 Printed Circuit Boards Webinar
Re-Engineering
Obsolete PCB’s
11.22.13
 DELIVERING QUALITY SINCE 1952.
America's Oldest,
A History of Innovation


Privately held company, established in 1952.



Estimated 2013: Sales: US$40 Million



100+ Employees Worldwide
(70 – North America, 30 – Asia, 3 – Europe)



Design and manufacture customized, built-to-print,
performance-critical products for all sectors of the
electronics industry.



Leading provider of printed circuit boards, membrane switches, graphic
overlays, silicone rubber products, electronic heaters, fans, motors and
custom battery packs.



Integrated supply chain management solutions to handle the complexity of
today’s global marketplace while making sure that every order is being
manufactured at the “right” factory.
2
Agenda


Required Business Information



Required Technical Information



Define the Scope of Work



Define any New Features for Product



Case Studies

3
PCB Design Engineering Services


Electrical Engineering



Signal Integrity Analysis



Mechanical Engineering



Library Management



Database Translations



PCB Layout



Re-Engineering

4
Re-Engineering Existing Products


Why Re-Engineer?
–
–
–
–
–



Cost Reduction
Obsolete Components
Obsolete Technology
Standards Compliance
Yield Improvement

Today’s Desired Outcome:
– Help you to better understand what information is required for
quoting the cost of Re-engineering an Existing Product.

5
Required Business Information


Requirement
– You need a proposal for the re-design of an existing product.



What do you need to do?
– Qualify the Return on Investment
• Is there a viable ROI?
– You’ll have to invest into this effort to be efficient & successful.
– Do you have the time and a budget for this work?
– Does the Product Life Expectancy support the ROI?
• IP Ownership?
– Do you actually own the rights to all of the technology you are looking to
re-engineer?

6
Required Business Information


Qualify the ROI (cont.):
– Does the product data include any “reference designs” from a third
party that would gate the effort.

– Does the “reference design” contain “protection” in the
programmable devices designed to prevent direct copying?

– Do you have a functional specification available that defines all
modes of operation. This includes environmental operational and
storage requirements along with agency certifications (UL, FCC,
and others).

7
Required Technical Information


Can you provide the Current Product’s Cost Data?
– The Existing Costed BOM with Manufacture & Manufacturer’s Part
Numbers and Unit Prices.
– The Current Actual Unit Cost Including Assembly Labor.
– Target Cost
– Projected Product Volumes



This data will provide the operational
specifications and cost benchmarks
required for comparing new and
replacement components.

8
Required Technical Information


We’ll need the Existing Product’s Schematic in a .pdf
format or the original schematic archive format.
– Providing the current design data upfront will help to minimize
engineering time.



We will need the Documentation or User Manual that
provides the User Interface Information.



We will need existing product
samples to use for verification
of the actual design.

9
Define the Scope of Work


It is very important to define the Scope of Work upfront.
– This is best achieved in a written Statement of Work (SOW).



Clearly define the Performance Requirements and ReEngineering Objectives.
–
–
–
–
–
–

Cost Reduction?
Obsolescence Abatement?
Functional Improvement?
Consolidation?
Size/Shape Change?
Standards Compliance?
10
Define the Scope of Work


Scope of Work Options
– Investigate possible new technologies that can be implemented to
reduce product cost or improve product performance.

– Verify the desired product life expectancy requirements
(Component Obsolesce).

– Review the existing manufacturing processes required to build the
PCB (fab) and PCBA (assembly). Research alternatives.
• Layer count reductions, single side assembly, consolidations

– Review unit assembly and final assembly manufacturing
processes to identify any potential process improvements.

– Explore logic consolidation opportunities.

11
Define the Scope of Work


Define Any New Product Features
– Identify the new product features / enhancements that are desired
– Are there any physical changes required
– Evaluate packaging improvements



Define Who will Validate/Approve Final Design

12
Key Takeaways


It’s vitally important to qualify the ROI. Quoting
re-engineering projects requires an investment on both the
OEM and the supplier.



Try to determine what the budget is. This will help to avoid
a mismatch.



Try to determine what the life expectancy of the product is.
This will determine if there is a sufficient ROI for the
re-engineering effort.

13
Key Takeaways


It’s important to define the Scope of Work clearly upfront.
Providing a written Statement of Work will help to define
the requirements and improve the chances for an accurate
proposal and lessen the potential for scope creep.



Once we have an SOW and have reviewed the customer
supplied data, we would recommend a scheduling
conference call to confirm our understanding of the Scope
of Work and address any issues.

14
Key Takeaways


You need to understand that you will be part of the
Re-engineering process. There are key elements of the
existing product and re-engineering that only you can
answer.



Your support is a key component the projects efficiency,
cost-effectiveness and successful.



The quality of the customer supplied data important to
providing an accurate cost estimate.

15
Case Study #1


16 Port, 2 Gigabit Fiber Channel Switch
– 16” x 9”, 16 layer PCB
– Intel P3 Processor
– 696 pin BGAs
– Controlled Impedance
– 155 MHZ Differential Pair Buses
– 2G Differential Pair signals
– Fault tolerant system
– Hot Swap power supplies
– 1867 Components/2400 Nets



Deliverables
– Logic Design
– Consolidated 2 PCBAs into 1
– PCB Layout
– Mechanical Design (sheet metal chassis)
– Thermal Analysis
– Signal Integrity analysis

16
Case Study #2


Design Cost Reduction & Logic Consolidation
Multiservice Access Platform (MAP)
Customer’s existing product was in need
of redesign for cost reduction and
component obsolescence.
–Engineering team Provided:
• Logic Design
• Converted 5V circuitry to 3.3V
• Converted PTH components to SMT
• FPGA Design and Simulation
• Consolidated logic functions
• Reduced component count
• Design For Supply Chain BOM analysis
–PCB Layout
• Physical Layout of the PCBA for DFM/DFT
• Converted from Double to Single sided PCB
–Verification Test
• Functionality verification with existing products
• Customer performed product validation
17
Case Study #3


Design Cost Reduction and Logic Consolidation



ATE Platform
– 14 PCBAs that required PTH to SMT
conversion Logic consolidation into
FPGAs
– Customer acquired existing product
from another OEM
• Did not have complete documentation
• Did not have engineers with product
knowledge
• Require Engineering team to be very
resourceful

18
Case Study #4



Before:
– Motherboard with 2 daughter
assemblies
– PTH components
– 8 I/O channels
– 6U Assembly



After:
– Single Assembly
– SMT components except Backplane
connectors are press fit, FPGA
Used for logic consolidation
– 16 I/O channels
– Maintained 6U form factor

19
Our Products

Battery Packs

Flex & Rigid-Flex PCB’s

User Interfaces

Fans & Motors

Cable Assemblies

Printed Circuit Boards

20
Design Centers & Technical Support









Battery Pack & Power Management – Denver, CO
User Interfaces – Largo, FL
Fans & Motors – Wales, UK
PCB’s – New Bedford, MA & Shenzhen, China
Flex & Rigid Flex – Toronto, Canada
Cable Assemblies – New Bedford, MA

Our Engineering and Design teams are ready to help
our customers create world class and cost effective
product solutions.
21
Q&A


Questions?
– Enter any questions you may have
in the Control Panel.

– If we don’t have time to get to it, we
will reply via email.

22
Thank You
Check out our previous webinars at www.epectec.com.

Stay Connected with Epec Engineered Technologies
Follow us on our social media sites for continuous technical updates and information:

23

Re-Engineering Obsolete Printed Circuit Boards Webinar

  • 1.
     Printed CircuitBoards Webinar Re-Engineering Obsolete PCB’s 11.22.13  DELIVERING QUALITY SINCE 1952.
  • 2.
    America's Oldest, A Historyof Innovation  Privately held company, established in 1952.  Estimated 2013: Sales: US$40 Million  100+ Employees Worldwide (70 – North America, 30 – Asia, 3 – Europe)  Design and manufacture customized, built-to-print, performance-critical products for all sectors of the electronics industry.  Leading provider of printed circuit boards, membrane switches, graphic overlays, silicone rubber products, electronic heaters, fans, motors and custom battery packs.  Integrated supply chain management solutions to handle the complexity of today’s global marketplace while making sure that every order is being manufactured at the “right” factory. 2
  • 3.
    Agenda  Required Business Information  RequiredTechnical Information  Define the Scope of Work  Define any New Features for Product  Case Studies 3
  • 4.
    PCB Design EngineeringServices  Electrical Engineering  Signal Integrity Analysis  Mechanical Engineering  Library Management  Database Translations  PCB Layout  Re-Engineering 4
  • 5.
    Re-Engineering Existing Products  WhyRe-Engineer? – – – – –  Cost Reduction Obsolete Components Obsolete Technology Standards Compliance Yield Improvement Today’s Desired Outcome: – Help you to better understand what information is required for quoting the cost of Re-engineering an Existing Product. 5
  • 6.
    Required Business Information  Requirement –You need a proposal for the re-design of an existing product.  What do you need to do? – Qualify the Return on Investment • Is there a viable ROI? – You’ll have to invest into this effort to be efficient & successful. – Do you have the time and a budget for this work? – Does the Product Life Expectancy support the ROI? • IP Ownership? – Do you actually own the rights to all of the technology you are looking to re-engineer? 6
  • 7.
    Required Business Information  Qualifythe ROI (cont.): – Does the product data include any “reference designs” from a third party that would gate the effort. – Does the “reference design” contain “protection” in the programmable devices designed to prevent direct copying? – Do you have a functional specification available that defines all modes of operation. This includes environmental operational and storage requirements along with agency certifications (UL, FCC, and others). 7
  • 8.
    Required Technical Information  Canyou provide the Current Product’s Cost Data? – The Existing Costed BOM with Manufacture & Manufacturer’s Part Numbers and Unit Prices. – The Current Actual Unit Cost Including Assembly Labor. – Target Cost – Projected Product Volumes  This data will provide the operational specifications and cost benchmarks required for comparing new and replacement components. 8
  • 9.
    Required Technical Information  We’llneed the Existing Product’s Schematic in a .pdf format or the original schematic archive format. – Providing the current design data upfront will help to minimize engineering time.  We will need the Documentation or User Manual that provides the User Interface Information.  We will need existing product samples to use for verification of the actual design. 9
  • 10.
    Define the Scopeof Work  It is very important to define the Scope of Work upfront. – This is best achieved in a written Statement of Work (SOW).  Clearly define the Performance Requirements and ReEngineering Objectives. – – – – – – Cost Reduction? Obsolescence Abatement? Functional Improvement? Consolidation? Size/Shape Change? Standards Compliance? 10
  • 11.
    Define the Scopeof Work  Scope of Work Options – Investigate possible new technologies that can be implemented to reduce product cost or improve product performance. – Verify the desired product life expectancy requirements (Component Obsolesce). – Review the existing manufacturing processes required to build the PCB (fab) and PCBA (assembly). Research alternatives. • Layer count reductions, single side assembly, consolidations – Review unit assembly and final assembly manufacturing processes to identify any potential process improvements. – Explore logic consolidation opportunities. 11
  • 12.
    Define the Scopeof Work  Define Any New Product Features – Identify the new product features / enhancements that are desired – Are there any physical changes required – Evaluate packaging improvements  Define Who will Validate/Approve Final Design 12
  • 13.
    Key Takeaways  It’s vitallyimportant to qualify the ROI. Quoting re-engineering projects requires an investment on both the OEM and the supplier.  Try to determine what the budget is. This will help to avoid a mismatch.  Try to determine what the life expectancy of the product is. This will determine if there is a sufficient ROI for the re-engineering effort. 13
  • 14.
    Key Takeaways  It’s importantto define the Scope of Work clearly upfront. Providing a written Statement of Work will help to define the requirements and improve the chances for an accurate proposal and lessen the potential for scope creep.  Once we have an SOW and have reviewed the customer supplied data, we would recommend a scheduling conference call to confirm our understanding of the Scope of Work and address any issues. 14
  • 15.
    Key Takeaways  You needto understand that you will be part of the Re-engineering process. There are key elements of the existing product and re-engineering that only you can answer.  Your support is a key component the projects efficiency, cost-effectiveness and successful.  The quality of the customer supplied data important to providing an accurate cost estimate. 15
  • 16.
    Case Study #1  16Port, 2 Gigabit Fiber Channel Switch – 16” x 9”, 16 layer PCB – Intel P3 Processor – 696 pin BGAs – Controlled Impedance – 155 MHZ Differential Pair Buses – 2G Differential Pair signals – Fault tolerant system – Hot Swap power supplies – 1867 Components/2400 Nets  Deliverables – Logic Design – Consolidated 2 PCBAs into 1 – PCB Layout – Mechanical Design (sheet metal chassis) – Thermal Analysis – Signal Integrity analysis 16
  • 17.
    Case Study #2  DesignCost Reduction & Logic Consolidation Multiservice Access Platform (MAP) Customer’s existing product was in need of redesign for cost reduction and component obsolescence. –Engineering team Provided: • Logic Design • Converted 5V circuitry to 3.3V • Converted PTH components to SMT • FPGA Design and Simulation • Consolidated logic functions • Reduced component count • Design For Supply Chain BOM analysis –PCB Layout • Physical Layout of the PCBA for DFM/DFT • Converted from Double to Single sided PCB –Verification Test • Functionality verification with existing products • Customer performed product validation 17
  • 18.
    Case Study #3  DesignCost Reduction and Logic Consolidation  ATE Platform – 14 PCBAs that required PTH to SMT conversion Logic consolidation into FPGAs – Customer acquired existing product from another OEM • Did not have complete documentation • Did not have engineers with product knowledge • Require Engineering team to be very resourceful 18
  • 19.
    Case Study #4  Before: –Motherboard with 2 daughter assemblies – PTH components – 8 I/O channels – 6U Assembly  After: – Single Assembly – SMT components except Backplane connectors are press fit, FPGA Used for logic consolidation – 16 I/O channels – Maintained 6U form factor 19
  • 20.
    Our Products Battery Packs Flex& Rigid-Flex PCB’s User Interfaces Fans & Motors Cable Assemblies Printed Circuit Boards 20
  • 21.
    Design Centers &Technical Support        Battery Pack & Power Management – Denver, CO User Interfaces – Largo, FL Fans & Motors – Wales, UK PCB’s – New Bedford, MA & Shenzhen, China Flex & Rigid Flex – Toronto, Canada Cable Assemblies – New Bedford, MA Our Engineering and Design teams are ready to help our customers create world class and cost effective product solutions. 21
  • 22.
    Q&A  Questions? – Enter anyquestions you may have in the Control Panel. – If we don’t have time to get to it, we will reply via email. 22
  • 23.
    Thank You Check outour previous webinars at www.epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information: 23