USB 3.0 provides faster data transfer speeds of up to 5 Gbps compared to USB 2.0's 480 Mbps. It uses a dual-bus architecture with separate buses for USB 3.0 and USB 2.0 to allow for backwards compatibility. The USB 3.0 standard features a new cable structure that supports full-duplex communication over two twisted signal pairs for the SuperSpeed data path. It also provides power efficiency and up to 900mA of power for configured devices. USB 3.0's advantages include faster speeds, power efficiency, and backwards compatibility, making it likely to replace other interface standards.

1. SUPER SPEED USB3.0
Guided By :
Ms. Dipti Umalkar
Made by :
Shirish O. Bhrade
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2. INTRODUCTION
• The USB 3.0 Promoter Group announced on
November 17, 2008, version 3.0 and
submitted to USB-IF
• The first certified USB 3.0 consumer products
were announced January 5, 2010
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3. UNIVERSAL SERIAL BUS
• Designed to allow many peripherals to be
connected using a single standardized
interface socket.
• Consists of a host, USB ports, and peripheral
devices connected in a tiered-star topology
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4. How Communication
• Endpoint built into device by manufacturer
• Endpoint addressable by (device address ,
endpoint number)as specified in packet sent
by host
• If data from host to endpoint an OUT packet
sent
• If data from device to an IN packet sent by
host
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5. How Communication Established
Device Connected
Enumeration starts by sending reset signal
Data rate of device determined
Device Assigned a unique address
If host supports device, driver loaded
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6. Past----->Present
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USB-IF formed
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USB 1.0 specification
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USB 2.0 specification
480 Mbit/s
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USB 3.0 specification
5 Gbit/s
2010
12 Mbit/s
USB 3.0 devices in market
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7. WHY USB 3.0
• Popularity
• Transfers HD data in short time
• Superior than its competitors
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8. FEATURES
• Dual bus architecture
• Cable sructure supporting full duplex
transmission
• Connector supporting cable structure
• Power
• Link level power management
• Asynchronous notify
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9. DUAL BUS ARCHITECTURE
• USB 3.0 is a
physical
SuperSpeed
bus combined
in parallel with
a physical USB
2.0 bus
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10. CABLE STRUCTURE
• One power pair
• One twisted signal pair for USB 2.0 data path
• Two twisted signal pairs for the SuperSpeed
data path.
• Supports full duplex mode
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11. CONNECTOR PINS
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12. Power
• 50% more power provided(100-150mA)for
unconfigured device.
• 80%more power provided(500-900mA)for
configured device.
• Link level power management
• Continous device polling eliminated
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13. SUPER SPEED ARCHITECTURE
Protocol layer
Link layer
Physical layer
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14. PHYSICAL LAYER
• Physical connection between downstream
port and upstream port
• If connected reciever termination enabled
• No signalling occurs generates LFPS
• 8 bit data scrambled and encoded to 10
bit,sends to link layer
• Link layer to physical
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15. LINK LAYER
•
•
•
•
Link level power management
Insertion of packet delimiters
Receive and manage packets
Interface between protocol layer
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16. PROTOCOL LAYER
• End to end communication
• Deals with protocols
• Reliable delivery
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17. SUPER SPEED CONNECTION
Device notifies it is connected
Host makes request
Device ready notifies this with ERDY
Else tells host unavailable to process by sending
NRDY
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18. SUPER SPEED TRANSFER
• Two channels
• No propagation delay
• Data bursting
• OUT-data packet contains address
information
• IN-sends packet with sequence number that
host tells
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19. USB 3.0 vs USB2.0
USB 3.0
USB 2.0
•Super speed
High speed
•Asynchronous notify Polling
•Link level power
management
No such properties
•900 mA power
500 mA
•Full duplex
Half duplex
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20. ADVANTAGES
•
•
•
•
Super speed
Power efficiency
Efficient when compared to its competitors
Backward compatibility
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21. DRAWBACK
• Intel at present not supporting
• Cable length limited to 3m
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22. FUTURE
• Twisted pair cable replaced by optical fibre
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23. CONCLUSION
• USB 3.0 wil also be popular like earlier
versions.
• Will replaces firewire etc
• As it is backward compatible it will be used in
the new computers and devices
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24. QUESTIONS??

25. THANK YOU
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