In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation (such as a NAND gate).
Cell-based methodology – the general class to which standard cells belong – makes it possible for one designer to focus on the high-level (logical function) aspect of digital design, while another designer focuses on the implementation (physical) aspect. Along with semiconductor manufacturing advances, standard-cell methodology has helped designers scale ASICs from comparatively simple single-function ICs (of several thousand gates), to complex multi-million gate system-on-a-chip (SoC) devices.
In the world of Very Large Scale Integration (VLSI), the Physical Design process plays a crucial role in transforming a logical design into a physical layout that can be manufactured. Among the various steps involved in the Physical Design flow, Place and Route (PnR) stand out as a critical phase. PnR consists in placing the different components of a design on a chip and routing the connections between them. In this article, we will delve into the PnR flow, exploring its key steps, challenges, and the tools involved.
1. Partitioning:
Partitioning is a preliminary step in the PnR flow that divides the design into manageable blocks or modules based on functionality, hierarchy, or timing constraints. It enables parallel processing during subsequent steps and facilitates easier placement and routing. Partitioning algorithms aim to balance the workload across partitions and minimize inter-partition communication.
2. Floorplanning:
Floorplanning is a critical aspect of the placement process, defining the overall chip's top-level structure and organizing the different functional blocks. It involves allocating space for each block, determining their relative positions, and defining the placement regions. Effective floorplanning ensures proper utilization of available chip areas, reduces congestion, and facilitates efficient routing.
3. Power Planning:
Power planning focuses on distributing power supply and ensuring a stable power delivery network throughout the chip. It involves inserting power distribution networks, decoupling capacitors, and voltage regulators to minimize voltage drop, signal noise, and power supply fluctuations. Power planning techniques aim to optimize power grid layout, reduce IR drop, and mitigate electromigration issues.
4. Placement:
Placement is the first step in the PnR flow and involves determining the optimal location for each logic component on the chip. The primary objective of placement is to minimize wire length, power consumption, and timing delays while adhering to various constraints such as blockages, power grid, and signal integrity.
5. Clock Tree Synthesis (CTS):
Clock Tree Synthesis is a crucial step in PnR flow that ensures the efficient distribution of clock signals to all sequential elements of the design. CTS aims to minimize clock skew, and power dissipation, and provide a balanced clock network. CTS algorithms construct a tree-like structure by inserting buffers and optimizing wire length to achieve reliable clock distribution.
6. Routing:
6.1 Global Routing:
Once the placement is complete, the next step is global routing, which establishes the connections between the placed components. Global routing generates a coarse routing structure using minimum spanning trees, maze routing, or other algorithms. It focuses on achieving reasonable wirelength and reducing congestion without considering the precise details of the interconnects.
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This is the standard VLSI design flow that every semiconductor company follows. The complete ASIC design flow is explained by considering each and every stage.
A typical design flow follows the below structure and can be broken down into multiple steps. Some of these phases happen in parallel and some in sequentially.
Requirements
A customer of a semiconductor firm is typically some other company who plans to use the chip in its systems or end products. So, the customer's requirements also play an important role in deciding how the chip should be designed.
The first step is to collect the requirements, estimate the end product's market value, and evaluate the number of resources required to do the project.
Specifications
The next step is to collect specifications that describe the functionality, interface abstractly, and over all architecture of the chip to be designed. This can be something along the lines such as:
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Requires computational power to run imaging algorithms to support virtual reality.
Requires two ARM A53 processors with coherent interconnect and should run at 600 MHz.
Requires USB 3.0, Bluetooth, and PCIe 2nd gen interfaces.
It should support 1920x1080 pixel displays with an appropriate controller.
Digital Design
Because of the complex nature of modern chips, it's impossible to build something from scratch, and in many cases, many components will be reused.
For example, company A requires a FlexCAN module to interact with other modules in an automobile. They can either buy the FlexCAN design from another company to save time and effort or spend resources to build one.
It's not practical to design such a system from basic building blocks such as flip-flops and CMOS transistors.
Instead, a behavioral description is developed to analyze the design in terms of functionality, performance, and other high-level issues using a Hardware Description Language such as Verilog or VHDL.
This is usually done by a digital designer and is similar to a high-level computer programmer equipped with digital electronics skills.
Verification
Once the RTL design is ready, it needs to be verified for functional correctness.
For example, a DSP processor is expected to issue bus transactions with fetching instructions from memory and know that this will happen as expected.
The functional verification is required at this point, which is done with EDA simulators' help that can model the design and apply a different stimulus to it. This is the job of a pre-silicon verification engineer.
Logic Synthesis
Now we will convert this design into hardware schematic with real elements such as combinational gates and flip-flops. This step is called synthesis.
Logic synthesis tools enable the conversion of RTL description in HDL to a gate-level netlist. This netlist is a description of the circuit in terms of gates and connections between them.
Logic synthesis tools ensure that the netlist meets timing, area, and power specifications. Typically, they have access to different technology node
In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation (such as a NAND gate).
Cell-based methodology – the general class to which standard cells belong – makes it possible for one designer to focus on the high-level (logical function) aspect of digital design, while another designer focuses on the implementation (physical) aspect. Along with semiconductor manufacturing advances, standard-cell methodology has helped designers scale ASICs from comparatively simple single-function ICs (of several thousand gates), to complex multi-million gate system-on-a-chip (SoC) devices.
In the world of Very Large Scale Integration (VLSI), the Physical Design process plays a crucial role in transforming a logical design into a physical layout that can be manufactured. Among the various steps involved in the Physical Design flow, Place and Route (PnR) stand out as a critical phase. PnR consists in placing the different components of a design on a chip and routing the connections between them. In this article, we will delve into the PnR flow, exploring its key steps, challenges, and the tools involved.
1. Partitioning:
Partitioning is a preliminary step in the PnR flow that divides the design into manageable blocks or modules based on functionality, hierarchy, or timing constraints. It enables parallel processing during subsequent steps and facilitates easier placement and routing. Partitioning algorithms aim to balance the workload across partitions and minimize inter-partition communication.
2. Floorplanning:
Floorplanning is a critical aspect of the placement process, defining the overall chip's top-level structure and organizing the different functional blocks. It involves allocating space for each block, determining their relative positions, and defining the placement regions. Effective floorplanning ensures proper utilization of available chip areas, reduces congestion, and facilitates efficient routing.
3. Power Planning:
Power planning focuses on distributing power supply and ensuring a stable power delivery network throughout the chip. It involves inserting power distribution networks, decoupling capacitors, and voltage regulators to minimize voltage drop, signal noise, and power supply fluctuations. Power planning techniques aim to optimize power grid layout, reduce IR drop, and mitigate electromigration issues.
4. Placement:
Placement is the first step in the PnR flow and involves determining the optimal location for each logic component on the chip. The primary objective of placement is to minimize wire length, power consumption, and timing delays while adhering to various constraints such as blockages, power grid, and signal integrity.
5. Clock Tree Synthesis (CTS):
Clock Tree Synthesis is a crucial step in PnR flow that ensures the efficient distribution of clock signals to all sequential elements of the design. CTS aims to minimize clock skew, and power dissipation, and provide a balanced clock network. CTS algorithms construct a tree-like structure by inserting buffers and optimizing wire length to achieve reliable clock distribution.
6. Routing:
6.1 Global Routing:
Once the placement is complete, the next step is global routing, which establishes the connections between the placed components. Global routing generates a coarse routing structure using minimum spanning trees, maze routing, or other algorithms. It focuses on achieving reasonable wirelength and reducing congestion without considering the precise details of the interconnects.
Visit https://www.vlsiuniverse.com/
https://www.vlsiuniverse.com/2020/05/complete-asic-design-flow.html
This is the standard VLSI design flow that every semiconductor company follows. The complete ASIC design flow is explained by considering each and every stage.
A typical design flow follows the below structure and can be broken down into multiple steps. Some of these phases happen in parallel and some in sequentially.
Requirements
A customer of a semiconductor firm is typically some other company who plans to use the chip in its systems or end products. So, the customer's requirements also play an important role in deciding how the chip should be designed.
The first step is to collect the requirements, estimate the end product's market value, and evaluate the number of resources required to do the project.
Specifications
The next step is to collect specifications that describe the functionality, interface abstractly, and over all architecture of the chip to be designed. This can be something along the lines such as:
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Current TimeÂ
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/
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Requires computational power to run imaging algorithms to support virtual reality.
Requires two ARM A53 processors with coherent interconnect and should run at 600 MHz.
Requires USB 3.0, Bluetooth, and PCIe 2nd gen interfaces.
It should support 1920x1080 pixel displays with an appropriate controller.
Digital Design
Because of the complex nature of modern chips, it's impossible to build something from scratch, and in many cases, many components will be reused.
For example, company A requires a FlexCAN module to interact with other modules in an automobile. They can either buy the FlexCAN design from another company to save time and effort or spend resources to build one.
It's not practical to design such a system from basic building blocks such as flip-flops and CMOS transistors.
Instead, a behavioral description is developed to analyze the design in terms of functionality, performance, and other high-level issues using a Hardware Description Language such as Verilog or VHDL.
This is usually done by a digital designer and is similar to a high-level computer programmer equipped with digital electronics skills.
Verification
Once the RTL design is ready, it needs to be verified for functional correctness.
For example, a DSP processor is expected to issue bus transactions with fetching instructions from memory and know that this will happen as expected.
The functional verification is required at this point, which is done with EDA simulators' help that can model the design and apply a different stimulus to it. This is the job of a pre-silicon verification engineer.
Logic Synthesis
Now we will convert this design into hardware schematic with real elements such as combinational gates and flip-flops. This step is called synthesis.
Logic synthesis tools enable the conversion of RTL description in HDL to a gate-level netlist. This netlist is a description of the circuit in terms of gates and connections between them.
Logic synthesis tools ensure that the netlist meets timing, area, and power specifications. Typically, they have access to different technology node
Physical verification will verify that the post-layout netlist and the layout are equivalent. i.e. all connections specified in the netlist is present in the layout. This article explains physical verification.
In today’s world, there is an ever-increasing demand for SOC speed, performance, and features. To cater to all those needs, the industry is moving toward lower technology nodes. The current market has become more and more demanding, in turn forcing complex architectures and reduced time to market. The complex integrations and smaller design cycle emphasize the importance of floorplanning, i.e., the first step in netlist-to-GDSII design flow. Floorplanning not only captures designer’s intent, but also presents the challenges and opportunities that affect the entire design flow, from design to implementation and chip assembly.
A typical SOC can include many hard- and soft-IP macros, memories, analog blocks, and multiple power domains. Because of the increases in gate count, power domains, power modes, and special architectural requirements, most SOCs these days are hierarchical designs. The SOC interacts with the outside world through sensors, antennas, displays, and other elements, which introduce a lot of analog component in the chip. All of these limitations directly result in various challenges in floorplanning.
Floorplanning includes macro/block placement, design partitioning, pin placement, power planning, and power grid design. What make the job more important is that the decisions taken for macro/block placement, partitioning, I/O-pad placement, and power planning directly or indirectly impact the overall implementation cycle.
Lots of iterations happen to get an optimum floorplan. The designer takes care of the design parameters, such as power, area, timing, and performance during floorplanning. These estimations are repeatedly reviewed, based on the feedback of other stakeholders such as the implementation team, IP owners, and RTL designers. The outcome of floorplanning is a proper arrangement of macros/blocks, power grid, pin placement, and partitioned blocks that can be implemented in parallel.
In hierarchical designs, the quality of the floorplan is analyzed after the blocks are integrated at the top level. That can results in unnecessary iterative work, wasted resource hours, and longer cycle times, which could mean missed market opportunities. This underscores the importance of floorplanning.
In this paper, we will discuss some of the good practices, techniques, and complex cases that arise while floorplanning in an SOC.
The first rule of thumb for floorplanning is to arrange the hard macros and memories in such a manner that you end up with a core area (to be used for SOG placement) square in shape. This is always not possible, however, because of the large number of analog-IP blocks, memories, and various other requirements in design.
As we push through lower technology nodes in the IC and chip design, the wire width goes thinner along with transistor size. This makes the wire resistance more dominant on 16nm and below technology nodes. This increasing resistance and the decreasing width of metal wires introduce many Electromigration and IR drop issues. These two issues play major roles in reducing the lifespan of an electronic device and are the causes of functionality failure in any electronic devices with lower technology nodes.
In this article, we will discuss the problems of electromigration and IR drop, and techniques to prevent the occurrence of these issues in electronic devices.
Electromigration is the gradual displacement of metal atoms in a semiconductor. It occurs when the current density is high enough to cause the drift of metal ions in the direction of the electron flow, and is characterized by the ion flux density. This density depends on the magnitude of forces that tend to hold the ions in place, i.e., the nature of the conductor, crystal size, interface and grain-boundary chemistry, and the magnitude of forces that tend to dislodge them, including the current density, temperature and mechanical stresses.
The Power supply in the chip is distributed uniformly through metal layers (Vdd & Vss) across the design. These metal layers have finite amount of resistance. When voltage is applied to this metal wires current starts flowing through the metal layers and some voltage is dropped due to that resistance of metal wires and current. this drop is called as IR drop.
Routing is an important step in the design of integrated circuits. It involves generating metal wires to connect the pins of same signal while obeying manufacturing design rules. Before routing is performed on the design, cell placement has to be carried out wherein the cells used in the design are placed. But the connections between the pins of the cells pertaining to same signal need to be made. At the time of placement, there are only logical connections between these pins. The physical connections are made by routing. More generally speaking, routing is to locate a set of wires in routing space so as to connect all the nets in the netlist taking into consideration routing channels’ capacities, wire widths and crossings etc. The objective of routing is to minimize total wire length and number of vias and that each net meets its timing budget. The tools that perform routing are termed as routers. You typically provide them with a placed netlist along with list of timing critical nets. These tools, in turn, provide you with the geometry of all the nets in the design.
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel. Crosstalk is usually caused by undesired capacitive, inductive, or conductive coupling from one circuit or channel to another.
Crosstalk is a significant issue in structured cabling, audio electronics, integrated circuit design, wireless communication and other communications systems.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
An application-specific IC (ASIC) can be either a digital or an analog circuit. As their name implies, ASICs are not reconfigurable; they perform only one specific function. For example, a speed controller IC for a remote control car is hard-wired to do one job and could never become a microprocessor. An ASIC does not contain any ability to follow alternate instructions.
Physical verification will verify that the post-layout netlist and the layout are equivalent. i.e. all connections specified in the netlist is present in the layout. This article explains physical verification.
In today’s world, there is an ever-increasing demand for SOC speed, performance, and features. To cater to all those needs, the industry is moving toward lower technology nodes. The current market has become more and more demanding, in turn forcing complex architectures and reduced time to market. The complex integrations and smaller design cycle emphasize the importance of floorplanning, i.e., the first step in netlist-to-GDSII design flow. Floorplanning not only captures designer’s intent, but also presents the challenges and opportunities that affect the entire design flow, from design to implementation and chip assembly.
A typical SOC can include many hard- and soft-IP macros, memories, analog blocks, and multiple power domains. Because of the increases in gate count, power domains, power modes, and special architectural requirements, most SOCs these days are hierarchical designs. The SOC interacts with the outside world through sensors, antennas, displays, and other elements, which introduce a lot of analog component in the chip. All of these limitations directly result in various challenges in floorplanning.
Floorplanning includes macro/block placement, design partitioning, pin placement, power planning, and power grid design. What make the job more important is that the decisions taken for macro/block placement, partitioning, I/O-pad placement, and power planning directly or indirectly impact the overall implementation cycle.
Lots of iterations happen to get an optimum floorplan. The designer takes care of the design parameters, such as power, area, timing, and performance during floorplanning. These estimations are repeatedly reviewed, based on the feedback of other stakeholders such as the implementation team, IP owners, and RTL designers. The outcome of floorplanning is a proper arrangement of macros/blocks, power grid, pin placement, and partitioned blocks that can be implemented in parallel.
In hierarchical designs, the quality of the floorplan is analyzed after the blocks are integrated at the top level. That can results in unnecessary iterative work, wasted resource hours, and longer cycle times, which could mean missed market opportunities. This underscores the importance of floorplanning.
In this paper, we will discuss some of the good practices, techniques, and complex cases that arise while floorplanning in an SOC.
The first rule of thumb for floorplanning is to arrange the hard macros and memories in such a manner that you end up with a core area (to be used for SOG placement) square in shape. This is always not possible, however, because of the large number of analog-IP blocks, memories, and various other requirements in design.
As we push through lower technology nodes in the IC and chip design, the wire width goes thinner along with transistor size. This makes the wire resistance more dominant on 16nm and below technology nodes. This increasing resistance and the decreasing width of metal wires introduce many Electromigration and IR drop issues. These two issues play major roles in reducing the lifespan of an electronic device and are the causes of functionality failure in any electronic devices with lower technology nodes.
In this article, we will discuss the problems of electromigration and IR drop, and techniques to prevent the occurrence of these issues in electronic devices.
Electromigration is the gradual displacement of metal atoms in a semiconductor. It occurs when the current density is high enough to cause the drift of metal ions in the direction of the electron flow, and is characterized by the ion flux density. This density depends on the magnitude of forces that tend to hold the ions in place, i.e., the nature of the conductor, crystal size, interface and grain-boundary chemistry, and the magnitude of forces that tend to dislodge them, including the current density, temperature and mechanical stresses.
The Power supply in the chip is distributed uniformly through metal layers (Vdd & Vss) across the design. These metal layers have finite amount of resistance. When voltage is applied to this metal wires current starts flowing through the metal layers and some voltage is dropped due to that resistance of metal wires and current. this drop is called as IR drop.
Routing is an important step in the design of integrated circuits. It involves generating metal wires to connect the pins of same signal while obeying manufacturing design rules. Before routing is performed on the design, cell placement has to be carried out wherein the cells used in the design are placed. But the connections between the pins of the cells pertaining to same signal need to be made. At the time of placement, there are only logical connections between these pins. The physical connections are made by routing. More generally speaking, routing is to locate a set of wires in routing space so as to connect all the nets in the netlist taking into consideration routing channels’ capacities, wire widths and crossings etc. The objective of routing is to minimize total wire length and number of vias and that each net meets its timing budget. The tools that perform routing are termed as routers. You typically provide them with a placed netlist along with list of timing critical nets. These tools, in turn, provide you with the geometry of all the nets in the design.
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel. Crosstalk is usually caused by undesired capacitive, inductive, or conductive coupling from one circuit or channel to another.
Crosstalk is a significant issue in structured cabling, audio electronics, integrated circuit design, wireless communication and other communications systems.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
An application-specific IC (ASIC) can be either a digital or an analog circuit. As their name implies, ASICs are not reconfigurable; they perform only one specific function. For example, a speed controller IC for a remote control car is hard-wired to do one job and could never become a microprocessor. An ASIC does not contain any ability to follow alternate instructions.
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Software Development Life Cycle (SDLC) is a process used by the software industry to design, develop and test high quality softwares. The SDLC aims to produce a high-quality software that meets or exceeds customer expectations, reaches completion within times and cost estimates.
SDLC is the acronym of Software Development Life Cycle.
It is also called as Software Development Process.
SDLC is a framework defining tasks performed at each step in the software development process.
ISO/IEC 12207 is an international standard for software life-cycle processes. It aims to be the standard that defines all the tasks required for developing and maintaining software.
Choosing architecture in your system is one of the most important things to do and there are many things to consider, like performance, maintenance, configuration and extension of the system. This presentation is about choosing the strategy for your architecture of how to build a measurement system.
Unit 1 INTRODUCTION (COMPUTER AIDED DESIGN AND MANUFACTURING )ravis205084
UNIT I INTRODUCTION 9
Product cycle- Design process- sequential and concurrent engineering- Computer aided design –
CAD system architecture- Computer graphics – co-ordinate systems- 2D and 3D transformationshomogeneous
coordinates
- Line drawing -Clipping- viewing transformation-Brief introduction to CAD
and CAM – Manufacturing Planning, Manufacturing control- Introduction to CAD/CAM –CAD/CAM
concepts ––Types of production - Manufacturing models and Metrics – Mathematical models of
Production Performance
Digital Design Technology and Techniques. The class notes present basic digital logic design abstraction, electronic design process, and CAD tools for digital design.
Overview of the fundamental roles in Hydropower generation and the components involved in wider Electrical Engineering.
This paper presents the design and construction of hydroelectric dams from the hydrologist’s survey of the valley before construction, all aspects and involved disciplines, fluid dynamics, structural engineering, generation and mains frequency regulation to the very transmission of power through the network in the United Kingdom.
Author: Robbie Edward Sayers
Collaborators and co editors: Charlie Sims and Connor Healey.
(C) 2024 Robbie E. Sayers
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Saudi Arabia stands as a titan in the global energy landscape, renowned for its abundant oil and gas resources. It's the largest exporter of petroleum and holds some of the world's most significant reserves. Let's delve into the top 10 oil and gas projects shaping Saudi Arabia's energy future in 2024.
2. AGENDA
• Digital Design Flow
• Basics of Layout
• About Layout Extractor
• Tools used
• Steps to Extract layout
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3. Digital Design Flow
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Design Analysis
Design Specification
Synthesis
Design Implementation using HDL
Simulation
Timing Analysis
Place & Route
Extraction
Verification
Verilog/
VHDL
Library
Std., Cell.
Library
Look up
Table for
timing
Tech file
For layout
values
Tech file
For RC
Parasite
extraction
4. Basics of Layout
• Layout can be very time consuming
– Design gates to fit together nicely
– Build a library of standard cells
– Must follow a technology rule
• Standard cell design methodology
– VDD and GND should abut (standard height)
– Adjacent gates should satisfy design rules
– nMOS at bottom and pMOS at top
– All gates include well and substrate contacts
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5. What Are Layout Extractors??
• Once the layout is made, there always is parasitic
capacitances and resistances associated with the
design.
• This is because of the compact layouts to make the
chips smaller. More you make compact layout more
will it introduce these parasitic components.
• These interferes in the functioning and performance of
the circuit in terms of timing, speed and power
consumption.
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6. Contd…
• Examine the inter-relationship of mask layers
to infer the existence of transistors and other
components
• Related to Design Rule Checkers
– Design-rule Verification
• Some form of layout extraction is usually done
to create data for back annotation
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7. Tools used for Extraction
• FastCap, FastHenry
• Star-RCXT
• QRC
• Calibre xACT3D
etc…
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8. Steps to Extract a Layout
• Create Layout Cellview
• Design Rule Checking
• Layout Parameter Extraction
• Layout vs. Schematic Comparison
5-Jul-14
Courtesy:http://www.egr.msu.edu/classes/ece410/mason/files/TutorialB.pdf
8
9. Step1: Create Layout Cellview
From the schematic, we can draw the layout cellview
From the Library Manager window, Select File => New => Cellview
(Virtuoso is the main layout editor of Cadence design tools)
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10. Step2:Design Rule Checking
• After you have finished your layout, an automatic program will check
each and every polygon in your design against these design rules
and report violations. This process is called Design Rule Checking
(DRC) and MUST be done for every layout to ensure it will function
properly when fabricated.
• After the DRC is complete, the bottom line in the CIW(Command
Interpreter Window) will show “# Total errors found”
• The DRC will be successful when you see the results saying “0 Total
errors found”
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11. Step3: Layout Parameter
Extraction
• mask layout contains only physical data
• Extraction process identifies the devices from the layout and
generates a SPICE-like netlist and other files necessary to complete
the design process
• In the Virtuoso Layout Editing window select Verify => Extract
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Back Annotation: Once a layout has been constructed and there is isomorphism between schematic n/w and layout n/w,
one can correlate extracted capacitances from the layout with the schematic and perform simulation or
timing analysis to verify performance. This is done by moving the capacitance that appears on a layout node
to the corresponding schematic node while accounting for existing capacitance on the schematic node. For
instance, the schematic may already have source-drain and gate load due to gates connected to the node
and only routing capacitance is required to be added. This operation is called “Back-Annotation”.