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USB 2.0 and 3.0
USB 3.0 provides faster data transfer speeds of up to 5 Gbps compared to USB 2.0's 480 Mbps. It uses a dual-bus architecture with separate buses for USB 3.0 and USB 2.0 to allow for backwards compatibility. The USB 3.0 standard features a new cable structure that supports full-duplex communication over two twisted signal pairs for the SuperSpeed data path. It also provides power efficiency and up to 900mA of power for configured devices. USB 3.0's advantages include faster speeds, power efficiency, and backwards compatibility, making it likely to replace other interface standards.
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Introduction of USB 3.0 by the Promoter Group in 2008, first certified products in 2010.
USB allows multiple peripheral connections via a standardized interface with a tiered-star topology.
Communication established through device endpoints, packet types (IN/OUT), and device enumeration.
Timeline from USB 1.0 through USB 3.0, showing the advancements in speed from 12 Mbit/s to 5 Gbit/s.
USB 3.0 offers high popularity and HD data transfer speeds, outperforming competitors.
Technical features include a dual bus architecture supporting full duplex and enhanced cable structure.
Increased power supply for devices ensuring better performance and management.
Explanation of the super speed architecture with protocol, link, and physical layers.
Device connection notifications and how super speed transfers occur with efficiency.
Comparison of USB 3.0 and USB 2.0 highlighting advantages like speed, power efficiency, and compatibility.
Current challenges such as cable length limitations and future potential with optical fiber.
USB 3.0 expected to replace older technologies, ensuring popularity and backward compatibility.
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USB 2.0 and 3.0
- 1. SUPER SPEED USB3.0 GuidedBy : Ms. Dipti Umalkar Made by : Shirish O. Bhrade 1
- 2. INTRODUCTION • The USB3.0 Promoter Group announced on November 17, 2008, version 3.0 and submitted to USB-IF • The first certified USB 3.0 consumer products were announced January 5, 2010 2
- 3. UNIVERSAL SERIAL BUS •Designed to allow many peripherals to be connected using a single standardized interface socket. • Consists of a host, USB ports, and peripheral devices connected in a tiered-star topology 3
- 4. How Communication • Endpointbuilt into device by manufacturer • Endpoint addressable by (device address , endpoint number)as specified in packet sent by host • If data from host to endpoint an OUT packet sent • If data from device to an IN packet sent by host 4
- 5. How Communication Established DeviceConnected Enumeration starts by sending reset signal Data rate of device determined Device Assigned a unique address If host supports device, driver loaded 5
- 6. Past----->Present 1 USB-IF formed 1 USB 1.0specification 1 USB 2.0 specification 480 Mbit/s 1 USB 3.0 specification 5 Gbit/s 2010 12 Mbit/s USB 3.0 devices in market 6
- 7. WHY USB 3.0 •Popularity • Transfers HD data in short time • Superior than its competitors 7
- 8. FEATURES • Dual busarchitecture • Cable sructure supporting full duplex transmission • Connector supporting cable structure • Power • Link level power management • Asynchronous notify 8
- 9. DUAL BUS ARCHITECTURE •USB 3.0 is a physical SuperSpeed bus combined in parallel with a physical USB 2.0 bus 9
- 10. CABLE STRUCTURE • Onepower pair • One twisted signal pair for USB 2.0 data path • Two twisted signal pairs for the SuperSpeed data path. • Supports full duplex mode 10
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- 12. Power • 50% morepower provided(100-150mA)for unconfigured device. • 80%more power provided(500-900mA)for configured device. • Link level power management • Continous device polling eliminated 12
- 13. SUPER SPEED ARCHITECTURE Protocollayer Link layer Physical layer 13
- 14. PHYSICAL LAYER • Physicalconnection between downstream port and upstream port • If connected reciever termination enabled • No signalling occurs generates LFPS • 8 bit data scrambled and encoded to 10 bit,sends to link layer • Link layer to physical 14
- 15. LINK LAYER • • • • Link levelpower management Insertion of packet delimiters Receive and manage packets Interface between protocol layer 15
- 16. PROTOCOL LAYER • Endto end communication • Deals with protocols • Reliable delivery 16
- 17. SUPER SPEED CONNECTION Devicenotifies it is connected Host makes request Device ready notifies this with ERDY Else tells host unavailable to process by sending NRDY 17
- 18. SUPER SPEED TRANSFER •Two channels • No propagation delay • Data bursting • OUT-data packet contains address information • IN-sends packet with sequence number that host tells 18
- 19. USB 3.0 vsUSB2.0 USB 3.0 USB 2.0 •Super speed High speed •Asynchronous notify Polling •Link level power management No such properties •900 mA power 500 mA •Full duplex Half duplex 19
- 20. ADVANTAGES • • • • Super speed Power efficiency Efficientwhen compared to its competitors Backward compatibility 21
- 21. DRAWBACK • Intel atpresent not supporting • Cable length limited to 3m 22
- 22. FUTURE • Twisted paircable replaced by optical fibre 23
- 23. CONCLUSION • USB 3.0wil also be popular like earlier versions. • Will replaces firewire etc • As it is backward compatible it will be used in the new computers and devices 24
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