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<ul><li>The following presentation contains proprietary information regarding The SMT Corp stringent quality control progr...
SMT Overview <ul><li>Established in 1995. </li></ul><ul><li>Independent Stocking Distributor of Electronic Components and ...
Facility Overview <ul><li>72,000 sf. facility specifically engineered for the proper storage, inspection, and distribution...
 
Facility Security
Dehumidification System
ESD Floor Treatments
ESD Air-lock
SMT Corporation  Certifications & Memberships <ul><li>ISO9001:2000  CERTIFIED </li></ul><ul><li>AS9120:2002  CERTIFIED </l...
CHINESE COUNTERFEIT MARKETS <ul><li>First hand look at the problem of counterfeit components created in Shantou China and ...
 
Electronic Debris Stored in Front and Back Yards seen while driving through city streets (SHANTOU)
 
 
 
 
Shantou Warehouse: Boards stacked, waiting for chip removal
 
 
Components Being Washed in River & Laid on Bank to Dry (Shantou)
Washing components in river
Components on river bank drying
Pulled Components Drying on City Sidewalks, Then Separated by Type
 
0402 Case Size Capacitors ( $.005 ea from Fran. Disty)
Components Sorted by Sifting
 
 
 
Components Being Made Ready for Refurbishment or Counterfeiting
 
 
 
 
Counterfeiting District where Refurbishing, Remarking, and Repackaging occurs.  Residence housing located above
 
Remarked counterfeit components  ready for counterfeit packaging and distribution thru Shenzhen’s global market
 
City of Shenzhen:  Counterfeit Component Marketplace - Entry point into the global electronics market
 
 
 
 
Scope of Counterfeit Problem <ul><li>Business Week, October 13 th  2008:   </li></ul><ul><li>“ Robert P. Ernst who heads R...
<ul><li>Approximately 5% to 7% of the world trade is in counterfeit goods. </li></ul><ul><ul><li>Source: IACC </li></ul></...
Scope of Counterfeit Problem continued <ul><li>ERAI Inc, receives 200 suspect counterfeit part complaints per  month </li>...
Development of a Stringent Counterfeit Mitigation Process
Equipment Required for Component Authentication & Quality <ul><li>Real Time X-ray  </li></ul><ul><li>Acid Etch Decapsulati...
Visual Inspection Documented  And   Retained Data
Please Note: The following Photos, X-Ray Images, Video Clips and Test Data are from  SMT Corp’s in-house  component lab.
 
 
CERTIFIED INSPECTORS <ul><li>1 year of on-site training in the proper handling, inspection, and authentication of electron...
 
Preliminary  Visual Inspection Checklist
Packaging Inspection
Counterfeit Label  Red Flags <ul><li>Misspelling </li></ul><ul><li>Inconsistent Logo Fonts or Layouts </li></ul><ul><li>In...
Counterfeit factory box
LOGO AUTHENTICATION FAKE REAL
 
 
Counterfeit OCM “Certificates of Compliance” (C of C)
Counterfeit C of C
Counterfeit C of C
Counterfeit C of C
 
Inspection Continued <ul><li>Visual Inspection and comparison to manufacturers product specifications. </li></ul>
Datasheet Comparison
Mechanical Verification
Component Package Verification & Condition
Microscopy Inspection Documented Images of Microscopic Inspection
Microscopic Inspection
FRONT IMAGE REAR IMAGE
Visual Inspection Marking Permanency & Black Topping
Marking Permanency
Sanded Surface Area Original Original
1997 parts remarked as 2006:  Nine years difference
After part permanency test Before part permanency test Different Part Number and Date code 1 2 3
Before After
Sanding Marks Under Black-Topping
Contamination
Laser-Etch remarking still visible after black topping has been removed
After Black-Top Removal Laser-Etch Still Remains
Baked-On Black-Topping Scraping required to remove finish
Correct Part Remarked with Wrong Date Code & Revision   =  POTENTIAL DISASTER <ul><li>Black topped / remarked parts of the...
Example:  Your  product was designed with the functionality features of revision  “C2”, although you unknowingly have rema...
B1 has 13 bugs that C2 does not
<ul><li>New features may not be present in older devices </li></ul><ul><li>“ Show stopper” bugs may be present in older de...
 
Decapsulation & DIE Verification Documented  Photographic Data Obtained
 
 
 
 
 
 
 
 
The following slides demonstrate the value of overlaying the mfg’s pin-out schematic onto the actual die photo to aid in D...
 
 
 
 
 
 
 
PLCC
 
 
BGA
 
 
Metal Can Decap
SOT-23 (3mm) 3mm
2.11mm 35 Micro-X (2.11mm)
Real Time X-Ray Imaging Documented  images using Real Time X-Ray
X-Ray Inspection Goals <ul><li>DIE presence </li></ul><ul><li>Wire bond pattern & condition </li></ul><ul><li>Lead frame p...
 
 
Match pin-out to datasheet
Match pin-out to datasheet
Match bond-out to mask
 
 
ESD damage seen by X-Ray
No ESD Damage
ESD Damage
ESD Damage
 
BGA
BGA wire bonds
Images taken through mfg’s tubes
Components as seen through manufacturer’s tubes
Images taken through sealed bags
Components in trays as seen through sealed bags
Die Example of a 82C55A from  four  different manufacturers <ul><li>Distinguishing Features: </li></ul><ul><li>Die size an...
Intel Harris Intersil OKI
Intel Harris Intersil OKI Doubled power & ground bond wires
Intel 8255A NEC 8255A GND GND <ul><li>8255A Bond wire connections to the die paddle </li></ul><ul><li>From lead frame </li...
Side View X-Ray <ul><li>Per MIL-STD-883G Method 2012 </li></ul><ul><li>Reveals  </li></ul><ul><ul><li>Taut and loose bond ...
 
 
XRF RoHS Testing Documented Verification   Leaded vs. Non-Leaded Components
 
 
 
 
 
 
Solderability Testing Documented Verification Component Solderability
 
Bath Test Globule Test
Wetting Curve Time Force Minimum amount of force required to pass PASS
 
Documented and retained test data
Unreliable “ Dip & Look” Method
No Captured Data Captured Data
Baking & Dry Packing
Large lots
 
Small lots
 
 
 
 
 
In-House Tape & Reel
 
Robotic Tape & Reel with Automated Optical Inspection for  High-Reliability Applications
 
 
DOCUMENTED  INSPECTION REPORT PROVIDED WITH ORDER <ul><li>Summary of all data collected utilizing the previous inspection ...
 
 
 
 
 
 
 
 
 
 
 
Sustained level of business maturity Established track record and quality recognition Recognized quality management system...
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Linkedin Defense And Aerospace Procurement

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Presentation regarding the standards Independent Electronic Component Distributors should utilize to mitigate risk and financial exposure of there primes and subs.

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Linkedin Defense And Aerospace Procurement

  1. 2. <ul><li>The following presentation contains proprietary information regarding The SMT Corp stringent quality control program, in-house testing procedures, and documentation. </li></ul><ul><li>Distribution of this presentation outside the intended recipients without permission from SMT Corp is strictly prohibited. </li></ul>Confidentiality
  2. 3. SMT Overview <ul><li>Established in 1995. </li></ul><ul><li>Independent Stocking Distributor of Electronic Components and Peripherals. </li></ul><ul><li>Located in S.W. Connecticut approximately 1.5 hours from N.Y.C. and 2.5 hours from Boston. </li></ul><ul><li>Woman Owned Small Business </li></ul>
  3. 4. Facility Overview <ul><li>72,000 sf. facility specifically engineered for the proper storage, inspection, and distribution of ESD and humidity sensitive electronic components </li></ul><ul><li>Over 100,000 line items in-stock from over 600 manufacturers. </li></ul><ul><li>Actives, Passives, IC’s, Discrete’s, Connectors, LCD’s and Peripherals. </li></ul>
  4. 6. Facility Security
  5. 7. Dehumidification System
  6. 8. ESD Floor Treatments
  7. 9. ESD Air-lock
  8. 10. SMT Corporation Certifications & Memberships <ul><li>ISO9001:2000 CERTIFIED </li></ul><ul><li>AS9120:2002 CERTIFIED </li></ul><ul><li>ISO14001:2004 CERTIFIED </li></ul><ul><li>OHSAS 18001:2007 CERTIFIED </li></ul><ul><li>ANSI/ESD-20.20:2007 CERTIFIED </li></ul><ul><li>WBENC CERTIFIED </li></ul><ul><li>IDEA MEMBER </li></ul><ul><li>ERAI MEMBER </li></ul><ul><li>EPA REGISTERED </li></ul>
  9. 11. CHINESE COUNTERFEIT MARKETS <ul><li>First hand look at the problem of counterfeit components created in Shantou China and sold into the Shenzhen China Global Market. </li></ul><ul><li>Pictures by Tom Sharpe of </li></ul><ul><li>SMT CORP </li></ul>
  10. 13. Electronic Debris Stored in Front and Back Yards seen while driving through city streets (SHANTOU)
  11. 18. Shantou Warehouse: Boards stacked, waiting for chip removal
  12. 21. Components Being Washed in River & Laid on Bank to Dry (Shantou)
  13. 22. Washing components in river
  14. 23. Components on river bank drying
  15. 24. Pulled Components Drying on City Sidewalks, Then Separated by Type
  16. 26. 0402 Case Size Capacitors ( $.005 ea from Fran. Disty)
  17. 27. Components Sorted by Sifting
  18. 31. Components Being Made Ready for Refurbishment or Counterfeiting
  19. 36. Counterfeiting District where Refurbishing, Remarking, and Repackaging occurs. Residence housing located above
  20. 38. Remarked counterfeit components ready for counterfeit packaging and distribution thru Shenzhen’s global market
  21. 40. City of Shenzhen: Counterfeit Component Marketplace - Entry point into the global electronics market
  22. 45. Scope of Counterfeit Problem <ul><li>Business Week, October 13 th 2008: </li></ul><ul><li>“ Robert P. Ernst who heads Research into Counterfeit Parts for the Naval Air Systems Command’s aging aircraft program in Patuxent River, Maryland, estimates as many as 15% of all spare microchips the Pentagon buys are counterfeit.” </li></ul>
  23. 46. <ul><li>Approximately 5% to 7% of the world trade is in counterfeit goods. </li></ul><ul><ul><li>Source: IACC </li></ul></ul><ul><li>Current value of counterfeit components ranges from $1b and $10b annually. </li></ul><ul><ul><li>Source: IACC </li></ul></ul>Scope of Counterfeit Problem continued
  24. 47. Scope of Counterfeit Problem continued <ul><li>ERAI Inc, receives 200 suspect counterfeit part complaints per month </li></ul><ul><li>ERAI Inc, has confirmed more than 2800 brokers selling counterfeit components </li></ul>
  25. 48. Development of a Stringent Counterfeit Mitigation Process
  26. 49. Equipment Required for Component Authentication & Quality <ul><li>Real Time X-ray </li></ul><ul><li>Acid Etch Decapsulation </li></ul><ul><li>Microscopy Equipment </li></ul><ul><li>XRF Tester (RoHS) </li></ul><ul><li>Solderability Tester </li></ul><ul><li>Baking & Dry packing equipment </li></ul>
  27. 50. Visual Inspection Documented And Retained Data
  28. 51. Please Note: The following Photos, X-Ray Images, Video Clips and Test Data are from SMT Corp’s in-house component lab.
  29. 54. CERTIFIED INSPECTORS <ul><li>1 year of on-site training in the proper handling, inspection, and authentication of electronic components is required before an employee is eligible to take the IDEA ICE 3000 certification exam at SMT Corp. </li></ul>
  30. 56. Preliminary Visual Inspection Checklist
  31. 57. Packaging Inspection
  32. 58. Counterfeit Label Red Flags <ul><li>Misspelling </li></ul><ul><li>Inconsistent Logo Fonts or Layouts </li></ul><ul><li>Inconsistent Packaging Materials </li></ul><ul><li>Non-Factory ESD indicators </li></ul><ul><li>Specs inconsistent with normal manufacturers specs. </li></ul>
  33. 59. Counterfeit factory box
  34. 60. LOGO AUTHENTICATION FAKE REAL
  35. 63. Counterfeit OCM “Certificates of Compliance” (C of C)
  36. 64. Counterfeit C of C
  37. 65. Counterfeit C of C
  38. 66. Counterfeit C of C
  39. 68. Inspection Continued <ul><li>Visual Inspection and comparison to manufacturers product specifications. </li></ul>
  40. 69. Datasheet Comparison
  41. 70. Mechanical Verification
  42. 71. Component Package Verification & Condition
  43. 72. Microscopy Inspection Documented Images of Microscopic Inspection
  44. 73. Microscopic Inspection
  45. 74. FRONT IMAGE REAR IMAGE
  46. 75. Visual Inspection Marking Permanency & Black Topping
  47. 76. Marking Permanency
  48. 77. Sanded Surface Area Original Original
  49. 78. 1997 parts remarked as 2006: Nine years difference
  50. 79. After part permanency test Before part permanency test Different Part Number and Date code 1 2 3
  51. 80. Before After
  52. 81. Sanding Marks Under Black-Topping
  53. 82. Contamination
  54. 83. Laser-Etch remarking still visible after black topping has been removed
  55. 84. After Black-Top Removal Laser-Etch Still Remains
  56. 85. Baked-On Black-Topping Scraping required to remove finish
  57. 86. Correct Part Remarked with Wrong Date Code & Revision = POTENTIAL DISASTER <ul><li>Black topped / remarked parts of the same manufacturer and part number may have substantial functional differences. </li></ul>
  58. 87. Example: Your product was designed with the functionality features of revision “C2”, although you unknowingly have remarked components from die revision “B1”.
  59. 88. B1 has 13 bugs that C2 does not
  60. 89. <ul><li>New features may not be present in older devices </li></ul><ul><li>“ Show stopper” bugs may be present in older devices </li></ul>ERRATA
  61. 91. Decapsulation & DIE Verification Documented Photographic Data Obtained
  62. 100. The following slides demonstrate the value of overlaying the mfg’s pin-out schematic onto the actual die photo to aid in DIE verification.
  63. 108. PLCC
  64. 111. BGA
  65. 114. Metal Can Decap
  66. 115. SOT-23 (3mm) 3mm
  67. 116. 2.11mm 35 Micro-X (2.11mm)
  68. 117. Real Time X-Ray Imaging Documented images using Real Time X-Ray
  69. 118. X-Ray Inspection Goals <ul><li>DIE presence </li></ul><ul><li>Wire bond pattern & condition </li></ul><ul><li>Lead frame pattern & condition </li></ul><ul><li>Detect ESD damage </li></ul><ul><li>Verify pin-out vs. data sheet </li></ul><ul><li>Verify die & bond-out match </li></ul>
  70. 121. Match pin-out to datasheet
  71. 122. Match pin-out to datasheet
  72. 123. Match bond-out to mask
  73. 126. ESD damage seen by X-Ray
  74. 127. No ESD Damage
  75. 128. ESD Damage
  76. 129. ESD Damage
  77. 131. BGA
  78. 132. BGA wire bonds
  79. 133. Images taken through mfg’s tubes
  80. 134. Components as seen through manufacturer’s tubes
  81. 135. Images taken through sealed bags
  82. 136. Components in trays as seen through sealed bags
  83. 137. Die Example of a 82C55A from four different manufacturers <ul><li>Distinguishing Features: </li></ul><ul><li>Die size and shape </li></ul><ul><li>Bond-out patterns </li></ul><ul><ul><li>Distinctive irregular spacing </li></ul></ul><ul><ul><li>Doubled bond wires for power and ground </li></ul></ul>
  84. 138. Intel Harris Intersil OKI
  85. 139. Intel Harris Intersil OKI Doubled power & ground bond wires
  86. 140. Intel 8255A NEC 8255A GND GND <ul><li>8255A Bond wire connections to the die paddle </li></ul><ul><li>From lead frame </li></ul><ul><li>From die </li></ul>
  87. 141. Side View X-Ray <ul><li>Per MIL-STD-883G Method 2012 </li></ul><ul><li>Reveals </li></ul><ul><ul><li>Taut and loose bond wires </li></ul></ul><ul><ul><li>Die attachment </li></ul></ul>
  88. 144. XRF RoHS Testing Documented Verification Leaded vs. Non-Leaded Components
  89. 151. Solderability Testing Documented Verification Component Solderability
  90. 153. Bath Test Globule Test
  91. 154. Wetting Curve Time Force Minimum amount of force required to pass PASS
  92. 156. Documented and retained test data
  93. 157. Unreliable “ Dip & Look” Method
  94. 158. No Captured Data Captured Data
  95. 159. Baking & Dry Packing
  96. 160. Large lots
  97. 162. Small lots
  98. 168. In-House Tape & Reel
  99. 170. Robotic Tape & Reel with Automated Optical Inspection for High-Reliability Applications
  100. 173. DOCUMENTED INSPECTION REPORT PROVIDED WITH ORDER <ul><li>Summary of all data collected utilizing the previous inspection process and test equipment. </li></ul><ul><li>Test & inspection data verifying quality and authentication. </li></ul>
  101. 185. Sustained level of business maturity Established track record and quality recognition Recognized quality management system established ANSI ESD S20.20 Certification ISO 9001 Certification AS-9100 / AS-9120 Certification Recently audited and approved by third party accreditation Customer audited and approved with site visit In-house test equipment for counterfeit detection Product Liability & Errors and Omissions insurance AS5553 SMT QUALITY LAYERS (Additional)
  102. 186. Thank You

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