The document discusses input/output (I/O) circuits and packaging for integrated circuits. It begins by describing how chips are connected to the outside world via I/O circuits, bonding wires, and packages. It then discusses the main properties and requirements of packages, including electrical characteristics, number of I/O pins, and thermal properties. The document outlines different packaging technologies like wire bonding and flip chip packaging. It also discusses I/O circuit requirements and different types of I/O cells like digital I/O buffers and analog I/O cells. Finally, it briefly introduces system-in-package technologies that integrate multiple silicon chips or dies into a single package using techniques like multi-chip modules, silicon interposers,
Fusion Compiler is the next-generation RTL-to-GDSII implementation system architected to address the complexities of advanced node designs and deliver up to 20% improved PPA while reducing Time To Results (TTR) by 2X.
Fusion Compiler is the next-generation RTL-to-GDSII implementation system architected to address the complexities of advanced node designs and deliver up to 20% improved PPA while reducing Time To Results (TTR) by 2X.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
The journey of designing an ASIC (application specific integrated circuit) is long and involves a number of major steps – moving from a concept to specification to tape-outs. Although the end product is typically quite small (measured in nanometers), this long journey is interesting and filled with many engineering challenges.
Today, ASIC design flow is a very mature process in silicon turnkey design. The ASIC design flow and its various steps in VLSI engineering that we describe below are based on best practices and proven methodologies in ASIC chip designs. This blog attempts to explain different steps in the ASIC design flow, starting from ASIC design concept and moving from specifications to benefits.
To ensure successful ASIC design, engineers must follow a proven ASIC design flow which is based on a good understanding of ASIC specifications, requirements, low power design and performance, with a focus on meeting the goal of right time to market. Every stage of ASIC design cycle has EDA tools that can help to implement ASIC design with ease.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
The journey of designing an ASIC (application specific integrated circuit) is long and involves a number of major steps – moving from a concept to specification to tape-outs. Although the end product is typically quite small (measured in nanometers), this long journey is interesting and filled with many engineering challenges.
Today, ASIC design flow is a very mature process in silicon turnkey design. The ASIC design flow and its various steps in VLSI engineering that we describe below are based on best practices and proven methodologies in ASIC chip designs. This blog attempts to explain different steps in the ASIC design flow, starting from ASIC design concept and moving from specifications to benefits.
To ensure successful ASIC design, engineers must follow a proven ASIC design flow which is based on a good understanding of ASIC specifications, requirements, low power design and performance, with a focus on meeting the goal of right time to market. Every stage of ASIC design cycle has EDA tools that can help to implement ASIC design with ease.
Design of ESD protection for high-speed interfacesSofics
Semiconductor companies are developing ever faster wireless, wired and optical interfaces to satisfy the need for higher data throughputs. They rely on BiCMOS, advanced CMOS and FinFET nodes with ESD-sensitive circuits. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates small area and low-cap Analog I/Os used in TSMC 28nm CMOS and TSMC 16nm, 12nm, 7nm FinFET technologies for high speed SerDes (28Gbps to 112Gbps) circuits. Parasitic capacitance of the ESD solutions is reduced below 100fF and for some silicon photonics applications even below 20fF.
2020 04 sofics low cap esd
On chip esd protection for Internet of ThingsSofics
Many of the applications in Internet of Things require non-standard on-chip ESD protection clamps. We identified 5 reasons.
- Non-standard signal voltages
- Low leakage requirement
- Sub-systems are powered down
- Wireless interfaces
- System level protection, on the chip
Clearly, IC designers need to think about the ESD protection strategy for their IoT system. It is wise to rely on silicon proven concepts to speed up market introduction.
In this webinar, you'll learn:
Why your stackup is critical to overall design success
Key elements that comprise PCB board stack-ups (power planes, balance, flex / rigid-flex, etc)
Material selection tips and guidelines
Considerations for determining the optimal layer count
Determining impedance targets and how your stack-up affects your ability to meet your impedance goals
How to leverage your stackup to ensure design accuracy and good signal quality with your CAD system
An overview of embedding components and the costs/benefits
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...Sofics
Presentation by Vera on the Mentor Graphics technology day in Cambridge (2018-09-11). In the presentation Vera covered different topics including techniques used at Sofics to speed up design. She also presented solutions for 5V tolerant interfaces and protection of high speed interfaces against ESD stress
In this presentation of mine, a basic Design approach of VLSI has been explained. The ppt explains the market level of VLSI and also the fabrication process and also its various applications. An integration of various switches, gates, etc on Ic's has also been showcased in the same.
Industrial Training at Shahjalal Fertilizer Company Limited (SFCL)MdTanvirMahtab2
This presentation is about the working procedure of Shahjalal Fertilizer Company Limited (SFCL). A Govt. owned Company of Bangladesh Chemical Industries Corporation under Ministry of Industries.
Saudi Arabia stands as a titan in the global energy landscape, renowned for its abundant oil and gas resources. It's the largest exporter of petroleum and holds some of the world's most significant reserves. Let's delve into the top 10 oil and gas projects shaping Saudi Arabia's energy future in 2024.
HEAP SORT ILLUSTRATED WITH HEAPIFY, BUILD HEAP FOR DYNAMIC ARRAYS.
Heap sort is a comparison-based sorting technique based on Binary Heap data structure. It is similar to the selection sort where we first find the minimum element and place the minimum element at the beginning. Repeat the same process for the remaining elements.
CW RADAR, FMCW RADAR, FMCW ALTIMETER, AND THEIR PARAMETERSveerababupersonal22
It consists of cw radar and fmcw radar ,range measurement,if amplifier and fmcw altimeterThe CW radar operates using continuous wave transmission, while the FMCW radar employs frequency-modulated continuous wave technology. Range measurement is a crucial aspect of radar systems, providing information about the distance to a target. The IF amplifier plays a key role in signal processing, amplifying intermediate frequency signals for further analysis. The FMCW altimeter utilizes frequency-modulated continuous wave technology to accurately measure altitude above a reference point.
Overview of the fundamental roles in Hydropower generation and the components involved in wider Electrical Engineering.
This paper presents the design and construction of hydroelectric dams from the hydrologist’s survey of the valley before construction, all aspects and involved disciplines, fluid dynamics, structural engineering, generation and mains frequency regulation to the very transmission of power through the network in the United Kingdom.
Author: Robbie Edward Sayers
Collaborators and co editors: Charlie Sims and Connor Healey.
(C) 2024 Robbie E. Sayers
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Forklift Classes Overview by Intella PartsIntella Parts
Discover the different forklift classes and their specific applications. Learn how to choose the right forklift for your needs to ensure safety, efficiency, and compliance in your operations.
For more technical information, visit our website https://intellaparts.com
We have compiled the most important slides from each speaker's presentation. This year’s compilation, available for free, captures the key insights and contributions shared during the DfMAy 2024 conference.
About
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Technical Specifications
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
Key Features
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface
• Compatible with MAFI CCR system
• Copatiable with IDM8000 CCR
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
Application
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
22. The Chip Hall of Fame
• Most chips are covered by a package.
But that was not exactly the case for the
• The chip that brought digital photography outside the lab.
• The imager of the DCS 100, the first commercially available DSLR.
• Release date: 1991 Technology: CCD
• Resolution: 1.3 MegaPixel
• Initial cost of Kodak DCS 100: $25,000
• The image sensor was mounted on a Nikon F3 Body.
• Required a 5kg external data storage unit that users
had to carry on a shoulder strap.
• Had a 200MB HDD that could store 156 images
2017 Inductee to the IEEE Chip Hall of Fame
Source: Kodak
Source: Kodak