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The document is a device modeling report that includes SPICE models for the MOSFET and body diode components of the 2SK2414 part from NEC Corporation. It details the model parameters and provides simulation results that are compared to measurement data for various electrical characteristics like transconductance, capacitance, switching time and more. The report demonstrates the accuracy of the simulated models compared to real world testing of the device.
Beyond Boundaries: Leveraging No-Code Solutions for Industry Innovation
MOSFET Modeling Report
1. Device Modeling Report
COMPONENTS: MOSFET (Model Parameters)
PART NUMBER: 2SK2414
MANUFACTURER: NEC Corporation
REMARK: Body Diode (Model Parameters) /
ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
2. MOSFET MODEL
PSpice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Modility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
3. Transconductance Characteristic s
Circuit Simulation Result
100
Measurement
Simulation
TRANSCONDUCTANCE Gfs(s)
10
1
0 5 10 15 20
DRIAN CURRENT ID (A)
Comparison table
gfs(s)
Id(A) Error(%)
Measurement Simulation
1 5.535 5.435 -1.807
2 7.591 7.491 -1.317
5 11.390 11.499 0.961
10 15.385 15.212 -1.120
20 20.665 19.802 -4.176
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
4. Vgs-Id Characteristics
Circuit Simulation Result
100A
10A
1.0A
100mA
0V 1.0V 2.0V 3.0V 4.0V 5.0V 6.0V
I(V2)
V_VGS
Evaluation circuit
Vsense
U1 2SK2414
VDS
10Vdc
VGS
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
5. Comparison Graph
Circuit Simulation Result
100
ID - Drain Current -A
10
1
Measurement
Simulation
0.1
1 2 3 4 5
VGS - Gate to Source Voltage - V
Comparison table
VGS(V)
ID(A) Error (%)
Measurement Simulation
0.1 1.950 1.884 -3.369
0.2 1.980 1.932 -2.424
0.5 2.050 2.028 -1.088
1 2.150 2.137 -0.595
2 2.300 2.295 -0.222
5 2.600 2.618 0.696
10 3.000 2.999 -0.050
20 3.700 3.563 -3.716
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
6. *Rds(on) Characteristic
Circuit Simulation result
5.0A
4.0A
3.0A
2.0A
1.0A
0A
0V 0.2V 0.4V 0.6V 0.8V 1.0V
I(V2)
V_VDD
Evaluation circuit
V2
U1 2SK2414
VDD
VGS 10Vdc
10Vdc
0
0
0
Simulation Result
ID=5.0A, VGS=10V Measurement Simulation Error (%)
R DS (on) 52.00 m 52.00 m 0.00
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
7. Gate Charge Characteristic
Circuit Simulation result
16V
14V
12V
10V
8V
6V
4V
2V
0V
0 5n 10n 15n 20n 25n 30n 35n 40n
V(W1:3)
Time*1.0mA
Evaluation circuit
Vsense
U2
2SK2414
I1
D1
Dbreak 10Adc
W1
+
-
I2 W VD
ION = 0A 48Vdc
IOFF = 1.1mA
0
Simulation Result
VDD=48V,ID=10A,
VGS=10V Measurement Simulation Error (%)
QGS nC 2.60 2.55 -1.92
GGD nC 6.00 6.09 1.50
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
14. Reverse Recovery Characteristic Reference
Trj=60.0(ns)
Trb=70.0(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
15. ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
10mA
9mA
8mA
7mA
6mA
5mA
4mA
3mA
2mA
1mA
0A
0V 10V 20V 30V 40V 50V 60V 70V 80V 90V
I(V2)
V_VGS
Evaluation Circuit
U2
2SK2414
V2
ID 0Adc
VGS
0Vdc
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2007