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Counterfeit Prevention & 
Detection Strategies: 
How To Do It, When To Do It 
Greg Caswell 
DfR Solutions, LLC 
College Park, MD USA
Purpose 
• Provide insight into the relative capabilities 
and costs of the different methodologies for 
identifying and mitigating counterfeit 
electronic components from reaching 
installation in an application
Outline 
• Introduction 
• Supply Chain Issues 
• Decision Matrix and Case Study Example 
• Detection Techniques 
– Visual Inspection 
– X-Ray 
– Electrical Characterization 
– Mechanical Robustness 
– DPA 
• Conclusions
Introduction 
• This presentation addresses the unique sources of counterfeit components and 
provides insights into how they occur. 
– Counterfeit components are a rapidly growing area of concern. The Department of 
Commerce has identified a 141% increase in the last three years alone! 
– Counterfeit Parts are no longer an emerging threat: they’re real, and they’re here 
to stay. 
– A counterfeit is any item that is not as it is represented with the intention to 
deceive its’ buyer or user. The misrepresentation is often driven by the known 
presence of defects or other inadequacies in regards to performance. Whether it is 
used for a commercial, medical or military application, a counterfeit component 
can cause catastrophic failure at a critical time. 
– Detection methodologies, such as visual inspection, mechanical robustness, X-Ray, 
XRF, C-SAM, Infrared Thermography, electrical characterization, decapsulation, and 
marking evaluations will be compared and contrasted. 
– Multiple examples of counterfeit parts identified using these techniques will be 
highlighted.
5 
Environmental Legislation 
• Providing additional opportunities 
– Recycling 
– Need for obsolete SnPb parts
6 
EIA/G-12 Committee Strategy 
• TB-0003-2009 Counterfeit Parts & Materials 
Risk Mitigation 
Prevention 
Detection 
Mitigation
7 
Prevention 
• EIA/G-12 Recommendation 
– “<sic> only procure from the Original Component Manufacturer 
(OCM) that makes and warranties the part or material or their 
designated franchisees.” 
• Procuring from OCM’s 
– Unrealistic for Military / Government programs 
– Volumes too low 
• Procuring from designated franchisees 
– Component availability from designated franchisees is often 
similar to that of OCM
8 
Designated Franchisees 
• Military / Government 
contractors standardizing 
sourcing plans 
– Lists of approved sources 
(Authorized Source Directory) 
– Other sources by exception and 
with specific approvals 
• Approval process 
– Audit based on quality system 
– Risk assessment to the program 
– Development of an inspection / 
test plan 
http://www.authorizedcomponents.com/manufacturers.html 
Use of Authorized Franchisees does not eliminate risk
9 
Complex Supply Chains 
• Multiple points of entry 
• Porous return policies 
Lloyd Condra, Boeing
Counterfeit Parts Defined 
What are they? 
What is their impact? 
Where do they come 
from? 
Identification 
Industry 
Countermeasures 
Avoidance 
Mitigation
Top Four Types of Counterfeits 
• Used product marked as higher grade new product 
• These types of counterfeit parts may work, but will not 
operate at the same level as the higher grade part and 
may fail under stress that would be expected under 
normal conditions. 
• Electronics recycling or salvage sources 
• Fake, non-working product 
• Disguised parts 
• Defective Scrap 
• Inside sources 
• New product re-marked as higher grade product 
• Like re-marked used product, re-marked new product 
will work, but not at the desired level of functionality.
Primary Sources of Counterfeit Parts 
• Most counterfeit parts come from parts brokers 
that deal in small and odd lots 
• Low volume of obsolete parts bought off the 
internet 
• Authorized parts distributors rarely have 
counterfeits because they receive them directly 
from the original component manufacturer (OCM) 
• Regions with highest counterfeit activity: 
• China 
• Middle East 
• Eastern Europe 
• But truly a global problem!
13 
Decision Process 
• If prevention is not realistic, when to detect? How 
to mitigate? 
• Entry for counterfeit components is cost 
– Cost to procure < cost of redesign (+ requal, etc.) 
– If cost to mitigate is too high, then simply redesign 
• How to determine the appropriate cost to detect 
and mitigate? 
– Driven by probability / mission risk / volume matrix
14 
Decision Matrix 
Probability of 
Counterfeit
15 
Counterfeit Probability 
• Probability of counterfeit (per shipment) tends to display 
order of magnitude dependence on component source 
– May vary based on supply chain and component 
technology 
Known: Existing business relationship 
Unknown: No existing business relationship (e.g., eBay)
16 
Case Study 
• Telecom OEM procures one reel of capacitors from 
known broker 
– End-of-life (EOL) product 
• Decision Matrix 
Probability is 2% Volume is 4000 parts 
Mission Risk is $5M 
Eight capacitors per CCA (500 CCAs) 
$10K cost of quality ($5K COGS + $1K service + $4K loss of market) 
• DfR recommended that $10K to $100K should be spent 
on counterfeit detection and mitigation 
– Industry ROI can be 1:1 to 10:1
17 
Detection of Counterfeits 
• Counterfeiters are increasingly 
sophisticated 
• Use of actual parts at the start 
and end of a reel 
– Challenges sampling techniques 
• Inspection and comparison of 
known-good to possible 
counterfeits 
– Markings 
– Internal structure 
– Performance measurement
18 
Detection Techniques 
Visual / 
Marking 
Inspec-tion 
T. Apple 610-531-5484 
Verificati 
on of 
Manuf. 
LDC, 
SNs, etc. 
Mater-ial 
Analy-sis 
Seal Test 
Radio-graphic 
DPA 
Minimal 
Electrical 
Test 
Full 
Electri-cal 
Test 
(Am-bient) 
Full 
Electrical 
Test (Hot 
/ Cold Am-bient) 
Test & 
Burn-in 
Test, 
Burn-in 
and QCI 
No Die / Non-functional 
No No No No Yes Yes Yes Yes Yes Yes Yes 
Material Content P No Yes No No Yes No No No No No 
Wrong Die P P No No P Yes Yes Yes Yes Yes Yes 
Re-used / 
Repaired / 
Salvaged 
P No P P P P No No No No No 
Scrapped / 
Reject 
P No No P P P P P P Yes Yes 
Mechanical 
Damage 
Yes No No P P Yes P P P P P 
Mis-Handling / 
Storage 
No No No P No P P Yes Yes Yes Yes 
Manufacturer 
Change 
P P P No P Yes P P P P P 
Less Reliable 
Parts 
P P P No No P No P P P P 
Reliability / 
Quality Issue 
No No No No P P No P P Yes Yes 
ESD / EOS 
Damage 
No No No No No P P P P Yes Yes 
Counterfeit with 
functional die 
P P P No P P P P Yes Yes Yes 
Temperature 
Range 
Upmarking 
No P No No No P No No Yes Yes Yes 
Code: 
This chart was developed from one created by Mark Marshall of Integra Technologies. 
No = Unlikely to Find 
Shading: 
Green = Low Cost / Easily Accomplished 
Yellow = Moderate Cost / Some time involved 
Red = High Cost / Significant time to accomplish 
Dotted Pattern = Will be found at first electrical test 
Counterfeit Concern 
P = Possibly Find 
Yes = Probably Find 
Detection/Risk Mitigation Methods
19 
Detection Techniques (cont.) 
Cost & Schedule The more spent, the more time taken, the more confidence in reliability 
Add post burn-in full electrical 
tests over temperature 
Add full ambient electrical tests 
Add full electrical tests 
over temperature 
Add material check / seal test / 
radio-graphic or do basic electrical 
testing 
Moderate cost / repairable-replaceable 
/ non-mission critical 
Add QCI and other 
lot acceptance 
testing 
Add DPA 
Add burn-in 
Low cost / repairable 
/ redundant systems 
T. Apple 610-531-5484 
theodore.s.apple@lmco.com 
3/27/2007 
Item End-Use Requirements 
High cost / non-repairable / 
mission critical 
Reliability (Probability of Detection) 
C of C Only 
Check Alerts 
Visual Inspection
20 
Case Study – Visual Inspection 
• Five different capacitor 
types in one reel 
Capacitor Group 1, 
Fluorescent Light - Dark 
Brown 
Capacitor Group 2, 
Fluorescent Light - Pink 
Capacitor Group 3, 
Fluorescent Light - 
Greenish Gray 
Capacitor Group 5, 
Fluorescent Light - Light 
Brown 
Capacitor Group 4, 
Fluorescent Light - Bluish 
Gray
21 
Visual 
1 2 3 
• Which is counterfeit? 
– The one with markings? Or the two that seem to 
have none? 
• Two samples are non-functional and one 
functions
• Customer experienced two failures 
• Left: known good part; center and right: bad 
parts 
• Center part: no die; right part: cracked die 
22 
1 2 3
23 
Date Code Marking - Differences 
2.22 
12.00 
3.18 
Registration (mm) 
12.00 
Surface 
Smooth 
Even 
Textured 
Uneven 
Lettering 
Uniform 
depth 
Uneven 
depth
Blacktopping Defined 
• Blacktopping is a counterfeiting technique where the 
counterfeiter: 
– Takes components, usually real, but discarded 
– Sands them to remove the original component marking 
– Blacktops them in order to hide the original marking 
– Prints them with fake markings. 
– Investigators able to dissolve the blacktop with a solvent 
solution that revealed the true identity of the components. 
• Many blacktopped components can be uncovered by vigorously 
wiping acetone on the component 
– But, methods used to blacktop sanded parts improve daily
L01, remarked date code, VC36 changed to GC33 L011, hynix part 
25 
Examples of Blacktopping 
Just under top surface, date code mismatch and hynix part
Blacktopping and Acetone Wipe Test 
• Appearance After 
Acetone Wipe: change in 
texture and finish 
Evidence of Sanding: 
Visible after blacktopping 
is removed 
Photos courtesy of Oxygen Electronics
27 
Visual Inspection Cost vs. Benefit 
• $1K to $3K 
• Identify color differences in parts 
• Ascertain marking 
imperfections/changes/blacktopping 
• Lead finish and variability 
• Co-planarity of leads – reused parts
Case Study: Counterfeit FETS-X-Ray 
• Customer has an issue 
28 
with DC to DC 
converter failures 
• Simulation models did 
not predict the 
failures 
• X-ray inspection of the 
failed units 
Parallel FETS
29 
Loose Parts 
Z436, Z536 Z536 Z536 
EZ609 
Z536
30 
Summary 
This is not an STS25NH3LL Part, does not meet 
resistance specifications. 
Its higher drain to source resistance will cause its 
parallel FET partner to carry all the current. This part is 
present in the failed KT Master module 
FETs with large die have similar 
resistances and electrical 
performance, regardless of 
lead frame style
31 
X-Ray Cost vs Benefit 
• $1K to $3K 
• Verification of die and wire bonding pattern 
• Internal construction of component 
• Die bonding delamination issues 
• Die attach voiding
1.057E-09 
1.056E-09 
1.055E-09 
1.054E-09 
1.053E-09 
1.052E-09 
1.051E-09 
1.050E-09 
9.820E-10 
9.810E-10 
9.800E-10 
9.790E-10 
9.780E-10 
9.770E-10 
9.760E-10 
9.750E-10 
9.740E-10 
9.730E-10 
32 
Case Study – Electrical Characterization 
Suspect capacitor - group 3 
9.720E-10 
-60 -40 -20 0 20 40 60 80 100 120 
Temperature (°C) 
Capacitance (F) 
C7 SN2854 - 0632 
limit 1 
limit 2 
Temperature (°C) Dissipation factor 
Cap 4 - Bag 10 
Suspect capacitor - group 3 
1.0E-03 
9.0E-04 
8.0E-04 
7.0E-04 
6.0E-04 
5.0E-04 
4.0E-04 
3.0E-04 
2.0E-04 
1.0E-04 
1.2E-03 
1.0E-03 
8.0E-04 
6.0E-04 
4.0E-04 
2.0E-04 
0.0E+00 
-60 -40 -20 0 20 40 60 80 100 120 
Temperature (°C) 
Dissipation factor 
C7 SN2854 - 0632 
Suspect capacitor - group 2 
1.049E-09 
-60 -40 -20 0 20 40 60 80 100 120 
Temperature (°C) 
Capacitance (F) 
Cap 4 - Bag 10 
limit 1 
limit 2 
Suspect capacitor - group 2 
0.0E+00 
-60 -40 -20 0 20 40 60 80 100 120 
• Top 
– Within spec 
• Bottom 
– Out of spec
Electrical Characterization of Counterfeit Diodes 
33 
Breakdown: 
280V 
250V 
Breakdown: 
50V 
420V
Electrical Characterization of Counterfeit Diodes 
Recovery measurements 
Acceptable Waveform Counterfeit Waveform 
34
Electrical Characterization Cost vs. Benefit 
• $3K to $6K – passives, simple actives 
• One temperature for evaluation 
• $15K to $80K – characterization of complex IC, 
fixturing, test equipment 
• Potential for circuit board design, layout and 
fabrication costs to enable testing 
• COMMENT: you can’t afford the risk 
associated with buying expensive ICs from 
unknown suppliers 
35
Case Study – Mechanical Robustness 
• Thermal Shock Test (EIA-595 allows for 5 mil depth) 
36 
– 35% of counterfeit caps had had unacceptable 
chip-outs 
Pictures of chip-outs of counterfeit capacitors (left) and OCM capacitors (right)
Mechanical Robustness-Cost vs. Benefit 
• $2K to $5K 
• Thermal cycling or other testing to verify 
component is not counterfeit 
37
38 
DPA 
• $7 to $10K passives 
• $8 to $12K actives 
• Step by Step analytical approach to identifying 
whether a device is counterfeit using all tools 
available.
39 
Example of SAC part labeled SnPb
40 
Conclusion 
• Counterfeits are a real threat and growing 
– Complex supply chain provides multiple entry 
points 
• Risk needs to be managed through a decision 
matrix 
– Probability / Mission Risk / Volumes 
• Helps provide clear boundaries and guidelines 
for mitigation practices 
• Costs are not prohibitive and should be 
chosen as a function of risk mitigation

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Counterfeit prevention & detection strategies, how to do it, when to do it.

  • 1. Counterfeit Prevention & Detection Strategies: How To Do It, When To Do It Greg Caswell DfR Solutions, LLC College Park, MD USA
  • 2. Purpose • Provide insight into the relative capabilities and costs of the different methodologies for identifying and mitigating counterfeit electronic components from reaching installation in an application
  • 3. Outline • Introduction • Supply Chain Issues • Decision Matrix and Case Study Example • Detection Techniques – Visual Inspection – X-Ray – Electrical Characterization – Mechanical Robustness – DPA • Conclusions
  • 4. Introduction • This presentation addresses the unique sources of counterfeit components and provides insights into how they occur. – Counterfeit components are a rapidly growing area of concern. The Department of Commerce has identified a 141% increase in the last three years alone! – Counterfeit Parts are no longer an emerging threat: they’re real, and they’re here to stay. – A counterfeit is any item that is not as it is represented with the intention to deceive its’ buyer or user. The misrepresentation is often driven by the known presence of defects or other inadequacies in regards to performance. Whether it is used for a commercial, medical or military application, a counterfeit component can cause catastrophic failure at a critical time. – Detection methodologies, such as visual inspection, mechanical robustness, X-Ray, XRF, C-SAM, Infrared Thermography, electrical characterization, decapsulation, and marking evaluations will be compared and contrasted. – Multiple examples of counterfeit parts identified using these techniques will be highlighted.
  • 5. 5 Environmental Legislation • Providing additional opportunities – Recycling – Need for obsolete SnPb parts
  • 6. 6 EIA/G-12 Committee Strategy • TB-0003-2009 Counterfeit Parts & Materials Risk Mitigation Prevention Detection Mitigation
  • 7. 7 Prevention • EIA/G-12 Recommendation – “<sic> only procure from the Original Component Manufacturer (OCM) that makes and warranties the part or material or their designated franchisees.” • Procuring from OCM’s – Unrealistic for Military / Government programs – Volumes too low • Procuring from designated franchisees – Component availability from designated franchisees is often similar to that of OCM
  • 8. 8 Designated Franchisees • Military / Government contractors standardizing sourcing plans – Lists of approved sources (Authorized Source Directory) – Other sources by exception and with specific approvals • Approval process – Audit based on quality system – Risk assessment to the program – Development of an inspection / test plan http://www.authorizedcomponents.com/manufacturers.html Use of Authorized Franchisees does not eliminate risk
  • 9. 9 Complex Supply Chains • Multiple points of entry • Porous return policies Lloyd Condra, Boeing
  • 10. Counterfeit Parts Defined What are they? What is their impact? Where do they come from? Identification Industry Countermeasures Avoidance Mitigation
  • 11. Top Four Types of Counterfeits • Used product marked as higher grade new product • These types of counterfeit parts may work, but will not operate at the same level as the higher grade part and may fail under stress that would be expected under normal conditions. • Electronics recycling or salvage sources • Fake, non-working product • Disguised parts • Defective Scrap • Inside sources • New product re-marked as higher grade product • Like re-marked used product, re-marked new product will work, but not at the desired level of functionality.
  • 12. Primary Sources of Counterfeit Parts • Most counterfeit parts come from parts brokers that deal in small and odd lots • Low volume of obsolete parts bought off the internet • Authorized parts distributors rarely have counterfeits because they receive them directly from the original component manufacturer (OCM) • Regions with highest counterfeit activity: • China • Middle East • Eastern Europe • But truly a global problem!
  • 13. 13 Decision Process • If prevention is not realistic, when to detect? How to mitigate? • Entry for counterfeit components is cost – Cost to procure < cost of redesign (+ requal, etc.) – If cost to mitigate is too high, then simply redesign • How to determine the appropriate cost to detect and mitigate? – Driven by probability / mission risk / volume matrix
  • 14. 14 Decision Matrix Probability of Counterfeit
  • 15. 15 Counterfeit Probability • Probability of counterfeit (per shipment) tends to display order of magnitude dependence on component source – May vary based on supply chain and component technology Known: Existing business relationship Unknown: No existing business relationship (e.g., eBay)
  • 16. 16 Case Study • Telecom OEM procures one reel of capacitors from known broker – End-of-life (EOL) product • Decision Matrix Probability is 2% Volume is 4000 parts Mission Risk is $5M Eight capacitors per CCA (500 CCAs) $10K cost of quality ($5K COGS + $1K service + $4K loss of market) • DfR recommended that $10K to $100K should be spent on counterfeit detection and mitigation – Industry ROI can be 1:1 to 10:1
  • 17. 17 Detection of Counterfeits • Counterfeiters are increasingly sophisticated • Use of actual parts at the start and end of a reel – Challenges sampling techniques • Inspection and comparison of known-good to possible counterfeits – Markings – Internal structure – Performance measurement
  • 18. 18 Detection Techniques Visual / Marking Inspec-tion T. Apple 610-531-5484 Verificati on of Manuf. LDC, SNs, etc. Mater-ial Analy-sis Seal Test Radio-graphic DPA Minimal Electrical Test Full Electri-cal Test (Am-bient) Full Electrical Test (Hot / Cold Am-bient) Test & Burn-in Test, Burn-in and QCI No Die / Non-functional No No No No Yes Yes Yes Yes Yes Yes Yes Material Content P No Yes No No Yes No No No No No Wrong Die P P No No P Yes Yes Yes Yes Yes Yes Re-used / Repaired / Salvaged P No P P P P No No No No No Scrapped / Reject P No No P P P P P P Yes Yes Mechanical Damage Yes No No P P Yes P P P P P Mis-Handling / Storage No No No P No P P Yes Yes Yes Yes Manufacturer Change P P P No P Yes P P P P P Less Reliable Parts P P P No No P No P P P P Reliability / Quality Issue No No No No P P No P P Yes Yes ESD / EOS Damage No No No No No P P P P Yes Yes Counterfeit with functional die P P P No P P P P Yes Yes Yes Temperature Range Upmarking No P No No No P No No Yes Yes Yes Code: This chart was developed from one created by Mark Marshall of Integra Technologies. No = Unlikely to Find Shading: Green = Low Cost / Easily Accomplished Yellow = Moderate Cost / Some time involved Red = High Cost / Significant time to accomplish Dotted Pattern = Will be found at first electrical test Counterfeit Concern P = Possibly Find Yes = Probably Find Detection/Risk Mitigation Methods
  • 19. 19 Detection Techniques (cont.) Cost & Schedule The more spent, the more time taken, the more confidence in reliability Add post burn-in full electrical tests over temperature Add full ambient electrical tests Add full electrical tests over temperature Add material check / seal test / radio-graphic or do basic electrical testing Moderate cost / repairable-replaceable / non-mission critical Add QCI and other lot acceptance testing Add DPA Add burn-in Low cost / repairable / redundant systems T. Apple 610-531-5484 theodore.s.apple@lmco.com 3/27/2007 Item End-Use Requirements High cost / non-repairable / mission critical Reliability (Probability of Detection) C of C Only Check Alerts Visual Inspection
  • 20. 20 Case Study – Visual Inspection • Five different capacitor types in one reel Capacitor Group 1, Fluorescent Light - Dark Brown Capacitor Group 2, Fluorescent Light - Pink Capacitor Group 3, Fluorescent Light - Greenish Gray Capacitor Group 5, Fluorescent Light - Light Brown Capacitor Group 4, Fluorescent Light - Bluish Gray
  • 21. 21 Visual 1 2 3 • Which is counterfeit? – The one with markings? Or the two that seem to have none? • Two samples are non-functional and one functions
  • 22. • Customer experienced two failures • Left: known good part; center and right: bad parts • Center part: no die; right part: cracked die 22 1 2 3
  • 23. 23 Date Code Marking - Differences 2.22 12.00 3.18 Registration (mm) 12.00 Surface Smooth Even Textured Uneven Lettering Uniform depth Uneven depth
  • 24. Blacktopping Defined • Blacktopping is a counterfeiting technique where the counterfeiter: – Takes components, usually real, but discarded – Sands them to remove the original component marking – Blacktops them in order to hide the original marking – Prints them with fake markings. – Investigators able to dissolve the blacktop with a solvent solution that revealed the true identity of the components. • Many blacktopped components can be uncovered by vigorously wiping acetone on the component – But, methods used to blacktop sanded parts improve daily
  • 25. L01, remarked date code, VC36 changed to GC33 L011, hynix part 25 Examples of Blacktopping Just under top surface, date code mismatch and hynix part
  • 26. Blacktopping and Acetone Wipe Test • Appearance After Acetone Wipe: change in texture and finish Evidence of Sanding: Visible after blacktopping is removed Photos courtesy of Oxygen Electronics
  • 27. 27 Visual Inspection Cost vs. Benefit • $1K to $3K • Identify color differences in parts • Ascertain marking imperfections/changes/blacktopping • Lead finish and variability • Co-planarity of leads – reused parts
  • 28. Case Study: Counterfeit FETS-X-Ray • Customer has an issue 28 with DC to DC converter failures • Simulation models did not predict the failures • X-ray inspection of the failed units Parallel FETS
  • 29. 29 Loose Parts Z436, Z536 Z536 Z536 EZ609 Z536
  • 30. 30 Summary This is not an STS25NH3LL Part, does not meet resistance specifications. Its higher drain to source resistance will cause its parallel FET partner to carry all the current. This part is present in the failed KT Master module FETs with large die have similar resistances and electrical performance, regardless of lead frame style
  • 31. 31 X-Ray Cost vs Benefit • $1K to $3K • Verification of die and wire bonding pattern • Internal construction of component • Die bonding delamination issues • Die attach voiding
  • 32. 1.057E-09 1.056E-09 1.055E-09 1.054E-09 1.053E-09 1.052E-09 1.051E-09 1.050E-09 9.820E-10 9.810E-10 9.800E-10 9.790E-10 9.780E-10 9.770E-10 9.760E-10 9.750E-10 9.740E-10 9.730E-10 32 Case Study – Electrical Characterization Suspect capacitor - group 3 9.720E-10 -60 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Capacitance (F) C7 SN2854 - 0632 limit 1 limit 2 Temperature (°C) Dissipation factor Cap 4 - Bag 10 Suspect capacitor - group 3 1.0E-03 9.0E-04 8.0E-04 7.0E-04 6.0E-04 5.0E-04 4.0E-04 3.0E-04 2.0E-04 1.0E-04 1.2E-03 1.0E-03 8.0E-04 6.0E-04 4.0E-04 2.0E-04 0.0E+00 -60 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Dissipation factor C7 SN2854 - 0632 Suspect capacitor - group 2 1.049E-09 -60 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Capacitance (F) Cap 4 - Bag 10 limit 1 limit 2 Suspect capacitor - group 2 0.0E+00 -60 -40 -20 0 20 40 60 80 100 120 • Top – Within spec • Bottom – Out of spec
  • 33. Electrical Characterization of Counterfeit Diodes 33 Breakdown: 280V 250V Breakdown: 50V 420V
  • 34. Electrical Characterization of Counterfeit Diodes Recovery measurements Acceptable Waveform Counterfeit Waveform 34
  • 35. Electrical Characterization Cost vs. Benefit • $3K to $6K – passives, simple actives • One temperature for evaluation • $15K to $80K – characterization of complex IC, fixturing, test equipment • Potential for circuit board design, layout and fabrication costs to enable testing • COMMENT: you can’t afford the risk associated with buying expensive ICs from unknown suppliers 35
  • 36. Case Study – Mechanical Robustness • Thermal Shock Test (EIA-595 allows for 5 mil depth) 36 – 35% of counterfeit caps had had unacceptable chip-outs Pictures of chip-outs of counterfeit capacitors (left) and OCM capacitors (right)
  • 37. Mechanical Robustness-Cost vs. Benefit • $2K to $5K • Thermal cycling or other testing to verify component is not counterfeit 37
  • 38. 38 DPA • $7 to $10K passives • $8 to $12K actives • Step by Step analytical approach to identifying whether a device is counterfeit using all tools available.
  • 39. 39 Example of SAC part labeled SnPb
  • 40. 40 Conclusion • Counterfeits are a real threat and growing – Complex supply chain provides multiple entry points • Risk needs to be managed through a decision matrix – Probability / Mission Risk / Volumes • Helps provide clear boundaries and guidelines for mitigation practices • Costs are not prohibitive and should be chosen as a function of risk mitigation