So, you want to save money by using a system-on-a-chip (SoC)? If you're trying to decide between using a wireless SoC or a wireless module, be sure you know the tradeoffs.
Learn more here: http://bit.ly/1RxcupG
This lesson on System-on-Chip was given for the course "Advanced Platform Architectures and Mapping Methods for Embedded Applications" at the KU Leuven and is based on chapter 8 of 'A Practical Introduction to Hardware Software Codesign (Schaumont P.)'
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...Yole Developpement
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony
All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison with previous technology choices from Sony
More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Toyota Prius 4 PCU Power Modules - teardown reverse costing report published ...Yole Developpement
Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing better thermal dissipation, modularity and scalability of the system.
For its latest Prius 4 Toyota has designed a new power control unit (PCU). The PCU has two types of power module, one for the motor inverter and the other for the boost converter and generator inverter.
PCU power module toyota prius 4 system plus consulting
The module integrates Toyota’s latest power card packaging, with double side cooling. It allows the modularity and scalability of the PCU’s inverters to be optimized and also enables better thermal dissipation thanks to the use of copper heatsinks and spacers. The power cards can be placed in parallel to have a single thermal dissipation circuit in a limited space.
This package includes two pairs of wire bonded IGBTs and freewheeling diodes and is plastic molded.
This report offers a deep technical analysis of the module structure, packaging, and of the IGBT and diode die.
Based on a complete teardown analysis, the report also provides an estimation of the production cost of the package, IGBT and diode.
Moreover, the report compares the Prius 4 PCU with the Chevrolet Volt power module, analyzing the technical choices of the packaging and the die. This comparison highlights the huge differences in design and manufacturing process and their impact on device size and production cost.
This lesson on System-on-Chip was given for the course "Advanced Platform Architectures and Mapping Methods for Embedded Applications" at the KU Leuven and is based on chapter 8 of 'A Practical Introduction to Hardware Software Codesign (Schaumont P.)'
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...Yole Developpement
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony
All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison with previous technology choices from Sony
More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Toyota Prius 4 PCU Power Modules - teardown reverse costing report published ...Yole Developpement
Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing better thermal dissipation, modularity and scalability of the system.
For its latest Prius 4 Toyota has designed a new power control unit (PCU). The PCU has two types of power module, one for the motor inverter and the other for the boost converter and generator inverter.
PCU power module toyota prius 4 system plus consulting
The module integrates Toyota’s latest power card packaging, with double side cooling. It allows the modularity and scalability of the PCU’s inverters to be optimized and also enables better thermal dissipation thanks to the use of copper heatsinks and spacers. The power cards can be placed in parallel to have a single thermal dissipation circuit in a limited space.
This package includes two pairs of wire bonded IGBTs and freewheeling diodes and is plastic molded.
This report offers a deep technical analysis of the module structure, packaging, and of the IGBT and diode die.
Based on a complete teardown analysis, the report also provides an estimation of the production cost of the package, IGBT and diode.
Moreover, the report compares the Prius 4 PCU with the Chevrolet Volt power module, analyzing the technical choices of the packaging and the die. This comparison highlights the huge differences in design and manufacturing process and their impact on device size and production cost.
Visit https://www.vlsiuniverse.com/
https://www.vlsiuniverse.com/2020/05/complete-asic-design-flow.html
This is the standard VLSI design flow that every semiconductor company follows. The complete ASIC design flow is explained by considering each and every stage.
Shirt techpack - tài liệu kỹ thuật áo sơ mi nam tay dài
Liên hệ page: https://www.facebook.com/garmentspace/
Garment Space - Diễn Đàn Công Nghệ May Thời Trang
Router 1X3 – RTL Design and VerificationIJERD Editor
Routing is the process of moving a packet of data from source to destination and enables messages
to pass from one computer to another and eventually reach the target machine. A router is a networking device
that forwards data packets between computer networks. It is connected to two or more data lines from different
networks (as opposed to a network switch, which connects data lines from one single network). This paper,
mainly emphasizes upon the study of router device, it‟s top level architecture, and how various sub-modules of
router i.e. Register, FIFO, FSM and Synchronizer are synthesized, and simulated and finally connected to its top
module.
Bài báo cáo môn thiết kế trang phục iii thiết kế đầm nhóm3 [123doc.vn] nguy...TÀI LIỆU NGÀNH MAY
Kho tài liệu: Giá 10k/ 5 lần download -Liên hệ: www.facebook.com/garmentspace Chỉ với 10k THẺ CÀO VIETTEL bạn có ngay 5 lượt download tài liệu bất kỳ do Garment Space upload, hoặc với 100k THẺ CÀO VIETTEL bạn được truy cập kho tài liệu chuyên ngành vô cùng phong phú Liên hệ: www.facebook.com/garmentspace
Functional verification is one of the key bottlenecks in the rapid design of integrated circuits. It is estimated that verification in its entirety accounts for up to 60% of design resources, including duration, computer resources and total personnel. The three primary tools used in logic and functional verification of commercial integrated circuits are simulation (at various levels), emulation at the chip level, and formal verification.
Implementation of 4-bit R-2R DAC on CADENCE Toolsjournal ijrtem
Abstract: An analog audio signal is continuously sampled; quantized and measured the height over time, and then the converted information is stored as series of numbers on the hard disk or in flash memory of an audio player. This series of numbers stored is known as digital audio signal. A compact disc(CD) stores these samples as 16-bit binary (1s and 0s) "words" 44K times a second, but digital audio data can be stored in a different sample rates, word sizes, and encoding or compression formats, and are brought to us on everything from our smartphone to your laptop. But in every case, the final thing that happens is the digital numbers get converted back into an analog electrical signal that can be sent to our headphones. The device that does this conversion is called a digital to analog converter (DAC).In this paper R-2R DAC converter is implemented on CADENCE tools with 180um technology. Keywords—DAC; CD; CADENCE; Technology;
Concepts of knit garments merchandisingSadia Textile
Merchandising denotes all the planned activities to execute and dispatch the merchandise on time taking into consideration the 4 R’s of expediting Right Cost, Right Quantity, Right Quality and Right Time.
Silicon Labs is celebrating its 20th anniversary this year. Over the last two decades we’ve shipped more than 7 billion connected devices for products that are changing lives and transforming industries. We recognize the IoT as more than things; it’s about a world of connections.
Silicon Labs website: http://bit.ly/292MQAV
Visit https://www.vlsiuniverse.com/
https://www.vlsiuniverse.com/2020/05/complete-asic-design-flow.html
This is the standard VLSI design flow that every semiconductor company follows. The complete ASIC design flow is explained by considering each and every stage.
Shirt techpack - tài liệu kỹ thuật áo sơ mi nam tay dài
Liên hệ page: https://www.facebook.com/garmentspace/
Garment Space - Diễn Đàn Công Nghệ May Thời Trang
Router 1X3 – RTL Design and VerificationIJERD Editor
Routing is the process of moving a packet of data from source to destination and enables messages
to pass from one computer to another and eventually reach the target machine. A router is a networking device
that forwards data packets between computer networks. It is connected to two or more data lines from different
networks (as opposed to a network switch, which connects data lines from one single network). This paper,
mainly emphasizes upon the study of router device, it‟s top level architecture, and how various sub-modules of
router i.e. Register, FIFO, FSM and Synchronizer are synthesized, and simulated and finally connected to its top
module.
Bài báo cáo môn thiết kế trang phục iii thiết kế đầm nhóm3 [123doc.vn] nguy...TÀI LIỆU NGÀNH MAY
Kho tài liệu: Giá 10k/ 5 lần download -Liên hệ: www.facebook.com/garmentspace Chỉ với 10k THẺ CÀO VIETTEL bạn có ngay 5 lượt download tài liệu bất kỳ do Garment Space upload, hoặc với 100k THẺ CÀO VIETTEL bạn được truy cập kho tài liệu chuyên ngành vô cùng phong phú Liên hệ: www.facebook.com/garmentspace
Functional verification is one of the key bottlenecks in the rapid design of integrated circuits. It is estimated that verification in its entirety accounts for up to 60% of design resources, including duration, computer resources and total personnel. The three primary tools used in logic and functional verification of commercial integrated circuits are simulation (at various levels), emulation at the chip level, and formal verification.
Implementation of 4-bit R-2R DAC on CADENCE Toolsjournal ijrtem
Abstract: An analog audio signal is continuously sampled; quantized and measured the height over time, and then the converted information is stored as series of numbers on the hard disk or in flash memory of an audio player. This series of numbers stored is known as digital audio signal. A compact disc(CD) stores these samples as 16-bit binary (1s and 0s) "words" 44K times a second, but digital audio data can be stored in a different sample rates, word sizes, and encoding or compression formats, and are brought to us on everything from our smartphone to your laptop. But in every case, the final thing that happens is the digital numbers get converted back into an analog electrical signal that can be sent to our headphones. The device that does this conversion is called a digital to analog converter (DAC).In this paper R-2R DAC converter is implemented on CADENCE tools with 180um technology. Keywords—DAC; CD; CADENCE; Technology;
Concepts of knit garments merchandisingSadia Textile
Merchandising denotes all the planned activities to execute and dispatch the merchandise on time taking into consideration the 4 R’s of expediting Right Cost, Right Quantity, Right Quality and Right Time.
Silicon Labs is celebrating its 20th anniversary this year. Over the last two decades we’ve shipped more than 7 billion connected devices for products that are changing lives and transforming industries. We recognize the IoT as more than things; it’s about a world of connections.
Silicon Labs website: http://bit.ly/292MQAV
Developing Biomedical Devices with BluetoothSilicon Labs
In a connected world, medical applications must be smart, low-power, and secure. Bluetooth’s complementary features and near-universal adoption make it an important and growing technology in the healthcare industry.
In this SlideShare, we’ll examine how Bluetooth is making medicine easier and more efficient in established use cases like blood glucose monitoring and discuss new medical applications that are enabled by this wireless technology.
Watch on-demand webinar: http://bit.ly/2f2xTzc
Applications and Industries Being Powered by Bluetooth Low EnergySilicon Labs
Smartphones have become the center of our personal universe, and the lowest power Radio embedded in each of those phones is Bluetooth with low energy functionality, or BLE.
This has led to an exponential growth in BLE since it’s Introduction. Nearly every company in every industry is trying to find creative ways to connect their products to a Smartphone, and subsequently to the cloud to create additional sources of revenue or cost savings.
We'll cover some of the key applications and industries being powered by Bluetooth.
Quickly introduce Bluetooth connectivity into your applications: http://bit.ly/28NdIP9
We’re at Embedded World this week introducing our new multiprotocol wireless system-on-chip (SoC) devices, bringing simplicity and connectivity to Internet of Things (IoT) applications. Based on our energy-friendly Gecko technology and integrated radio, these Wireless Gecko SoCs aren’t holding anything back and represent the next step in low-power wireless connectivity.
Integrating Speed and Flexibility Isolating Industrial ControlSilicon Labs
We will introduce targeted applications within the Industrial Automation market and focus on Programmable Logic Controllers (PLC) and Factory Automation. We will discuss where isolation is used in a PLC input module and the high level of integration and features of the Si838x, including user programmable de-bounce. We’ll dive into details about the Si838x input thresholds and how to calculate resistor network values to scale any system voltage to be compliant with IEC 61131-2 types 1, 2, and 3.
To watch the full on-demand webinar: http://bit.ly/2fxJXd1
Developing Accessories for the Apple HomeKit EcosystemSilicon Labs
Apple HomeKit is a framework for communicating with and controlling connected home applications. Dozens of devices can be built with HomeKit, but designing these products for the Apple protocol and navigating the approval process can be a daunting process. Learn how Silicon Labs can help dramatically reduce this complexity and mitigate risks.
On-demand webinar: http://bit.ly/2hyikkx
Top Lessons Learned: Industrial Automation Webinar SeriesSilicon Labs
This slideshare includes an overview of what viewers of our Industrial Automation webinar series learned about our Isolation, Bluetooth, and Motor Control-related products.
Greg Fyke, Director of IoT Wireless Products, spoke at ARM TechCon about the benefits and challenges of multi-mode wireless, as well as the types of configurations.
Learn more about Silicon Labs products: http://bit.ly/1QKDOF4
Silicon Labs' Vice President of Software, Skip Ashton, evaluated CPU loading at ARM TechCon.
Abstract: The growth of devices connected to each other and the internet and the growth of wireless and security protocols means these embedded ARM processors are doing more and more processing. While developers and designers have focused on energy efficiency, evaluation of processor loading can also reveal design improvements and power savings.
Learn more about Silicon Labs products: http://bit.ly/1QKDOF4
Six Hidden Costs in a 99 Cent Wireless SoC Considerations when choosing betwe...Pallavi Das
Silicon Labs is the vendor of choice for OEMs developing ZigBee® networking into their products. The Silicon Labs ZigBee platform is the most integrated, complete and feature rich ZigBee solution available — a family of Wireless SoCs, based on ARM® Cortex® processor and 2.4 GHz transceiver, together the most reliable, scalable and advanced ZigBee software and supported by best-in-class development tools.
Selecting wireless module or chip for your next internet of things (iot) projectPallav Aggarwal
When starting a new project where RF connectivity is required like Bluetooth(BLE), WiFi, Zigbee, LoRa, etc. first critical question which comes to an engineer’s mind is whether to use a wireless SoC chip or a ready-made wireless module?
There are various factors which a design engineer or manager should consider before taking a decision in this direction.
Read the article to know details.
Let me know your feedback. If you like it, please share it with your friends.
Building and selecting hardware for connected devices, use case - BLE devicesPavel Stessin
In this talk, we will show the building blocks of connected products, we will discuss the various considerations for selecting the hardware and components. Deeper examples of BLE products will be given.
Physical and cost analysis of the Bose Audio Amplifier found in the Renault Talisman.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/bose-automotive-audio-amplifier/
Not many customers know that we offer full PCB design and layout services here at Epec. Design and layout may not be a full-time employable position, so there are advantages of having your PCB fabricator complete the PCB design for you, not to mention the time needed to accomplish this task. So, rely on Epec to be an extension of your electrical engineering team.
PCB designs can be difficult to manufacture. Working in tandem with your circuit board supplier is beneficial to both you and your supplier. It can save cost, reduce manufacturing challenges and prototyping.
Knowing what is needed for quoting purpose and at the time of your order is key to a smooth process.
In this webinar, we review what is needed in terms of the Bill of Materials and schematic details to accurately quote and deliver the exact PCB design and layout that you require.
For more information on our custom PCB solutions, visit https://www.epectec.com/pcb/
How to use Bluetooth® Smart to control your embedded device with a mobile deviceAnaren, Inc.
This presentation explores the challenges facing OEMs trying to achieve wireless control of their embedded applications via Bluetooth mobile devices -- and several tips for overcoming those challenges. At the session’s conclusion, he will also touch on how Anaren's online development tool (Atmosphere) simplifies the embedded-to-mobile-device code authoring experience.
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...Yole Developpement
Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.
Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.
A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.
More information on that report at http://www.i-micronews.com/reports.html
Prepare Your Products for Successful Wireless Device EMC TestingNorthwest EMC
Ready to bring new wireless products to market? Not without testing. Here, EMC tester Northwest EMC helps you prepare your products for successful wireless device testing.
Get more information about wireless EMC testing at www.nwemc.com
Pavel stessin - building and selecting hardware for connected devicesYael Malki
In this talk, we will show the building blocks of connected products, we will discuss the various considerations for selecting the hardware and components. Deeper examples of BLE products will be given.
Physics of Failure Electronics Reliability Assurance SoftwareCheryl Tulkoff
Reliability Assurance Tool
•This powerful software tool uses the principles of PoF to predict the life of CCAs prior to prototypes being built.
•Optimization of the design layout can now take place early in the design cycle which greatly improves the chances of designing it right the first time.
Develop Secure, Interoperable Smart Home Products with Z-WaveSilicon Labs
Z-Wave is a popular wireless technology for smart home applications with a large ecosystem of interoperable devices, such as smart lighting, energy monitoring, and home security systems. Consumers benefit from Z-Wave’s ease of use and secure interoperability thanks to mandatory product certification and features including SmartStart plug-and-play installation, Security 2 (S2), and backwards compatibility. Adding Z-Wave connectivity to your product is straightforward due to clearly defined software stacks, published device profiles, pre-certified modules, a finished product certification program and development tools that ensure high-quality products get to market fast.
Watch the corresponding webinar here: http://bit.ly/2LpNScj
Benchmarking Bluetooth Mesh, Thread, and Zigbee Network PerformanceSilicon Labs
When it comes to mesh networking wireless connectivity, one size does not fit all. Bluetooth, Thread, and Zigbee protocols each present unique advantages depending on the use case, and it’s important to understand how they perform in the key areas of power consumption, throughput, and scalability. The inner workings of these mesh networking technologies goes beyond a list of key features and Silicon Labs has released the industry’s first comprehensive network performance results based on large-scale, multicast testing of each of these stacks.
We've provided an overview of this benchmarking and share how developers can make more informed choices when designing products for the IoT.
Watch the webinar: http://bit.ly/2Nlic4T
Why the IoT the Needs Upgradable SecuritySilicon Labs
In this webinar, Lars Lydersen, senior director of product security at Silicon Labs, delves into the historical data of how adversary capability has evolved, and discusses how these can be extrapolated into the future. This understanding gives a necessary background to evaluate what security functionality is necessary in an IoT design. Even with advanced security functionality, there will always be unknown unknowns, and it will be necessary to secure against attacks and adversaries of the future. Lars will also discuss the typical properties of an attack that can be thwarted via updates, why enabling software updates is needed, and the consequences for IoT designs.
Watch the complete webinar, here: http://bit.ly/2wyiTDB
Enhance Home and Building Automation with Multiprotocol Wireless ConnectivitySilicon Labs
Smart lighting has experienced notable success in home and building automation thanks to a wide selection of application-specific wireless protocols. During this webinar, we’ll discuss the wireless technologies that best serve smart lighting, homes, and buildings and consider the benefits of enabling simultaneous operation of Zigbee and Bluetooth low energy (LE) on a single device. We’ll also review key considerations related to multiprotocol implementation and outline advanced functionality that can be achieved such as beaconing and smartphone direct control of smart lamps and connected luminaires.
Enjoy this topic as an on-demand webinar, here: http://bit.ly/2sGJufV
5 Clock Tree Design Techniques to Optimize SerDes Performance for Networking ...Silicon Labs
As new designs adopt FPGAs, SoCs, ASICs, and CPUs with higher speed SerDes, it’s becoming increasingly important to understand the impact of reference timing on overall system performance. This deck provides practical guidance on overcoming common timing design challenges by reviewing timing requirements for 10G/25G/40G/56G-based designs, explaining when to use clocks versus oscillators, highlighting system-level factors that degrade signal integrity and reviewing how to budget jitter and/or phase noise margin in order to select an optimal timing solution. This deck also explains how to use common bench equipment and software-based tools to simplify the design-in process.
Watch the complete webinar here: http://bit.ly/2zkBIHb
Extending Bluetooth with Mesh NetworkingSilicon Labs
Mesh networking is a new topology available for Bluetooth Low Energy (LE) devices that enables many-to-many (m:m) communications. It's optimized for creating large-scale node networks and ideally suited for lighting, home automation, and asset tracking. Bluetooth mesh benefits many IoT systems with its ability to reduce system power consumption, extend communication range, increase scalability, improve network reliability, and optimize device-to-device communication responsiveness.
Watch this webinar to learn more about Bluetooth LE mesh networking and how to get started with development.
Watch on-demand webinar: http://bit.ly/2xiactW
Selecting the Right Mesh Technology for Your ApplicationSilicon Labs
Mesh network topologies are ideal for many IoT systems due to their ability to reduce system power consumption, extend communication range, increase scalability, improve network reliability, and optimize communication responsiveness.
A number of mesh networking protocols are commercially available today including Bluetooth Mesh, Thread, and zigbee. There are many applications where mesh networks can provide benefits to the overall system, business, and consumer. Notable applications that can utilize mesh networking include asset tracking, beaconing, home & building automation, lighting, and smart metering.
In this webinar, we compare different mesh networking protocols and discuss the criteria you should consider when selecting the right approach for your design, including the role of solution ecosystems and wireless security.
Watch on-demand webinar: http://bit.ly/2wXuwDr
Bluetooth 5 is the most significant update to the Bluetooth specification since the introduction of Bluetooth low energy. With the launch of Bluetooth 5, the technology continues to evolve to meet the needs of the industry as the global wireless standard for simple, secure connectivity. With 4x range, 2x speed and 8x broadcasting message capacity, the enhancements of Bluetooth 5 focus on increasing the functionality of Bluetooth for the IoT.
Explore the new capabilities of Bluetooth 5 and how to get the most out of it using the new EFR32 Blue Gecko SoCs.
On-demand webinar: http://bit.ly/2t3Szeg
Whitepaper: http://bit.ly/2sLCYAv
EFM32 Zero Gecko Cortex-M0 - the Internet of Things starts hereSilicon Labs
The EFM32 Zero Gecko MCU family is designed to achieve the lowest system energy consumption for a wide range of battery-powered applications. With a 32-bit ARM Cortex-M0+ CPU, the Zero Gecko is suited for mobile health and fitness products, smart watches, activity trackers, smart meters, security systems and wireless sensor nodes, as well as battery-less systems powered by harvested energy.
The new Zero Gecko family is the latest addition to the EFM32 Gecko portfolio pioneered by Energy Micro and includes 16 cost-effective MCU products designed from the ground up to enable the lowest possible energy consumption for connected devices enabling the Internet of Things (IoT).
Explore the innovative world of trenchless pipe repair with our comprehensive guide, "The Benefits and Techniques of Trenchless Pipe Repair." This document delves into the modern methods of repairing underground pipes without the need for extensive excavation, highlighting the numerous advantages and the latest techniques used in the industry.
Learn about the cost savings, reduced environmental impact, and minimal disruption associated with trenchless technology. Discover detailed explanations of popular techniques such as pipe bursting, cured-in-place pipe (CIPP) lining, and directional drilling. Understand how these methods can be applied to various types of infrastructure, from residential plumbing to large-scale municipal systems.
Ideal for homeowners, contractors, engineers, and anyone interested in modern plumbing solutions, this guide provides valuable insights into why trenchless pipe repair is becoming the preferred choice for pipe rehabilitation. Stay informed about the latest advancements and best practices in the field.
Final project report on grocery store management system..pdfKamal Acharya
In today’s fast-changing business environment, it’s extremely important to be able to respond to client needs in the most effective and timely manner. If your customers wish to see your business online and have instant access to your products or services.
Online Grocery Store is an e-commerce website, which retails various grocery products. This project allows viewing various products available enables registered users to purchase desired products instantly using Paytm, UPI payment processor (Instant Pay) and also can place order by using Cash on Delivery (Pay Later) option. This project provides an easy access to Administrators and Managers to view orders placed using Pay Later and Instant Pay options.
In order to develop an e-commerce website, a number of Technologies must be studied and understood. These include multi-tiered architecture, server and client-side scripting techniques, implementation technologies, programming language (such as PHP, HTML, CSS, JavaScript) and MySQL relational databases. This is a project with the objective to develop a basic website where a consumer is provided with a shopping cart website and also to know about the technologies used to develop such a website.
This document will discuss each of the underlying technologies to create and implement an e- commerce website.
Sachpazis:Terzaghi Bearing Capacity Estimation in simple terms with Calculati...Dr.Costas Sachpazis
Terzaghi's soil bearing capacity theory, developed by Karl Terzaghi, is a fundamental principle in geotechnical engineering used to determine the bearing capacity of shallow foundations. This theory provides a method to calculate the ultimate bearing capacity of soil, which is the maximum load per unit area that the soil can support without undergoing shear failure. The Calculation HTML Code included.
Student information management system project report ii.pdfKamal Acharya
Our project explains about the student management. This project mainly explains the various actions related to student details. This project shows some ease in adding, editing and deleting the student details. It also provides a less time consuming process for viewing, adding, editing and deleting the marks of the students.
Saudi Arabia stands as a titan in the global energy landscape, renowned for its abundant oil and gas resources. It's the largest exporter of petroleum and holds some of the world's most significant reserves. Let's delve into the top 10 oil and gas projects shaping Saudi Arabia's energy future in 2024.
NO1 Uk best vashikaran specialist in delhi vashikaran baba near me online vas...Amil Baba Dawood bangali
Contact with Dawood Bhai Just call on +92322-6382012 and we'll help you. We'll solve all your problems within 12 to 24 hours and with 101% guarantee and with astrology systematic. If you want to take any personal or professional advice then also you can call us on +92322-6382012 , ONLINE LOVE PROBLEM & Other all types of Daily Life Problem's.Then CALL or WHATSAPP us on +92322-6382012 and Get all these problems solutions here by Amil Baba DAWOOD BANGALI
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Industrial Training at Shahjalal Fertilizer Company Limited (SFCL)MdTanvirMahtab2
This presentation is about the working procedure of Shahjalal Fertilizer Company Limited (SFCL). A Govt. owned Company of Bangladesh Chemical Industries Corporation under Ministry of Industries.
Immunizing Image Classifiers Against Localized Adversary Attacksgerogepatton
This paper addresses the vulnerability of deep learning models, particularly convolutional neural networks
(CNN)s, to adversarial attacks and presents a proactive training technique designed to counter them. We
introduce a novel volumization algorithm, which transforms 2D images into 3D volumetric representations.
When combined with 3D convolution and deep curriculum learning optimization (CLO), itsignificantly improves
the immunity of models against localized universal attacks by up to 40%. We evaluate our proposed approach
using contemporary CNN architectures and the modified Canadian Institute for Advanced Research (CIFAR-10
and CIFAR-100) and ImageNet Large Scale Visual Recognition Challenge (ILSVRC12) datasets, showcasing
accuracy improvements over previous techniques. The results indicate that the combination of the volumetric
input and curriculum learning holds significant promise for mitigating adversarial attacks without necessitating
adversary training.
Hierarchical Digital Twin of a Naval Power SystemKerry Sado
A hierarchical digital twin of a Naval DC power system has been developed and experimentally verified. Similar to other state-of-the-art digital twins, this technology creates a digital replica of the physical system executed in real-time or faster, which can modify hardware controls. However, its advantage stems from distributing computational efforts by utilizing a hierarchical structure composed of lower-level digital twin blocks and a higher-level system digital twin. Each digital twin block is associated with a physical subsystem of the hardware and communicates with a singular system digital twin, which creates a system-level response. By extracting information from each level of the hierarchy, power system controls of the hardware were reconfigured autonomously. This hierarchical digital twin development offers several advantages over other digital twins, particularly in the field of naval power systems. The hierarchical structure allows for greater computational efficiency and scalability while the ability to autonomously reconfigure hardware controls offers increased flexibility and responsiveness. The hierarchical decomposition and models utilized were well aligned with the physical twin, as indicated by the maximum deviations between the developed digital twin hierarchy and the hardware.
Hybrid optimization of pumped hydro system and solar- Engr. Abdul-Azeez.pdffxintegritypublishin
Advancements in technology unveil a myriad of electrical and electronic breakthroughs geared towards efficiently harnessing limited resources to meet human energy demands. The optimization of hybrid solar PV panels and pumped hydro energy supply systems plays a pivotal role in utilizing natural resources effectively. This initiative not only benefits humanity but also fosters environmental sustainability. The study investigated the design optimization of these hybrid systems, focusing on understanding solar radiation patterns, identifying geographical influences on solar radiation, formulating a mathematical model for system optimization, and determining the optimal configuration of PV panels and pumped hydro storage. Through a comparative analysis approach and eight weeks of data collection, the study addressed key research questions related to solar radiation patterns and optimal system design. The findings highlighted regions with heightened solar radiation levels, showcasing substantial potential for power generation and emphasizing the system's efficiency. Optimizing system design significantly boosted power generation, promoted renewable energy utilization, and enhanced energy storage capacity. The study underscored the benefits of optimizing hybrid solar PV panels and pumped hydro energy supply systems for sustainable energy usage. Optimizing the design of solar PV panels and pumped hydro energy supply systems as examined across diverse climatic conditions in a developing country, not only enhances power generation but also improves the integration of renewable energy sources and boosts energy storage capacities, particularly beneficial for less economically prosperous regions. Additionally, the study provides valuable insights for advancing energy research in economically viable areas. Recommendations included conducting site-specific assessments, utilizing advanced modeling tools, implementing regular maintenance protocols, and enhancing communication among system components.
2. 22
Two options for adding wireless – a module or an SoC
Module vs SoC breakeven analysis
Exploring the six hidden costs of using an SoC
1. RF Engineers
2. Lab equipment and facilities
3. RF design,
4. Regulatory approvals and wireless standard certifications
5. TTM delays
6. Supply management
Moving from one module/wireless standard to another
Moving from a module to an SoC
Appendices
Table of Contents
3. 33
There’s a rush to add wireless connectivity to everything from
thermostats to lawnmowers.
The premise is that a connected device leads to better visibility to
end customer usage and improves customer service.
But not all product designers know how to add wireless functionality.
It generally boils down to two options...
Adding Wireless to Your Product?
Bluetooth low energy ZigBee Thread Wi-Fi
4. 44
Designers can add wireless by putting a wireless SoC directly onto the
product’s printed circuit board (PCB).
SoC = fully-integrated SoC with RF, analog, and digital circuitry, and a
microcontroller (MCU) in an easy-to-use, inexpensive IC
Smaller and cheaper than a wireless module
Lots of unknowns when designing it in
Option 1: Add Wireless with an SoC (System-on-a-Chip)
Bluetooth
SoC
5. 55
Designers can use a wireless module that includes the same wireless
SoC at Option 1, but is a fully characterized system, including RF and
shielding, timing components (crystals), BOM, regulatory approvals,
and standards bodies’ certifications.
Module = Fully certified, qualified, and approved
wireless module including BOM on an individual PCB
Resolves many unknowns of designing
with a wireless SoC
Generally bigger and more expensive
Option 2: Add Wireless with a Module
Bluetooth module
6. 66
HF XTAL
and components
The Bill of Material (BOM) components are roughly the same.
BGM113 Blue Gecko Bluetooth Smart Module
Chip antenna
LC of the
DCDC
Blue Gecko Bluetooth Smart SoC Ref Design
Chip antenna
impedance
matching
LF XTAL
and components
Supply
by-pass caps
DCDC inductor
Supply
decoupling
Antenna connector
Antenna
impedance
matching
HF XTAL
and componentsLF XTAL
and components
BOM Comparison – Roughly Equivalent
7. 77
Lowest possible BOM cost is critical
Product has high annual volumes (+200-300K/year)
You have RF Engineers on staff
You own RF lab equipment and tools
There is ample time for prototypes to optimize antenna
You have experts and/or budget for wireless
standards compliance and testing
You have experts and/or budget for regulatory
approvals
Designers Should Seriously Consider an SoC when…
8. 88
Fast time to market is crucial
There is no appetite for RF design risk on TTM
BOM cost, while important, can be supported by the MSRP
You have limited RF engineering on staff
You have limited RF lab equipment or tools
Product has volumes <150K/year
You have limited experience in wireless
standards compliance and testing
You have limited experience
in regulatory approvals
Designers Should Seriously Consider a Module when…
9. 99
Lowest possible BOM cost is critical
Product has high annual volumes (+200-
300K/year)
You have RF Engineers on staff
You own RF lab equipment and tools
There is ample time for prototypes to
optimize antenna
You have experts and/or budget for
wireless standards compliance and testing
You have experts and/or budget for
regulatory approvals
Fast time to market is crucial
BOM cost, while important, can be
supported by the MSRP
Product has volumes <150K-200K/year
You have limited RF engineering on staff
You have limited RF lab equipment or tools
There is no appetite for RF design risk on
TTM
You have limited experience in wireless
standards compliance and testing
You have limited experience
in regulatory approvals
Module vs. SoC Considerations Table
Consider an SoC When… Consider a Module When…
10. 1010
Lower piece cost
Possibly lower BOM cost
Longer design window
Higher risk to TTM
Certification and regulatory cost
Higher piece cost
Possibly higher BOM cost
Shorter design window
Lower risk to TTM
Pre-certified and regulatory approval
Module vs. SoC Breakeven Analysis
*Silicon Labs’ Press Release Pricing in 2015
Breakeven Point = Volume when using an SoC or Module is equivalent in $GM
Blue Gecko Bluetooth Smart
SoC pricing = $0.99 @ 100KU*
Blue Gecko Bluetooth Smart BMG113
module pricing = $3.07 @ 100KU*
11. 1111
NOPE.
The iPhone 6 has shipped about 200 million units,
and yet iFixit reveals a Wi-Fi module inside.
Why?
Pre-certified w/ standards
Pre-approved w/ gov’ts
Reduced design risk
Removed unknowns
Shortened TTM
With Apple’s Volumes an SoC is Always Right, Right?
iPhone 6 Teardown with Murata Wi-Fi Module
Source - ifixit.com/Teardown/iPhone+6+Teardown/29213
12. 1212
So, what is the easiest and most cost effective way to add wireless?
It’s a complicated answer that can change depending on
the product,
the design team,
the time to market requirements,
the end markets,
the competition, and so on…
Further, the answer can change over time as factors evolve
Let’s examine various cost trade-offs…
Back to the Breakeven Analysis…
13. 1313
Module price includes the BOM cost, SoC does not
Flat $3.07 module pricing between 10K-300K annual volumes
Flat $1.49 SoC + BOM pricing between 10K-300K annual volumes
Flat $0.99 SoC pricing
Flat $0.50 BOM pricing
Gross Margin = $5.12 or 40% above module price
Assumes both SoC and module use this for the sales price
SoC requires 3 months of extra development time due to more
complexity in design, certification and regulatory approvals
Breakeven Assumptions
14. 1414
The “Total” R&D cost is spread over each unit by volume step
50KU/year volume has higher cost per unit allocation than 300KU/year volume
Breakeven Cost Calculations
Cost for a single product Module Costs SoC Costs
Wireless Standards Body Certification (Single) $ - $4,000
Wireless Memberships (Single) $4,000 $4,000
Reg. Approvals (US, IC, EU, Korea, Japan) $5,000 $36,000
Lab Equip or Rental for Development
(3 months for rental at $5K/month for module)
$5,000 $15,000
RF Expertise
(3 months for SoC design and debug)
$ - $20,000
Total $14,000 $79,800
15. 1515
Products with an SoC are $1.58 lower BOM than Module
Products with an SoC make $1.49 more GM$ than Module
Breakeven Margin and Revenue Calculations
100KU
Module Cost (BGM113) $3.07
SoC Total Cost $1.49
SoC Cost (EFR32 32 QFN w/ 256 Flash) $0.99
SoC BOM Cost $0.50
SoC Savings vs. Module $1.58
Product Retail ASP Wireless Premium @ 40% GM on Module Price $5.12
Margin $$ per Module $2.05
Margin $$ per SoC $3.54
Net SoC Net Margin (Margin $$ - Module Margin $$) $1.49
16. 1616
Breakeven is Between 200K and 300K Annually
$(200)
$-
$200
$400
$600
$800
10,000 25,000 50,000 100,000 200,000 300,000
GM$$Thousands
Annual Volumes
Module Net $$GM
SoC Net $$GM
Breakeven
(SoC $$GM - Module $$GM)
Breakeven
Zone
17. 1717
Breakeven analysis is tricky.
Predicting all the factors is nearly impossible.
This is simply one scenario.
Breakeven Spreadsheet
Annual Volumes 1 10,000 25,000 50,000 100,000 200,000 300,000
Total Revenue 5.12$ 51,167$ 127,917$ 255,833$ 511,667$ 1,023,333$ 1,535,000$
Module Dev Costs (14,000)$ (14,000)$ (14,000)$ (14,000)$ (14,000)$ (14,000)$ (14,000)$
Module Costs (3.07)$ (30,700)$ (76,750)$ (153,500)$ (307,000)$ (614,000)$ (921,000)$
Module Net $$GM (13,998)$ 6,467$ 37,167$ 88,333$ 190,667$ 395,333$ 600,000$
SoC Dev Costs (79,800)$ (79,800)$ (79,800)$ (79,800)$ (79,800)$ (79,800)$ (79,800)$
SoC TTM Lost Revenue (1.28)$ (12,792)$ (31,979)$ (63,958)$ (127,917)$ (255,833)$ (383,750)$
SoC + BOM Costs (1.49)$ (14,900)$ (37,250)$ (74,500)$ (149,000)$ (298,000)$ (447,000)$
SoC Net $$GM (79,798)$ (56,325)$ (21,113)$ 37,575$ 154,950$ 389,700$ 624,450$
Breakeven
(SoC $$GM - Module $$GM)
(65,800)$ (62,792)$ (58,279)$ (50,758)$ (35,717)$ (5,633)$ 24,450$
18. 1818
1. RF Engineers – Company needs RF engineers if putting RF on their
PCBs. RF engineers are expensive.
2. Lab Equipment and Facilities – Owning and equipping an RF lab is
expensive and fundamentally required to do RF development.
3. Getting the RF done correctly takes time.
4. Regulatory approvals and wireless standard certifications cost
money and take time.
5. TTM delays reduce revenue and hurt ROI.
6. Once in production, managing supply can be an issue.
Exploring the Six Hidden Costs in Using an SoC
These could be “Six Hidden Benefits of Using a Module”
19. 1919
Overview: Hidden SoC Costs/Hidden Module Benefits
Cost category for a single product Wireless Module Wireless SoC
100K pricing from example above $3.07 each $0.99 each
RF Engineering Low High
Resource and lab equipment costs Low High
Board design effort (antenna, layout,
match, PCB, debug)
Low High
Regulatory certifications costs Low High
Standards certifications costs Low Med
Time to Market (TTM) risks Low High
Supply management risks Low Med
20. 2020
RF Engineers are expensive
Burdened salary = $100-200K/year
(Glassdoor.com)
No two RF designs are the same,
so constant RF expertise is
required
RF performance challenges:
Antenna type, supplier
Optimal trace shape/length
PCB design constraints
PCB fab constraints
RF parasitics
RF impact of housings, batteries,
displays, etc.
Hidden Cost #1: RF Engineering
21. 2121
RF Engineers are expensive
Burdened salary = $100-200K/year
(Glassdoor.com)
No two RF designs are the same,
so constant RF expertise is
required
RF performance challenges:
Antenna type, supplier
Optimal trace shape/length
PCB design constraints
PCB fab constraints
RF parasitics
RF impact of housings, batteries,
displays, etc.
Hidden Cost #1: RF Engineering
Modules are already optimized by the module companies’ RF
experts, eliminating many of the challenges.
22. 2222
SoC suppliers provide application notes (AN) like Silicon Labs’ AN930
to help RF layout.
Antenna ANs Include recommended antennas, traces, board
recommendations, calculations, and matching networks to maximize
performance while minimizing cost and footprint.
However, every design is different, and recommendations are
always—always—hard to implement.
In fact, industry experts will attest that it is very common to follow
an recommendations “exactly” and still have performance issues.
Hidden Cost #1: RF Engineering
23. 2323
SoC suppliers provide application notes (AN) like Silicon Labs AN930
to help RF layout.
Antenna ANs Include recommended antennas, traces, board
recommendations, calculations, and matching networks to maximize
performance while minimizing cost and footprint.
However, every design is different, and recommendations are
always—always—hard to implement.
In fact, industry experts will attest that it is very common to follow
an recommendations “exactly” and still have performance issues.
Hidden Cost #1: RF Engineering
A module’s layout is self-contained. Any RF recommendations
are minimal.
24. 2424
Modules cost more partly because they are already RF-optimized
within a small footprint and with an optimized, low BOM.
The whole “system” can be laid-out and placed in a matter of hours
if not minutes.
Of course, RF is “never always” easy, and there may be surprises.
But in the base case, putting a module on the board is much easier
than putting down an SoC.
See the next pages for a table of some issues that can affect RF
performance.
Hidden Cost #1: RF Engineering
25. 2525
RF Performance Factor Potential RF Impact
Antenna type, supplier
and placement
Antenna placement, type, material composition, manufacturer (and cost)
can change signal gain to the matching network resulting in mismatch
and poor performance.
Antenna trace shape
and length
Minor variations in length and shape can change the expected signal
energy and therefore the recommended matching network.
Board manufacturer Differing distances or insulation material between layers, PCB via
materials, trace widths, screw holes, etc. can have effects.
Component suppliers Different suppliers’ components can behave differently and result in
different performance. This can result when designers use “the ones they
have on the shelf” versus the recommended supplier, or save a few
pennies with a cheaper alternative.
RF Engineering Challenges – Page 1 of 2
Continued…
26. 2626
RF Performance Factor Potential RF Impact
Component types Different component technologies can affect received power and voltage
(e.g., wire-wound capacitors vs. thin-film).
Plastics and screw
location
Screw placement can have coupling effects for both radiated and
received energy.
Battery location Battery location and technology can affect signal power. A charging
battery can also be an unknown player.
Display location Like batteries mentioned above, displays can also create interference on
the antenna.
RF Engineering Challenges – Page 2 of 2
27. 2727
RF engineering and debug requires special equipment, software, and
facilities
Hidden Cost #2: Lab Equipment and Facilities
Lab Equipment Cost to Own Cost to Rent/Day
Calibrated traceable gain horn antenna ~$2,500
Included in a single
day rental at test
facilities.
This is generally
$1,000-3,000/day.
Bi-conical antenna ~$2,000
3D positioner ~$2,000
Spectrum analyzer ~$6,000
Testing software with desired standard and modulation ~$1,500
RF isolated, anechoic room (5m x 5m) ~$20,000
Wireless standard emulator, sniffer, and debug ~$20,000
Estimated Total Outlay ~$54,000
1 - 5 days OR
~$1,000 to ~$15,000
28. 2828
RF engineering and debug requires special equipment, software, and
facilities
Hidden Cost #2: Lab Equipment and Facilities
www.ni.com
Lab Equipment Cost to Own Cost to Rent/Day
Calibrated traceable gain horn antenna ~$2,500
Included in a single
day rental at test
facilities.
This is generally
$1,000-3,000/day.
Bi-conical antenna ~$2,000
3D positioner ~$2,000
Spectrum analyzer ~$6,000
Testing software with desired standard and modulation ~$1,500
RF isolated, anechoic room (5m x 5m) ~$20,000
Wireless standard emulator, sniffer, and debug ~$20,000
Estimated Total Outlay ~$54,000
1 - 5 days OR
~$1,000 to ~$15,000
Modules designs have already been fully tested and qualified in the
module companies’ labs.
Additional testing is always a good idea, but challenges and costs
should be minimal.
29. 2929
Many engineers believe it should be easy to successfully follow an
antenna application note.
But RF antenna layout is often complex, and even the best efforts
require board spins.
Every design is different due to parasitics from the PCB, the ground
plane, the traces, the spacing, the vias, different vendors, etc. …
Hidden Cost #3: PCB Antenna Design and Optimization
Example parasitics
guidelines from a typical
antenna application
note.
30. 3030
Many engineers believe it should be easy to successfully follow an
antenna application note.
But RF antenna layout is often complex, and even the best efforts
require board spins.
Every design is different due to parasitics from the PCB, the ground
plane, the traces, the spacing, the vias, different vendors, etc. …
Hidden Cost #3: PCB Antenna Design and Optimization
Example parasitics
guidelines from a typical
antenna application
note.
Layout for a module requires following a few simple guidelines.
The module is robust to PCB variables.
Testing is always advised, but performance should be acceptable
with the first boards.
31. 3131
All wireless standards require compliance testing
Re-certifications convey with module (products w/ module are grandfathered)
Country approvals are nuanced, with some needing extra work
Hidden Cost #4: Standards and Regulatory Approvals
Certifying Body Estimated
Cost
Module Pre-Certification
Applies (Yes / No)
Wireless SoC Pre-Certification
Applies (Yes / No)
FCC (US) ~$7,900 Yes No
IC (Canada) ~$7,900 Yes No
ETSI / CE
(Europe)
~$7,900
Yes; some limited
testing/re-testing required
No
S. Korea ~$4,500 Yes No
Japan ~$8,600 Yes No
Bluetooth® ~$8,000 Yes; Membership fee required No; Membership fee required
ZigBee® ~$4,000 Yes; Membership fee required No; Membership fee required
32. 3232
All wireless standards require compliance testing
Re-certifications convey with module (products w/ module are grandfathered)
Country approvals are nuanced, with some needing extra work
Hidden Cost #4: Standards and Regulatory Approvals
Certifying Body Estimated
Cost
Module Pre-Certification
Applies (Yes / No)
Wireless SoC Pre-Certification
Applies (Yes / No)
FCC (US) ~$7,900 Yes No
IC (Canada) ~$7,900 Yes No
ETSI / CE
(Europe)
~$7,900
Yes; some limited
testing/re-testing required
No
S. Korea ~$4,500 Yes No
Japan ~$8,600 Yes No
Bluetooth® ~$8,000 Yes; Membership fee required No; Membership fee required
ZigBee® ~$4,000 Yes; Membership fee required No; Membership fee required
End products using pre-certified/pre-approved modules inherit the
module’s approvals and certifications.
Plus, when approvals or certifications change after a product has
already been sent to market, a module’s re-approval and / or re-
certification will likely apply to the end product too.
Products with SoCs on board would likely have to be retested.
33. 3333
Hidden Cost #4: Regulatory Approvals (see appendices)
Appendices provide:
Selected consulting companies for regulatory approval and standards
certifications
Breakout of standards bodies and estimated costs
Breakout of regulatory approvals and estimated costs
34. 3434
Hidden Cost #5: Lost Product Revenue from TTM Delays
Design antenna
& RF matching
circuit(s)
Build &
populate
board(s)
Regulatory &
Standards
testing
Pass?
Tweak BOM
values or
redesign HW
No
Go to
Market
2-6 weeks 2-4 weeks 2-8 weeks
6-18 weeks;
high risk of
rework
1-2 weeks 1-2 weeks
2-4 weeks;
low risk of
rework
SoC Development
Module Development
Yes
35. 3535
Pass?
Hidden Cost #5: Lost Product Revenue from TTM Delays
Design antenna
& RF matching
circuit(s)
Build &
populate
board(s)
Regulatory &
Standards
testing
Tweak BOM
values or
redesign HW
No
Go to
Market
2-6 weeks 2-4 weeks 2-8 weeks
6-18 weeks;
high risk of
rework
1-2 weeks 1-2 weeks
2-4 weeks;
low risk of
rework
SoC Development
Module Development
Yes
Challenges of designing an SoC onto the board can delay a
product’s time to market (TTM).
Modules provide a faster, safer path to market and associated
revenue.
36. 3636
Added challenges of designing an SoC onto the board can delay a
product’s time to market (TTM).
Hidden Cost #5: Lost Product Revenue from TTM Delays
Coming Soon!!Buy Now!!
Annual Volumes 1 10,000 25,000 50,000 100,000 200,000 300,000
Module Revenue
(baseline TTM)
$5.12 $51,167 $127,917 $255,833 $511,667 $1,023,333 $1,535,000
SoC w 3 months
lost TTM =
Rev/12*-3
$(1.28) $(12,792) $(31,979) $(63,958) $(127,917) $(255,833) $(383,750)
Versus
37. 3737
Hidden Cost #5: Lost Product Revenue from TTM Delays
Coming Soon!!Buy Now!!
Annual Volumes 1 10,000 25,000 50,000 100,000 200,000 300,000
Module Revenue
(baseline TTM)
$5.12 $51,167 $127,917 $255,833 $511,667 $1,023,333 $1,535,000
SoC w 3 months
lost TTM =
Rev/12*-3
$(1.28) $(12,792) $(31,979) $(63,958) $(127,917) $(255,833) $(383,750)
Versus
Modules allow customers to buy the product sooner.
38. 3838
Multiple components & vendors
Multiple OPNs / pricing
Multiple lead-times
Variable MOQs
System quality issues post assembly
Compounded yield issues
Smaller customers may face supply
issues
One component & vendor
One OPN / price
One lead time
Single MOQ
System pre-tested and calibrated
Modules delivered with 100% yield
Consolidated module company
demand reduces supply issues
Hidden Cost #6: Supply Management and Assurance
SoC Production Management Module Production Management
39. 3939
Multiple components & vendors
Multiple OPNs / pricing
Multiple lead-times
Variable MOQs
System quality issues post assembly
Compounded yield issues
Smaller customers may face supply
issues
One component & vendor
One OPN / price
One lead time
Single MOQ
System pre-tested and calibrated
Modules delivered with 100% yield
Consolidated module company
demand reduces supply issues
Hidden Cost #6: Supply Management and Assurance
SoC Production Management Module Production Management
Modules are less complex to manage for supply and production.
40. 4040
Overview: Hidden SoC Costs / Hidden Module Benefits
Cost category for a single product Wireless Module Wireless SoC
100K pricing from example above $3.07 each $0.99 each
RF Engineering Low High
Resource and lab equipment costs Low High
Board design effort (antenna, layout,
match, PCB, debug)
Low High
Regulatory certifications costs Low High
Standards certifications costs Low Med
Time to Market (TTM) risks Low High
Supply management risks Low Med
41. 4141
Moving to a new wireless standard
requires design and software rework,
as well as new certifications and
approvals.
Module companies do this
work ahead of time with pin-
compatible, software-compatible,
drop-in module replacements.
New modules come pre-certified and
with regulatory approvals.
Reduces work load and risk…
Transitioning Between Wireless Standards / Revisions
Outdated Bluetooth silicon and standard
Needs to be updated to new
Bluetooth standard.
42. 4242
Moving to a new wireless standard
requires design and software rework,
as well as new certifications and
approvals.
Module companies do this
work ahead of time with pin-
compatible, software-compatible,
drop-in module replacements.
New modules come pre-certified and
with regulatory approvals.
Reduces work load and risk…
Transitioning Between Wireless Standards / Revisions
Pin
compatible
Outdated Bluetooth silicon and standard
New Bluetooth silicon and standard, more
power efficient and lower cost module
Software
compatible
43. 4343
Companies providing both modules
and SoCs make transitioning from
one to the other easier.
Same supplier
Same software
Same support teams and expertise
Same community support
Same silicon and performance
Transitioning from a Module to an SoC
New Bluetooth silicon and standard, more
power efficient and lower cost module
Needs to be migrated to an
SoC solution.
44. 4444
Companies providing both modules
and SoCs make transitioning from
one to the other easier.
Same supplier
Same software
Same support teams and expertise
Same community support
Same silicon and performance
Transitioning from a Module to an SoC
New Bluetooth silicon and standard, more
power efficient and lower cost module
Same
software
Same supplier,
support,
community
Same new Bluetooth silicon and standard,
smaller and lower cost than module
45. 4545
Choosing a wireless module versus SoC is complex.
RF expertise, lab equipment, time to market, volumes, BOM costs, and so on…
Silicon Labs offers market-leading wireless modules and SoCs.
Click below to select your IoT wireless module and/or SoC solution.
Summary
Bluetooth Smart ZigBee Thread Proprietary
47. 4747
Regulatory Approvals and Estimated Costs
Regulatory Body Helpful Links
Estimated
Costs
Module Applies
(Yes/No)
US FCC, Parts 15B and
15C for unlicensed
radios
https://en.wikipedia.org/wiki/Title_47_CFR_Part_15
This page provides an easy-to-read guide.
~$7,900 Yes for Part 15B
Industrie Canada (IC)
http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf01698.html
Guidelines for testing: http://www.ic.gc.ca/eic/site/smt-
gst.nsf/eng/sf01130.html
FCC Part 15 certification applies for IC certifications with
written reports stating cross-country compliance.
~$7,900 Yes
Europe ETSI and CE
Covers Europe, Africa, Middle East and parts of Asia.
http://www.etsi.org/standards/looking-for-an-etsi-
standard/list-of-harmonised-standards
EN 300 328, EN 301 489, and EN 60950 are all important for
unlicensed radios.
~$7,900 Yes
South Korea http://rra.go.kr/eng2/cas/introduction.jsp ~$4,500 Yes
Japan MIC / Telec
http://www.tele.soumu.go.jp/e/sys/equ/tech/
~$8,600 Yes
Sub-GHz / Proprietary
wireless
Generally only require regulatory compliance. Yes
49. 4949
Consulting Firms for Regulatory Approvals and Wireless
Certifications
Consulting Company Link
Northwest EMC http://www.nwemc.com/
TUV
http://www.tuv.com/en/corporate/business_customers/product_testing_3/product_testing.
html
NTS https://www.nts.com/services/certification_services
7Layers http://www.7layers.com/#!/type-approval/
50. 5050
Estimates of Designing Modules vs. SoCs – 1 of 2
Cost Category Module
Cost
Confidence Level (%)?
Comment?
SoC
Cost
Confidence Level (%)? Comment?
Selecting antenna Zero 100% Med 50% – The supplier likely has a list of
recommended antennas. Even so, picking one
with confidence can require careful analysis.
Laying out antenna Low 90% – As an all-in-one
system, a module is hard to
mess up. However, there
may be restraints on
module placement and
“keep-out zones” that
could get messed up. It’s
also likely that the module
package probably includes
shielding to account for
these eventualities and so
the probability of these
issues is really low.
High 90% – Very high likelihood of trial-error-tweak-
repeat cycle. Even highly experienced RF
engineers spend weeks optimizing antennas for
Rx/Tx performance and low BOM cost. This
includes rigorous attention to keep-out zones,
effectively isolated inductive loops, component
selection and placement, etc.… Also likely to
need RF expertise, lab equipment and an RF-
isolated testing environment.
Optimizing antenna
layout
Low High
Reducing interference to
antenna inputs
Low High 90% – Very high likelihood of coupled noise into
RF front end from unanticipated and / or
unintentional radiators.
Reducing interference to
antenna output power
Low Med 50% – Very likely that suboptimal layouts will
degrade output performance; unintentional
interferors will also degrade output power.
Continued…
51. 5151
Estimates of Designing Modules vs. SoCs – 2 of 2
Cost Category Module
Cost
Confidence Level (%)?
Comment?
SoC Cost Confidence Level (%)? Comment?
Pinout complexity Standard Module companies mask SoC
pinout changes by
accommodating them in an
unchanging module footprint.
Standard SoC pinouts may change between alpha and
production silicon. Likewise they may
change with subsequent releases.
Software
complexity
Low / Med 50% – It’s likely that module
companies have an “SoC
abstraction layer” development
software and API. It varies from
supplier to supplier.
Low /
Med
50% – Depending on the SoC company’s
design philosophy, their software APIs may
be super easy or super hard. It varies from
supplier to supplier.
Regulatory
certifications
None / Low 100% – Modules can come pre-
certified for various regions and
wireless standards. There may
be some product-level certs
required that the module
supplier cannot provide, driving
some incremental cost here.
High 100% – Each product must be certified in
each desired regulatory region and for each
supported wireless standard. This is a time
consuming and expensive task, and not
always successful the first time resulting in
“redos.”
Standards
certifications