Toyota Prius 4 PCU Power Modules - teardown reverse costing report published by Yole Developpement

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September 2016 - Version 1 - Written by Elena Barbarini

Toyota Prius 4 Power Module
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
3. Physical Analysis 9
– Synthesis of the Physical Analysis
– Module design
3.1 Generator Inverter 13
3.1.1 Module teardown
– View and dimensions and marking
– Package Opening & Cross-section
3.1.2 IGBT
– Dimension, process
– Cross-section
3.1.3 Diode Analysis
– Cross-section
3.2 Boost Converter & Motor Inverter 55
3.2.1 Module teardown
– View and dimensions and marking
– Package Opening & Cross-section
3.2.2 IGBT
– Cross-section
3.2.3 Diode Analysis
– Cross-section
4. Manufacturing Process Flow 85
– Overview
– IGBT Process Flow & Fabrication unit
– Diode Process Flow & Fabrication unit
– Package Process Flow & fabrication unit
5. Cost & Price Analysis 90
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Yields Explanation
5.1 Cost & price Analysis Generator Inverter 93
– IGBT Wafer Cost & die cost
– Diode Wafer Cost & die cost
– Module Wafer Cost & die cost
– Module price
5.2 Cost & price Analysis Boost converter & motor inverter 113
– IGBT Wafer Cost & die cost
– Diode Wafer Cost & die cost
– Module Wafer Cost & die cost
– Module price
6. Toyota Prius vs Chevrolet Volt Power Module 133
Contact

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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the IGBT power modules integrates in the PCU of the Toyota
Prius 4.
• For its latest Prius 4 Toyota designed a new PCU. The PCU is assembled with two types of power
modules, one for the motor inverter and the other for the boost converter and generator inverter.
• The module integrates the latest packaging of Toyota power card with double side cooling. The
module allows an optimization of the modularity and scalability of the PCU’s inverters and a better
thermal dissipation thanks to the use of copper heatsink and spacers. The power cards can be placed
in parallel to have a single thermal dissipation circuit in a limited space. This package includes two
pairs of IGBT and FWD wire bonded and it is plastic molded.
• The report offers a deep technical analysis of the module structure and packaging and of the IGBT and
diode dies.
• Based on a complete teardown analysis, the report also provides an estimation of the production cost
of the package, IGBT and diode.
• Moreover the report proposes a comparison with the Chevrolet Volt Power module.

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“Toyota’s Challenge of Applying SiC Power Semiconductors to Environmentally Friendly Vehicles and its update” ISiCPEAW 2016

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• Module dimensions: 105 mm x 57 mm
Module marking
IGBT and diode of generator inverter

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Module Overview
Module marking
Pins Pins cross section

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Module: Optical view
Wire bonding
IGBT
Collector plate
Diode

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Module Cross-Section Optical view
Module Cross-Section Optical view

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IGBT Die Overview

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Die Cross-Section – Optical View

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Die Cross-Section – SEM View

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Diode Die Overview

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Diode manufacturing
1 metal layer, backside
Probe test
Dicing
IGBT
Diode
Assembly in package
Final test
Power Module
IGBT manufacturing
1 metal layer, trench, backside
Probe test
Dicing

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• The wafer cost is between $xxx and
$xxxaccording to yield.
• The main part of the wafer cost is due to the
consumables with xxx%. The equipment part
counts for xxxx%.

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• The dies cost is between $xxx and $xx
according to yield.
– Silicon cost accounts for xx% of the cost
for medium yield .
– The probe test, backgrinding and dicing
represent xx% of the cost for medium
yield.
– The scrap cost (xxx% ) is the total of all
the losses during probe test and dicing for
medium yield.

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• The die cost is between $xxx and $xx
according to yield.
– Silicon cost accounts for xx% of the cost.
– The probe test, backgrinding and dicing
represent xx% of the cost.
– The scrap cost (xx% ) is the total of all the
losses during probe test and dicing.

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• The assembled module cost is estimated between $xxx
and $xxx according to yield.
• The dies cost (Silicon cost) accounts for about xxx%.
• The copper cost accounts for xxx% of the cost.
• The added value cost is $xx (x%).

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• The module manufacturer price is estimated between $xxx and $xxx.

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Chevrolet Volt IGBT & Diode
Toyota Prius IGBT & Diode

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• Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the
manufacturing cost (if all parameters are cumulated)
• These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
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Toyota Prius 4 PCU Power Modules - teardown reverse costing report published by Yole Developpement

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Toyota Prius 4 PCU Power Modules - teardown reverse costing report published by Yole Developpement