Gas Sensors, Detection of Particles, 3D Images…: What are the Next opportunities in MEMS? presentation held at Semicon West 2017 from Yole Développement
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MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products A psychological survey in 1994 by Hatwell (Hatwell, Y. (1994). Traitéde psychologie expérimentale. Paris, P.U.F.) showed that 83% of our external world perception is through our vision. Thus a high quality image is highly valued by the user –today Smartphone bill of materials is $10 for the camera module. The next senses we use are Audio and Smell. Thus, we believe next innovation in MEMS & Sensors will be for microphones. Gas sensors could be the next one to be valued for consumer applications. Complete integration has been achieved at sensor level Strong miniaturization race Still some developments on power consumption, advanced packaging Major developments at Software level to achieve sensor fusion Accurate data acquisition Precise tracking within the environment After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance An ever growing market Imaging is highly valued The imaging industry stopped the low cost/high integration model by increasing the pixel size and thus the die size Interesting way for the MEMS industry to gain value: More integration at environmental level seems a good opportunity Pressure + Microphone Add Particles & Gas detection (market pull) High power consumption •Limited access to sensors •Players: Qualcomm, Samsung, Apple, etc… •Application processors and MCU manufacturers try to override sensor hubs and access the fullfunctionality of the sensors. It requires allocated resources, may be not as optimized as a sensor hub provides Deep access to the functionalities of the sensor •Low power consumption •Optimized performance •They try to add value to their sensors by providing sensor hub, adding software and promoting use case,showing there al added-value offer by their sensors combined with their software. A great competition to gather value at a higher level in the system, because value is in the software, not in the hardware. More information on that report at http://www.i-micronews.com/reports.html
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Gas Sensors, Detection of Particles, 3D Images…: What are the Next opportunities in MEMS? presentation held at Semicon West 2017 from Yole Développement
- 1. From Technologies to Market Gas Sensors, Detection of Particles, 3D Images…:What are the Next opportunities in MEMS? © 2016© 2016
- 2. 2©2016 | www.yole.fr | About Yole Développement MEMS & Sensors Displays Compound Semi – LED & OLEDs Imaging Photonics MedTech Manufacturing Advanced Packaging Batteries / Energy Management Power Electronics FIELDS OF EXPERTISE Yole Développement’s 30 analysts operate in the following areas
- 3. 3 A GROUP OF COMPANIES Market, technology and strategy consulting www.yole.fr M&A operations Due diligences www.yolefinance.com Innovation and business maker www.bmorpho.com Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr
- 4. Status of the Mems industry ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 5. 5 MEMS, A « TRANSFER FUNCTION » TECHNOLOGY MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products ©2016 | www.yole.fr | Semicon West - MEMS Presentation Galvanometric mirror Pressure sensor Hg tilt sensor Microphone Gas sensor Syringe Micro-mirror VCM MEMS gas sensor Micro needles WL auto focus Microphone IMU Pressure/environment sensor 2016, gas sensors as the next MEMS success (?)
- 6. 6 MEMS MARKET ENTRY: PRODUCTS RELEASES EXAMPLES Automotive is the historical MEMS high volume market Transition started in 2003 towards consumer products… ©2016 | www.yole.fr | Semicon West - MEMS Presentation 1976 1988 1992 1994 1998 2003 2005 2007 2008 2009 2012 2014 Pressure Car engine control Acceleros Air Bag 1982 Pressure MAP Pressure Blood Micromirrors DLP Gyros Vehicle Stability Microphones Feature phone Acceleros Gaming - Wii Acceleros & Gyros Smartphone Magnetos Smartphone Humidity Smartphone Optical Display (IMOD) – e-reader, watches RF Antenna Tuner Smartphone RF Filters Feature phone 2015 Micromirrors Laptop/Tablets
- 7. 7 HOW DOWE PERCEIVETHE EXTERNALWORLD? Audio is the next innovation. ©2016 | www.yole.fr | Semicon West - MEMS Presentation A psychological survey in 1994 by Hatwell (Hatwell,Y. (1994).Traité de psychologie expérimentale. Paris, P.U.F.) showed that 83% of our external world perception is through our vision. Thus a high quality image is highly valued by the user – today Smartphone bill of materials is $10 for the camera module. The next senses we use are Audio and Smell.Thus, we believe next innovation in MEMS & Sensors will be for microphones. Gas sensors could be the next one to be valued for consumer applications.
- 8. 8 THE 5 SENSES AND MANY MORE: MEMS, SENSORS MEMS & sensors are mimicking humans senses Smell Taste Sight Touch Microbolometers Gas sensors & electronic noses Force, haptic & touch sensors Humidity sensors CMOS Image sensor Audio Microphones Ultrasonic ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 9. 9 Actuators & more sensors give increased perception & functionalities. Smell Taste Sight Touch Microbolometers Micromirrors Pressure Gas sensors & electronic noses Pressure sensors Force, haptic & touch sensors Humidity sensors Body balance Inertial systems RF communication Oscillators, tuners, switches & filters Speech Microspeakers CMOS Image sensor Focus RF communication Autofocus Fluids Biochips Micropumps Audio Microphones Ultrasonic THE 5 SENSES AND MANY MORE: MEMS, SENSORS & ACTUATORS ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 10. 10 MEMS & SENSORS ROADMAP From More than Moore towards Beyond Law MEMS & Sensors enable key functionalities. Current battleground of the industry 1980 2010 2020 Industry competition Moore Industry competition More than Moore Industry Competition Beyond Moore LaptopPersonal Computers Smartphones Autonomous vehicles Robotic Servants Quantified self Drones Acceleration Sensing Interaction age Processing Information age Actuating Enhancement age Tablets Smart homes 2040 Telekinesis ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 11. 11 ACTUATORSSENSORS THE DIFFERENT MEMS, SENSORS & ACTUATORS & WHERE THEY CAN COMBINE Pressure Sound (microphone) Environment Optical sensors Drugdelivery Microfluidics Inkjetheads Auto-Focus Micromirrors RF µspeakers Optical MEMS Micro structures Particles Humidity Movement Gas Magnetometers IMUs (6 to 9 DOF) Accelerometers Gyroscopes Temperature Opticalbenches Microtips Probes Watches components PIR&thermopiles Microbolometers Switch Filter Bosch BME680 FLIR Lepton One Infineon microphone ST pressure sensorInvenSense MPU9250 Debiotech micro pump Texas Instruments DLP Avago-Broadcom FBAR Filter Spiromax Patek Philippe Audio Pixels MEMS based speaker Resonator Biochips poLight AF SiTime oscillator Ambientlightsensor Fingerprint Vision Optical combos “open” package environmental combos “closed” package 6 to 11 DOF combos Possible integration with environment combos Possible integration with opto combos ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 12. MEMS & Sensors ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 13. 13 MEMS & SENSORS TRANSITIONING TOWARDS 3 MAIN HUBS… ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer INERTIAL DOF 6 9 IMU ENVIRONMENTAL Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone OPTICAL Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient
- 14. 14 MEMS & SENSORS:THE INERTIAL HUB ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer DOF 6 9 IMU ENVIRONMENTAL Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone OPTICAL Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient Complete integration has been achieved at sensor level Strong miniaturization race Still some developments on power consumption, advanced packaging Major developments at Software level to achieve sensor fusion Accurate data acquisition Precise tracking within the environment
- 15. 15 MEMS & SENSORS:THE INERTIAL HUB ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer DOF 6 9 IMU ENVIRONMENTAL Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone OPTICAL Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient Complete integration has been achieved at sensor level Strong miniaturization race Still some developments on power consumption, advanced packaging Major developments at Software level to achieve sensor fusion Accurate data acquisition Precise tracking within the environment Inertial Bill Of Materials $1
- 16. 16 INERTIAL MEMS PACKAGE Typical package footprint for inertial sensors used in mobile systems After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 17. 17 MEMS & SENSORS:THE OPTICAL HUB ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer INERTIAL DOF 6 9 IMU ENVIRONMENTAL Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient An ever growing market Imaging is highly valued The imaging industry stopped the low cost/high integration model by increasing the pixel size and thus the die size
- 18. 18 MEMS & SENSORS:THE OPTICAL HUB ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer INERTIAL DOF 6 9 IMU ENVIRONMENTAL Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient An ever growing market Imaging is highly valued The imaging industry stopped the low cost/high integration model by increasing the pixel size and thus the die size Imaging Bill Of Materials $10
- 19. 19 MEMS & SENSORS:THE ENVIRONMENTAL HUB ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer INERTIAL DOF 6 9 IMU Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone OPTICAL Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient Interesting way for the MEMS industry to gain value: More integration at environmental level seems a good opportunity Pressure + Microphone Add Particles & Gas detection (market pull)
- 20. 20 MEMS & SENSORS:THE ENVIRONMENTAL HUB ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer INERTIAL DOF 6 9 IMU Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone OPTICAL Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient Interesting way for the MEMS industry to gain value: More integration at environmental level seems a good opportunity Pressure + Microphone Add Particles & Gas detection (market pull) Environmental Bill Of Materials $0.70
- 21. 21 MEMS & SENSORS:THE ENVIRONMENTAL HUB ©2016 | www.yole.fr | Semicon West - MEMS Presentation Closed Package Hub Accelerometer Gyroscope Magnetometer INERTIAL DOF 6 9 IMU Open Cavity Hub Gas / Particle Pressure Temp/Humidity Microphone OPTICAL Optical Hub Visible 3D vision Multi spectral 3D Proximity/ambient Interesting way for the MEMS industry to gain value: More integration at environmental level seems a good opportunity Pressure + Microphone Add Particles & Gas detection (market pull) Environmental Bill Of Materials $1.50 Environmental Bill Of Materials $0.70
- 22. 22 SENSOR HUB vs MCU/AP A fight to acquire value Value is in the software, not in the hardware • Deep access to the functionalities of the sensor • Low power consumption • Optimized performance • They try to add value to their sensors by providing sensor hub, adding software and promoting use case, showing the real added-value offer by their sensors combined with their software. • High power consumption • Limited access to sensors • Players: Qualcomm, Samsung,Apple, etc… • Application processors and MCU manufacturers try to override sensor hubs and access the full functionality of the sensors. It requires allocated resources, maybe not as optimized as a sensor hub provides MCU AP $30 - 40 Sensor Hub Sensor 1 Sensor 2 Sensor # … … A great competition to gather value at a higher level in the system, because value is in the software, not in the hardware. <<$1/sensor $1 -$2 Value Sensor System ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 23. 23 IOT,WEARABLES … WHERE IS THE NEXT SEMICONDUCTOR WAVE? Looking for next « Holy Grail » … What is the next growth driver? ©2016 | www.yole.fr | Semicon West - MEMS Presentation 0 50 100 150 200 250 300 350 400 450 SEMICONDUCTOR INDUSTRY REVENUE (in bn US$) Source: WSTS, Cisco, Gartner, Yole ? IoT? Wearables? Likely the next growth driver will be a mix of smartphones, IoT, wearables, cars …
- 24. 24 $0,0 $0,5 $1,0 $1,5 $2,0 $2,5 $3,0 $3,5 $4,0 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2000–2020 MEMS ASP decrease SourceYole Développement Where can the market absorb this price decrease? The smartphone wave boosted volume sales but prices dropped! MEMS AVERAGE SELLING PRICE Smartphone wave CAGR -6% CAGR -13% ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 25. 25 IS THE MEMS INDUSTRY DIGGING ITS OWN GRAVE? The commoditization paradox! Does it make sense to further shrink MEMS devices by out passing physics law requiring minimal sensor mass for detection? The CIS industry solved this issue by increasing pixel & die size, thus the price! ©2016 | www.yole.fr | Semicon West - MEMS Presentation SIZE REDUCTION PRICE DROP SHRINKING MARGINS INCREASING VOLUMES (SMART PHONES/WEARABLES) THE MEMS MARKET PARADOX: units volume growth is much higher than market value STABLE/DECLINING MARKET IN US$VALUE Where is the cursor?
- 26. 26 LOOKING AT THE CIS INDUSTRY: MOBILE MARKET TREND Main rear camera & sub front camera roadmap: increased added value for more cost. The trend is for more complexity at the system level Log Image sensor Resolution 2Mp 4Mp 8Mp 16Mp 20182010 2012 2014 2016 Sub Camera Resolution VGA-1.2Mp Pixel size 1.1µm 2020 OIS Sub Camera Resolution 5Mp Pixel size 1.1µm Sub Camera Resolution 8Mp Pixel size 1.2µm Main Cameras Resolution 8Mp Pixel size 1.4µm OIS OIS Main Cameras Resolution 8Mp-16Mp Pixel size 1.1µm- 1.5µm Main Camera Resolution 16Mp+ Pixel size 1.0-1.6µm Dual Cameras Resolution 2x 8Mp Pixel size 1.1µm+ Size constraints & Drive for better images & Features: → More pixels → Smaller modules → Image stabilization (OIS)
- 27. 27 WHAT CANWE LEARN FROM THE CIS INDUSTRY AND APPLY TO MEMS & SENSORS? More integration, improved environment tracking, sensor fusion CMOS IMAGE SENSORS More complexity at the system level: drive for better images and features More pixels Smaller modules Image stabilization (OIS) MEMS & Sensors More complexity at the system level: drive for better accuracy/precise tracking and features Sensor fusion More integration: Pressure + Microphone Improved environment tracking: Particles & Gas sensing ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 28. 28 NEW MEMS CHALLENGES Power consumption is becoming a major trend MEMS market challenges are evolving 2016, a new virtuous cycle?Yesterday ASP decrease Consumer volume Size decrease Power consumption decrease Importance for user case Sensor fusion, software & more features Mobiles have to survive for long periods on battery power while interacting with environment (voice calls, Wi-Fi, Bluetooth, GPS, sensors …). Start with applications, and work downwards to the chips needed to support them. Less silicon, more brain. • Yesterday, the main MEMS challenges were decrease size, which in turn led to price decrease then volume growth. • Today, trends are different.They are: importance of user case (start with the definition of an application), fusion of different sensors with software and power decrease (which paradoxically is linked to a chip size increase because of the ASIC). ©2016 | www.yole.fr | Semicon West - MEMS Presentation Start with more intelligence!
- 29. © 2016 Conclusions ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 30. 30 CONCLUSIONS & OUTLOOK From Sensing to Sensor fusion to Actuating Sensing Trend is fusion to open new application fields More accurate data Precise tracking within the environment Low Power Hubs approach and in particular the environmental hub seems a nice opportunity to gain value Add particles and gas sensing Combine Pressure and Microphone ? Actuating Actuators are back and represent big market opportunities Auto-focus devices Micro-mirrors RF switches … ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 31. 31 RELATEDYOLE REPORTS Some slides from this presentation were extracted from the following reports Status of the MEMS industry 2016 To be released in Q2 2016 Gas sensors Report 2016 Released in Feb 2016 – More info. here. Status of the CMOS Image sensor industry Released in Jan. 2015 – More info. here. ©2016 | www.yole.fr | Semicon West - MEMS Presentation
- 32. 32 CONTACT INFORMATION Follow us on • Consulting and Specific Analysis • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr • Japan & Asia:Takashi Onozawa, Representative Director,Yole KK Email: onozawa@yole.fr • RoW: Jean-Christophe Eloy, CEO & President,Yole Développement Email eloy@yole.fr • Report business • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr • Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: khamassi@yole.fr • Japan & Asia:Takashi Onozawa, Representative Director,Yole KK. Email: onozawa@yole.fr • Korea: HaileyYang, Business Development Manager, Korean Office Email: yang@yole.fr • Taiwan: Mavis Wang, Business Development Director Email: wang@yole.fr • Financial services • Jean-Christophe Eloy, CEO & President Email: eloy@yole.fr • General • Email: info@yole.fr ©2016 | www.yole.fr | Semicon West - MEMS Presentation