A Professional Connector Maker in HF I/O Field Company Profile Date: Dec’08 Prepared By: Frank Chen Email: frank@mainsuper.com.tw
Company Milestone 1984  Taiwan headquarter established 1994  ISO 9002 certificate 1997  China Factory 1 built-up 2000  ISO 9001 certificate 2003  SONY GP certificate 2003  Lab built-up 2004  China Factory 2 built-up 2007  IECQ QC080000 certificate 2008  ISO 14001 certificate
Competitive Advantage Meet Customer Requirement Capable of  TDR & NA verifications  in HF connector 3D mechanical design and simulation  analysis Improvement in production efficiency by auto assembly Institute the specification by joining the association: 1. HDMI,  2. USB 2.0/3.0 3. Display Port 4. SATA 5. SD card ISO 14001 certificate Quality control by date code in laser marking Material Market Specification Product Development Manufacturing Quality Management In-house RoHS and Reliability Test Lab In-house tooling manufacturing Material control with Sony GP & RoHS  compliance  Halogen-Free available
Technical Leading Main Super is aggressive to institute the specification by becoming an adopter of the association.  HDMI USB 2.0 /3.0 DisplayPort SATA SD Card
Engineering Capability Design Theory –  Technological cooperation with Taiwan ITRI     Design tool –  VNA, OSD      One Space Designer Genesys VNA
Engineering Capability Precision  Stamping Tooling: 0.002 mm   Mold Tooling: 0.005 mm   Finished product : 0.4 mm Pitch Debugging  High-frequency tester as TDR, NA   Microfocus X-Ray Television System Mass Production  Gaugeable production lines Automated production lines Mark printing for tracing
3D Design Tool  ー   OSD
High-Frequency Tester  -   TDR
High-Frequency Tester  -   NA
Mechanical Analysis Tester  –  Microfocus X-Ray Television System Microfocus X-Ray Television System
Mechanical Tester  -  Durability
Product Roadmap USB 1394 HDMI & DisplayPort Solution for smart cable
Main Products DVI  HDMI  HP (SCSI) IEEE 1394  SATA  SD/Micro-SD Card Holder USB-STD/USB Mini/Micro-USB USB 3.0 Adapter  ODM/OEM Cases
Manufacturing Tooling with tapping Metal Stamping Lines Resin Injection Lines Tooling Shop
Manufacturing Insert-Molding Lines Auto-Ass’y M/C Sub-Auto Ass’y Lines Auto-Ass’y Lines
Strategic Business/Products 3.Tatung, Primax, Elka, Longwell 3.LogiTech, Inventech, JEM, JHL, FoxLink 3.SpeedTech, Longwell 2.HP, Samsung 2.Apple, Motorola, Jabra, Plantronics 2.Molex, Spacelabs, Amphenol 1.Panasonic, Sony, Canon, Sharp, Pioneer, Sanyo, Shinko, Marunix 1.Panasonic, Sony, Canon, Sharp, Pioneer, Shinko, Marunix 1. Tyco-AMP, Honda, ITT-Cannon, Jalco, Yamaichi HDMI-A & C & D  DVI  DFP Display Port USB STD/ USB Mini/ Micro USB/USB 3.0 1394-a & b  PCMCIA  Champ (SCSI) D-sub, Centronic , FFC, Slot Bus ... etc.  Stamping Metal Parts  Injection Plastic Pars Display Port 33% 48% 19% Audio/ Video Transmission  System Market Data  Transmission  System Market OEM/ODM  Market Market Market Products Products Customers Customers
Main Clients μ-USB A & B Foster ODM/ OEM USB/ USB Mini IEEE1394 A & B DVI D & I HDMI A & C
Milestone – Green System ISO 14001 certificate 2008 Q4, 2009 China factory built-up 1997 Sony G.P. certificate 2003 Cadmium Free Plant certificate 2004 Panasonic G.S. certificate Sony G.P. re-checked 2005 Lead Free Plant certificate 2006 IECQ/QC 080000 certificate  Samsung G.S. certificate   Sony G.P. re-checked  2007 ISO/TS16949 PLAN:
Green Managing System - RoHS SONY GP certificated in 2003 Cadmium-Free plant certificated in 2004 Green Managing System & Lab certificated in 2005 Lead-Free plant certificated in 2006 Halogen-Free phase-in  for Apple and Nokia in 2008
Quality Managing System - ISO/TS ISO 9001:2000 certificated in 2000 ISO/TS16949 system included in 2005 ISO 14001 certificated in 2008 ISO/TS16949 certificate planning in Q4, 2009
Environmental Protection System ISO 14001 certificated in 2008
RoHS Test Flow Chart Control Items for RoHS    鎘 (Cd) PBB PBDE 鉛 (Pb) 水銀 (Hg) X<  lower limit X>  upper limit Cd,Pb,Hg Cd,Pb,Hg lower limit  ≦X≦ upper limit lower limit ≦X Cd,Pb,Hg PASS NG Judgment Cr 6+ PBB PBDE <  limit ≧ limit 六価 鉻 ( Cr 6+ ) EDXRF Cr( 鉻 ),Br( 溴 ) Cr( クロム ),Br( 臭素 ) ICP-AES UV-VIS GC/MS Cd,Pb,Hg PASS NG
EX-RF Tester EDX-RF Tester
ICP-AES Tester
GC-MS Tester
UV-VIS Tester
Lab for Reliability Test –  ANSI/EIA-364 SMT Tester Durability Tester Chamber X-Ray Tester Image Micro Scope Salty Spray Tester Main Equipments : Environment Tester (Chamber/Thermal Shock) X-Ray Tester Salty Spray Tester Image Micro Scope Durability Tester HF & SMT Equipments : NA & TDR SMT Tester
Quality Policy ★   Our products: To reach the highest request  of  customer s (P.S.: A competitive quality) ★   Our jobs: To challenge the zero-defect (P.S.: A good quality is our job for everyone) ★   Our goal: To satisfy our customers (P.S.: The products is our responsibility) ★   Our system: To execute the concept of  ISO9000 (P.S.: To institutionalize the quality system)
Management Philosophy To create a win-win fruitful result for both of client and us by our service, quality, responsibility and speed performance! Win-Win Quality Service Speed R esponsibility
Date: Dec’08 Prepared By: Frank Chen Email: frank@mainsuper.com.tw
Objectives Supporting 5 Gbps data rate Backward compatible with USB 2.0 Minimizing connector form factor variations Managing EMI Supporting On-The-Go (OTG) Lost cost
SuperSpeed USB Background Hi-Speed USB (480 Mbps) is adequate for many products Emerging applications will benefit from higher performance. Most other aspects of SuperSpeed USB will remain the same: Backward compatibility with USB 2.0 Maintain the extensive device driver infrastructure Preserve USB EoU usage expectations for Users SuperSpeed USB will provide headroom for the next 5 years. SuperSpeed USB delivers bandwidth and headroom for Flash-based products.
Why isn’t USB 2.0 fast enough? Flash-based peripherals will require much higher data rates Digital cameras and camcorders Flash memory drives (USB thumb sticks, and cards) Flash-based digital MP3 and video players PC, Mobile, Handheld PCs and smart phones (SSD’s)
Why isn’t USB 2.0 fast enough? User wait time requirement, 1 ½ minutes to synchronize Interface performance sets the requirement
Products Requiring SuperSpeed USB
USB 3.0 Bus Interface USB 3.0 and a dual-simplex data path with a revised  USB protocol No auxiliary signals, i.e.no reference dock, no reset  signal, etc. USB 2.0 two-wire interface remains untouched
SuperSpeed USB Physical Layer Goals Support up to a 3 Meter cable Minimum 300MB/s throughput for storage class devices Fit into current USB 2.0 Type-A and Micro-B form factors Minimized risk/cost Base it on existing specs Retain USB Hot Plug functionality Solution Add 2 differential pairs – dual simples Signaling similar to existing high-speed serial buses (PCI Express*/SATA) Retain sideband functionality without additional wires Rx termination for connect / disconnect detect.
SuperSpeed Connector The USB 3.0 specification defines the following connectors: USB 3.0 Standard-A plug and receptacle USB 3.0 Standard-B plug and receptacle USB 3.0 Power-B plug and receptacle USB 3.0 Micro-B plug and receptacle USB 3.0 Micro-A plug USB 3.0 Micro-AB receptacle
Connector Interoperability Summary
USB 3.0 Standard-A Connector Same interface as USB2.0 Standard-A connector, but with added pins for SuperSpeed USB signals Complete compatibility with USB 2.0 Standard-A connector Double-stacked connectors supported
USB 3.0 Standard-B Connector Defined for relatively large, stationary peripherals  such as hard drives and printers Visually different from USB 2.0 Standard-B  connector But the receptacle works with USB 2.0 Standard-B plug
USB3.0 Micro-B Connector Defined for cell phones and other hand held devices Backward compatible with USB 2.0 Micro-B connector Based on USB 2.0 Micro-B connector with an extended portion for the SuperSpeed USB signals Some preliminary mock-ups have been made to assess wrenching strength USB 3.0 Micro-A and –AB connectors are identical to  USB 3.0 Micro-B connector except for different keying
Compliant Cable Assemblies The USB 3.0 specification defines the following cable assemblies: USB 3.0 Standard-A plug to USB 3.0 Standard-B plug USB 3.0 Standard-A plug to USB 3.0 Micro-B plug USB 3.0 Standard-A plug to USB 3.0 Standard-A plug  USB 3.0 Micro-A plug to USB 3.0 Micro-B plug USB 3.0 Micro-A plug to USB 3.0 Standard-B plug Captive cable with USB 3.0 Standard-A plug  Permanently attached cable with USB 3.0 Micro-A plug Permanently attached cable with USB 3.0 Power-B plug
USB 3.0 Cable Construction
USB 3.0 Cable A to B
USB 3.0 Cable A to Micro B
USB 3.0 Cable Micro A to Micro B
USB 3.0 Cable Micro A to B
 
MS P/N: AK2SA009**
MS P/N: AK4AA009**
MS P/N: MK1S*009*0
MS P/N: MK3AA009*0
Thank you! Your comments will be highly  appreciated. Head Office  8F, No. 506-2 Yuan-Shan Rd., Chung-Ho City,  Taipei Shien 23545, Taiwan Tel: 886-2-3234-1234 Fax: 886-2-2223-5065 China Factory Dongguan Hua-Bao Electronics Fty., Xin-Tang  Industrial Zone, Houjie Zhen, Dongguan City,  Guangdong 523949, China Tel: 86-769-8591-5620~22 FAX: 86-769-8591-5623

USB 3.0 Product Info

  • 1.
    A Professional ConnectorMaker in HF I/O Field Company Profile Date: Dec’08 Prepared By: Frank Chen Email: frank@mainsuper.com.tw
  • 2.
    Company Milestone 1984 Taiwan headquarter established 1994 ISO 9002 certificate 1997 China Factory 1 built-up 2000 ISO 9001 certificate 2003 SONY GP certificate 2003 Lab built-up 2004 China Factory 2 built-up 2007 IECQ QC080000 certificate 2008 ISO 14001 certificate
  • 3.
    Competitive Advantage MeetCustomer Requirement Capable of TDR & NA verifications in HF connector 3D mechanical design and simulation analysis Improvement in production efficiency by auto assembly Institute the specification by joining the association: 1. HDMI, 2. USB 2.0/3.0 3. Display Port 4. SATA 5. SD card ISO 14001 certificate Quality control by date code in laser marking Material Market Specification Product Development Manufacturing Quality Management In-house RoHS and Reliability Test Lab In-house tooling manufacturing Material control with Sony GP & RoHS compliance Halogen-Free available
  • 4.
    Technical Leading MainSuper is aggressive to institute the specification by becoming an adopter of the association. HDMI USB 2.0 /3.0 DisplayPort SATA SD Card
  • 5.
    Engineering Capability DesignTheory – Technological cooperation with Taiwan ITRI     Design tool – VNA, OSD    One Space Designer Genesys VNA
  • 6.
    Engineering Capability Precision Stamping Tooling: 0.002 mm   Mold Tooling: 0.005 mm   Finished product : 0.4 mm Pitch Debugging High-frequency tester as TDR, NA   Microfocus X-Ray Television System Mass Production Gaugeable production lines Automated production lines Mark printing for tracing
  • 7.
  • 8.
  • 9.
  • 10.
    Mechanical Analysis Tester – Microfocus X-Ray Television System Microfocus X-Ray Television System
  • 11.
    Mechanical Tester - Durability
  • 12.
    Product Roadmap USB1394 HDMI & DisplayPort Solution for smart cable
  • 13.
    Main Products DVI HDMI HP (SCSI) IEEE 1394 SATA SD/Micro-SD Card Holder USB-STD/USB Mini/Micro-USB USB 3.0 Adapter ODM/OEM Cases
  • 14.
    Manufacturing Tooling withtapping Metal Stamping Lines Resin Injection Lines Tooling Shop
  • 15.
    Manufacturing Insert-Molding LinesAuto-Ass’y M/C Sub-Auto Ass’y Lines Auto-Ass’y Lines
  • 16.
    Strategic Business/Products 3.Tatung,Primax, Elka, Longwell 3.LogiTech, Inventech, JEM, JHL, FoxLink 3.SpeedTech, Longwell 2.HP, Samsung 2.Apple, Motorola, Jabra, Plantronics 2.Molex, Spacelabs, Amphenol 1.Panasonic, Sony, Canon, Sharp, Pioneer, Sanyo, Shinko, Marunix 1.Panasonic, Sony, Canon, Sharp, Pioneer, Shinko, Marunix 1. Tyco-AMP, Honda, ITT-Cannon, Jalco, Yamaichi HDMI-A & C & D DVI DFP Display Port USB STD/ USB Mini/ Micro USB/USB 3.0 1394-a & b PCMCIA Champ (SCSI) D-sub, Centronic , FFC, Slot Bus ... etc. Stamping Metal Parts Injection Plastic Pars Display Port 33% 48% 19% Audio/ Video Transmission System Market Data Transmission System Market OEM/ODM Market Market Market Products Products Customers Customers
  • 17.
    Main Clients μ-USBA & B Foster ODM/ OEM USB/ USB Mini IEEE1394 A & B DVI D & I HDMI A & C
  • 18.
    Milestone – GreenSystem ISO 14001 certificate 2008 Q4, 2009 China factory built-up 1997 Sony G.P. certificate 2003 Cadmium Free Plant certificate 2004 Panasonic G.S. certificate Sony G.P. re-checked 2005 Lead Free Plant certificate 2006 IECQ/QC 080000 certificate Samsung G.S. certificate Sony G.P. re-checked 2007 ISO/TS16949 PLAN:
  • 19.
    Green Managing System- RoHS SONY GP certificated in 2003 Cadmium-Free plant certificated in 2004 Green Managing System & Lab certificated in 2005 Lead-Free plant certificated in 2006 Halogen-Free phase-in for Apple and Nokia in 2008
  • 20.
    Quality Managing System- ISO/TS ISO 9001:2000 certificated in 2000 ISO/TS16949 system included in 2005 ISO 14001 certificated in 2008 ISO/TS16949 certificate planning in Q4, 2009
  • 21.
    Environmental Protection SystemISO 14001 certificated in 2008
  • 22.
    RoHS Test FlowChart Control Items for RoHS    鎘 (Cd) PBB PBDE 鉛 (Pb) 水銀 (Hg) X< lower limit X> upper limit Cd,Pb,Hg Cd,Pb,Hg lower limit ≦X≦ upper limit lower limit ≦X Cd,Pb,Hg PASS NG Judgment Cr 6+ PBB PBDE < limit ≧ limit 六価 鉻 ( Cr 6+ ) EDXRF Cr( 鉻 ),Br( 溴 ) Cr( クロム ),Br( 臭素 ) ICP-AES UV-VIS GC/MS Cd,Pb,Hg PASS NG
  • 23.
  • 24.
  • 25.
  • 26.
  • 27.
    Lab for ReliabilityTest – ANSI/EIA-364 SMT Tester Durability Tester Chamber X-Ray Tester Image Micro Scope Salty Spray Tester Main Equipments : Environment Tester (Chamber/Thermal Shock) X-Ray Tester Salty Spray Tester Image Micro Scope Durability Tester HF & SMT Equipments : NA & TDR SMT Tester
  • 28.
    Quality Policy ★ Our products: To reach the highest request of customer s (P.S.: A competitive quality) ★ Our jobs: To challenge the zero-defect (P.S.: A good quality is our job for everyone) ★ Our goal: To satisfy our customers (P.S.: The products is our responsibility) ★ Our system: To execute the concept of ISO9000 (P.S.: To institutionalize the quality system)
  • 29.
    Management Philosophy Tocreate a win-win fruitful result for both of client and us by our service, quality, responsibility and speed performance! Win-Win Quality Service Speed R esponsibility
  • 30.
    Date: Dec’08 PreparedBy: Frank Chen Email: frank@mainsuper.com.tw
  • 31.
    Objectives Supporting 5Gbps data rate Backward compatible with USB 2.0 Minimizing connector form factor variations Managing EMI Supporting On-The-Go (OTG) Lost cost
  • 32.
    SuperSpeed USB BackgroundHi-Speed USB (480 Mbps) is adequate for many products Emerging applications will benefit from higher performance. Most other aspects of SuperSpeed USB will remain the same: Backward compatibility with USB 2.0 Maintain the extensive device driver infrastructure Preserve USB EoU usage expectations for Users SuperSpeed USB will provide headroom for the next 5 years. SuperSpeed USB delivers bandwidth and headroom for Flash-based products.
  • 33.
    Why isn’t USB2.0 fast enough? Flash-based peripherals will require much higher data rates Digital cameras and camcorders Flash memory drives (USB thumb sticks, and cards) Flash-based digital MP3 and video players PC, Mobile, Handheld PCs and smart phones (SSD’s)
  • 34.
    Why isn’t USB2.0 fast enough? User wait time requirement, 1 ½ minutes to synchronize Interface performance sets the requirement
  • 35.
  • 36.
    USB 3.0 BusInterface USB 3.0 and a dual-simplex data path with a revised USB protocol No auxiliary signals, i.e.no reference dock, no reset signal, etc. USB 2.0 two-wire interface remains untouched
  • 37.
    SuperSpeed USB PhysicalLayer Goals Support up to a 3 Meter cable Minimum 300MB/s throughput for storage class devices Fit into current USB 2.0 Type-A and Micro-B form factors Minimized risk/cost Base it on existing specs Retain USB Hot Plug functionality Solution Add 2 differential pairs – dual simples Signaling similar to existing high-speed serial buses (PCI Express*/SATA) Retain sideband functionality without additional wires Rx termination for connect / disconnect detect.
  • 38.
    SuperSpeed Connector TheUSB 3.0 specification defines the following connectors: USB 3.0 Standard-A plug and receptacle USB 3.0 Standard-B plug and receptacle USB 3.0 Power-B plug and receptacle USB 3.0 Micro-B plug and receptacle USB 3.0 Micro-A plug USB 3.0 Micro-AB receptacle
  • 39.
  • 40.
    USB 3.0 Standard-AConnector Same interface as USB2.0 Standard-A connector, but with added pins for SuperSpeed USB signals Complete compatibility with USB 2.0 Standard-A connector Double-stacked connectors supported
  • 41.
    USB 3.0 Standard-BConnector Defined for relatively large, stationary peripherals such as hard drives and printers Visually different from USB 2.0 Standard-B connector But the receptacle works with USB 2.0 Standard-B plug
  • 42.
    USB3.0 Micro-B ConnectorDefined for cell phones and other hand held devices Backward compatible with USB 2.0 Micro-B connector Based on USB 2.0 Micro-B connector with an extended portion for the SuperSpeed USB signals Some preliminary mock-ups have been made to assess wrenching strength USB 3.0 Micro-A and –AB connectors are identical to USB 3.0 Micro-B connector except for different keying
  • 43.
    Compliant Cable AssembliesThe USB 3.0 specification defines the following cable assemblies: USB 3.0 Standard-A plug to USB 3.0 Standard-B plug USB 3.0 Standard-A plug to USB 3.0 Micro-B plug USB 3.0 Standard-A plug to USB 3.0 Standard-A plug USB 3.0 Micro-A plug to USB 3.0 Micro-B plug USB 3.0 Micro-A plug to USB 3.0 Standard-B plug Captive cable with USB 3.0 Standard-A plug Permanently attached cable with USB 3.0 Micro-A plug Permanently attached cable with USB 3.0 Power-B plug
  • 44.
    USB 3.0 CableConstruction
  • 45.
  • 46.
    USB 3.0 CableA to Micro B
  • 47.
    USB 3.0 CableMicro A to Micro B
  • 48.
    USB 3.0 CableMicro A to B
  • 49.
  • 50.
  • 51.
  • 52.
  • 53.
  • 54.
    Thank you! Yourcomments will be highly appreciated. Head Office 8F, No. 506-2 Yuan-Shan Rd., Chung-Ho City, Taipei Shien 23545, Taiwan Tel: 886-2-3234-1234 Fax: 886-2-2223-5065 China Factory Dongguan Hua-Bao Electronics Fty., Xin-Tang Industrial Zone, Houjie Zhen, Dongguan City, Guangdong 523949, China Tel: 86-769-8591-5620~22 FAX: 86-769-8591-5623