BGA Cleaning and Inspection

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This is one slide set in a multi part series on the BGA rework process. In this section the BGA cleaning and inspection process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.

Technology

BGA Rework-Cleaning and Inspection

Rework and Repair of PCBs
 Solder/Assembly Training
Rework/Repair Soldering Tools




www.solder.net

BGA Rework
I.
II.
III.

Why Rework
Scope of Material Covered
BGA Rework Process
A.
B.
C.
D.
E.
F.

IV.

Removal
Site Dressing
Placement
Reflow
Cleaning
Inspection

Materials

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BGA Rework-the process
Cleaning
Objective remove soils that will impact product reliability of a
PCB based on the end use environment and/or provide for
surface that will accept a subsequent coating.

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BGA Rework-the process
Cleaning
Objective remove soils

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BGA Rework-the process
Inspection-Visual
Objective assure that the rework process
performed meets the inspection criteria applicable

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BGA Rework-the process
Inspection - endoscope

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BGA Rework-the process
Inspection- Transmissive X-ray

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BGA Rework-the process
Inspection- Laminographic X-ray or CT scanning

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BGA Rework-the process

BGA XRAY inspection-3D
http://www.youtube.com/watch?v=7AQzccfwS

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BGA Rework-the process
Inspection- Inspection Criteria
•May involve visual assessment only
(Table 1-2 )
•Process validation can be used in lieu of XRay/Visual inspection provided objective
evidence is available
•Outside rows through visual inspection when
practical
•Alignment in both X and Y w/corner markers
on PCB (if present)

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Inspection- Inspection Criteria8.3.12 Surface Mount Area Array (cont.)
IPC-A-610 (collapsing balls)
Feature

Clause

Classes 1,2 and 3

Alignment

8.3.12.1

No violation of minimum
electrical clearance

Solder Ball
Spacing

8.3.12.2

No violation of minimum
electrical clearance

Soldering
Connections

8.3.12.3

Voids

8.3.12.4

No bridging. Solder balls
contact and wet to the land
forming connection of right
shape
25% or less voiding of any
ball in the xray image area

Underfill or staking
material

8.3.12.5

S8-11

Present and completely
cured

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$BGA Rework-the process Inspection- Inspection Criteria Target 1,2,3 -Uniform size and shape Acceptable 1,2,3-No bridging, continuous elliptical Process Indicator 1,2,3 –Non uniform size, color, shape Defect 1,2,3- solder bridging, waste showing paste did not flow together, fractured solder connection, no connect between ball and solder Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net$

BGA Rework-the process

Macrovoids

Planar Microvoids
(<1-2 mils)

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BGA Rework-the process

Microvia Voids

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BGA Rework-Materials
Flux
•
•
•

RoHS Issues
Higher processing temperatures
Longer time above liquidus

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BGA Rework-Materials
Solder
RoHS Issues
•Lower wettability
•Higher reflow temperatures
•Specialty rheology formulations for dipping

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This slide deck takes you through important elements of manula PCB inspection including some definitions, what makes a good inspector , what type of lighting is required to be able to see the important aspects of a PCB and the types of inspection aids. The slide deck ends with some real examples where the user is challenged to make a determination of defect/process indicator/acceptable of an electronics assembly in accordance with the IPC-A-610 and IPC-A-620 standards.

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The BGA reballing process is explained in this slide set. The need for reballing is explained as well as the diifferent methods of reballing as a function of the number of devicss to be reballed and the type of BGA package being reballed.A brief description of the reballing process as well as some of the inspection tools is also discussed.If BGA reballing services are required then contact information for BGA reballing is on the last slide.

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