Thin-Film Integrated Passive Devices

| Sample | www.yole.fr | ©2018
From Technologies to Markets
Sample
Thin-Film
Integrated
Passives
Devices
Publication date: February 2018

Biographies & contacts
2| Sample | www.yole.fr | ©2018
Mattin GRAOTXAPARTEGI,Technology & Market Analyst, Power Electronics
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is in charge of inverter architecture evolutions and passive
components (from capacitors to protection devices). Previously, he worked as an intern at the French car maker Renault, designing power converters
for electric car chargers. He graduated from Grenoble INP with an Engineering degree in Electrical Systems, followed by a specialization in embedded
systems for transportation. He then earned an advanced master’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time,
he oversaw managerial, financial, and marketing fields within the aeronautics industry.
Contact: grao@yole.fr
Amandine PIZZAGALLI, Market &Technology Analyst, Equipment and Materials Manufacturing
Amandine Pizzagalli oversees the equipment and materials fields for the Advanced Packaging and Manufacturing team at Yole Développement. She graduated
with a degree in Electronics Engineering, specializing in semiconductors and nanoelectronic technologies. Before joining Yole, Amandine worked for Air
Liquide with an emphasis on CVD and ALD processes for semiconductor applications.
Contact: pizzagalli@yole.fr
Jérôme Azémar, Senior Market &Technology Analyst, Advanced Packaging
Jérôme Azémar is a senior member of the Advanced Packaging & Manufacturing team of Yole Développement. As a technology and market analyst since 2013, Jérôme
provided numerous market research and strategy analysis on Power Electronics, Advanced Packaging and Semiconductor Manufacturing and he performed several
presentations, keynotes and market briefings in semiconductors conferences. Upon graduating from INSA Toulouse with a Master’s in Microelectronics and Applied Physics,
he joined ASML and worked in Veldhoven for three years as an Application Support Engineer, specializing in immersion scanners. During this time, he acquired
photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. Whilst with ST, he developed new processes, co-authored
an international publication and worked on metrology structures embedded on reticules, before joining Yole Développement in 2013.
Contact: azemar@yole.fr
Thin-Film Integrated Passives Devices

COMPANIES CITED IN THE REPORT
3D Glass solutions,Amkor, ASE,AVX/ATC, Broadcom/Avago, CEA-LETI, CrocusTechnology, Fraunhofer-IISB institute,
Fraunhofer-IZM institute, Georgia Institute of Technology, IMEC, Infineon, Qualcomm/TDK Epcos, Ibiden, Johanson
Technology, Maxim Integrated, Murata/Ipdia, NXP, Onchip devices, ON Semiconductor, Qorvo, Shinko, STATS ChipPAC,
STMicroelectronics, Skyworks,Texas Instrument,TSMC, Unimicron,Wavenics,Vishay, and more…
(non-exhaustive list)

REPORT OBJECTIVES
• This report - Yole’s third research update for the IPD market in the field of semiconductor applications - provides an understanding of
applications, technology trends, and market forecasts, by market segment
• This report’s objectives are to:
• Provide detailed information regarding IPD applicability
• Detailed analysis of the major applications using IPD today, and potential applications that could use IPD substrate
• IPD roadmap, by application
• Review the current status of IPD adoption on the market
• Deliver an overview of IPD manufacturing’s technological trends (substrate type, material type)
• Understand IPD key benefits and added value
• How does IPD differ from the other alternative technologies?
• Understand the remaining challenges for IPD implementation
• Offer market metrics at IPD market level for ESD/EMI, RF, and digital/mixed signal applications (2016 - 2022)
• Evaluate market developments in terms of market size (volume, value) and substrate sizes/formats
• Overall 2017 IPD market share -– breakdown by substrate type
• 2017 IPD market share by substrate type, for RF IPD, ESD/EMI IPD, and Digital mixed signal IPD
• Explore the competitive landscape and identify key IPD players in technology development and manufacturing
• Give an overview of who is doing what, and each market’s specificities
• Market share of the key 2017 IPD manufacturers: pure IPD manufacturers: OSATs, IDMs, and foundries and their market share
• Furnish an overview of the technologies available for IPD structuration, and their challenges
• Technology process, specification, supply chain, and value chain
• This report does not cover the following applications where IPD are applied or could be applied:
• Thick-film IPD (based on LTCC ceramic substrate)
• IC IPDs
• RF CMOS

TABLE OF CONTENT
• Introduction, definitions & methodology 6
• Objectives of the report
• Who should be interested in this report?
• Companies cited in this report
• Definitions, limitations & methodology
• Glossary
• Executive summary 18
• IPD market segment 57
• IPD segmentation: RF IPD, ESD/EMI IPD, digital mixed signal IPD
• IPD attributes vs applications requirements
• IPD market segment
• IPD drivers
• IPD technologies manufacturing_____________________71
• IPD technology requirements & options
• Inductors (multilayer planar inductors, 3D inductors…)
• Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST
versus PZT capacitors…)
• IPD substrate type _103
• Substrate type for IPD manufacturing
• IPD market share – breakdown by substrate type
• IPD devices market forecast 114
• In $M, in wafer eq. with attached growth rates
• Volume shipments for each IPD by application (ESD/EMI, RF IPD,
Digital mixed signal)
• IPD shipments by substrate type (Silicon, Glass, GaAs, SOI…)
• IPD shipments by wafer size (6” / 8” / 12”)
• IPD players and manufacturers suppliers 126
• 2017 IPD player market shares and revenues
• Overall player market shares based on 2017 IPD revenues
• Supply chain 136
• Conclusions________________________________________142
• Appendix
• IPD definition
• IPD integration/packaging platforms
• IPD players (example of IPD products for each player)

REPORT METHODOLOGY
Technology analysis methodology Information collection

REPORT METHODOLOGY
Market forecast methodology

SCOPE OF THE REPORT
Thick film IPD
Rigid
organic
IPD platforms
IPD technologies
Scope of the Report
Thin film IPD
SOC
System on Chip
technology
Advanced substrate
technology (Fan-
Out WLP)
flex
Ceramic LTCC Plastic
laminate
Silicon Glass GaAs SOI Alumina RF CMOS
Traditional substrates
Organic

IPD - BENEFITS AND DRIVERS
IPD added value
Time to Market
Functionalities/
system integration
Performance
Thin-film
IPD driversMiniaturization
Cost-effective solution
• High reliability
• Stable electrical performance
• Better tolerance/precision
• Footprint reduction of the
electronic system
• Low profile and 3D integration
• Low weight
• High-density routing capabilities
Manufacturing cost reduction due to
minimizing passive device placement time
Making a system-in-package (SiP) with
IPD takes less time than making a new
system-on-chip (SoC)
Ascend the value chain by
seizing more system value
Flexibility
• Design flexibility (tunable values and
component characteristics)
• Flexible assembly and integration

 ESD + EMI
 ESD + MCF
(multi component filtering)
 ESD +TVS
 EMI filtering alone
 ESD alone
Thin film IPD
applications
ESD/EMI protection Digital & mixed signal RF devices
IPD DEVICES APPLICATIONS
What are the final applications where IPDs are used?
 Matching
 Filtering
 Baluns
 Diplexers
 Couplers
 Pull-ups / Pull-downs
 Decoupling,
tank and blocking
capacitors
 Analog filtering
Capacitors, resistors, inductors
Capacitors, resistors, inductors +
diodes zener

IPD TYPE - MARKET SEGMENT BY FUNCTION
IPD type - Segmentation by electronic function
• 3 key IPD categories of applications have been identified depending on their electronic functions they can
provide
RF IPD
(or hyper, microwave) passive devices
• Matching, filtering, RF decoupling, RF ESD
protection
• Integration of R, L, C, baluns, diplexers,
waveguides,…
ESD/EMI protection
(ESD/EMI IPD)
• ESD protection, transient voltage
suppression
(TVS), and signal conditioning
• Integration of Zener diodes, R, L, C
• Submounts with embedded Zener diodes
for High Brightness LED’s
Digital and mixed-signal
passive devices
(logic and mixed signal IPD)
• Pull-ups, pull-downs for circuit versioning,
power decoupling, tank and blocking
capacitors, analog filtering, DC/DC
conversion…
• Combinations of R,L,C, resistor and
capacitor networks, discreteThin-Film
devices, silicon capacitors
• Digital interposers (MCU,CPU, GPU,
FPGA)

ImportantPrimary attribute: very important
IPD ATTRIBUTESVS APPLICATION REQUIREMENT
RF IPD
(or hyper, microwave) passive devices
ESD/EMI IPD
(ESD/EMI protection)
Digital & mixed signal
IPD
Miniaturization
Density integration
Tolerance/Accuracy
Functionalities/ System
integration
Cost effective
Time to market
Technology
Drivers
1 2 Less critical3 4 Not very important
1
3
1
2
3
1
4
4
2
3
1
3

IPD APPLICATIONS
Where are IPDs used?
Understand in what
applications IPDs
are used…
And where they
are emerging

IPD AT A GLANCE:APPLICATION MARKETS
Type of markets segment integrating IPD devices by integrated systems (end-products)
Digital and mixed signal IPD ESD/EMI IPDRF IPD
Consumer
Industrial / Scientific / Medical (ISM)
Network & server equipment
Buildings & homes utilities equipment
Automotive Automotive
Defense & aerospace

Mobile Phones
Notebook & tablets
High volumes
Network & server
equipment
WHERE DO WE FIND IPD DEVICES
Highest market volume integrating IPD devices
Consumer
market
segment is the
key domain
application for
IPD devices
Low volume
Gaming Devices / Stations
Industrial & home
networking
Military &
aerospace
Medical &
life ScienceTransportation
(automotive)
IPD devices
> 2B units
< 1M units

MORE SLIDES EXTRACTS
IPD technology overview
IPD technology
overview

THIN-FILM IPD DEVICES SUBSTRATE TYPE
Substrate type for IPD manufacturing
• There are numerous potential substrate type that could be used for IPD manufacturing
Six type of
substrates can
be used for
IPD
manufacturing
IPD substrate type
Sapphire
Silicon
High resistivity
Glass GaAs
Alumina wafer
SOI

Which substrates are used by which company?
Information about the
substrate types used by each
IPD market

IPD MARKET FORECAST- BREAKDOWN BY IPD TECHNOLOGY
Breakdown per application
The overall IPD
market is
mostly driven
by the ESD/EMI
IPDs market
which stands
for more than
60% of the total
IPD market
ESD/EMI IPDs
RF IPDs
Mixed Signal IPD market
Silicon (Si)
Si Glass GaAs
AluminaSOI
Si

IPD markets: Market forecasts 2016-2022
IPD forecasts by
market segments,
substrates and
applications
As well as
market shares
by market

2017 IPDVOLUME – BREAKDOWN BY SUBSTRATE TYPE
IPD volume split by substrate type
Silicon
substrate is
the main IPD
substrate
technology
in 2017, with
more than
80% market
share

Supply chain: Key IPD manufacturers' positioning, by IPD application area
Explanations of howYole sees
the different business models
related to IPDs
Reasons why some
business models
works better than
other

RELATED REPORTS
Discover more related reports within our bundles here.

Today, miniaturization and integration are key
drivers in electronic devices. This is even more
critical in several consumer applications, where
thinner devices mean higher integration levels,
necessitating low-profile components.
The thin-film IPD process offers finer pitch feature,
better tolerance control, higher flexibility, and
packages possessing higher integration than other
commonly available technologies, i.e. PCB and low
temperature co-fired ceramic (LTCC) technologies.
These aspects explain IPD’s expansion over the last
years, and its promising continued growth.
Today, electrostatic discharge (ESD) and
electromagnetic interference (EMI) protection
are IPD’s primary applications, but RF front-end
modules requiring IPD baluns, diplexers, matching,
etc. are fast-increasing too. Currently, consumer
applications (especially smartphones) are the
big consumers of IPDs in RF front-end modules,
or for ESD/EMI protection. Miniaturization, low
cost, and high-value precision are the added-values
IPDs bring to these applications. Planar structure
capacitors, inductors, and resistors are built
using thin-film deposition technologies with high-
performance results. A wide variety of dielectric
and resistive materials are proposed by a large
number of companies, depending on the desired
performance of the IPD.
3D structure technologies have also been
available for a couple of years now, especially for
achieving excellent capacitance density values in
silicon-trench capacitors. This new technology
has opened new business opportunities for IPDs
in other applicative markets, as was demonstrated
with the iPhone 7 and its A10 processor, which
integrates several silicon-trench capacitors
under the microprocessor’s bumps. In the digital
& mixed signal market, integration density and
miniaturization are the priorities - therefore
conventional planar technologies can’t be used
since the capacitance densities are currently far
from what’s required.
In this report, Yole Développement explains each
application’s different requirements, and the IPD
technologies being used to answer increasing
demand.
THIN-FILM INTEGRATED PASSIVE DEVICES
Market & Technology report - January 2018
DRIVEN BY MINIATURIZATION, HIGHER PERFORMANCE, AND LOWER COST,
IPD DEVICES OFFER GREAT OPPORTUNITIES IN THE SMARTPHONE MARKET
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Overview of the IPD device
market, segmented by IPD type
and application
• Update of our 2016 - 2022 IPD
market forecast, segmented by
application: RF IPD, ESD/EMI IPD,
and digital mixed signal IPD
• Overview of the substrate type
used for thin-film IPD, segmented
by IPD application
• Update of key 2017 IPD
manufacturers’ market share,
by IPD type
• Overall IPD market share -
breakdown by substrate type
• Analysis of 2017 IPD market
share, by substrate type for each
IPD application: RF IPD, ESD/EMI
IPD, and digital mixed signal IPD
• Update of our 2016 - 2022 IPD
market forecast, by substrate type
and wafer size
• Key technical insights into IPD
technology trends and challenges
• Overview and status of the IPD
technologies applied today for
each key application
• In-depth analysis of the different
market segments using RF IPD,
ESD/EMI IPD, and digital mixed
signal IPD
• Comprehensive overview of the
competitive landscape and market
share for all main laser equipment
manufacturers involved in the
semiconductor industry
• Important technical insights and a
detailed analysis of IPD solutions/
trends/requirements/challenges,
by application
• IPD roadmap for new technology
adoption
ESD + EMI
ESD + MCF
ESD +TVS
EMI filtering alone
ESD alone
Thin film IPD
applications
ESD/EMI
protection
Digital mixed
signal RF devices
Matching
Filtering
Baluns
Diplexers
Couplers
Pull-ups / Pull-downs
Decoupling,
tank and blocking
capacitors
Analog filtering
Capacitors, resistors, inductors
Capacitors, resistors,
inductors + diodes zener
ESD: Electrostatic Discharge EMI: Electromagnetic Interference
TVS:TransientVoltage Suppresor MCF: Multi Component Filtering
(Yole Développement, January 2018)
Thin film IPD application overview

THIN-FILM INTEGRATED PASSIVE DEVICES
DIFFERENT BUSINESS MODELS AND DIFFERENT EXPECTATIONS FOR A COMPLEX
SUPPLY CHAIN
As mentioned earlier, IPDs have a variety of
applications and high potential in numerous areas.
This, combined with large range of solutions, creates
a diversified supply chain - depending on the end-
application targeted. This diversity is actually even
more complex considering the different types of
manufacturers and their business models: pure
players, OSATs, IDMs, foundries, etc. Many producer
types can be involved in IPDs but with different
resources and objectives.
IDMs/foundries use IPDs as options to complete their
offers and make them more appealing for customers.
The focus is not to make a pure business of IPD,
but to use it as an added-value for their products.
The most illustrative example is TSMC promoting
its decoupling capacitors to save more space and
increase efficiency in Apple’s processors – a solution
that has opened the door for IPD in large volumes for
advanced applications.
OSATs have a similar approach in terms of priority and
promotion, but with different integration capabilities.
Most OSATs have IPD offers in their portfolio and
implement them upon customer request. Their
solutions are either more standardized IPDs, or
supplied from pure players to integrate them in
packages afterwards.
Pure players like IPDiA (now part of Murata) are, by
definition, pushing for the spread of IPD solutions.
These solutions must convince customers that
they are vital for implementing passives in their
integration. In order for this to happen, IPDs must
be seen either as an easily-outsourceable commodity
or as a differentiator justifying new supplies. In both
cases strong development is required, which pure
players are pushing for.
This report analyzes the different business models,
rationales for IPD manufacturing, and expectations
for this market according to various offers.
In 2017 the overall IPD market generated a revenue
exceeding $750M, and is expected to peak at more
than $1B by 2022. As of 2017, this market is driven
mostly by the ESD/EMI IPDs market, which represents
more than 60% of the total IPD market, followed by
RF IPD. Mixed signal IPD did not represent a significant
volume and is still an emerging IPD market.
Although it is difficult to predict the success of
digital mixed signal IPD, we see a small penetration
rate (driven mainly by decoupling applications) in
smartphone processors, where miniaturization is a
key driver. Moreover, a few medical applications also
require decoupling capacitors in IPD format, where
again miniaturization and high capacitance density are
essential.
In terms of substrate material, although silicon
remains the only mainstream solution for ESD/EMI
IPD and digital mixed signal (presently 100% in these
IPD commercial devices), there are a wide variety
of substrates available for RF IPD manufacturing.
Indeed, advanced requirements such as substrate loss
are considered for RF applications. Also, due to the
limitation in terms of insertion loss as well as dielectric
loss for silicon, various alternative substrates such as
glass and GaAs are being integrated into some RF
IPD products manufactured by STMicroelectronics,
Murata, Qorvo, and others.
Glass is an appealing choice for high-frequency
applications requiring low dielectric loss and low
insertion loss. Meanwhile, GaAs is especially
advantageous for its smaller size and higher
performance in terms of linearity and noise
characteristics, especially at high frequencies.
Consequently, we expect these substrates to take
market share in the RF IPD market.
This report offers a comprehensive overview of the
substrates used in each IPD manufacturing process, a
detailed analysis of technology trends, and a market
forecast by IPD application type. Moreover, an IPD
market forecast split by wafer size and substrate type
has been calculated for the 2016 - 2022 timeframe.
IPD forecasts : breakdown by technology type - 2017
Si
Si Glass GaAs
AluminaSOI
Si
Total IPD revenue $750M
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2016 2017 2018 2019 2020 2021 2022
intermsofrevenue
Mixed Signal IPD market RF IPDs ESD/EMI IPDs
IPD passives devices supply chain
ESD/EMI protection RF IPD Digital Mixed signal
Pure IPD
manufacturers
IDMs
foundries
Substrate
packaging
OSATs
RD institutes
DESPITE SILICON’S DOMINATION IN THE IPD MARKET, ALTERNATIVE
SUBSTRATES ARE DISRUPTING THE RF IPD MARKET

Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
3D Glass Solutions, Amkor, ASE, AVX/ATC, Broadcom/Avago, CEA-LETI, Crocus Technology,
Fraunhofer-IISB Institute, Fraunhofer-IZM Institute, Georgia Institute of Technology, IMEC, Infineon,
Qualcomm/TDK Epcos, Ibiden, Johanson Technology, Maxim Integrated, Murata/Ipdia, NXP, Onchip
Devices, ON Semiconductor, Qorvo, Shinko, STATSChipPAC, STMicroelectronics, Skyworks, Texas
Instruments, TSMC, Unimicron, Wavenics, Vishay, and more...
AUTHORS
As an Senior Technology and Market analyst,
Jérôme Azémar is member of the
Advanced Packaging Manufacturing team
of Yole Développement (Yole). Jérôme is
daily managing the production of technology
market reports as well as custom
consulting projects. He also takes part in
the business development of these activities.
Upon graduating from INSA Toulouse
(France) with a master’s in Microelectronics
Applied Physics, he joined ASML in the
Netherlands and worked as Application
Support Engineer for three years. Then he
honed over a two-year stint as a Process
Engineer at STMicroelectronics (France).

Introduction, definitions methodology 6
Report objectives
Who should be interested in this report?
Companies cited in this report
Definitions, limitations methodology
Glossary
Executive summary 18
IPD market segment 57
IPD segmentation: RF IPD, ESD/EMI IPD, digital mixed
signal IPD
IPD attributes vs. application requirements
IPD market segment
IPD drivers
IPD technologies manufacturing 71
IPD technology requirements and options
Inductors (multilayer planar inductors, 3D inductors, etc.)
Capacitors (i.e. planar vs. trench geometries, SiO2 vs.
SiN vs. BST vs. PZT capacitors)
IPD substrate type 103
Substrate type for IPD manufacturing
IPD market share - breakdown by substrate type
IPD devices - market forecast 114
In $M and wafer eq., with attached growth rates
Volume shipments for each IPD, by application (ESD/
EMI, RF IPD, digital mixed signal)
IPD shipments, by substrate type (silicon, glass, GaAs, SOI)
IPD shipments, by wafer size (6” / 8” / 12”)
IPD players and manufacturers’ suppliers 126
2017 IPD player market share and revenue
Overall player market share based on 2017 IPD revenues
Supply chain 136
Conclusions 142
Appendix
IPD definition
IPD integration/packaging platforms
IPD players (example of IPD products for each player)
Yole Développement presentation
TABLE OF CONTENTS (complete content on i-Micronews.com)
Mattin Grao Txapartegi is a Technology
Market Analyst, Power Electronics at
Yole Développement (Yole). He is engaged
in many custom studies and reports
dedicated to the evolution of inverters
architecture and passive components. And
today, he investigates power packaging to
understand the latest technical challenges
and market evolution. Previously he
acquired a comprehensive expertise in
the design of power converters for EV at
Renault. As an engineer, Mattin is graduated
from Grenoble INP (FR) with specialization
in embedded systems for transportation.
• TSMC Deep Trench Capacitor Land-Side
Decoupling Capacitor in Apple’s A10
Application Processor
• Silicon Capacitor Technology and Cost Review
• 5G’s Impact on the RF Front-End Industry
• Glass Substrate Manufacturing in the
Semiconductor Field
Find all our reports on www.i-micronews.com
RELATED REPORTS
OBJECTIVES OF THE REPORT
• Provide detailed information regarding IPD devices’ applicability
• Detailed analysis of the major applications using IPD today, and potential applications that could require
an IPD substrate
• Offer an IPD device application roadmap
• Discuss the current status of IPD adoption in the market
• Present an overview of IPD manufacturing’s technological trends (substrate type, material type)
• Understand IPD devices’ key benefits and added-value
• Review the remaining challenges for IPD device implementation
• Provide market metrics at IPD market level for ESD/EMI, RF, and digital/mixed signal applications (2016 - 2022)
• Evaluate market developments in terms of market size (volume, value) and substrate sizes/formats
• Reveal a competitive landscape and identify key IPD players in technology development and manufacturing
• Analyze technology process, specification, supply chain, and value chain
Amandine Pizzagalli is a Technology
Market Analyst at Yole Développement
(Yole). Amandine is part of the development
of the Advanced Packaging Semiconductor
Manufacturing Business Unit with the
production of reports and custom consulting
projects. She is in charge of comprehensive
analyses focused on equipment, materials
and manufacturing processes. Amandine
is graduated in Electronics from CPE Lyon
(France), with a technical expertise in
Semiconductor Nano-Electronics and
has a master focused on Semiconductor
Manufacturing Technology, from KTH Royal
Institute of Technology (Sweden).
WHAT’S NEW
• Status of the IPD industry, and evolution since 2012
• Update of our 2016 - 2022 IPD market forecast for RF IPD, ESD/EMI, and digital mixed signal IPD
• Update and market share for key 2017 IPD manufacturers: pure IPD manufacturers, OSATs,
IDMs, and foundries
• New analysis based on the competitive landscape and market share of IPD manufacturers, by
IPD applications covered in this report (RF, ESD/EMI, digital mixed signal)
• Overall IPD market share - breakdown by substrate type
• New analysis of 2017 IPD market share by substrate type, for RF IPD, ESD/EMI IPD, and digital
mixed signal IPD
• Key technical insights and detailed analysis of IPD solutions, trends, requirements, and
challenges - by application
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finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon
and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors,
Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics Medical, Advanced Packaging, Manufacturing,
Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology
trends to grow their business.
CONSULTING AND ANALYSIS
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of innovative optical systems
• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
MEDIA EVENTS
• i-Micronews.com website related @Micronews e-newsletter
• Communication webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Teardowns reverse costing analysis
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies
• Press Relations Corporate Communication: Sandrine Leroy (leroy@yole.fr)

© 2018
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons

2©2018 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS
MEMS Sensors
Solid State Lighting
(LED, OLED, …)
Compound Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices
Techno.
Advanced
Substrates
Software

3 BUSINESS MODELS
o Consulting and Analysis
• Market data research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
MA with our partner)
www.yole.fr
o Reports
• Market technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast
services
• Events:TechDays, forums,…
www.i-Micronews.com

6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto

ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low

SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators and
end-users
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software

OUR 2018 REPORTS COLLECTION (1/3)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 - Update
− Silicon Photonics 2018 - Update
− Consumer Biometrics: Sensors Software 2018 - Update
− MEMS Pressure Sensors 2018
− Air Quality Sensors 2018
− Sensors for AR/VR 2018
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− Gas Particles Sensors
− MEMS Pressure Sensors
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
RF DEVICES ANDTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – byYole Développement
− RF Front End Module and Connectivity for Cellphones 2018 – Update
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2018 - Update
− RF GaN 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Radar Technologies for Emerging Applications 2018 *
− Radar Technologies for Automotive 2018
− RF Photonic Technologies for 5G Infrastructure 2018
− RF Front-End Modules in Smartphones
− RF GaN *
− RF Front End Module – Patent Landscape Analysis
− RF GaN – Patent Landscape Analysis
IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2018 – Update
− Status of the Compact Camera Module Industry 2018 - Update
− 3D Imaging and Sensing 2018 - Update
− Imaging for Industry and Automation 2018
− Sensors for Robotic Vehicles 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
− CMOS Image Sensors 2018 *
− CMOS Image Sensors
− Compact Camera Modules
− LiDAR – Patent Landscape Analysis
− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 - Update
− Processing Hardware and Software for AI: Integration Challenges 2018
Update : 2017 version still available / *To be confirmed

ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 - Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates
Like PCB Trends
− Fan-Out Packaging 2018 – Update
− 3D TSV and Monolithic Business Update 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 – Update
− MEMS Packaging and Testing 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Status of Panel Level Packaging 2018
− Trends in Automotive for Advanced Packaging 2018
− Processing Hardware and Software for AI: Integration Challenges 2018
− Integrated Passive Devices (IPD) 2018
− RF Front-End SiP
− Fan-Out Packaging *
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
MANUFACTURING
− Manufacturing Wafer Starts for More than Moore 2018
− Equipment for More than Moore: Technology Market Trends for Lithography
Bonding/Debonding 2018
− Equipment for More than Moore: Technology Market Trends for Thin Film
Deposition Etching 2018
− Wafer Bonding Technology Overview 2018
MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Memory Market 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement
− Memory Pricing 2018 (NAND DRAM)
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
COMPOUND SEMICONDUCTORS
MARKET AND TECHNOLOGY REPORT – byYole Développement
− Status of Compound Semiconductor Industry 2018 *
− Power SiC 2018: Materials, Devices, and Applications - Update
− Power GaN 2018: Materials, Devices, and Applications – Update
− RF GaN 2018 – Update
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Power SiC Devices
− Power GaN Devices
− Power SiC – Patent Landscape Analysis
− Status of the GaN IP – Patent Landscape Analysis

POWER ELECTRONICS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 - Update
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 - Update
− EV/HEV Market Expectations and Technology Trends - Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Integrated Passive Devices (IPD) 2018
− Power ICs Market 2018 – Update
− Power ICs Market 2018 *
− Power Modules *
BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry Update with Focus on Manufacturing 2018 *
− Battery Pack Technology and Business Opportunities 2018 - Update
− Solid-State Batteries – Patent Landscape Analysis
SOLID STATE LIGHTING
− IR LEDs and Lasers 2018 - Update
− Automotive Lighting 2018 – Update
− UV LEDs 2018 - Update
− VCSELs 2018
− Lasers 2018
− Light Shaping Technologies 2018
− LiFi 2018
− VCSELs 2018
− UV LEDs 2018 *
DISPLAYS
− MicroLED Displays 2018 – Update
− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -
Update *
− Displays for AR / VR / MR 2018
− Non Display Applications of MicroLEDs 2018 *
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− Status of the BioMEMS Industry 2018 - Update
− Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update
− Neuro-Technologies for Healthcare and Consumer Applications 2018
− CRISPR Technology: From Lab to Industries 2018
− Portable Medical Imaging 2018
− Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018
− Liquid Biopsy 2018: From Isolation to Downstream Applications
− Chinese Microfluidics Industry 2018
− Microfluidic IC Cooling – Patent Landscape Analysis
− Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS (1/3)
MEMS SENSORS
− Status of the MEMS Industry 2017
− High End Inertial Systems Market and Technology 2017
− Magnetic Sensors Market and Technologies 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017
− Acoustic MEMS and Audio Solutions 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –
Reverse Costing Report
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report
− MEMS Packaging 2017 - Reverse Costing Review
− Bosch BMP380 Pressure Sensor – Reverse Costing Report
IMAGING PHOTONICS
− Status of the CMOS Image Sensor Industry 2017
− 3D Imaging and Sensing 2017
− Uncooled Infrared Imaging Technology Market Trends 2017
− Camera Module Industry Market and Technology Trends 2017
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse
Costing Report
− Camera Module Physical Analyses Overview 2017
RF DEVICES ANDTECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF System-in-Package for Cell Phones 2017
− 5G Impact on RF Front-End Industry 2017
ADVANCED PACKAGING
− Status of the Advanced Packaging Industry 2017
− Embedded Die Packaging: Technology and Market Trends 2017
− Fan-Out: Technologies and Market trends 2017
− Advanced Substrates Overview: From IC Package to Board 2017
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced RF System-in-Package for Cellphones 2017
− Memory Packaging Market and Technology Report 2017
− MEMS Packaging 2017
− Emerging Non-Volatile Memory 2017
− NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
SOFTWARE
− Embedded Software in Vision Systems
MEDTECH
− Status of the Microfluidics Industry 2017
− Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
− Connected Medical Devices Market and Business Models 2017
− Artificial Organ Technology and Market analysis 2017
− Medical Robotics Technology Market Analysis 2017

OUR 2017 PUBLISHED REPORTS (2/3)
MANUFACTURING
− Laser Technologies for Semiconductor Manufacturing 2017
− Equipment and Materials for 3D TSV Applications 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
BATTERIES ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry
− Market Opportunities for Thermal Management Components in Smartphones
DISPLAYS
− MicroLED Displays
− Quantum Dots and Wide Color Gamut Display Technologies
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
SOLID STATE LIGHTING
− LED Packaging 2017: Market, Technology and Industry Landscape
− CSP LED Lighting Modules
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends
POWER ELECTRONICS
− Status of the Power Electronics Industry 2017
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
− Power Module Packaging: Material Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Management ICs Market 2017
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
− Silicon Capacitor - Technology and Cost Review
− Industrial 100V MOSFET - Technology and Cost Review
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
Combo – Reverse Costing Report
COMPOUND SEMICONDUCTORS
− Bulk GaN Substrate Market 2017
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− Power SiC 2017: Materials, Devices, Modules, and Applications
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Japan Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Japan:
• Miho Othake, Account Manager
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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