Presentation of The Professional Commons\' ICT Policy Research Paper http://www.procommons.org.hk/documents/20080618_e-Govt-Research%20Paper_Eng_v2.pdf
2008.06.18
Presentation of The Professional Commons\' ICT Policy Research Paper http://www.procommons.org.hk/documents/20080618_e-Govt-Research%20Paper_Eng_v2.pdf
2008.06.18
The document discusses three types of training for developing human resources: learning, training, and development. Learning involves acquiring new knowledge and skills, especially hands-on skills. Training strengthens existing knowledge and skills through re-education, especially hands-on skills. Development refers to building and improving attitudes, abilities, values and beliefs over time, especially for managers, and can be seen as transformational learning. While knowledge and skills can grow quickly through learning and training in the short term, building and improving attitudes, abilities, values and beliefs takes much longer time, even fundamentally without progress.
This document contains notes on optical engineering topics including:
1. Optical science and technology, including fiber optics, optical components, and optical circuits.
2. Sources of light including natural light sources like sunlight and artificial light sources like lasers.
3. Optical design engineering which involves using principles of optics and design software to model optical systems.
11. 技術發展趨勢
晶片尺寸(Chip Scale)封裝的樣式
Au Wire Over Molded
Chip
LFBGA
Via
Laminate
Solder Ball substrate Cu Traces
Au Wire Over Molded
TFBGA
Laminate Cu Traces
Solder Ball
substrate
華泰電子股份有限公司
10-8
Orient Semiconductor Electronic, Ltd.
12. 技術發展趨勢
晶片尺寸(Chip Scale)封裝的樣式
Flip Chip
Soldering Bump Solder Most Efficient Use of Silicon
Highest Performance
IC • Low inductance
• Highest processor speeds
• Utilized in latest generation of processors
• Direct thermal path
Substrate
Practical Assembly of extremely High I/O’s
Smallest Possible Package
• Highest package density
• Shrink of component dimension
• Used in portable electronics, medical devices, etc.
Soldering Ball
華泰電子股份有限公司
10-8
Orient Semiconductor Electronic, Ltd.
13. 技術發展趨勢
晶片尺寸(Chip Scale)封裝的樣式
Stack Die Development (Same Die Size)
Bump Bond Elastomer
Gold Wire Die 2 Compound
Feature
Exchange Wire Bonding Loop
Mode From Bump Bonding to
Substrate Die 1 Solder Ball New Loop Mode “M” Loop and
the Loop High Could Control at
4±1mil.
華泰電子股份有限公司
10-8
Orient Semiconductor Electronic, Ltd.
16. Module Development
Product Outlook
Product name : Bluetooth Module
Product application : RF Wireless Protocol
Die size : mm
Mass production capacity : 400K / month
資料來源: PRISMARK
華泰電子股份有限公司
10-8
Orient Semiconductor Electronic, Ltd.
