Course Code: CS-301
Course Title: Introduction to Computing
Degree: BS(SE, CS, BIO)
Chapter Contents:
1. Identify the components of the central processing unit and how they work together and interact with memory
2. Describe how program instructions are executed by the computer
3. Explain how data is represented in the computer
4. Describe how the computer finds instructions and data
5. Describe the components of a microcomputer system unit’s motherboard
6. List the measures of computer processing speed and explain the approaches that increase speed
MODULE III Parallel Processors and Memory Organization 15 Hours
Parallel Processors: Introduction to parallel processors, Concurrent access to memory and cache
coherency. Introduction to multicore architecture. Memory system design: semiconductor memory
technologies, memory organization. Memory interleaving, concept of hierarchical memory
organization, cache memory, cache size vs. block size, mapping functions, replacement
algorithms, write policies.
Case Study: Instruction sets of some common CPUs - Design of a simple hypothetical CPU- A
sequential Y86-64 design-Sun Ultra SPARC II pipeline structure
INTRODUCTION
WHAT IS OSI?
OSI MODEL
TYPES OF LAYERS
PHYSICAL LAYER
DATA LINK LAYER
NETWORK LAYER
TRANSPORT LAYER
SESSION LAYER
PRESENTATION LAYER
APPLICATION LAYER
MODULE III Parallel Processors and Memory Organization 15 Hours
Parallel Processors: Introduction to parallel processors, Concurrent access to memory and cache
coherency. Introduction to multicore architecture. Memory system design: semiconductor memory
technologies, memory organization. Memory interleaving, concept of hierarchical memory
organization, cache memory, cache size vs. block size, mapping functions, replacement
algorithms, write policies.
Case Study: Instruction sets of some common CPUs - Design of a simple hypothetical CPU- A
sequential Y86-64 design-Sun Ultra SPARC II pipeline structure
INTRODUCTION
WHAT IS OSI?
OSI MODEL
TYPES OF LAYERS
PHYSICAL LAYER
DATA LINK LAYER
NETWORK LAYER
TRANSPORT LAYER
SESSION LAYER
PRESENTATION LAYER
APPLICATION LAYER
The control unit (CU) is a component of a computer's central processing unit (CPU) that directs the operation of the processor. It tells the computer's memory, arithmetic/logic unit and input and output devices how to respond to a program's instructions.
Many Networking Software are structured into layers in the same way, TCP/IP is modelled in layers. This layered representation represents the term protocol stack, which refers to the stacked set of rules in the protocol suite. Copy the link given below and paste it in new browser window to get more information on TCP IP Model:- www.transtutors.com/homework-help/computer-science/tcp-ip-model.aspx
Although the OSI reference model is universally recognized, the historical and technical open standard of the Internet is Transmission Control Protocol / Internet Protocol (TCP/IP).
The TCP/IP reference model and the TCP/IP protocol stack make data communication possible between any two computers, anywhere in the world, at nearly the speed of light.
The control unit (CU) is a component of a computer's central processing unit (CPU) that directs the operation of the processor. It tells the computer's memory, arithmetic/logic unit and input and output devices how to respond to a program's instructions.
Many Networking Software are structured into layers in the same way, TCP/IP is modelled in layers. This layered representation represents the term protocol stack, which refers to the stacked set of rules in the protocol suite. Copy the link given below and paste it in new browser window to get more information on TCP IP Model:- www.transtutors.com/homework-help/computer-science/tcp-ip-model.aspx
Although the OSI reference model is universally recognized, the historical and technical open standard of the Internet is Transmission Control Protocol / Internet Protocol (TCP/IP).
The TCP/IP reference model and the TCP/IP protocol stack make data communication possible between any two computers, anywhere in the world, at nearly the speed of light.
I hope You all like it. I hope It is very beneficial for you all. I really thought that you all get enough knowledge from this presentation. This presentation is about materials and their classifications. After you read this presentation you knowledge is not as before.
Introduction to image processing (or signal processing).
Types of Image processing.
Applications of Image processing.
Applications of Digital image processing.
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Features of OOP
Classes in C++
Objects & Creating the Objects
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Subject Title: Engineering Numerical Analysis
Subject Code: ID-302
Contents of this chapter:
Mathematical preliminaries,
Solution of equations in one variable,
Interpolation and polynomial Approximation,
Numerical differentiation and integration,
Initial value problems for ordinary differential equations,
Direct methods for solving linear systems,
Iterative techniques in Matrix algebra,
Solution of non-linear equations.
Approximation theory;
Eigen values and vector;
Course Code: CS-301
Course Title: Introduction to Computing.
Degree: BS (SE, CS, BIO)
Contents of this chapter:
Basic information about computer networks, types of computer networks. Other contents include:
1. List four major benefits of connecting computers to form a network.
2. Define the terms LAN, WAN, and MAN.
3. List the three types of networks.
4. Name the three physical topologies used to build networks.
Course Code: CS-301
Book: Introduction to Computing.
Chapter Number 1: Introduction to Computer Systems.
Degree: BS (SE, CS, BIO)
Contents:
This chapter will cover the following topics:
1.Computer Hardware and Information Technology Infrastructure
2. The Computer System
3. How Computers Represent Data
4. The CPU and Primary Storage
5. Microprocessors and Processing Power
6. Multiple Processors and Parallel Processing
7. Storage Input, and Output Technology
8. Secondary Storage Technology
9. Input and Output Devices
10. Categories of Computers and Computer Systems
11. Computer Software
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This is a presentation by Dada Robert in a Your Skill Boost masterclass organised by the Excellence Foundation for South Sudan (EFSS) on Saturday, the 25th and Sunday, the 26th of May 2024.
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2. Objectives
• Identify the components of the central processing unit
and how they work together and interact with memory
• Describe how program instructions are executed by the
computer
• Explain how data is represented in the computer
• Describe how the computer finds instructions and data
• Describe the components of a microcomputer system
unit’s motherboard
• List the measures of computer processing speed and
explain the approaches that increase speed
3. Contents
• The CPU
• Types of Storage
• Executing Programs
• Finding Data in Memory
• The System Unit
• Microprocessor
• Semiconductor Memory
• Bus Line
• Speed and Power
5. The CPU
• Converts data into information
• Control center
• Set of electronic circuitry that executes stored
program instructions
• Two parts
– Control Unit (CU)
– Arithmetic Logic Unit (ALU)
6. Control Unit
CU
• Part of the hardware that is in-charge
• Directs the computer system to execute
stored program instructions
• Communicates with other parts of the
hardware
7. Arithmetic / Logic Unit
ALU
Performs arithmetic operations
Performs logical operations
11. Types of Storage
• Secondary
– Data that will eventually be used
– Long-term
• Memory
– Data that will be used in the near future
– Temporary
– Faster access than storage
• Registers
– Data immediately related to the operation being executed
– Faster access than memory
12. Measuring Storage Capacity
KB – kilobyte
• 1024 bytes
• Some diskettes
• Cache memory
MB – megabyte
• Million bytes
• RAM
GB – gigabyte
• Billion bytes
• Hard disks
• CDs and DVDs
TB – terabytes
• Trillion bytes
• Large hard disks
14. Main Types of Memory
RAM
Random Access Memory
ROM
Read Only Memory
15. RAM
• Requires current to retain values
• Volatile
• Data and instructions can be read and
modified
• Users typically refer to this type of memory
16. What’s in RAM?
•
•
•
•
Operating System
Program currently running
Data needed by the program
Intermediate results waiting to be output
17. ROM
• Non-volatile
• Instructions for booting the computer
• Data and instructions can be read, but not
modified
• Instructions are typically recorded at factory
18. Executing Programs
• CU gets an instruction and places it in memory
• CU decodes the instruction
• CU notifies the appropriate part of hardware to take
action
• Control is transferred to the appropriate part of
hardware
• Task is performed
• Control is returned to the CU
19. Machine Cycle
I-time
• CU fetches an instruction from memory and puts it
into a register
• CU decodes the instruction and determines the
memory location of the data required
20. Machine Cycle
E-time
• Execution
– CU moves the data from memory to registers in the
ALU
– ALU is given control and executes the instruction
– Control returns to the CU
• CU stores the result of the operation in memory
or in a register
21.
22. System Clock
• System clock produces pulses at a fixed rate
• Each pulse is one Machine Cycle
• One program instruction may actually be several
instructions to the CPU
• Each CPU instruction will take one pulse
• CPU has an instruction set – instructions that it can
understand and process
23. Finding Data in Memory
• Each location in memory has a unique address
– Address never changes
– Contents may change
• Memory location can hold one instruction or piece of data
• Programmers use symbolic names
25. Bits, Bytes, Words
• BIT
– Binary DigIT
– On/off circuit
– 1 or 0
• BYTE
– 8 bits
– Store one alphanumeric character
• WORD
– Size of the register
– Number of BITS that the CPU processes as a unit
26. Coding Schemes
• ASCII
– Uses one 8 bit byte
– 28 = 256 possible combinations or characters
– Virtually all PCs and many larger computers
• EBCDIC
– Uses one 8 bit byte
– 28 =256 possible combinations or characters
– Used primarily on IBM-compatible mainframes
• Unicode
–
–
–
–
Uses two 8 bit bytes (16 bits)
216 = 65,536 possible combinations or characters
Supports characters for all the world’s languages
Downward-compatible with ASCII
27. The System Unit
The Black Box
• Houses electronic components
– Motherboard
– Storage devices
– Connections
• Some Apple Macintosh models have system unit
inside monitor
28. The System Unit
The Black Box
Motherboard
• Microprocessor chip
• Memory chips
• Connections to other parts of
the hardware
• Additional chips may be added
– math coprocessor
29. The System Unit
The Black Box
Storage Devices
Hard drive
Floppy drive
CD-ROM drive
DVD-ROM drive
30. Microprocessor
•
•
•
•
CPU etched on a chip
Chip size is ¼ x ¼ inch
Composed of silicon
Contains millions of transistors
– Electronic switches that can allow current to pass
through
32. Building a Better Microprocessor
• Computers imprint circuitry onto
microchips
– Cheaper
– Faster
• Perform functions of other hardware
– Math coprocessor is now part of
microprocessor
– Multimedia instructions are now part of
microprocessor
33. Building a Better Microprocessor
The more functions that are combined on
a microprocessor:
• The faster the computer runs
• The cheaper it is to make
• The more reliable it is
35. Types of Microprocessors
• PowerPC
– Cooperative efforts of Apple, IBM, and
Motorola
– Used in Apple Macintosh family of PCs
– Found in servers and embedded systems
• Alpha
– Manufactured by Compaq
– High-end servers and workstations
37. Semiconductor Memory
CMOS
• Complementary metal oxide semiconductor
• Uses little electricity
• Used in PC to store hardware settings that are
needed to boot the computer
• Retains information with current from battery
38. RAM
•
•
•
•
•
•
Keeps the instructions and data for current program
Data in memory can be accessed randomly
Easy and speedy access
Volatile
Erased
Written over
39. Types of RAM
SRAM
• Retains contents as long as power is
maintained
• Faster than DRAM
40. Types of RAM
DRAM
• Must be constantly refreshed
• Used for most PC memory because of size and
cost
• SDRAM
– faster type of DRAM
• Rambus DRAM
– Faster than SDRAM
– Expensive
41. Adding RAM
• Purchase memory modules that are packaged on
circuit boards
• SIMMS – Chips on one side
• DIMMS – Chips on both sides
• Maximum amount of RAM that can be installed is
based upon the motherboard design
42. ROM
• Programs and data that are permanently recorded at
the factory
• Read
• Use
• Cannot be changed by the user
• Stores boot routine that is activated when computer
is turned on
• Nonvolatile
44. Bus Line
• Paths that transport electrical signals
• System bus
– Transports data between the CPU and memory
• Bus width
– Number of bits of data that can be carried at a time
– Normally the same as the CPUs word size
• Speed measured in MHz
45. Bus Line
Larger bus width
=
More powerful
computer
CPU can transfer more
data at a time
=
Faster computer
=
More memory
available
CPU can reference
larger memory
addresses
CPU can support a greater number and variety of
instructions
46. Expansion Buses
• Connect the motherboard to expansion slots
• Plug expansion boards into slots
– interface cards
– adapter cards
• Provides for external connectors / ports
– Serial
– Parallel
48. PC Buses and Ports
ISA
Slow-speed devices like mouse, modem
PCI
High-speed devices like hard disks and network cards
AGP
Connects memory and graphics card for faster video
performance
USB
Supports “daisy-chaining” eliminating the need for
multiple expansion cards; hot-swappable
IEEE 1394 High-speed bus connecting video equipment to the
(FireWire) computer
PC Card
Credit card sized PC card devices normally found on
laptops
49. Speed and Power
What makes a computer fast?
•
•
•
•
•
•
Microprocessor speed
Bus line size
Availability of cache
Flash memory
RISC computers
Parallel processing
50. Computer Processing Speed
Time to execute an instruction
• Millisecond
• Microsecond
• Nanosecond
– Modern computers
• Picosecond
– In the future
51. Microprocessor Speed
• Clock speed
– Megahertz (MHz)
– Gigahertz (GHz)
• Number of instructions per second
– Millions of Instructions Per Second (MIPS)
• Performance of complex mathematical operations
– One million floating-point operations per second
(Megaflop )
52. Cache
• Small block of very fast temporary memory
• Speed up data transfer
• Instructions and data used most frequently
or most recently
54. Types of Cache
• Internal cache
– Level 1 (L1)
– Built into microprocessor
– Up to 128KB
• External cache
–
–
–
–
–
–
Level 2 (L2)
Separate chips
256KB or 512 KB
SRAM technology
Cheaper and slower than L1
Faster and more expensive than memory
55. Flash Memory
• Nonvolatile RAM
• Used in
– Cellular phones
– Digital cameras
– Digital music recorders
– PDAs
56. Instruction Sets
• CISC Technology
– Complex Instruction Set Computing
– Conventional computers
– Many of the instructions are not used
• RISC Technology
–
–
–
–
Reduced Instruction Set Computing
Small subset of instructions
Increases speed
Programs with few complex instructions
• Graphics
• Engineering
57. Types of Processing
• Serial processing
– Execute one instruction at a time
– Fetch, decode, execute, store
• Parallel Processing
– Multiple processors used at the same time
– Can perform trillions of floating-point instructions per
second (teraflops)
– Ex: network servers, supercomputers
58. Types of Processing
• Pipelining
– Instruction’s action need not be complete before the
next begins
– Fetch instruction 1, begin to decode and fetch
instruction 2