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Transmission electron
microscopy
By
Sri. M.Ragu
Assistant Professor
Department of Chemistry
Vivekananda College
Madurai, Tamil Nadu
AdvancedMaterialsCharacterization
Workshop
Transmission Electron Microscopy
J.G. Wen, C.H. Lei, M. Marshall
W. Swiech, J. Mabon, I. Petrov
Supportedby the U.S. Departmentof Energy under grantsDEFG02-07-ER46453and DEFG02-07-ER46471
© 2008 University of Illinois Board of Trustees. All rightsreserved.
Outline
1. Introduction to TEM
2. Basic Concepts
3. Basic TEM techniques
Diffraction contrast imaging
High-resolution TEM imaging
Diffraction
4. Scanning-TEM techniques
5. Spectroscopy
X-ray Energy Dispersive Spectroscopy
Electron Energy-Loss Spectroscopy
6. Advanced TEM
techniques Spectrum
imaging Energy-filtered
TEM
7. Other TEM techniques
Low-dose; in-situ; etc.
8. Summary
Why Use Transmission Electron Microscope?
AN is 0.95 with air
up to 1.5 with oil
Transmission Electron Microscope
(TEM)
Optical Microscope
Resolution limit: 200 nm 100k eV electrons : 0.037 Å
Sample thickness requirement:
Thinner than 500 nm
High quality image: <20 nm
Resolution record by TEM
0.63 Å
GaN [211]
Thin foil, thin edge, or
nanoparticles
< 500nm
 =0.66(Cs3)1/4
Basic Structure of a TEM
Gun and
Illumination partGun: LaB6, FEG
100, 200,300keV
Mode selection and
Magnification part
View screen
TEM Sample
Objective lens part
How does a TEM get Image and Diffraction?
TEM
Conjugated planes
Sample
Objective Lens
Back Focal Plane
Incident Electrons
< 500nm
First Image Plane
Back Focal Plane
View Screen
First Image Plane
u v
u v f
Object Image
1_+
1_= _1
Structural info
Morphology
Specimen
magnetic
prism
Inelastically scattered electrons
Incoherent
beam
Diffracted
beam
Coherent beam
Transmitted
beam
Basic Concepts
High energy electron – sample interaction
Incident high-kV beam
1. Transmitted electron (beam)
2. Diffracted electrons (beams)
Bragg Diffraction
3. Coherent beams
4. Incoherent beams
5. Elastically scattered electrons
6. Inelastically scattered electrons
TEM
X-rays
d
Bragg’s Law
2 d sin  = n

Zero-order Laue Zone (ZOLZ)
First-order Laue Zone (FOLZ)
….
High-order Laue Zone (HOLZ)
Diffraction
Electron Diffraction I
SOLZ
FOLZ
ZOLZ
Wavelength
X-ray: about 1A
Electrons: 0.037A
 is small, Ewald sphere (1/) is almost flat
EwaldSphere
002
022
50 nm Polycrystal
Lattice parameter, space group, orientation relationship
Diffraction
Electron Diffraction II
Diffraction patterns from single grain and multiple grains Tilting sample to obtain 3-D structure of a crystal
To identify new phases, TEM has advantages:
1) Small amount of materials
2) No need to be single phases
3) determining composition by EDS or EELSAmorphous
Major Imaging Contrast Mechanisms:
1. Mass-thickness contrast
2. Diffraction contrast
3. Phase contrast
4. Z-contrast
Imaging
Major Imaging Techniques
1) Imaging techniques in TEM mode
a) Bright-Field TEM (Diff. contrast)
b) Dark-Field TEM (Diff. contrast)
Weak-beam imaging
hollow-cone dark-field imaging
a) Lattice image (Phase)
b) High-resolution Electron Microscopy
(Phase)
Simulation and interpretation
2) Imaging techniques in scanning transmission
electron microscopic (STEM) mode
1) Z-contrast imaging (Dark-field)
2) Bright-field STEM imaging
3) High-resolution Z-contrast imaging
(Bright- & Dark-field)
3) Spectrum imaging
1) Energy-filtered TEM (TEM mode)
2) EELS mapping (STEM mode)
3) EDS mapping (STEM mode)
Mass-thickness contrast
Diffraction Contrast Image
Kikuchi Map
TEM Imaging Techniques
I. Diffraction Contrast Image:
Contrast related to crystal orientation
[111]
[110]
[112]
[001]
Application:
Morphology, defects, grain boundary, strain field, precipitates
Two-beam condition
[001]
Many-beam condition
Transmitted beam
Diffracted beam
ObjectiveLens
Aperture Back Focal Plane
DiffractionPattern
First ImagePlane
Bright-field Image Dark-field Image
Sample Sample
T
D
Diffraction ContrastImage
TEM Imaging Techniques
II. Diffraction Contrast Image: Bright-field & Dark-field Imaging
Two-beam condition
Bright-field Dark-field
Bright-field
thickness
B
Increasing S S=0
B
S=0
Increasing S
S<0
t /g
g
Extinction distance
0 g
Excitation error
S = g 
Thickness fringes Bending contour
To distinguish them from
intrinsic defects inside sample:
Tilting sample or beamslightly
dz g
g
Sd0
=
i
 exp{2isz}
Diffraction ContrastImage
TEM Imaging Techniques
III. Thickness fringes and bending contour
Electron Wave B
Howie-Whelan equation
S>0
S>0
s
-g 0 g
I
Dislocation loop
Diffraction contrast images of typical defects
Dislocations Stacking faults
dz g
g
d0
=
i
 exp{2i(sz+g.R)}
Howie-Whelan equation
g 1 2 3
3-Each staking fault changes phase 2
Sample
Diffraction ContrastImage
TEM Imaging Techniques
II. Diffraction Contrast Image
Two-beam condition for defects Dislocations
Use g.b = 0 to determine Burgers vector b
Stacking faults
Phase = 2  g • R
Diffraction ContrastImage
Weak-beam Dark-field imaging
High-resolution dark-field imaging
Dislocations can be imaged
as 1.5 nm narrowlinesBright-field Weak-beam
C.H. Lei
g g
Planes do not satisfy Possible planes satisfy
Bragg diffraction Bragg diffraction
S
Weak-beam means
Large excitationerror
Exact Bragg condition
“Near Bragg Condition”
“Away from Bragg Condition”
Taken by I. Petrov
1g 2g 3g
Experimental weak-beam
Lattice imaging
Two-beam condition
Phase Contrast Image
C.H. LeiM. Marshall
Many-beam condition
[001]
Phase Contrast Image
Lattice imaging
Delocalization effect from a field-emission gun (FEG)
From a LaB6 Gun Field-Emission Gun
Lattice image of film on substrates
Weak-phase-object approximation (WPOA)
srsch = 0.66 C 4 4
1 Scherzer Defocus:
Positive phase contrast “black atoms”
2 Scherzer Defocus: ("2nd Passband" defocus).
Contrast Transfer Function is positive
Negative phase contrast ("white atoms")
 fsch  fsch
Phase Contrast Image
High-resolution Electron Microscopy (HREM)
Simulation of images Software: Web-EMAPS (UIUC)
MacTempas
f(x,y) = exp(iVt(x,y))
~1 + i  Vt(x,y)
Vt(x,y): projected potential
Indirect imaging
Depends on defocus
Scherzerdefocus
1
fsch = - 1.2(Cs)2
Resolution limit
1 3
J.G. WenContrast transfer function
Selected-area electron diffraction (SAD)
Example of SAD and
dark-field imaging
Selected-area aperture
High-contrast
aperture
Diffraction
Major Diffraction Techniques
1) Selected-area Diffraction
2) Nanobeam Diffraction
3) Convergent-beam electron diffraction
Objective
aperture
SAD
aperture
A. Ehiasrian, J.G. Wen, I. Petrov
Diffraction
Electron Nanodiffraction
5 m condenser aperture  30 nm
M. Gao, J.M. Zuo, R.D. Twesten, I. Petrov, L.A. Nagahara & R. Zhang,
Appl. Phys. Lett. 82, 2703 (2003)
J.M. Zuo, I. Vartanyants, M. Gao, R. Zhang and L.A. Nagahara,
Science, 300, 1419 (2003)
This technique was developed by CMM
Back FocalPlane
Sample Sample
Large-angle bright-field CBED
Bright-disk Dark-disk Whole-pattern
4. Defects
5. Chemical bonding
SAD CBED
1. Point and space group
2. Lattice parameter (3-D) strain field
3. Thickness
Diffraction
Convergent-beam electron diffraction (CBED)
Parallel beam Convergent-beam
Diffraction
Convergent-beam electron diffraction
Quantitative Analysis of Local Strain Relaxation
a b c
d e f
g h i
CoSi2
C. W. Lim, C.-S. Shin, D. Gall, M. Sardela,
R. D. Twesten, J. M. Zuo, I. Petrov and J. E. Greene
Use High-order Laue zone (HOLZ) lines
to measure strain field
secondary
electrons
<50 eV
Auger
electrons
backscattered
electrons
characteristic&
Bremsstrahlung
x-rays
1 m
Scanning electron microscopy (SEM)
1O primary e-beam
0.5-30 keV
Scanning transmission
electron microscopy (STEM)
primary e-beam
100-300 keV
characteristic &
Bremsstrahlung
x-rays
Probe size
0.18 nm
SEM vs STEM
Thickness
<100 nm
STEM
“Coherent”
Scattering
(i.e. Interference)
“Incoherent”
Scattering
i.e.
Rutherford
Dark-field Detector
Bright-field
5 nm
5 nm
ADF-STEM
Ir nanoparticles
TEM
10nm
Z-contrast image
TEM vs STEM
Ge quantum dots on Si substrate
1. STEM imaging gives better
contrast
2. STEM images show Z-
contrast

STEM
L. LongJ.G. Wen
Annular dark-field (ADF) detector
I  Z2
Z-contrast imaging
Z
HRTEM vs STEM
STEM
3 3 3BaTiO /SrTiO /CaTiO superlattice
1. Contrast
• High-resolution TEM (HRTEM) image is a
phase contrast image (indirect image). The
contrast depends on defocus.
• STEM image is a direct atomic column
image (average Z-contrast in the column).
From Pennycook’s group
J.G. Wen
2. DelocalizationEffect
• High-resolution TEM image from FEG has
delocalization effect.
• STEM image has no such an effect.
Spatial resolution ~1 nm
A
r
eaMapping
A B
2-D mapping
HAADF
voids
Au
Ti Mo
Si Al
Ga
Liang Wang
Au
Ti
Mo
B
Line scan
Spectroscopy
X-ray Energy-Dispersive Spectroscopy (EDS)
1) TEM mode  spot, area
2) STEM mode  spot, line-scan and 2-D mapping
A
A. Ehiasrian, I. Petrov
Ti0.85Nb0.15 metal ion etch
Creates a mixed amorphised surface layer ~ 6 nm
Electron Energy-loss Spectroscopy (EELS)
ZLP
Low-loss
Spectroscopy
ZLP
Low-loss
t =  ln( ℓ
)
I
I0
I0
Iℓ
  Mean free path
Post-column In-column
EELS spectrum:
1. Zero-loss Peak (ZLP)
2. Low-loss spectrum (<50eV)
Interacted with weakly bound outer-shell
electrons
Plasmon peaks
Inter- & Intra-Band transition
Application:
Thickness measurement
Elemental mapping
Low-loss
Ti
O
Mn
La
Edges
1. Plasmon imaging
2. Edge imaging
e
M
1. ZLP imaging
2. Plasmon imaging
3. Edge imaging
TEM mod
Diamond
Nanoparticle
 bonding
Amorphous
carbon
 bonding
Edge Peaks in EELS
Spectroscopy
ZLP
Low-loss
Ti
O
Mn
La
x100
Edge peak position
3. High-loss spectrum
Interacted with tightly bound inn-shell
electrons
Edge peaks
Application:
Elements identification
Chemistry
Edge peak shape
J.G. Wen
Spectrum imaging
Energy-filtered TE
TEM mode
ZLP
Image atE1
Image atE2
Image atE3
Image at En
E
x
y
Energy-filtered TEM
•Fill in data cube by taking one image at each energy
STEM mode
•Fill in data cube by taking one spectrum at each location
S
Spectrum imaging
Low-loss
Spectrum imaging
Energy-Filtered TEM (EFTEM)
EFTEM - Zero-Loss Peak imaging
Only elastic electrons contribute to image – remove the “inelastic fog”
1. Improve contrast (especially good for medium thick samples)
2. Z<12, the inelastic cross-section is larger than elastic cross-section
ZLP
A B
A B
WAl
Spectrum imaging
EFTEM – Plasmon Peak imaging
Spectrum image (20 images) Al mapping image W mapping image
J.G. Wen
30 nm
Three-window method
Jump ratio
EFTEM – Edge Peak imaging
Image Ti
SiTi EELS spectrum
Spectrum imaging
J.G. Wen
convergence
angle ~ 10mrad
scan
coils
incident probe
probe size  ~ 0.2 nm
specimen
Z-contrast
image
HAADF detector
magnetic
prism
Spectrum imaging
STEM + EELS Spectroscopy
LaMnO3
SrTiO3
LaMnO3
SrTiO3
Z-contrast image
Ti
O
Mn
La
EELS spectrum
Spectrum imaging
STEM + EELS Spectroscopy
Z-contrast image shows
where columns of atoms are
and EELS spectrum identify
chemical components
Electronic structure
changes are observed in the
fine structure of O K-edge
Electron Energy-Loss Spectrum
n
iot
di
re
c
S
c
a
n
Z-contrast Image E
O K edge La
M4,5
O KMnL2, 3
Ti L2,3 La M4,5
2nm
STO
SMO
STO
3LMO
STO
2LMO
STO
2LMO
STO
LMO
STO
STMO
STO
STMO
J.G. Wen, Amish, J.M. Zuo
Ti
O
Mn La
New TEM: Cs-corrected Analytical STEM/TEM
Sound Isolation
Low Airflow
Vibrationdecoupling
CEOS Corrector
Ω-Filter
Remote operation
With this setup we can achieve
a probe-size of <0.1nm
JEOL 2010F, Cs = 1.0 mm
JEOL 2200FS, Cs < 5 m
Cs-corrected Ronchigram
Small probe size for high-resolution scanning
transmission electron microscopic images
1.36Å
Si [110] Zone Axis
JEOL 2010F, Cs = 1 mm
(2nd smallestProbe)
JEOL 2200FS
with probe forming
Cs Corrector
La atom
Mn atom
La atom
Sr atom
Ti atom
Sr atom
2 x 2 LaMnO3-SrTiO3 superlattice
Dec. 2006 June 2007 Dec. 2007
Thick specimen Same specimen Thin Specimen
Å
LaMnO3
SrMnO3
SrTiO3 Substrate
R
S
interfacial ferromagnetic moment
measured at 10 Kelvin is enhanced in
LaMnO3 at the sharp LaMnO3-SrMnO3
interface and reduced at the rough
SrMnO3-LaMnO3 interface.
Sharp Interface
RoughInterface
Sharp Interface
RoughInterface
High Mag. Image
Epitaxial Oxide Films Grown on SrTiO3
Polarized neutron scattering shows
STEM Image of Superlattice
LaMnO3
SrMnO3
Cd
Se
Cd
Se
CdSe nanoparticles
View along [110] zone axis
Polarity of CdSe
100
100
Zn
Te
Zn
Te
Cd
Se
Cd
Se
ZnTe CdSe
Hetero-structure nanoparticle
Stacking
fault
Grain
boundary
1 nm
Se Cd
Quantitative STEM Imaging
1 nm
3
11
9 10
6
Quantitative STEM Imaging
Projectedpotential
3 0 0
2 5 0
2 0 0
1 5 0
1 0 0
5 0
0
x10^4
0 50 10 0 15 0 20 0 25 0
Monometallic Pt
The intensity at each atomic column is
proportional to numbers of atoms
No defects in Pt nanoparticles
Monometallic Pd
Pd nanoparticles contain
many defects such as twin
boundaries
x10^4
200
150
100
50
0
0 50 100 150 200 250
Bimetallic Pd(core)-Pt(shell)
Pd (core) – Pt (shell) structure
1
Core-shell structure of FePd nanoparticles
Core: Ordered Fe/Pd structure
Shell: non-ordered structure
Twin in the
nanoparticle
Amorphous
nanoparticle
1 nm
Pd columns are shown as brighter spots in the core
Both TEM & STEM
STEM better contrast
Ultra thin carbon grid
STEM better contrast
Ultra thin carbon grid
Only STEM
Study Nanoparticles by TEM
Size distribution: STEM will give better contrast
> 5nm
Bi-nanoparticles Au-nanoparticles
2 nm < Size < 5nm
< 2 nm
Composition study: EDS counts are low
2200FS EDS system
detector area 2 times bigger
beam 4 times brighter
200 nm
200 nm
Minimum-dose in STEM mode
HAADF-STEMimage
Long exposure time
Minimum-dose in TEM mode
Search in low magnification
Focus at another area
Photo with minimum dose
MDS + tomography
will be available on
2100 Cryo-TEM soon
+/- 80 degree tilt
Special TEM technique
Minimum-Dose for beam sensitive samples
BF-STEM image
Short exposuretime
Z-contrast tilt-series
J.G. Wen
L. Menard, J.G. Wen
In-situ capabilities
1. Heating (hot stage 1000°C)
2. Cooling (liquid N2)
3. Tensile-stage
4. MEMS tensile stage
5. Universal MEMS holder
6. Wet-cell
7. Nanomanipulator
8. Environmental holder
9. Applied voltage to sample
10.Cryo transfer holder
In-situ holders
MEMS straining stage
nanomanipulation
universal MEMS holder
In-situ
N. Schmit liquid cell
All developed at CMM
Water
front
30 nm
CNT in water
J.G. Wen
List of TEMs and functions
1. CM12 (120 KeV) (S)TEM
• TEM, BF, DF, CBED (good), EDS,
large tilt angle, etc
2. 2010 LaB6 TEM
• TEM, low dose, NBD, good for
HREM, video function
3. 2100 LaB6 (Cryo-TEM)
• TEM, Low dose, special cryo-
shielding; high-tilt angle (+/-80)
(using special retainer).
4. 2010F (S)TEM
• TEM, BF, DF, NBD, CBED, EDS,
STEM, EELS, EFTEM, Spectrum
imaging, etc.
5. HB501 STEM
• STEM, BF, DF, EDS, EELS (cold
FEG), ultra-high vacuum
6. JEOL 2200FS (S)TEM
• Cs-corrected probe, TEM, BF, DF,
NBD, CBED, EDS, STEM, EELS,
EFTEM, Spectrum imaging, etc.
CM 12 2010LaB6 2100 Cryo
2010F HB501
2200FS

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TEM

  • 1. Transmission electron microscopy By Sri. M.Ragu Assistant Professor Department of Chemistry Vivekananda College Madurai, Tamil Nadu
  • 2. AdvancedMaterialsCharacterization Workshop Transmission Electron Microscopy J.G. Wen, C.H. Lei, M. Marshall W. Swiech, J. Mabon, I. Petrov Supportedby the U.S. Departmentof Energy under grantsDEFG02-07-ER46453and DEFG02-07-ER46471 © 2008 University of Illinois Board of Trustees. All rightsreserved. Outline 1. Introduction to TEM 2. Basic Concepts 3. Basic TEM techniques Diffraction contrast imaging High-resolution TEM imaging Diffraction 4. Scanning-TEM techniques 5. Spectroscopy X-ray Energy Dispersive Spectroscopy Electron Energy-Loss Spectroscopy 6. Advanced TEM techniques Spectrum imaging Energy-filtered TEM 7. Other TEM techniques Low-dose; in-situ; etc. 8. Summary
  • 3. Why Use Transmission Electron Microscope? AN is 0.95 with air up to 1.5 with oil Transmission Electron Microscope (TEM) Optical Microscope Resolution limit: 200 nm 100k eV electrons : 0.037 Å Sample thickness requirement: Thinner than 500 nm High quality image: <20 nm Resolution record by TEM 0.63 Å GaN [211] Thin foil, thin edge, or nanoparticles < 500nm  =0.66(Cs3)1/4 Basic Structure of a TEM Gun and Illumination partGun: LaB6, FEG 100, 200,300keV Mode selection and Magnification part View screen TEM Sample Objective lens part
  • 4. How does a TEM get Image and Diffraction? TEM Conjugated planes Sample Objective Lens Back Focal Plane Incident Electrons < 500nm First Image Plane Back Focal Plane View Screen First Image Plane u v u v f Object Image 1_+ 1_= _1 Structural info Morphology Specimen magnetic prism Inelastically scattered electrons Incoherent beam Diffracted beam Coherent beam Transmitted beam Basic Concepts High energy electron – sample interaction Incident high-kV beam 1. Transmitted electron (beam) 2. Diffracted electrons (beams) Bragg Diffraction 3. Coherent beams 4. Incoherent beams 5. Elastically scattered electrons 6. Inelastically scattered electrons TEM X-rays
  • 5. d Bragg’s Law 2 d sin  = n  Zero-order Laue Zone (ZOLZ) First-order Laue Zone (FOLZ) …. High-order Laue Zone (HOLZ) Diffraction Electron Diffraction I SOLZ FOLZ ZOLZ Wavelength X-ray: about 1A Electrons: 0.037A  is small, Ewald sphere (1/) is almost flat EwaldSphere 002 022 50 nm Polycrystal Lattice parameter, space group, orientation relationship Diffraction Electron Diffraction II Diffraction patterns from single grain and multiple grains Tilting sample to obtain 3-D structure of a crystal To identify new phases, TEM has advantages: 1) Small amount of materials 2) No need to be single phases 3) determining composition by EDS or EELSAmorphous
  • 6. Major Imaging Contrast Mechanisms: 1. Mass-thickness contrast 2. Diffraction contrast 3. Phase contrast 4. Z-contrast Imaging Major Imaging Techniques 1) Imaging techniques in TEM mode a) Bright-Field TEM (Diff. contrast) b) Dark-Field TEM (Diff. contrast) Weak-beam imaging hollow-cone dark-field imaging a) Lattice image (Phase) b) High-resolution Electron Microscopy (Phase) Simulation and interpretation 2) Imaging techniques in scanning transmission electron microscopic (STEM) mode 1) Z-contrast imaging (Dark-field) 2) Bright-field STEM imaging 3) High-resolution Z-contrast imaging (Bright- & Dark-field) 3) Spectrum imaging 1) Energy-filtered TEM (TEM mode) 2) EELS mapping (STEM mode) 3) EDS mapping (STEM mode) Mass-thickness contrast Diffraction Contrast Image Kikuchi Map TEM Imaging Techniques I. Diffraction Contrast Image: Contrast related to crystal orientation [111] [110] [112] [001] Application: Morphology, defects, grain boundary, strain field, precipitates Two-beam condition [001] Many-beam condition Transmitted beam Diffracted beam
  • 7. ObjectiveLens Aperture Back Focal Plane DiffractionPattern First ImagePlane Bright-field Image Dark-field Image Sample Sample T D Diffraction ContrastImage TEM Imaging Techniques II. Diffraction Contrast Image: Bright-field & Dark-field Imaging Two-beam condition Bright-field Dark-field Bright-field thickness B Increasing S S=0 B S=0 Increasing S S<0 t /g g Extinction distance 0 g Excitation error S = g  Thickness fringes Bending contour To distinguish them from intrinsic defects inside sample: Tilting sample or beamslightly dz g g Sd0 = i  exp{2isz} Diffraction ContrastImage TEM Imaging Techniques III. Thickness fringes and bending contour Electron Wave B Howie-Whelan equation S>0 S>0 s -g 0 g I
  • 8. Dislocation loop Diffraction contrast images of typical defects Dislocations Stacking faults dz g g d0 = i  exp{2i(sz+g.R)} Howie-Whelan equation g 1 2 3 3-Each staking fault changes phase 2 Sample Diffraction ContrastImage TEM Imaging Techniques II. Diffraction Contrast Image Two-beam condition for defects Dislocations Use g.b = 0 to determine Burgers vector b Stacking faults Phase = 2  g • R Diffraction ContrastImage Weak-beam Dark-field imaging High-resolution dark-field imaging Dislocations can be imaged as 1.5 nm narrowlinesBright-field Weak-beam C.H. Lei g g Planes do not satisfy Possible planes satisfy Bragg diffraction Bragg diffraction S Weak-beam means Large excitationerror Exact Bragg condition “Near Bragg Condition” “Away from Bragg Condition” Taken by I. Petrov 1g 2g 3g Experimental weak-beam
  • 9. Lattice imaging Two-beam condition Phase Contrast Image C.H. LeiM. Marshall Many-beam condition [001] Phase Contrast Image Lattice imaging Delocalization effect from a field-emission gun (FEG) From a LaB6 Gun Field-Emission Gun Lattice image of film on substrates
  • 10. Weak-phase-object approximation (WPOA) srsch = 0.66 C 4 4 1 Scherzer Defocus: Positive phase contrast “black atoms” 2 Scherzer Defocus: ("2nd Passband" defocus). Contrast Transfer Function is positive Negative phase contrast ("white atoms")  fsch  fsch Phase Contrast Image High-resolution Electron Microscopy (HREM) Simulation of images Software: Web-EMAPS (UIUC) MacTempas f(x,y) = exp(iVt(x,y)) ~1 + i  Vt(x,y) Vt(x,y): projected potential Indirect imaging Depends on defocus Scherzerdefocus 1 fsch = - 1.2(Cs)2 Resolution limit 1 3 J.G. WenContrast transfer function Selected-area electron diffraction (SAD) Example of SAD and dark-field imaging Selected-area aperture High-contrast aperture Diffraction Major Diffraction Techniques 1) Selected-area Diffraction 2) Nanobeam Diffraction 3) Convergent-beam electron diffraction Objective aperture SAD aperture A. Ehiasrian, J.G. Wen, I. Petrov
  • 11. Diffraction Electron Nanodiffraction 5 m condenser aperture  30 nm M. Gao, J.M. Zuo, R.D. Twesten, I. Petrov, L.A. Nagahara & R. Zhang, Appl. Phys. Lett. 82, 2703 (2003) J.M. Zuo, I. Vartanyants, M. Gao, R. Zhang and L.A. Nagahara, Science, 300, 1419 (2003) This technique was developed by CMM Back FocalPlane Sample Sample Large-angle bright-field CBED Bright-disk Dark-disk Whole-pattern 4. Defects 5. Chemical bonding SAD CBED 1. Point and space group 2. Lattice parameter (3-D) strain field 3. Thickness Diffraction Convergent-beam electron diffraction (CBED) Parallel beam Convergent-beam
  • 12. Diffraction Convergent-beam electron diffraction Quantitative Analysis of Local Strain Relaxation a b c d e f g h i CoSi2 C. W. Lim, C.-S. Shin, D. Gall, M. Sardela, R. D. Twesten, J. M. Zuo, I. Petrov and J. E. Greene Use High-order Laue zone (HOLZ) lines to measure strain field secondary electrons <50 eV Auger electrons backscattered electrons characteristic& Bremsstrahlung x-rays 1 m Scanning electron microscopy (SEM) 1O primary e-beam 0.5-30 keV Scanning transmission electron microscopy (STEM) primary e-beam 100-300 keV characteristic & Bremsstrahlung x-rays Probe size 0.18 nm SEM vs STEM Thickness <100 nm STEM “Coherent” Scattering (i.e. Interference) “Incoherent” Scattering i.e. Rutherford Dark-field Detector Bright-field
  • 13. 5 nm 5 nm ADF-STEM Ir nanoparticles TEM 10nm Z-contrast image TEM vs STEM Ge quantum dots on Si substrate 1. STEM imaging gives better contrast 2. STEM images show Z- contrast  STEM L. LongJ.G. Wen Annular dark-field (ADF) detector I  Z2 Z-contrast imaging Z HRTEM vs STEM STEM 3 3 3BaTiO /SrTiO /CaTiO superlattice 1. Contrast • High-resolution TEM (HRTEM) image is a phase contrast image (indirect image). The contrast depends on defocus. • STEM image is a direct atomic column image (average Z-contrast in the column). From Pennycook’s group J.G. Wen 2. DelocalizationEffect • High-resolution TEM image from FEG has delocalization effect. • STEM image has no such an effect.
  • 14. Spatial resolution ~1 nm A r eaMapping A B 2-D mapping HAADF voids Au Ti Mo Si Al Ga Liang Wang Au Ti Mo B Line scan Spectroscopy X-ray Energy-Dispersive Spectroscopy (EDS) 1) TEM mode  spot, area 2) STEM mode  spot, line-scan and 2-D mapping A A. Ehiasrian, I. Petrov Ti0.85Nb0.15 metal ion etch Creates a mixed amorphised surface layer ~ 6 nm Electron Energy-loss Spectroscopy (EELS) ZLP Low-loss Spectroscopy ZLP Low-loss t =  ln( ℓ ) I I0 I0 Iℓ   Mean free path Post-column In-column EELS spectrum: 1. Zero-loss Peak (ZLP) 2. Low-loss spectrum (<50eV) Interacted with weakly bound outer-shell electrons Plasmon peaks Inter- & Intra-Band transition Application: Thickness measurement Elemental mapping
  • 15. Low-loss Ti O Mn La Edges 1. Plasmon imaging 2. Edge imaging e M 1. ZLP imaging 2. Plasmon imaging 3. Edge imaging TEM mod Diamond Nanoparticle  bonding Amorphous carbon  bonding Edge Peaks in EELS Spectroscopy ZLP Low-loss Ti O Mn La x100 Edge peak position 3. High-loss spectrum Interacted with tightly bound inn-shell electrons Edge peaks Application: Elements identification Chemistry Edge peak shape J.G. Wen Spectrum imaging Energy-filtered TE TEM mode ZLP Image atE1 Image atE2 Image atE3 Image at En E x y Energy-filtered TEM •Fill in data cube by taking one image at each energy STEM mode •Fill in data cube by taking one spectrum at each location S Spectrum imaging
  • 16. Low-loss Spectrum imaging Energy-Filtered TEM (EFTEM) EFTEM - Zero-Loss Peak imaging Only elastic electrons contribute to image – remove the “inelastic fog” 1. Improve contrast (especially good for medium thick samples) 2. Z<12, the inelastic cross-section is larger than elastic cross-section ZLP A B A B WAl Spectrum imaging EFTEM – Plasmon Peak imaging Spectrum image (20 images) Al mapping image W mapping image J.G. Wen 30 nm
  • 17. Three-window method Jump ratio EFTEM – Edge Peak imaging Image Ti SiTi EELS spectrum Spectrum imaging J.G. Wen convergence angle ~ 10mrad scan coils incident probe probe size  ~ 0.2 nm specimen Z-contrast image HAADF detector magnetic prism Spectrum imaging STEM + EELS Spectroscopy LaMnO3 SrTiO3 LaMnO3 SrTiO3 Z-contrast image Ti O Mn La EELS spectrum
  • 18. Spectrum imaging STEM + EELS Spectroscopy Z-contrast image shows where columns of atoms are and EELS spectrum identify chemical components Electronic structure changes are observed in the fine structure of O K-edge Electron Energy-Loss Spectrum n iot di re c S c a n Z-contrast Image E O K edge La M4,5 O KMnL2, 3 Ti L2,3 La M4,5 2nm STO SMO STO 3LMO STO 2LMO STO 2LMO STO LMO STO STMO STO STMO J.G. Wen, Amish, J.M. Zuo Ti O Mn La New TEM: Cs-corrected Analytical STEM/TEM Sound Isolation Low Airflow Vibrationdecoupling CEOS Corrector Ω-Filter Remote operation With this setup we can achieve a probe-size of <0.1nm JEOL 2010F, Cs = 1.0 mm JEOL 2200FS, Cs < 5 m Cs-corrected Ronchigram
  • 19. Small probe size for high-resolution scanning transmission electron microscopic images 1.36Å Si [110] Zone Axis JEOL 2010F, Cs = 1 mm (2nd smallestProbe) JEOL 2200FS with probe forming Cs Corrector La atom Mn atom La atom Sr atom Ti atom Sr atom 2 x 2 LaMnO3-SrTiO3 superlattice Dec. 2006 June 2007 Dec. 2007 Thick specimen Same specimen Thin Specimen
  • 20. Å LaMnO3 SrMnO3 SrTiO3 Substrate R S interfacial ferromagnetic moment measured at 10 Kelvin is enhanced in LaMnO3 at the sharp LaMnO3-SrMnO3 interface and reduced at the rough SrMnO3-LaMnO3 interface. Sharp Interface RoughInterface Sharp Interface RoughInterface High Mag. Image Epitaxial Oxide Films Grown on SrTiO3 Polarized neutron scattering shows STEM Image of Superlattice LaMnO3 SrMnO3 Cd Se Cd Se CdSe nanoparticles View along [110] zone axis Polarity of CdSe 100 100
  • 22. 1 nm 3 11 9 10 6 Quantitative STEM Imaging Projectedpotential 3 0 0 2 5 0 2 0 0 1 5 0 1 0 0 5 0 0 x10^4 0 50 10 0 15 0 20 0 25 0 Monometallic Pt The intensity at each atomic column is proportional to numbers of atoms No defects in Pt nanoparticles Monometallic Pd Pd nanoparticles contain many defects such as twin boundaries
  • 23. x10^4 200 150 100 50 0 0 50 100 150 200 250 Bimetallic Pd(core)-Pt(shell) Pd (core) – Pt (shell) structure 1 Core-shell structure of FePd nanoparticles Core: Ordered Fe/Pd structure Shell: non-ordered structure Twin in the nanoparticle Amorphous nanoparticle 1 nm Pd columns are shown as brighter spots in the core
  • 24. Both TEM & STEM STEM better contrast Ultra thin carbon grid STEM better contrast Ultra thin carbon grid Only STEM Study Nanoparticles by TEM Size distribution: STEM will give better contrast > 5nm Bi-nanoparticles Au-nanoparticles 2 nm < Size < 5nm < 2 nm Composition study: EDS counts are low 2200FS EDS system detector area 2 times bigger beam 4 times brighter 200 nm 200 nm Minimum-dose in STEM mode HAADF-STEMimage Long exposure time Minimum-dose in TEM mode Search in low magnification Focus at another area Photo with minimum dose MDS + tomography will be available on 2100 Cryo-TEM soon +/- 80 degree tilt Special TEM technique Minimum-Dose for beam sensitive samples BF-STEM image Short exposuretime Z-contrast tilt-series J.G. Wen L. Menard, J.G. Wen
  • 25. In-situ capabilities 1. Heating (hot stage 1000°C) 2. Cooling (liquid N2) 3. Tensile-stage 4. MEMS tensile stage 5. Universal MEMS holder 6. Wet-cell 7. Nanomanipulator 8. Environmental holder 9. Applied voltage to sample 10.Cryo transfer holder In-situ holders MEMS straining stage nanomanipulation universal MEMS holder In-situ N. Schmit liquid cell All developed at CMM Water front 30 nm CNT in water J.G. Wen List of TEMs and functions 1. CM12 (120 KeV) (S)TEM • TEM, BF, DF, CBED (good), EDS, large tilt angle, etc 2. 2010 LaB6 TEM • TEM, low dose, NBD, good for HREM, video function 3. 2100 LaB6 (Cryo-TEM) • TEM, Low dose, special cryo- shielding; high-tilt angle (+/-80) (using special retainer). 4. 2010F (S)TEM • TEM, BF, DF, NBD, CBED, EDS, STEM, EELS, EFTEM, Spectrum imaging, etc. 5. HB501 STEM • STEM, BF, DF, EDS, EELS (cold FEG), ultra-high vacuum 6. JEOL 2200FS (S)TEM • Cs-corrected probe, TEM, BF, DF, NBD, CBED, EDS, STEM, EELS, EFTEM, Spectrum imaging, etc. CM 12 2010LaB6 2100 Cryo 2010F HB501 2200FS