Gas Sensors, Detection of Particles, 3D Images…: What are the Next opportunities in MEMS? presentation held at Semicon West 2017 from Yole Développement

From Technologies to Market
Gas Sensors,
Detection of
Particles, 3D
Images…:What are
the Next
opportunities in
MEMS?
© 2016© 2016

2©2016 | www.yole.fr | About Yole Développement
MEMS &
Sensors
Displays
Compound
Semi – LED
& OLEDs
Imaging Photonics
MedTech
Manufacturing
Advanced Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas

3
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr

Status of the Mems
industry
©2016 | www.yole.fr | Semicon West - MEMS Presentation

5
MEMS, A « TRANSFER FUNCTION » TECHNOLOGY
MEMS is a
semiconductor
technology
thus enabling
miniaturization
and lower cost
manufacturing
of existing
products
Galvanometric
mirror
Pressure sensor
Hg tilt sensor
Microphone
Gas sensor
Syringe
Micro-mirror
VCM
MEMS gas sensor
Micro needles
WL auto focus
Microphone
IMU
Pressure/environment
sensor
2016, gas sensors as the
next MEMS success (?)

6
MEMS MARKET ENTRY: PRODUCTS RELEASES EXAMPLES
Automotive is
the historical
MEMS high
volume market
Transition
started in 2003
towards
consumer
products…
1976 1988 1992 1994 1998 2003 2005 2007 2008 2009 2012 2014
Pressure
Car engine
control
Acceleros
Air Bag
1982
Pressure
MAP
Pressure
Blood
Micromirrors
DLP
Gyros
Vehicle Stability
Microphones
Feature phone
Acceleros
Gaming - Wii
Acceleros &
Gyros
Smartphone
Magnetos
Smartphone
Humidity
Smartphone
Optical
Display (IMOD) –
e-reader, watches
RF Antenna Tuner
Smartphone
RF Filters
Feature phone
2015
Micromirrors
Laptop/Tablets

7
HOW DOWE PERCEIVETHE EXTERNALWORLD?
Audio is the
next
innovation.
A psychological survey in 1994 by Hatwell
(Hatwell,Y. (1994).Traité de psychologie
expérimentale. Paris, P.U.F.) showed that 83% of
our external world perception is through our
vision.
 Thus a high quality image is highly valued by the
user – today Smartphone bill of materials is $10
for the camera module.
 The next senses we use are Audio and Smell.Thus,
we believe next innovation in MEMS & Sensors
will be for microphones.
 Gas sensors could be the next one to be valued
for consumer applications.

8
THE 5 SENSES AND MANY MORE: MEMS, SENSORS
MEMS &
sensors are
mimicking
humans
senses
Smell
Taste
Sight
Touch
Microbolometers
Gas sensors & electronic
noses
Force, haptic & touch
sensors
Humidity sensors
CMOS Image
sensor
Audio
Microphones Ultrasonic

9
Actuators &
more sensors
give increased
perception &
functionalities.
Smell
Taste
Sight
Touch
Microbolometers Micromirrors
Pressure
Gas sensors & electronic
noses
Pressure sensors
Force, haptic & touch
sensors
Humidity sensors
Body balance
Inertial systems
RF communication Oscillators, tuners, switches & filters
Speech
Microspeakers
CMOS Image
sensor
Focus
RF communication
Autofocus
Fluids
Biochips Micropumps
Audio
Microphones Ultrasonic
THE 5 SENSES AND MANY MORE: MEMS, SENSORS & ACTUATORS

10
MEMS & SENSORS ROADMAP
From More than Moore towards Beyond Law
MEMS &
Sensors enable
key
functionalities.
Current
battleground of
the industry
1980 2010 2020
Industry competition
Moore
Industry competition
More than Moore
Industry Competition
Beyond Moore
LaptopPersonal Computers
Smartphones
Autonomous
vehicles
Robotic
Servants
Quantified
self
Drones
Acceleration
Sensing
Interaction age
Processing
Information age
Actuating
Enhancement age
Tablets
Smart
homes
2040
Telekinesis

11
ACTUATORSSENSORS
THE DIFFERENT MEMS, SENSORS & ACTUATORS & WHERE THEY CAN COMBINE
Pressure Sound
(microphone)
Environment Optical sensors
Drugdelivery
Microfluidics
Inkjetheads
Auto-Focus
Micromirrors
RF
µspeakers
Optical MEMS Micro structures
Particles
Humidity
Movement
Gas
Magnetometers
IMUs (6 to 9 DOF)
Accelerometers
Gyroscopes
Temperature
Opticalbenches
Microtips
Probes
Watches
components
PIR&thermopiles
Microbolometers
Switch
Filter
Bosch BME680
FLIR Lepton One
Infineon microphone
ST pressure sensorInvenSense
MPU9250
Debiotech micro
pump
Texas Instruments DLP
Avago-Broadcom
FBAR Filter
Spiromax Patek
Philippe
Audio
Pixels
MEMS
based
speaker
Resonator
Biochips
poLight AF
SiTime oscillator
Ambientlightsensor
Fingerprint
Vision
Optical combos
“open” package
environmental combos
“closed” package
6 to 11 DOF
combos
Possible integration with environment
combos
Possible
integration with
opto combos

MEMS & Sensors

13
MEMS & SENSORS TRANSITIONING TOWARDS 3 MAIN HUBS…
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF
6
9
IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient

14
MEMS & SENSORS:THE INERTIAL HUB
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
DOF
6
9
IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
Complete integration has been
achieved at sensor level
Strong miniaturization race
Still some developments on
power consumption, advanced
packaging
Major developments at Software
level to achieve sensor fusion
 Accurate data acquisition
 Precise tracking within the
environment

15
MEMS & SENSORS:THE INERTIAL HUB
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
DOF
6
9
IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
Complete integration has been
achieved at sensor level
Strong miniaturization race
Still some developments on
power consumption, advanced
packaging
Major developments at Software
level to achieve sensor fusion
 Accurate data acquisition
 Precise tracking within the
environment
Inertial
Bill Of Materials
$1

16
INERTIAL MEMS PACKAGE
Typical package footprint for inertial sensors used in mobile systems
After
decreasing die
size,
improvements
are now
focused on
packaging
issues and use
of through
silicon vias
(TSVs) for
instance

17
MEMS & SENSORS:THE OPTICAL HUB
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF
6
9
IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
An ever growing market
Imaging is highly valued
The imaging industry stopped
the low cost/high integration
model by increasing the pixel
size and thus the die size

18
MEMS & SENSORS:THE OPTICAL HUB
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF
6
9
IMU
ENVIRONMENTAL
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
An ever growing market
Imaging is highly valued
The imaging industry stopped
the low cost/high integration
model by increasing the pixel
size and thus the die size
Imaging
Bill Of Materials
$10

19
MEMS & SENSORS:THE ENVIRONMENTAL HUB
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF
6
9
IMU
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
Interesting way for the
MEMS industry to gain value:
More integration at
environmental level seems a
good opportunity
Pressure + Microphone
Add Particles & Gas
detection (market pull)

20
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF
6
9
IMU
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
More integration at
good opportunity
Add Particles & Gas
Environmental
Bill Of Materials
$0.70

21
Closed Package Hub
Accelerometer
Gyroscope
Magnetometer
INERTIAL
DOF
6
9
IMU
Open Cavity Hub
Gas / Particle
Pressure
Temp/Humidity
Microphone
OPTICAL
Optical Hub
Visible
3D vision
Multi spectral
3D
Proximity/ambient
More integration at
good opportunity
Add Particles & Gas
Environmental
Bill Of Materials
$1.50
Environmental
Bill Of Materials
$0.70

22
SENSOR HUB vs MCU/AP
A fight to acquire value
Value is in the
software, not
in the
hardware
• Deep access to the functionalities of the sensor
• Low power consumption
• Optimized performance
• They try to add value to their sensors by providing
sensor hub, adding software and promoting use case,
showing the real added-value offer by their sensors
combined with their software.
• High power consumption
• Limited access to sensors
• Players: Qualcomm, Samsung,Apple, etc…
• Application processors and MCU manufacturers try to
override sensor hubs and access the full functionality of
the sensors. It requires allocated resources, maybe not
as optimized as a sensor hub provides
MCU
AP
$30 - 40
Sensor
Hub
Sensor 1
Sensor 2
Sensor #
…
…
A great competition to gather value at a
higher level in the system, because value
is in the software, not in the hardware.
<<$1/sensor
$1 -$2
Value
Sensor
System

23
IOT,WEARABLES … WHERE IS THE NEXT SEMICONDUCTOR WAVE?
Looking for next « Holy Grail » …
What is the
next growth
driver?
0
50
100
150
200
250
300
350
400
450
SEMICONDUCTOR INDUSTRY REVENUE (in bn US$)
Source: WSTS, Cisco, Gartner, Yole
?
IoT?
Wearables?
Likely the next growth
driver will be a mix of
smartphones, IoT,
wearables, cars …

24
$0,0
$0,5
$1,0
$1,5
$2,0
$2,5
$3,0
$3,5
$4,0
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
2000–2020 MEMS ASP decrease
SourceYole Développement
Where can the market absorb this price decrease?
The
smartphone
wave boosted
volume sales
but prices
dropped!
MEMS AVERAGE SELLING PRICE
Smartphone wave
CAGR
-6%
CAGR
-13%

25
IS THE MEMS INDUSTRY DIGGING ITS OWN GRAVE?
The commoditization paradox!
Does it make
sense to further
shrink MEMS
devices by out
passing physics
law requiring
minimal sensor
mass for
detection?
The CIS industry
solved this issue
by increasing
pixel & die size,
thus the price!
SIZE REDUCTION PRICE DROP
SHRINKING MARGINS
INCREASING VOLUMES
(SMART PHONES/WEARABLES)
THE MEMS MARKET
PARADOX: units volume
growth is much higher than
market value
STABLE/DECLINING MARKET IN
US$VALUE
Where is the cursor?

26
LOOKING AT THE CIS INDUSTRY: MOBILE MARKET TREND
Main rear camera & sub front camera roadmap: increased added value for more cost.
The trend is
for more
complexity at
the system
level
Log
Image sensor Resolution
2Mp
4Mp
8Mp
16Mp
20182010 2012 2014 2016
Sub Camera
Resolution VGA-1.2Mp
Pixel size 1.1µm
2020
OIS
Sub Camera
Resolution 5Mp
Pixel size 1.1µm
Sub Camera
Resolution 8Mp
Pixel size 1.2µm
Main Cameras
Resolution 8Mp
Pixel size 1.4µm
OIS
OIS
Main Cameras
Resolution 8Mp-16Mp
Pixel size 1.1µm- 1.5µm
Main Camera
Resolution 16Mp+
Pixel size 1.0-1.6µm
Dual Cameras
Resolution 2x 8Mp
Pixel size 1.1µm+
Size constraints &
Drive for better images &
Features:
→ More pixels
→ Smaller modules
→ Image stabilization (OIS)

27
WHAT CANWE LEARN FROM THE CIS INDUSTRY AND APPLY TO MEMS & SENSORS?
More
integration,
improved
environment
tracking,
sensor fusion
CMOS IMAGE SENSORS
More complexity at the system level: drive for
better images and features
 More pixels
 Smaller modules
 Image stabilization (OIS)
MEMS & Sensors
More complexity at the system level: drive for
better accuracy/precise tracking and features
 Sensor fusion
 More integration: Pressure + Microphone
 Improved environment tracking: Particles &
Gas sensing

28
NEW MEMS CHALLENGES
Power consumption is becoming a major trend
MEMS market
challenges are
evolving
2016, a new virtuous cycle?Yesterday
ASP
decrease
Consumer
volume
Size
decrease
Power
consumption
decrease
Importance
for user case
Sensor fusion,
software &
more features
Mobiles have to survive for long
periods on battery power while
interacting with environment
(voice calls, Wi-Fi, Bluetooth,
GPS, sensors …).
Start with applications, and
work downwards to the chips
needed to support them.
Less silicon, more brain.
• Yesterday, the main MEMS challenges were decrease size, which in turn led to price decrease then volume growth.
• Today, trends are different.They are: importance of user case (start with the definition of an application), fusion of different
sensors with software and power decrease (which paradoxically is linked to a chip size increase because of the ASIC).
Start with more intelligence!

30
CONCLUSIONS & OUTLOOK
From Sensing
to Sensor
fusion to
Actuating
Sensing
Trend is fusion to open new application fields
 More accurate data
 Precise tracking within the environment
 Low Power
Hubs approach and in particular the environmental hub seems a nice opportunity to gain value
 Add particles and gas sensing
 Combine Pressure and Microphone ?
Actuating
Actuators are back and represent big market opportunities
Auto-focus devices
Micro-mirrors
RF switches
…

31
RELATEDYOLE REPORTS
Some slides
from this
presentation
were
extracted
from the
following
reports
Status of the MEMS industry 2016
To be released in Q2 2016
Gas sensors Report 2016
Released in Feb 2016 – More info. here.
Status of the CMOS Image sensor industry
Released in Jan. 2015 – More info. here.

32
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Email: onozawa@yole.fr
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Email eloy@yole.fr
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Email: laferriere@yole.fr
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Gas Sensors, Detection of Particles, 3D Images…: What are the Next opportunities in MEMS? presentation held at Semicon West 2017 from Yole Développement

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