IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
Performance of high power light emitting diode for various zinc oxide film th...eSAT Journals
Abstract Oxide ceramic materials have attractive features either as filler or substrate materials in electronic packaging. Consequently, ZnO thin film for various thicknesses was prepared over Al substrates by RF sputtering and used as heat sink for high power LED. The thermal transient curve of device under test (DUT) was recorded for five boundary conditions. Rise in junction temperature (TJ) was measured and observed low value (54.4°C) for 200 nm ZnO thin films at 350 mA. The difference in junction temperature rise (ΔTJ) was observed as 7.46 °C at 700 mA when compared to bare Al substrates. The total thermal resistance (Rth-tot) of the DUT was low for 200 nm ZnO thin film coated Al substrates. AFM images were used to evaluate the surface roughness factors and their influence on thermal resistance. As expected, the surface roughness, grain size and peak-valley distance were strongly influenced the heat flow. Index Terms: ZnO thin film, thermal interface material, LED, thermal resistance, surface roughness
Engineering Research Publication
Best International Journals, High Impact Journals,
International Journal of Engineering & Technical Research
ISSN : 2321-0869 (O) 2454-4698 (P)
www.erpublication.org
Heat Transfer Enhancement in a Smart PhoneIJERA Editor
Smart phones are posed with heat transfer problems due to the space and weight limitation and also due to ever increasing processer speed. In this work, heat transfer in a Xiaomi Mi4i smart phone model has been studied using CFD. Studies at various operating conditions like (i) Basic operation, (ii) Usage of all applications, and (iii) Usage of internet have been considered. Certain hot spots have been identified and solutions to reduce temperature have proposed. Also, a scaled up model of the smart phone has been set up to measure the temperature distribution. It has been found that using copper and aluminium heat spreaders with sufficiently sized and numbered heat taps contributes to reduction in temperatures and thereby would be useful in using the mobile phone with lesser discomfort and yield longer life for the electronic components.
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
Performance of high power light emitting diode for various zinc oxide film th...eSAT Journals
Abstract Oxide ceramic materials have attractive features either as filler or substrate materials in electronic packaging. Consequently, ZnO thin film for various thicknesses was prepared over Al substrates by RF sputtering and used as heat sink for high power LED. The thermal transient curve of device under test (DUT) was recorded for five boundary conditions. Rise in junction temperature (TJ) was measured and observed low value (54.4°C) for 200 nm ZnO thin films at 350 mA. The difference in junction temperature rise (ΔTJ) was observed as 7.46 °C at 700 mA when compared to bare Al substrates. The total thermal resistance (Rth-tot) of the DUT was low for 200 nm ZnO thin film coated Al substrates. AFM images were used to evaluate the surface roughness factors and their influence on thermal resistance. As expected, the surface roughness, grain size and peak-valley distance were strongly influenced the heat flow. Index Terms: ZnO thin film, thermal interface material, LED, thermal resistance, surface roughness
Engineering Research Publication
Best International Journals, High Impact Journals,
International Journal of Engineering & Technical Research
ISSN : 2321-0869 (O) 2454-4698 (P)
www.erpublication.org
Heat Transfer Enhancement in a Smart PhoneIJERA Editor
Smart phones are posed with heat transfer problems due to the space and weight limitation and also due to ever increasing processer speed. In this work, heat transfer in a Xiaomi Mi4i smart phone model has been studied using CFD. Studies at various operating conditions like (i) Basic operation, (ii) Usage of all applications, and (iii) Usage of internet have been considered. Certain hot spots have been identified and solutions to reduce temperature have proposed. Also, a scaled up model of the smart phone has been set up to measure the temperature distribution. It has been found that using copper and aluminium heat spreaders with sufficiently sized and numbered heat taps contributes to reduction in temperatures and thereby would be useful in using the mobile phone with lesser discomfort and yield longer life for the electronic components.
Evaluation Performance ofan Annular Composite Fin by UsingMATLAB ProgrammingIJERA Editor
The aim of this project is analysis the efficiency ratio in an annular fin by the variation of heat transfer coefficient for any surface condition by using MATLAB software to calculate the base fin efficiency and the coated fin efficiency by the variation of heat transfer coefficient, radius ratio and base fin thickness of an annular fin and compare the coating fin efficiency to base fin efficiency. If the heat transfer coefficient is 50W/m2K the increase efficiency ratio is 10.46 – 28.02% for zinc coating fin from the literature but the MATLAB result is 9.3 - 25.54% , the gain efficiency ratio at thicker base fin (d=0.001m) is 11.72%, at the thinner base fin (d=0.0002m) is 33.57% from the literature but the MATLAB result is 7.45% (d=0.001m) and 32.14% (d=0.0002m) for zinc coating fin and the gain efficiency ratio at thicker base fin (d=0.001m) is 11.92%, at the thinner base fin (d=0.0002m) is 33.61% from the literature but the MATLAB result is 7.51% (d=0.001m) and 32.16% (d=0.0002m) for zinc alloy coating fin.
Experimental evaluation of performance of electrical discharge machining of d...eSAT Journals
Abstract Electrical discharge machining is the most widely used machining process in industries. Its use is particularly intense when very complex shapes on hard materials with a high dimensional accuracy are required. However the technological capability of the process has limited application when there is a requirement of high surface quality and mirror like characteristics. Its operation is characterized by long machining time, high tool wear and uncertainty in the final finish of the surface. However for finish surface, materials are subjected to mechanical polishing after EDM, which is wastage of time and energy. To improve the efficiency and surface finish of the work piece, the abrasive particles of Aluminum oxide (Al2O3 ) are mixed into the dielectric fluid at tool-work interface. In this Abrasive mixed EDM, the Abrasive mixed dielectric fluid facilitate the bridging effect and minimize the insulating strength of the dielectric fluid. As a result it improves the material removal rate and surface roughness. This paper presents the effect of abrasive on the performance of the EDM process. The results of both the processes have been analyzed using Design of experiments to find the significant parameters and to obtain the optimum parameters required for machining. Analyzed results indicate that abrasive particle size and abrasive concentration and pulse current are the most significant parameters that improve the material removal rate in comparison with traditional EDM. A new experimental setup is developed for experimentation. The result shows that the MRR increases with the abrasive mixed EDM. Keywords: Material removal rate, Abrasive mixed EDM, Dielectric fluid, Design of experiment, Abrasive particle size.
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
International Journal of Engineering Research and Development (IJERD)IJERD Editor
call for paper 2012, hard copy of journal, research paper publishing, where to publish research paper,
journal publishing, how to publish research paper, Call For research paper, international journal, publishing a paper, IJERD, journal of science and technology, how to get a research paper published, publishing a paper, publishing of journal, publishing of research paper, reserach and review articles, IJERD Journal, How to publish your research paper, publish research paper, open access engineering journal, Engineering journal, Mathemetics journal, Physics journal, Chemistry journal, Computer Engineering, Computer Science journal, how to submit your paper, peer reviw journal, indexed journal, reserach and review articles, engineering journal, www.ijerd.com, research journals,
yahoo journals, bing journals, International Journal of Engineering Research and Development, google journals, hard copy of journal
International Journal of Engineering Research and Development (IJERD)IJERD Editor
call for paper 2012, hard copy of journal, research paper publishing, where to publish research paper,
journal publishing, how to publish research paper, Call For research paper, international journal, publishing a paper, IJERD, journal of science and technology, how to get a research paper published, publishing a paper, publishing of journal, publishing of research paper, reserach and review articles, IJERD Journal, How to publish your research paper, publish research paper, open access engineering journal, Engineering journal, Mathemetics journal, Physics journal, Chemistry journal, Computer Engineering, Computer Science journal, how to submit your paper, peer reviw journal, indexed journal, reserach and review articles, engineering journal, www.ijerd.com, research journals,
yahoo journals, bing journals, International Journal of Engineering Research and Development, google journals, hard copy of journal
Environment-Friendly, Self-Sensing Concrete Blended with Byproduct WastesTalalSalem5
Smart structures have attracted significant research attention in the last decade, mainly due
to the capabilities of advanced concrete in electrical resistance-enabled self-sensing. In this study,
we present a type of environment-friendly, self-sensing concrete enabled by electrical resistance.
Environment-friendly, self-sensing concrete was casted with the additions of byproduct wastes
(i.e., coal fly ash (FA), blast furnace slag (BOF) and red mud (RM)) at various volume fractions and
cured using the conditions of 3, 7 and 28 days. The self-sensing concrete samples were experimentally
tested to investigate the eects of the byproduct wastes on the mechanical and electrical properties
(i.e., compressive strength and electrical resistance). In the end, parametric studies were experimentally
conducted to investigate the influences of the byproduct wastes on the mechanical and electrical
properties of the reported environment-friendly, self-sensing concrete.
Dielectric Properties of Compatibilised EPDM/Silicone rubber NanocompositesIJERA Editor
EPDM/Silicone rubber nanocomposites are prepared by incorporating various phr of organically modified montmorillonite (OMMT) nanoclay onto compatibilised and uncompatibilised EPDM/Silicone rubber blends using two roll mill. Compatibilisation of EPDM and Silicone rubber blend is achieved through insitu grafting of silane onto EPDM during mixing of rubbers. Effect of OMMT content and compatibilisation of blend system on electrical, mechanical and thermal properties of the nanocomposites are investigated. The results obtained for various properties indicate that the compatibilised EPDM/Silicone rubber nanocomposites have improved dielectric, mechanical and thermal properties compared to that of uncompatibilised blend nanocomposites. It is observed that, the addition of OMMT upto 5 phr onto both compatibilised and uncompatibilised blends of EPDM/Silicone offers significant improvement in the above mentioned properties. Increasing content of OMMT onto the blends cause marked enhancement in thermal stability of the nanocomposties. Transmission electron micrographs shows the compatibility between EPDM and silicone rubbers in the blend and the exfoliation of OMMT layers in the matrix phase. The present work reveals that the compatibilised EPDM/ Silicone/ OMMT nanocomposite can be a better candidate for high voltage electrical insulation due to its enhanced dielectric, mechanical and themal characteristics.
A NOVEL METHODLOGY FOR THERMAL ANANALYSIS & 3-DIMENSIONAL MEMORY INTEGRATION ijait
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However, recently Moore’s law has come to a stand-still since device scaling beyond
65 nm is not practical. 2D integration has problems like memory latency, power dissipation, and large foot-print. 3D technology comes as a solution to the problems posed by 2D integration. The utilization of 3D is limited by the problem of temperature crisis. It is important to develop an accurate power profile
extraction methodology to design 3D structure. In this paper, design of 3D integration of memory is considered and hence the static power dissipation of the memory cell is analysed in transistor level and is used to accurately model the inter-layer thermal effects for 3D memory stack. Subsequently, packaging
of the chip is considered and modelled using an architecture level simulator. This modelling is intended to analyse the thermal effects of 3D memory, its reliability and lifetime of the chip, with greater accuracy.
IJERA (International journal of Engineering Research and Applications) is International online, ... peer reviewed journal. For more detail or submit your article, please visit www.ijera.com
A Study on Stochastic Thermal Characterization of Electronic PackagesIJERA Editor
Insofar as the electronics can be found now in several applications of multiple domains, we have tried to
highlight in this study that, those systems must be based on unquestionable reliability and meet the needs of the
external environment. Starting from the unit "°c / w" concerning the thermal resistance from the gap between
junction temperature and a reference temperature, we have tried to compare the thermal performance of
electronic packages taking into consideration the thermal management. Our approach is based on the Monte
Carlo simulation and the stochastic characterization of the QFN. From the norm of normalization, we have
obtained standardized data sheets allowing accurate comparisons of the thermal performance of electronic
packages as produced by different manufacturers. Our numerical model through simulation, prototyping
concerning the design involves the JEDEC recommendations, which we consider a very interesting alternative.
Through the deterministic analysis, we conducted an analysis from the Matlab program parameters, which
control the Ansys software, the results were processed by statistical techniques to evaluate the times of the
thermal resistance of the QFN. That is why we must consider the electronic package (encapsulating the
integrated circuit), through the printed circuit board (PCB) to ensure the junction temperature maintenance and
avoid the dissipation of the heat. Also our process was based on the union of the finite element method to the
Monte Carlo simulation and stochastic characterization of the QFN.
Keywords: Electronic package; Finite element method; printed
Enhanced thermal conductivity of epoxy matrix composites filled with boron ni...IAEME Publication
The present paper deals with the estimation of thermal conductivity of epoxy Composites embedded with boron nitride (BN) micro-fillers. These composites with BN content ranging from 0 to 11.3 vol. % have been prepared and the thermal conductivities of the samples are measured experimentally.
Evaluation Performance ofan Annular Composite Fin by UsingMATLAB ProgrammingIJERA Editor
The aim of this project is analysis the efficiency ratio in an annular fin by the variation of heat transfer coefficient for any surface condition by using MATLAB software to calculate the base fin efficiency and the coated fin efficiency by the variation of heat transfer coefficient, radius ratio and base fin thickness of an annular fin and compare the coating fin efficiency to base fin efficiency. If the heat transfer coefficient is 50W/m2K the increase efficiency ratio is 10.46 – 28.02% for zinc coating fin from the literature but the MATLAB result is 9.3 - 25.54% , the gain efficiency ratio at thicker base fin (d=0.001m) is 11.72%, at the thinner base fin (d=0.0002m) is 33.57% from the literature but the MATLAB result is 7.45% (d=0.001m) and 32.14% (d=0.0002m) for zinc coating fin and the gain efficiency ratio at thicker base fin (d=0.001m) is 11.92%, at the thinner base fin (d=0.0002m) is 33.61% from the literature but the MATLAB result is 7.51% (d=0.001m) and 32.16% (d=0.0002m) for zinc alloy coating fin.
Experimental evaluation of performance of electrical discharge machining of d...eSAT Journals
Abstract Electrical discharge machining is the most widely used machining process in industries. Its use is particularly intense when very complex shapes on hard materials with a high dimensional accuracy are required. However the technological capability of the process has limited application when there is a requirement of high surface quality and mirror like characteristics. Its operation is characterized by long machining time, high tool wear and uncertainty in the final finish of the surface. However for finish surface, materials are subjected to mechanical polishing after EDM, which is wastage of time and energy. To improve the efficiency and surface finish of the work piece, the abrasive particles of Aluminum oxide (Al2O3 ) are mixed into the dielectric fluid at tool-work interface. In this Abrasive mixed EDM, the Abrasive mixed dielectric fluid facilitate the bridging effect and minimize the insulating strength of the dielectric fluid. As a result it improves the material removal rate and surface roughness. This paper presents the effect of abrasive on the performance of the EDM process. The results of both the processes have been analyzed using Design of experiments to find the significant parameters and to obtain the optimum parameters required for machining. Analyzed results indicate that abrasive particle size and abrasive concentration and pulse current are the most significant parameters that improve the material removal rate in comparison with traditional EDM. A new experimental setup is developed for experimentation. The result shows that the MRR increases with the abrasive mixed EDM. Keywords: Material removal rate, Abrasive mixed EDM, Dielectric fluid, Design of experiment, Abrasive particle size.
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
International Journal of Engineering Research and Development (IJERD)IJERD Editor
call for paper 2012, hard copy of journal, research paper publishing, where to publish research paper,
journal publishing, how to publish research paper, Call For research paper, international journal, publishing a paper, IJERD, journal of science and technology, how to get a research paper published, publishing a paper, publishing of journal, publishing of research paper, reserach and review articles, IJERD Journal, How to publish your research paper, publish research paper, open access engineering journal, Engineering journal, Mathemetics journal, Physics journal, Chemistry journal, Computer Engineering, Computer Science journal, how to submit your paper, peer reviw journal, indexed journal, reserach and review articles, engineering journal, www.ijerd.com, research journals,
yahoo journals, bing journals, International Journal of Engineering Research and Development, google journals, hard copy of journal
International Journal of Engineering Research and Development (IJERD)IJERD Editor
call for paper 2012, hard copy of journal, research paper publishing, where to publish research paper,
journal publishing, how to publish research paper, Call For research paper, international journal, publishing a paper, IJERD, journal of science and technology, how to get a research paper published, publishing a paper, publishing of journal, publishing of research paper, reserach and review articles, IJERD Journal, How to publish your research paper, publish research paper, open access engineering journal, Engineering journal, Mathemetics journal, Physics journal, Chemistry journal, Computer Engineering, Computer Science journal, how to submit your paper, peer reviw journal, indexed journal, reserach and review articles, engineering journal, www.ijerd.com, research journals,
yahoo journals, bing journals, International Journal of Engineering Research and Development, google journals, hard copy of journal
Environment-Friendly, Self-Sensing Concrete Blended with Byproduct WastesTalalSalem5
Smart structures have attracted significant research attention in the last decade, mainly due
to the capabilities of advanced concrete in electrical resistance-enabled self-sensing. In this study,
we present a type of environment-friendly, self-sensing concrete enabled by electrical resistance.
Environment-friendly, self-sensing concrete was casted with the additions of byproduct wastes
(i.e., coal fly ash (FA), blast furnace slag (BOF) and red mud (RM)) at various volume fractions and
cured using the conditions of 3, 7 and 28 days. The self-sensing concrete samples were experimentally
tested to investigate the eects of the byproduct wastes on the mechanical and electrical properties
(i.e., compressive strength and electrical resistance). In the end, parametric studies were experimentally
conducted to investigate the influences of the byproduct wastes on the mechanical and electrical
properties of the reported environment-friendly, self-sensing concrete.
Dielectric Properties of Compatibilised EPDM/Silicone rubber NanocompositesIJERA Editor
EPDM/Silicone rubber nanocomposites are prepared by incorporating various phr of organically modified montmorillonite (OMMT) nanoclay onto compatibilised and uncompatibilised EPDM/Silicone rubber blends using two roll mill. Compatibilisation of EPDM and Silicone rubber blend is achieved through insitu grafting of silane onto EPDM during mixing of rubbers. Effect of OMMT content and compatibilisation of blend system on electrical, mechanical and thermal properties of the nanocomposites are investigated. The results obtained for various properties indicate that the compatibilised EPDM/Silicone rubber nanocomposites have improved dielectric, mechanical and thermal properties compared to that of uncompatibilised blend nanocomposites. It is observed that, the addition of OMMT upto 5 phr onto both compatibilised and uncompatibilised blends of EPDM/Silicone offers significant improvement in the above mentioned properties. Increasing content of OMMT onto the blends cause marked enhancement in thermal stability of the nanocomposties. Transmission electron micrographs shows the compatibility between EPDM and silicone rubbers in the blend and the exfoliation of OMMT layers in the matrix phase. The present work reveals that the compatibilised EPDM/ Silicone/ OMMT nanocomposite can be a better candidate for high voltage electrical insulation due to its enhanced dielectric, mechanical and themal characteristics.
A NOVEL METHODLOGY FOR THERMAL ANANALYSIS & 3-DIMENSIONAL MEMORY INTEGRATION ijait
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However, recently Moore’s law has come to a stand-still since device scaling beyond
65 nm is not practical. 2D integration has problems like memory latency, power dissipation, and large foot-print. 3D technology comes as a solution to the problems posed by 2D integration. The utilization of 3D is limited by the problem of temperature crisis. It is important to develop an accurate power profile
extraction methodology to design 3D structure. In this paper, design of 3D integration of memory is considered and hence the static power dissipation of the memory cell is analysed in transistor level and is used to accurately model the inter-layer thermal effects for 3D memory stack. Subsequently, packaging
of the chip is considered and modelled using an architecture level simulator. This modelling is intended to analyse the thermal effects of 3D memory, its reliability and lifetime of the chip, with greater accuracy.
IJERA (International journal of Engineering Research and Applications) is International online, ... peer reviewed journal. For more detail or submit your article, please visit www.ijera.com
A Study on Stochastic Thermal Characterization of Electronic PackagesIJERA Editor
Insofar as the electronics can be found now in several applications of multiple domains, we have tried to
highlight in this study that, those systems must be based on unquestionable reliability and meet the needs of the
external environment. Starting from the unit "°c / w" concerning the thermal resistance from the gap between
junction temperature and a reference temperature, we have tried to compare the thermal performance of
electronic packages taking into consideration the thermal management. Our approach is based on the Monte
Carlo simulation and the stochastic characterization of the QFN. From the norm of normalization, we have
obtained standardized data sheets allowing accurate comparisons of the thermal performance of electronic
packages as produced by different manufacturers. Our numerical model through simulation, prototyping
concerning the design involves the JEDEC recommendations, which we consider a very interesting alternative.
Through the deterministic analysis, we conducted an analysis from the Matlab program parameters, which
control the Ansys software, the results were processed by statistical techniques to evaluate the times of the
thermal resistance of the QFN. That is why we must consider the electronic package (encapsulating the
integrated circuit), through the printed circuit board (PCB) to ensure the junction temperature maintenance and
avoid the dissipation of the heat. Also our process was based on the union of the finite element method to the
Monte Carlo simulation and stochastic characterization of the QFN.
Keywords: Electronic package; Finite element method; printed
Enhanced thermal conductivity of epoxy matrix composites filled with boron ni...IAEME Publication
The present paper deals with the estimation of thermal conductivity of epoxy Composites embedded with boron nitride (BN) micro-fillers. These composites with BN content ranging from 0 to 11.3 vol. % have been prepared and the thermal conductivities of the samples are measured experimentally.
A Novel Methodlogy For Thermal Ananalysis & 3-Dimensional Memory Integrationijait
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However, recently Moore’s law has come to a stand-still since device scaling beyond 65 nm is not practical. 2D integration has problems like memory latency, power dissipation, and large foot-print. 3D technology comes as a solution to the problems posed by 2D integration. The utilization of 3D is limited by the problem of temperature crisis. It is important to develop an accurate power profile extraction methodology to design 3D structure. In this paper, design of 3D integration of memory is considered and hence the static power dissipation of the memory cell is analysed in transistor level and is used to accurately model the inter-layer thermal effects for 3D memory stack. Subsequently, packaging of the chip is considered and modelled using an architecture level simulator. This modelling is intended to analyse the thermal effects of 3D memory, its reliability and lifetime of the chip, with greater accuracy
Thermal Stress Analysis of Electro Discharge MachiningIJESFT
Procedures and results of experimental work to find thermal stress analysis in electric discharge machined surfaces are presented. In this study, an axisymmetric thermo-physical FEA model for the simulation of single sparks machining during electrical discharge machining (EDM) process is shown. This model has been solved using ANSYS 14.0 software. A transient thermal analysis assuming a Gaussian distribution heat source with temperature-dependent material properties is used to investigate the stress analysis based on temperature distribution. The effect on significant machining parameters (Gap current – Gap voltage) on aforesaid responses had been investigated and found that the stresses sharply changes with the parameters [1].
The FEA model is used to study the relation between these parameters and maximum temperature attended at the end of cycle which is further used to find residual stress produced at the end of cooling cycle. To find residual stresses in the work piece during EDM, the temperature distribution at the end of pulse duration in the work piece has to be estimated [2]
High residual thermal stresses are developed on the surfaces of electric discharge machined parts because of the high temperature gradients generated at the gap during electrical discharge machining (EDM) in a small heat-affected zone. These thermal stresses can be responsible for micro-cracks, decrease in fatigue life and strength and possibly catastrophic failure. The results of the analysis show high temperature gradient zones and the regions of large stresses where, sometimes, they exceed the material yield strength. A transient thermal analysis assuming a Gaussian distribution heat can be used to investigate the Stress analysis.
THERMAL MODELING AND ANALYSIS OF 3- DIMENSINAL MEMORY INTEGRATION cscpconf
Moore's law describes a long-term trend in the history of computing hardware. The
conventional methods have reached his limits so new fields has to be exploited. Such a concept
is 3-Dimensional integration where the components are arranged in 3D plane. This
arrangement can increase the package density of devices. The successful construction of 3D
memory can lead to a new revolution in designing and manufacturing high performance
microprocessor system on chip. The major problem is the increased temperature effects. It’s
important to develop an accurate power profile extraction methodology to design 3D memory.
The total power dissipation includes static and dynamic component. In this paper the static
power dissipation of the memory cell is analysed and is used to accurately model the inter-layer
thermal effects for 3D memory stack. Then packaging of the chip is considered and modelled
using an architecture level simulator. This modelling is intended to analyse the thermal effects
of 3D memory, its reliability and lifetime of the chip with greater accuracy.
Green energy harvesting aims to supply electricity to electric or electronic systems from an energy source present in the environment (e.g., thermal energy (thermoelectricity)) without grid connection or utilisation of batteries. The possibility of using a thermoelectric (TE) device to capture and to directly convert this waste heat into electric power is a very attractive and valuable approach to improve the overall energy efficiency and, thus, promotes a sustainable future.
THERMAL ANALYSIS OF A HEAT SINK FOR ELECTRONICS COOLINGIAEME Publication
Heat transfer is a discipline of thermal engineering that concern the generation, use, conversion and exchange of thermal energy, heat between physical systems. Heat transfer is classified in to various mechanisms such as heat conduction, convection, thermal radiation & transfer of energy by phase change. Most of the electronic equipment are low power and produce negligible amount of heat in their operation. Some devices, such as power transistors, CPU's, & power diodes produce a significant amount of heat. so sufficient measures are need to be taken so as to prolong their working life and reliability.
Evaluation of the Influence of the Welding Current on the Surface Quality of ...theijes
Welding is a metallurgical process; all aspects of a welding process can be more or less, related to metallurgy of the materials involved in welding,either base metal or electrodes. It is a rapid joining technique extensively used for joining thin assemblies in military and automotive applications. The resistance spot welding process bonds contacting metal surfaces via the heat obtained from resistance to an electrical current flow.Process parameters like welding current, time and pressure are closely controlled to obtain superior weld quality. Welding current is generally considered as a key factor affecting the weld quality. The paper deals with evaluation of welding current as the most important parameter of resistance spot welding on the surface quality of welded steel sheets.Various values of welding current were used in the experiments and consequently the marks of spot welded tips on the welded material surfaces were observed. Hot-dip galvanized steel sheets of H220PD and TRIP RAK 40/70 were used for resistance spot welding.
Student information management system project report ii.pdfKamal Acharya
Our project explains about the student management. This project mainly explains the various actions related to student details. This project shows some ease in adding, editing and deleting the student details. It also provides a less time consuming process for viewing, adding, editing and deleting the marks of the students.
About
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Technical Specifications
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
Key Features
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface
• Compatible with MAFI CCR system
• Copatiable with IDM8000 CCR
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
Application
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
6th International Conference on Machine Learning & Applications (CMLA 2024)ClaraZara1
6th International Conference on Machine Learning & Applications (CMLA 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of on Machine Learning & Applications.
Cosmetic shop management system project report.pdfKamal Acharya
Buying new cosmetic products is difficult. It can even be scary for those who have sensitive skin and are prone to skin trouble. The information needed to alleviate this problem is on the back of each product, but it's thought to interpret those ingredient lists unless you have a background in chemistry.
Instead of buying and hoping for the best, we can use data science to help us predict which products may be good fits for us. It includes various function programs to do the above mentioned tasks.
Data file handling has been effectively used in the program.
The automated cosmetic shop management system should deal with the automation of general workflow and administration process of the shop. The main processes of the system focus on customer's request where the system is able to search the most appropriate products and deliver it to the customers. It should help the employees to quickly identify the list of cosmetic product that have reached the minimum quantity and also keep a track of expired date for each cosmetic product. It should help the employees to find the rack number in which the product is placed.It is also Faster and more efficient way.
Saudi Arabia stands as a titan in the global energy landscape, renowned for its abundant oil and gas resources. It's the largest exporter of petroleum and holds some of the world's most significant reserves. Let's delve into the top 10 oil and gas projects shaping Saudi Arabia's energy future in 2024.
Welcome to WIPAC Monthly the magazine brought to you by the LinkedIn Group Water Industry Process Automation & Control.
In this month's edition, along with this month's industry news to celebrate the 13 years since the group was created we have articles including
A case study of the used of Advanced Process Control at the Wastewater Treatment works at Lleida in Spain
A look back on an article on smart wastewater networks in order to see how the industry has measured up in the interim around the adoption of Digital Transformation in the Water Industry.
CW RADAR, FMCW RADAR, FMCW ALTIMETER, AND THEIR PARAMETERSveerababupersonal22
It consists of cw radar and fmcw radar ,range measurement,if amplifier and fmcw altimeterThe CW radar operates using continuous wave transmission, while the FMCW radar employs frequency-modulated continuous wave technology. Range measurement is a crucial aspect of radar systems, providing information about the distance to a target. The IF amplifier plays a key role in signal processing, amplifying intermediate frequency signals for further analysis. The FMCW altimeter utilizes frequency-modulated continuous wave technology to accurately measure altitude above a reference point.
We have compiled the most important slides from each speaker's presentation. This year’s compilation, available for free, captures the key insights and contributions shared during the DfMAy 2024 conference.
Industrial Training at Shahjalal Fertilizer Company Limited (SFCL)MdTanvirMahtab2
This presentation is about the working procedure of Shahjalal Fertilizer Company Limited (SFCL). A Govt. owned Company of Bangladesh Chemical Industries Corporation under Ministry of Industries.