICs). It describes the two main types of semiconductor devices that ICs are based on, bipolar and unipolar devices, and how various digital logic functions have been implemented using these technologies. It then discusses several key characteristics used to evaluate and compare the performance of different digital IC technologies, including speed of operation, power dissipation, noise immunity, propagation delay, loading and fan-out.
This document discusses different types of logic families used in integrated circuits. It describes bipolar logic families like RTL, DCTL, IIL, DTL, HTL and TTL which can operate in saturated or non-saturated modes. MOS logic families including PMOS, NMOS and CMOS which use only MOSFET devices are also discussed. The key characteristics of logic families like propagation delay, power dissipation, noise immunity and operating temperature are summarized. Specific bipolar and MOS logic gates like TTL NAND, CMOS inverter, and CMOS NAND, AND, NOR and OR gates are illustrated.
Digital logic gates called NAND and NOR are considered universal logic gates because all other logic gates can be constructed using only NAND gates or only NOR gates. Transistor-Transistor Logic (TTL) is one of the most widely used integrated circuit logic families. TTL uses a multi-emitter input transistor and a totem-pole output stage to provide a variable output resistance and achieve high noise immunity. Key parameters for logic families include input/output voltage levels, propagation delay, power dissipation, and noise margins.
This document discusses logic families, which are groups of logic gates that have compatible logic levels and power supply characteristics. It then lists several common logic families such as RTL, DTL, ECL, TTL, PMOS, NMOS, CMOS, and BiCMOS. The document goes on to define basic concepts related to logic gates such as fan-in, fan-out, gate delay, wire delay, skew, logic levels, current levels, noise margin, rise/fall time, propagation delay, and power dissipation. It provides information on logic thresholds and outputs as well as gate transition times and current sink capabilities for different logic families.
The document discusses different types of logic families used in integrated circuits (ICs). It describes bipolar logic families like RTL, DCTL, IIL, DTL, HTL, TTL and ECL. It also discusses unipolar logic families like MOSFET-based PMOS, NMOS, and CMOS. It provides details on the characteristics of different logic families like their supply voltages, logic levels, noise immunity, noise margins, power dissipation, propagation delay, and fan-out. It provides circuit diagrams and operating principles of RTL, DTL, TTL and CMOS gates. Finally, it discusses the advantages and disadvantages of different logic families.
This document discusses different types of digital logic families. It describes Transistor-Transistor Logic (TTL) circuits, including TTL NAND gates which use a totem pole configuration to provide high speed and low output impedance. Metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) circuits are also covered, with CMOS NAND gates using both N-channel and P-channel MOSFETs for low power dissipation. Emitter-coupled logic (ECL) is described as the fastest logic family using current-mode switching, though it has higher power dissipation. Key specifications for digital ICs like propagation delay, power, noise immunity, and fan-in
This document provides an overview of different logic families used in digital circuits. It discusses the classification of logic families into bipolar and unipolar families. It describes key characteristics of different logic families like RTL, DTL, TTL, ECL and CMOS. RTL uses resistors and transistors, DTL added diodes for improved fan-out. TTL replaced diodes with transistors for higher speed. ECL uses differential amplifiers to prevent saturation for highest speeds. CMOS combines high speed with low power consumption. Fan-in, fan-out, noise margin and propagation delay are also explained for different logic families.
Digital logic families classify integrated circuits by their circuit technology. A logic family consists of chips that perform logic functions like AND and OR with similar input/output characteristics. Popular families include TTL, ECL, MOS, and CMOS. CMOS uses fewer transistors than other families for inversion and is known for low power. Logic levels and noise margins define input and output voltage thresholds. Transition times and capacitive loading affect a circuit's propagation delay.
TTL is a logic family consisting of bipolar junction transistors and resistors. It was developed in 1961 and commercially used in 1963. There are several sub-families of TTL that differ in speed and power characteristics, including standard TTL, low power TTL, and high-speed TTL. TTL uses 5V power and 0V/0.2V logic levels, has a fan-out of 10 and propagation delay of around 9ns. It is used in applications like processors, printers, and displays. TTL gates come in open collector, totem pole, and three-state configurations to provide different output characteristics.
Digital logic families have evolved significantly over time, starting with simple diode logic and moving to more complex families like TTL, ECL, and CMOS. TTL was first introduced in 1964 and shaped digital technology, with newer TTL families still used today. ECL provides the fastest speeds but has low noise margins and high power. CMOS uses less static power, allows for scaling to more transistors, and has full voltage swing, though is susceptible to electrostatic damage. CMOS family evolution has decreased supply voltages over time from 12V down to 1.8V or less for lower power.
TTL and CMOS are the two main logic families. TTL uses bipolar transistors and was previously dominant, while CMOS now dominates due to its lower power consumption. TTL provides high speed but uses more power, while CMOS is slower but more power efficient. Both have evolved over time with different sub-families for various applications.
This document provides an overview of different logic families used in digital circuits. It discusses Resistor Transistor Logic (RTL), Diode Transistor Logic (DTL), Transistor-Transistor Logic (TTL), Emitter Coupled Logic (ECL) and Complementary Metal-Oxide-Semiconductor (CMOS) logic families. It describes the basic components, operation and advantages/limitations of each logic family type. The document is intended as lecture notes for a course on logic families used in digital electronics.
This document provides an overview of different digital logic families. It begins by introducing logic gates and integrated circuits. It then classifies logic families as either bipolar or unipolar, and lists examples of each. Key specifications of digital ICs are defined, including propagation delay, fan-in/fan-out, input/output logic levels, and noise margin. Transistor-transistor logic (TTL) and complementary metal-oxide-semiconductor (CMOS) circuits are described. The TTL NAND gate uses multiple emitter transistors while the CMOS NAND gate uses both P-channel and N-channel MOSFETs. Emitter-coupled logic (ECL) provides the fastest
This document discusses different types of logic families used in digital electronics, including TTL, CMOS, and ECL. It provides information on what each acronym stands for and the typical voltage levels for logic 0 and 1 inputs. It also lists some key differences between TTL and CMOS logic families. The document also includes vocabulary terms and circuit diagrams to illustrate MOSFET, CMOS, and ECL logic technologies.
ACEP Magazine edition 4th launched on 05.06.2024Rahul
This document provides information about the third edition of the magazine "Sthapatya" published by the Association of Civil Engineers (Practicing) Aurangabad. It includes messages from current and past presidents of ACEP, memories and photos from past ACEP events, information on life time achievement awards given by ACEP, and a technical article on concrete maintenance, repairs and strengthening. The document highlights activities of ACEP and provides a technical educational article for members.
Redefining brain tumor segmentation: a cutting-edge convolutional neural netw...IJECEIAES
Medical image analysis has witnessed significant advancements with deep learning techniques. In the domain of brain tumor segmentation, the ability to
precisely delineate tumor boundaries from magnetic resonance imaging (MRI)
scans holds profound implications for diagnosis. This study presents an ensemble convolutional neural network (CNN) with transfer learning, integrating
the state-of-the-art Deeplabv3+ architecture with the ResNet18 backbone. The
model is rigorously trained and evaluated, exhibiting remarkable performance
metrics, including an impressive global accuracy of 99.286%, a high-class accuracy of 82.191%, a mean intersection over union (IoU) of 79.900%, a weighted
IoU of 98.620%, and a Boundary F1 (BF) score of 83.303%. Notably, a detailed comparative analysis with existing methods showcases the superiority of
our proposed model. These findings underscore the model’s competence in precise brain tumor localization, underscoring its potential to revolutionize medical
image analysis and enhance healthcare outcomes. This research paves the way
for future exploration and optimization of advanced CNN models in medical
imaging, emphasizing addressing false positives and resource efficiency.
Optimizing Gradle Builds - Gradle DPE Tour Berlin 2024Sinan KOZAK
Sinan from the Delivery Hero mobile infrastructure engineering team shares a deep dive into performance acceleration with Gradle build cache optimizations. Sinan shares their journey into solving complex build-cache problems that affect Gradle builds. By understanding the challenges and solutions found in our journey, we aim to demonstrate the possibilities for faster builds. The case study reveals how overlapping outputs and cache misconfigurations led to significant increases in build times, especially as the project scaled up with numerous modules using Paparazzi tests. The journey from diagnosing to defeating cache issues offers invaluable lessons on maintaining cache integrity without sacrificing functionality.
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODELgerogepatton
As digital technology becomes more deeply embedded in power systems, protecting the communication
networks of Smart Grids (SG) has emerged as a critical concern. Distributed Network Protocol 3 (DNP3)
represents a multi-tiered application layer protocol extensively utilized in Supervisory Control and Data
Acquisition (SCADA)-based smart grids to facilitate real-time data gathering and control functionalities.
Robust Intrusion Detection Systems (IDS) are necessary for early threat detection and mitigation because
of the interconnection of these networks, which makes them vulnerable to a variety of cyberattacks. To
solve this issue, this paper develops a hybrid Deep Learning (DL) model specifically designed for intrusion
detection in smart grids. The proposed approach is a combination of the Convolutional Neural Network
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accuracy rate of 99.50%.
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1. Objective
Describe the specification of the various logic ICs with
emphasis on fan-in, fan-out, input and output
characteristic.
Verify the common technical specification of TTL and
CMOS logic families.
2. Basic
Characteristics
Digital ICs are a collection of resistors, diodes, and transistors
fabricated on apiece of semiconductor material (usually silicon).
Digital ICs are categorized according to their circuit complexity as
measured by the number of equivalent logic gates packaged
within.
Complexity Numbers of gates
Small-scale integration (SSI) Fewer than 12
Medium-scale integration (MSI) 12 to 99
Large-scale integration (LSI) 100 to 9999
Very large-scale integration (VLSI) 10,000 or more
Ultra large-scale integration (ULSI) 100,000 or more
3. Integrated Circuit Logic Families: EC30110
3
WEST (AMK) Unit 5 YUNOS
In the beginning…
Diode Logic (DL)
• simplest; does not scale
• NOT not possible (need
an active element)
=
=
Resistor-Transistor
Logic (RTL)
• replace diode switch
with a transistor switch
• can be cascaded
• large power draw
3
4. Integrated Circuit Logic Families: EC30110
4
WEST (AMK) Unit 5 YUNOS
was…
=
Diode-Transistor Logic (DTL)
• essentially diode logic with transistor amplification
• reduced power consumption
• faster than RTL
DL AND gate Saturating inverter
4
5. Types of IC families:
TTL Family
TTL Prefix Example IC
a) Standard TTL 74 7404(hex inverter)
b) High speed TTL 74H 74H04
c) Low power TTL 74L 74L04
d) Low power Schottky TTL 74LS 74LS04
e) Advanced Schottky 74AS 74AS04
f) Advanced low power Schottky TTL 74ALS 74ALS04
6. CMOS Family
CMOS Prefix Example IC
a) Metal oxide 40 or 140 4001 or 14001
CMOS (quad NOR gates)
b) Metal oxide, pin compatible 74C 74C02
with TTL (quad NOR gates)
c) Silicon gate, pin compatible 74HC 74HC02
with TTL, high speed (quad NOR gates)
d) Silicon gate, high speed, 74HCT 74HCT02
electrically compatible with TTL (quad NOR gates)
7. Power and Ground
Digital ICs are DC powered with ground.
Power supply pin for TTL circuit is labeled Vcc and for
CMOS circuit is labeled Vdd.
9. Unconnected (Floating)
Inputs
A floating TTL input acts as logic 1
Inputs not used should be connected to logic HIGH as a floating
TTL input is extremely susceptible to picking up noise signals
that can adversely affect the device’s operation.
A floating TTL input will measure a DC level between 1.4V to
1.8V.
+5V
1k
A
B X = AB X = AB
X = AB
A
B
A
B
(a) (b) (c)
Three ways to handle unused logic inputs
Unconnected
(floating)
10. If a CMOS input is left floating, it may become
overheated and eventually destroyed itself.
Thus, all inputs to a CMOS IC must be connected to a
LOW or a HIGH level or to the output of another IC.
A floating CMOS input will not measure as a specific
DC voltage but fluctuate randomly as it picks up noise.
Thus, it does not act as a logic 1 or logic 0 and its effect
on the output is unpredictable.
11. Digital IC terminology
Voltage parameters
a) VIH (min) – High-Level Input Voltage
The voltage level required for logic 1 at an input.
Any voltage below this level will not be accepted as a HIGH by the logic circuit.
b) VIL (max) – Low-Level Input Voltage
The voltage level required for logic 0 at an input.
Any voltage above this level will not be accepted as a LOW by the logic circuit.
c) VOH (min) – High-Level Output Voltage
The voltage level at a logic circuit output in the logic 1 state.
The maximum value of VOH is usually specified.
d) VOL (max) – Low-Level Output Voltage
The voltage level at a logic circuit output in the logic 0 state
The maximum value of VOL is usually specified.
12. Integrated Circuit Logic Families: EC30110
12
WEST (AMK) Unit 5 YUNOS
VOH(min) – The minimum voltage level at an output in the logical
“1” state under defined load conditions
VOL(max) – The maximum voltage level at an output in the logical
“0” state under defined load conditions
VIH(min) – The minimum voltage required at an input to be
recognized as “1” logical state
VIL(max) – The maximum voltage required at an input that still will
be recognized as “0” logical state
Logic families: V levels
VOH VIH VOL VIL
12
13. Current parameters
a) IIH – High-Level Input Current
The current the flows into an input when a specified HIGH-level
voltage is applied to that input.
b) IIL – Low-Level Input Current
The current that flows into an input when a specified LOW-level
voltage is applied to that input.
c) IOH – High-Level Output Current
The current that flows from an output in the logical 1 state under
specified load conditions.
d) IOL – Low-Level Output Current
The current that flows from an output in the logical 0 state under
specified load conditions.
14. Integrated Circuit Logic Families: EC30110
14
WEST (AMK) Unit 5 YUNOS
IOH – Current flowing into an output in the logical “1” state under
specified load conditions
IOL – Current flowing into an output in the logical “0” state under
specified load conditions
IIH – Current flowing into an input when a specified HI level is
applied to that input
IIL – Current flowing into an input when a specified LO level is
applied to that input
Logic families: I requirements
VOH VIH VOL VIL
IOH IIH IOL IIL
14
15. +5V
HIGH LOW
Current and Voltages in the 2 logic inputs
IOH
VOH
+
_
IIH
VIH
+
_
IOL
VOL
+
_
IIL
VIL
+
_
16. Fan-Out
A logic circuit output is specified to drive a certain fixed
number of logic inputs.
The fan-out (also called loading factor) is defined as the
maximum number of standard logic inputs that an
output can drive reliably.
For example, a logic gate specified to have a fan-out of
10 can drive 10 standard logic inputs. If this number is
exceeded, the output logic level voltages cannot be
guaranteed.
17. Propagation Delays
A logic signal always experiences a delay in going through a
circuit.
Two propagation delay times are defined as:
tPLH – delay time in going from logical 0 to logical 1 state.
tPHL – delay time in going from logical 1 to logical 0 state.
In general, tPHL and tPLH are not the same value, and both will
vary depending on loading conditions. The values of propagation
times are used as a measure of the relative speed of logic
circuits. For example, a logic circuit with values of 10ns is a
faster logic circuit than one with values of 20ns.
18. Noise Immunity
The noise immunity of a logic circuit refers to the
circuit’s ability to tolerate noise voltages on its inputs.
A quantitative measure of noise immunity is called
noise margin.
20. DC Noise Margins
a) The high-state noise margin VNH is defined as
VNH = VOH (min) – VIH (min)
b) The low-state noise margin VNL is defined as
VNL = VIL (max) – VOL (max)
21. Current-Sourcing and Current-Sinking
Logic
Current-sourcing action
Driving gate supplies (sources) current to load gate in HIGH
state.
+VCC
VOH
Driving gate
Load gate
Current Sourcing Action
1
2
Current sourcing
Driving gate supplies
(sources) current to load
gate in HIGH state.
LOW
LOW
IIH
22. Current-sinking action
Driving gate receives (sink) current from load gate in LOW state.
1
2 Current sinking
Driving gate receives
(sinks) current from
load gate in LOW state.
IIL
HIGH
HIGH
Current Sinking Action
+VCC
Load gate
Driving gate
VOL
23. Standard TTL series
characteristics
Standard 74 series voltage levels
Minimum Typical Maximum
VOL - 0.1 0.4
VOH 2.4 3.4 -
VIL - - 0.8
VIH 2.0 - -
Noise Margins (worst case) VNL = VNH = 400mV
Average power dissipation Pd = 10mW
Average propagation delay td = 9nsec
Typical fan-out = 10
24. Other TTL series
a) Low-Power TTL, 74L series
Same basic circuit as standard 74 series except that all resistor
values are increased, thus reducing the power requirements.
Increased resistor values results in longer propagation delays.
Suitable for low frequency operation.
Has become obsolete.
b) High-Speed TTL, 74H series
Smaller resistor values used and have much faster switching
speed with an average propagation delay of 6ns.
The power dissipation, however, is higher.
25. c) Schottky TTL, 74S series
A Schottky Barrier Diode (SBD) is included to increase switching
speed.
Schottky diode
74S have twice the speed of 74H at about the same power
requirement.
26. d) Low-Power Schottky TTL, 74LS series (LS-TTL)
Lower-powered, slower speed version of the 74S series.
Most common series in TTL family.
e) Advanced Schottky TTL, 74AS series (AS TTL)
Improved in speed over the 74S series at a much lower power
requirement.
Fastest TTL series and speed power product is lower than 74S
series.
Requires lower input current (IIL, IIH) that results in a greater fan-
out.
f) Advanced Low-Power Schottky TTL, 74ALS series
Lowest speed-power product of all the TTL series.
Lowest gate power dissipation.
Higher fan-out.
27. TTL loading and fan-out
Fig 5.3 (a) shows a standard TTL output in the LOW state
connected to drive several standard TTL inputs.
With gate 1 output in the LOW state, it will sink an amount of
current IOL which is the sum of the IIL currents from each input.
IOL
IIL
IIL
+5V
+5V
1
1
VOL
Fig 5.3 (a)
28. Determining the Fan-out
To determine how many different inputs an IC output
can drive, one needs to know the current drive
capability of the output [i.e. IOL(max) and IOH(max)] and
the current requirements of each input (i.e. IIL and IIH).
29. Unit Loads
The device input and output currents is specified in terms of
UNIT LOAD (UL).
1 unit load (UL) =
40uA in the HIGH state
1.6mA in the LOW state
Example: If an IC has a fan-out of 10 UL, it means
IOH(max) = 10 x 40uA = 100uA
IOL(max) = 10 x 1.6mA = 16mA
30. MOS Digital Integrated Circuits
The transistors of MOS technology are field-effect transistors
called MOSFETs.
The advantages of MOSFET are that it is:
Relatively simple and inexpensive to fabricate (since no other components needed)
Small
Consuming lesser power
MOS ICs can accommodate a much larger number of circuit
elements on a single chip than a bipolar ICs.
This higher packing density of MOS ICs result in greater system
operating speed due to the reduction of external connections.
However, MOS ICs are relatively slow in operating speed as
compared to bipolar ICs.
31. Digital MOSFET circuits
Three categories of MOSFETs:
1. P-MOS :- P-channel enhancement MOSFETs
2. N-MOS :- N-channel enhancement MOSFETs
3. C-MOS :- Complementary MOS
P-MOS and NMOS digital ICs have a greater packing density
and more economical as compared to CMOS ICs.
N-MOS is twice as fast as P-MOS.
CMOS has greater complexity and lowest packing density of the
MOS families.
CMOS has higher speed and much lower power dissipation
among the MOS families.
32. Characteristics of MOS logic
MOS logic families compared to bipolar logic families:
a) Slower speed
b) Requires much less power (large resistance)
c) Better noise margin
d) Greater supply voltage range
e) Higher fan-out
f) Simplest to fabricate (only N-MOS or P-MOS
elements are used)
33. CMOS series characteristics
a) 4000 series
2 versions, namely 4000A and 4000B with the “B” series having
higher output current capabilities.
b) 74C series
pin-for-pin and function-for-function compatible with TTL
devices having the same number.
c) 74HC series (high speed CMOS)
higher switching speed and higher output current capability.
d) 74HCT series
voltage-compatible with TTL devices.
can be driven directly by a TTL output.
34. Voltage levels
When CMOS outputs drive only CMOS inputs, the output
voltage levels will be very close to 0V for the LOW state, and
+Vdd for the HIGH state.
This is due to very high CMOS input resistance drawing very
little current from the CMOS output that is driving it.
The input voltage requirements for both logic states are expressed
as a percentage of the supply voltage as such:
VIL(max) = 30% of Vdd
VIH(min) = 70% of Vdd
For example, when a CMOS is operating from Vdd = +5V, it will
accept any input voltage less than VIL(max) = 1.5V as a LOW,
and any input voltage greater than VIH(min) = 3.5V as a HIGH.
35. Noise Margins
CMOS noise margins are determined as follows:
VNH = VOH(min) – VIH(min)
= Vdd – 70% Vdd
= 30% Vdd
VNL = VIL(max) – VOL(max)
= 30% Vdd – 0
= 30% Vdd
The noise margins are the same in both states and depend on Vdd.
For example, at Vdd = +5V, the noise margins are both 1.5V
which is better than TTL.
This makes CMOS attractive for applications that are exposed to
a high-noise environment.
36. Power dissipation
When CMOS logic circuit is in static state (not changing), its power
dissipation, Pd, is extremely Low.
However, the power dissipation will increase in proportion to frequency
at which the circuits are switching states.
Each time a CMOS output switches from ‘0’ to ‘1’, a transient charging
current has to be supplied to the load capacitance which consists of the
combined input capacitances of any loads being driven and the device’s
own output capacitance.
These narrow spikes of current are supplied by Vdd, which can be of
5mA. As the switching frequency increases, there will be more of these
current spikes and the average current drawn from Vdd will increase.
Thus, at higher frequencies, CMOS begins to lose some of its
advantage over other logic families.
37. +
Current spikes drawn from Vdd each time the output
switches from ‘0’ to ‘1’
+5V
ON
OFF
CLOAD
VIN
+
_
ID
P
N
VIN
5V
0V
VOUT
5V
0V
ID
0V
VOUT
38. Fan-out
CMOS inputs have extremely large resistance (10M ohms) that draws
essentially no current from the signal source.
Each CMOS inputs has a capacitance (5pF) that limit the number of
CMOS inputs that one CMOS output can drive.
The CMOS output has to change and discharge the parallel
combination of each input number of loads being driven.
Typically, each CMOS load increases the driving circuit’s propagation
delay by 3nsec.
CMOS outputs are limited to a fan-out of 50 for low frequency
operation.
For higher frequency, the fan-out would have to be less.
39. Each CMOS input adds to the total load capacitance
seen by the the driving gate’s output
+
5pF
+
5pF
Gate 1 output
drives a total
CLOAD of N x 5pF
To other loads
40. Unused inputs
CMOS input should never be left disconnected.
All CMOS inputs have to be tied either to a fixed
voltage level (0V or Vdd) or to another input.
An unconnected CMOS input is susceptible to noise and
static charges that could easily bias the P and N-channel
MOSFETs in the conductive state, resulting increased
power dissipation and possible overheating.