Our PCB 101 Presentation goes through the processes involved in manufacturing a printed circuit board.
From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper and production tolerances allow us to provide our customers exactly what they need for their end product.
Designing process of printed circuit boardselprocus
Most key element in electronic circuits and equipment’s is the Printed Circuit Board which connects electronic components with conductive lines printed
Designing process of printed circuit boardselprocus
Most key element in electronic circuits and equipment’s is the Printed Circuit Board which connects electronic components with conductive lines printed
PCB Production Introduction /How to Make PCB will separated with 3 parts to introduce about printed circuit boards PCB basic, different PCB types, PCB material, PCB sheet, PCB production process, main PCB manufacturing process include PCB drilling, plated through hole, dry film,PCB etching, solder mask, different PCB surface finishing and so on...
This is a presentation that I put together that explains the basic manufacturing process for printed circuit boards. There are many different ways to build a board. This presentation explains the basics of the most common operations. This is a general overview. For more information on the subject visit www.pcbdesignschool.com
Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
A class to introduce students to designing Printed Circuit Boards (PCBs) using the Eagle software. Reflow soldering with stencil and solder paste will also be covered. This class was originally held by me at One Maker Group.
The lesson should take approximately 6 hours to complete.
The example designs used in this class can be found in the repo here. https://github.com/yeokm1/intro-to-pcb-design-eagle
Predicting an instrument's performance over time is essential to the design phase. This session will cover reliability testing and performance deterioration, including recommendations for tests that should be performed to ensure that an instrument will function through a lifetime of use, and ways to collect measurable outputs of the instrument from initial use to the end of its lifecycle.
PCB Production Introduction /How to Make PCB will separated with 3 parts to introduce about printed circuit boards PCB basic, different PCB types, PCB material, PCB sheet, PCB production process, main PCB manufacturing process include PCB drilling, plated through hole, dry film,PCB etching, solder mask, different PCB surface finishing and so on...
This is a presentation that I put together that explains the basic manufacturing process for printed circuit boards. There are many different ways to build a board. This presentation explains the basics of the most common operations. This is a general overview. For more information on the subject visit www.pcbdesignschool.com
Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
A class to introduce students to designing Printed Circuit Boards (PCBs) using the Eagle software. Reflow soldering with stencil and solder paste will also be covered. This class was originally held by me at One Maker Group.
The lesson should take approximately 6 hours to complete.
The example designs used in this class can be found in the repo here. https://github.com/yeokm1/intro-to-pcb-design-eagle
Predicting an instrument's performance over time is essential to the design phase. This session will cover reliability testing and performance deterioration, including recommendations for tests that should be performed to ensure that an instrument will function through a lifetime of use, and ways to collect measurable outputs of the instrument from initial use to the end of its lifecycle.
Design for Manufacturability Rapid Fire April Bright
Design for manufacturability (DFM) is a broadly-implemented step in today’s development process to ensure that a designed product can actually be manufactured. While the concept sounds simple, there are nuances to every supplier relationship and every new process.
Three suppliers—a contract manufacturer, additive manufacturer and plastics company—will each spend 15 minutes answering the following question: With orthopaedic customers, our greatest DFM pain point is ___ and the best strategy to change that is ___.
OEMs will learn best practices and ways to approach DFM with their supplier partners.
Strategies for Device Approval in China, India, South Korea and AustraliaApril Bright
This session will describe the orthopaedic device regulatory and registration requirements in Asia Pacific markets. Regulatory steps and strategies will be presented for each of these countries. The discussion will also cover ways to gain regulatory information about competitors already selling in these markets. Attendees will leave the session with an understanding of timelines, costs and complexity for approval.
Significant changes are underway that impact the quality and regulatory systems of medical device companies and their suppliers. ISO 13485:2016 adds new requirements to address risk management and to better align the standard with global regulatory requirements (FDA, MDD, JPAL, etc.). With the release of ISO 9001:2015, the ISO 9001 and ISO 13485 standards are no longer integrated. A new single audit MDSAP program will be in effect beginning 2017 that incorporates applicable FDA, Canadian, Brazilian, Australian and Japanese quality system requirements into the annual ISO 13485 audit cycle. The presentation will provide an overview of these changes and the steps required to incorporate these changes into existing quality management systems.
PCBA Assembly Process Flow / PCB Assembly Manufacturing introduces the basic manufacturing process of PCBA / PCB assembly in different condition of component.It is about PCBA manufacture production.
This webinar goes over the major changes of the new ISO 13485:2016 standard, including the upgrade process. Program Manager Rick Burgess presented and responded to questions live on the webinar.
Design controls are not an easy subject to address during and after the design of medical devices and manufacturing processes. Design controls should drive the device design process, not be an afterthought. This session focuses on treating design as a separate entity within the quality management system, user needs vs. design inputs, continuation of design controls after the transfer process, design review and more.
CAPA: Using Risk-Based Decision-Making Toward ClosureApril Bright
Implementing a risk‐based CAPA process within a QMS is a necessity in the improvement of controls aligned with product and process non-conformances, adverse events, audit findings, complaints, etc. Making decisions concerning scope and extent about these “defectives” is a modern and cost-saving approach to improvement and compliance. Every non-conformity does not force you to open a corrective action. While almost every problematic issue needs at least a correction, the biggest payback is to use corrective actions on systemically-driven problems that are repetitive and recurring.
Applying the methods of determining risk to the device’s complete life cycle will give your company a complete look at all of the device’s risks—including those relative to processes. Manufacturers should be able to justify that they have reduced the risks as far as possible as part of their risk management plan and ongoing corrective and preventive actions.
Steps to Compliance with the European Medical Device RegulationsApril Bright
The trilogue negotiations for the European Medical Device Regulations are expected to conclude by June. Whether or not the long-awaited regulations receive another postponement, orthopaedic manufacturers cannot put off preparation or they risk their ability to sell products in Europe. Dr. Tariah will walk attendees through the greatest pain points for orthopaedic manufacturers when complying with the new regulations.
Orthopaedic Device Industry Business Models: 2020 and BeyondApril Bright
During last year’s closing keynote, Dr. Wael Barsoum underscored the importance of producing transformational, innovative products to stay competitive and maintain a strong company and a healthy supply chain. This year, Dr. Bill Tribe will shine the “innovation lens” on the value of transforming your business.
Dr. Tribe co-authored the often-cited “Medical Devices: Equipped for the Future?” study in which the orthopaedics sector is called out specifically as facing an extreme combination of forces — none of which come as a surprise or are new, but when viewed holistically (as in the image below), paint a rather obvious picture of the need for companies to respond. As you can see, orthopaedics is the only sector with 4 of 5 “hot” areas…and in this case, the odd one out (regulatory scrutiny) is still marked “critical.”
From a top-down view, the five “disruptors” listed above are acute (power shift to payors, regulatory scrutiny, unclear sources of innovation, new healthcare delivery models, need to serve lower socio-economic classes). They impact the overall orthopaedic industry intensely – but how are they impacting you? Dr. Tribe’s Keynote Address will take into account the uniqueness of the OMTEC audience: large and small OEMs, Suppliers and Service Providers.
As stated in the A.T. Kearney study, “Each company faces a different set of headwinds…while the macro-factors held true, individual experiences and prioritization depended on factors such as market geography, product life cycles and go-to-market strategies. The most effective strategies are therefore likely to be company specific.”
What will be your business model in 2020? 2025?
Will you be considering cost-structure, deployment of inventory, commercial logistics, quality and regulatory frameworks, R&D, innovation and data collection?
Dr. Tribe will break down the issues and share potential approaches to help you navigate toward a more relevant and lucrative business model – regardless of where you are in the process.
Understanding the New ISO 13485:2016 RevisionGreenlight Guru
he much anticipated revision to ISO 13485, the global medical device quality management system (QMS) standard, was released late last month (Feb, 2016).
The new ISO 13485:2016 ushers in a whole new wave of changes and requirements medical device manufacturers must adhere to, which we covered on our previous webinar here (http://www.greenlight.guru/webinar/iso-13485-2016-changes).
ISO tells us that there will be a three year transition period after which the guidance says, “any existing certification issued to ISO 13485:2003 will not be valid.”
The time to start planning your organization's transition to ISO 13485:2016 is now. Or face playing expensive catch up later.
(You can view the full webinar here: http://www.greenlight.guru/webinar/iso-13485-2016-transition-planning)
In this webinar, you'll learn specifically:
What your organization needs to be doing to prepare for the transition to ISO 13485:2016
Why the transition presents an opportunity for your organization to implement better processes
An overview of the specific changes coming with ISO 13485:2016
The actions you should be taking now and how to plan for the implementation of the standard
Creative Hi-Tech would like to share some basics of Printed Circuit Boards which will help you to gain some knowledge before going to any vendor. This power point presentation will clear your basic doubts regarding the PCB.
South Bay Circuits, Printed Circuit Board Process for NewbiesJames Anderson
To many buyers in the electronics industry, the P.C.B. on the B.O.M. is just another part number. From data transmission to South Bay through boards ready-to-ship, here are the fundamental manufacturing steps before they dock.
Now you have a road map when you ask "where are my boards in process?."
Critical flex and rigid-flex circuit applications often must pass very stringent electromagnetic (EM) or radio frequency (RF) interference requirements. This type of interference, if absorbed or emitted, can negatively impact the functionality and reliability of the end product when in use.
To prevent this from occurring, the circuit design must incorporate shielding to eliminate either the absorption or transmission of EM or RF interference. For flex and rigid-flex PCB designs, there are two types of shielding solutions that can be applied, but which is best suited will depend upon other design requirements.
In this webinar, we review shielding methods and how to implement them in a flex or rigid-flex PCB design to ensure interference free operation of your design.
For more information on our custom flex and rigid-flex circuit solutions, visit https://www.epectec.com/flex.
Step by step guide which will help to understand the PCB fabrication process. PCB manufacturing and assembly must be conducted in a clean environment that is free of contaminants. This is important to produce good quality boards that offer unfailing service for years.
There is a ppt presentation on the process of PCB Designing . That will help others to made their own ppt in this topic. They can use it as a guidance but it is advised not to copy from this. There might be many topics that was not covered in this ppt. So, you can improve that in your own ppt
In the dynamic landscape of energy storage, choosing the right battery pack is a critical decision that significantly impacts performance, efficiency, and overall product design. This webinar aims to unravel the complexities surrounding standard and custom battery packs (primarily lithium), providing you with a comprehensive understanding to make informed decisions.
We'll embark on a journey to explore the fundamental distinctions between standard off-the-shelf battery packs and their bespoke counterparts tailored to specific applications.
We will delve into the nuance of what is defined as a standard battery pack along with its benefits, limitations, and how it caters to broad market needs.
Simultaneously, we will dissect the world of custom battery packs, diving into the advantages they offer in terms of precise energy requirements, form factors, and unique design considerations.
Whether you are a product designer, engineer, or industry professional, this webinar is designed to equip you with the knowledge necessary to navigate the intricate terrain of battery pack selection. Join us for this webinar as we navigate through the intricacies of standard and custom battery packs, empowering you to make strategic decisions that align with your project goal.
For more information on our battery pack solutions, visit https://www.epectec.com/batteries/.
In today's technology-driven business, High-Speed Digital (HDI) has become more and more in demand. Bringing with it the demand for electrical and thermal performance, along with sequential lamination. To achieve this demand, the performance and reliability of the material have become much more important.
Tachyon-100G laminate materials are designed for very high-speed digital applications. Tachyon-100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz and have proven to pass 10x lamination cycles.
In this webinar, Isola Director of High-Performance Products Michael Gay presents Tachyon-100G, highlighting the product offering and properties, and focusing on key performance attributes, product comparison, electrical performance, lamination, and more.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
While many perceive high-tech PCBs as those with more layers, our aim is to outline the key areas that need to be understood when evaluating the capabilities of 2- and 4-layer PCB manufacturers. These versatile and cost-effective circuit boards can be as high-tech as their multi-layer counterparts, and our objective is to educate our audience as to what to look for to ensure that you get exactly what you are looking for.
Low Layer Count PCBs - Why They Are Not All Created Equal Because of changes in technology, 2- and 4-layer PCBs continue to be at the forefront of high-tech electronics manufacturing, design strategies, manufacturing requirements, and the future of PCB technology, showcasing how these compact boards can rise to any challenge.
In this webinar, we cover design strategies, manufacturing requirements, and the future of PCB technology, showcasing how these compact boards can rise to any challenge. We will also delve into the advantages and limitations of 2- and 4-layer PCBs, compare them to multi-layer boards, and discuss design tips to maximize their performance.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
Flex and rigid-flex circuit boards have a number of design requirements that either differ or do not exist in rigid PCB designs. Because of this, we routinely see technical issues in data sets supplied by our customers that need to be either resolved, updated, or corrected.
Some items are easily addressed, some require input from the supplier while others require updates/changes to the data set by the customer.
Understanding these issues and root causes allows for improved and complete data sets which will streamline both the quoting and production engineering processes. Any additional communications to resolve the technical items will be minimized and or eliminated.
In this webinar, we cover the three most common areas we see in the supplied flex and rigid-flex PCB data sets, that lead to technical issues that need to be addressed.
For more information on our flex and rigid-flex PCB solutions, visit https://www.epectec.com/flex/.
Building a custom enclosure or handheld device comes with many design challenges. Adding components like power cords, buttons, and displays to your application can become a painstaking engineering task taking several design iterations.
However, a few wise choices early on in the project’s design stage can help all parties involved in the application’s development. A truly custom user interface design solutions can be brought to market quickly without a huge development budget.
In this webinar, we cover several design examples and industry best practices for integrating keypads and cable assemblies within an injection molded enclosure.
For more information on our custom cable solutions, visit https://www.epectec.com/batteries.
Why spend the time and money to develop and manufacture a custom lithium-ion battery pack when off-the-shelf battery packs are radially available? Custom battery packs can be designed to fit the unique needs of an end product’s size and shape, temperature, power, voltage, runtime, and interface requirements, which generic battery packs cannot meet.
Supply chain issues can be avoided with better control of all the components and “end-of-life” surprises prevented. Custom battery packs come with a host of design and manufacturing challenges. Each battery is unique and must be designed and fully tested for the intended application.
In addition, regulatory testing is mandatory to ensure that the new design can safely withstand environmental abuses expected and unexpected in the field.
For more information on our custom battery pack solutions, visit https://www.epectec.com/batteries.
Over the last several years, the technical complexity of printed circuit boards that we fabricate on a day-to-day basis has risen exponentially. Many companies embrace this complexity, but for customers, the overall financial risk increases dramatically.
Printed circuit boards are a complex product that requires many steps to produce, and all customer’s specifications are a little different. This requires a PCB fabricator to have a very clear process and understanding of how these requirements affect production.
In this webinar, we share with you how to better understand what each of the requirements means for you and the fabricator, how to ensure that you are getting exactly what you specified and how to protect your data from falling into the wrong hands.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
A standard requirement for all flexible and rigid-flex circuit board designs is that they all contain both electrical and mechanical requirements. The demands of each of these two distinct areas, when combined in a specific design, can create conflicts that may compromise it. A complete review of all the requirements, and how they interact, is part of the design process that ensures all performance requirements are met reliability.
In this webinar, we identify the specific technical items, for both electrical and mechanical portions, that can create design challenges or limitations and the methods used to resolve them.
For more information on our flex and rigid-flex PCB solutions, visit https://www.epectec.com/flex.
Custom multiconductor cable assemblies and wire harnesses are used in just about all electronic products in the world today. Ranging from UL-approved internal appliance wiring to highly flexible moisture-resistant extension cords, to household lamp cords, low-cost cabling options are available in a wide range of wire sizes, temperature limits, and voltage ratings.
Choosing the best wire type in terms of function, cost, and delivery can be overwhelming with the thousands of wire options available. But with a few design tips from an experienced manufacturing partner like Epec and the flexibility to specify off-brand UL-approved wire and connectors, our customers can get to market faster with less risk for countless types of custom cable assemblies.
In this webinar as we review common UL wire types and applications, form, fit, and function equivalency for wire and connectors, simplified documentation to get started, and more.
For more information on our custom cable assembly solutions, visit https://www.epectec.com/cable-assemblies.
CNC machining costs will always vary depending on many different factors, including the length of time required to complete the project, materials specified, as well as the type of machine used, such as 3- and 5-axis machines.
CNC machining is an integral part of many industries, getting the tools and parts you need with an accuracy that is difficult to achieve. Businesses are often looking for ways to trim their budgets; reducing CNC machining costs is no exception. If you are interested in CNC machining cost reduction, you need to understand the factors that impact the cost of CNC parts — machining time, start-up costs, material costs, and more.
In this webinar, we review some of the biggest factors that can affect your CNC machining costs and specific ways to help you reduce costs on your CNC machined parts.
For more information on our precision CNC machined parts, visit http://www.epectec.com/cnc-machining.
There are many special features that are designed into the printed circuit board (PCB) that will increase the number of processing steps that it takes to complete the order. The combination of features can add additional cost to the raw PCB and increase the lead time to process.
When considering a PCB design and layout or redesign, it would be advantageous to consult with experts. Your printed circuit board supplier should have engineering resources to consult and review preliminary information and be able to assist with design suggestions.
In this webinar, we discuss multilayer features for printed circuit boards that add cost and processing time. We will also look at base costing materials, copper weights, common cost adders, plating finishes, processing, less common features, and more.
For more information on our custom PCB solutions, visit https://www.epectec.com/pcb.
As you know, component shortages are impacting product lead times around the world. Advanced smart battery packs and chargers are no exception. Over recent years, electronic circuit functionality has been consolidated into smaller ICs that can manage a lot of functionality into small, easy-to-use single ICs. Unfortunately, these ICs are single-sourced ICs with lead times stretching beyond 80 weeks. These extremely long lead times can kill projects and companies.
In this webinar, we reviewed methods that we use to minimize or eliminate these single-sourced components used in battery pack manufacturing. Along with ways to layout circuit boards to allow component flexibility preventing redesigns, and methods to use firmware to reduce dependencies on sole-sourced parts.
For more information on our custom battery pack solutions, visit https://www.epectec.com/batteries.
Epec Engineered Technologies is the ideal choice for an OEM seeking customized product solutions from a focused and agile partner having supported over 5,000 customers across all sectors of the electronics industry. By providing highly experienced technical resources, a proven manufacturing platform and the fastest delivery in the industry, we are able to provide cost effective and innovative solutions that deliver the highest reliability products to the market faster.
Not many customers know that we offer full PCB design and layout services here at Epec. Design and layout may not be a full-time employable position, so there are advantages of having your PCB fabricator complete the PCB design for you, not to mention the time needed to accomplish this task. So, rely on Epec to be an extension of your electrical engineering team.
PCB designs can be difficult to manufacture. Working in tandem with your circuit board supplier is beneficial to both you and your supplier. It can save cost, reduce manufacturing challenges and prototyping.
Knowing what is needed for quoting purpose and at the time of your order is key to a smooth process.
In this webinar, we review what is needed in terms of the Bill of Materials and schematic details to accurately quote and deliver the exact PCB design and layout that you require.
For more information on our custom PCB solutions, visit https://www.epectec.com/pcb/
In order to properly manufacture mil/aero, flex/rigid-flex PCBs, and RF/Microwave PCBs, significant investment in specialized equipment to meet the demanding tolerances required in these applications.
COVID-19 has turned the world of manufacturing, and everything else, upside down. For printed circuit boards, it was especially painful. Close to 75% of all PCBs are made in Asia, and this made it even more difficult to manage. Currently, less than 5% of all PCBs are made in the U.S., and that is not going to change anytime soon as our cost base is much too high to be price competitive. It is also very difficult to get a new site permitted given the type and amount of chemicals that go into PCB manufacturing.
With this being the reality that we live in at the moment, we must truly understand all of the aspects of the PCB supply chain in Asia (not just China) and how to position ourselves with a partner that has made the significant financial investment in a resilient supply chain.
In this webinar, we reviewed some topics we have been asked to elaborate on by our customers, along with managing your freight costs, delivery times, laminate availability, and stocking programs we offer.
For more information on our quick-turns PCBs, visit https://www.epectec.com/pcb/quick-turn-pcb-printed-circuit-board.html.
Flexible heaters are just that…heaters designed to be flexible enough to accommodate tight areas and intricate geometries that need heating properties. These highly-customized heaters are engineered specifically to meet your specific requirements. They’re thin, bendable, and can be designed using the most complex shapes, geometries, and curves to fit almost any type of application.
In today’s world of making every device portable, the electronics industry has increased the demands and requirements for portable power at an incredible rate.
Often, the battery and the design of the proper management system are key to making a device function properly in its portable state. This makes the needs of battery design within complex systems more important than ever.
In this webinar, we review some of the key battery pack design consideration that our experience shows are critical to a successful product launch.
For more information on our custom battery pack solutions visit http://www.epectec.com/batteries/.
Have you ever designed a PCB and sent it out for quotation, only to receive a series of no-quotes or deviation requests from potential suppliers? If so, then you may be interested to find out why this happens and how to minimize the likelihood that it will happen again in the future.
Good circuit board design practices are essential, of course, but it is also helpful to understand your suppliers’ capabilities so that you can anticipate which features might make your high-tech PCB more difficult to build.
In this webinar as we discuss some of the key requirements you should know about your PCB suppliers’ capabilities to ensure your high-tech PCB is manufactured properly in a timely manner.
For more information on our printed circuit board solutions visit http://www.epectec.com/pcb/.
The flex and rigid-flex manufacturing process is inherently more complex with more process steps than those found in a rigid PCB of similar technology. When it comes to flex PCB designs, this is driven by the difference in materials combined with the many added items or features that can be incorporated into a design.
These include stiffeners (of varying materials / thickness / locations), pressure sensitive adhesives, shield layers, strain reliefs, etc. For rigid-flex designs this can become additionally complex as all the available flex items are combined with all the technical items found in rigid PCBs. These items potentially interact and can negatively impact the efficiency of the production process.
Streamlining is defined as making a process more efficient and effective. Having a design that streamlines the production process will have the benefits of improved delivery times, reduced part cost, improved manufacturing yield, and even potentially improved long-term part reliability.
In this webinar where we review the many areas of flex and rigid-flex designs that can impact how streamlined a design is for production.
For more information on our flex and rigid-flex PCB solutions visit https://www.epectec.com/flex/.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
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During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
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The Art of the Pitch: WordPress Relationships and Sales
PCB 101 - How To Build a Circuit Board
1. How to Build a Circuit Board
PCB 101
DELIVERING QUALITY SINCE 1952.
2. America's Oldest,
A History of Innovation
Privately held company, established in 1952.
Estimated 2013: Sales: US$40 Million
100+ Employees Worldwide
(70 – North America, 30 – Asia, 3 – Europe)
Design and manufacture customized, built-to-print,
performance-critical products for all sectors of the
electronics industry.
Leading provider of printed circuit boards, membrane switches, graphic
overlays, silicone rubber products, electronic heaters, fans, motors and
custom battery packs.
Integrated supply chain management solutions to handle the complexity of
today’s global marketplace while making sure that every order is being
manufactured at the “right” factory.
2
6. PCB Design and Layout
Our Capabilities Encompass The Full Design Flow From Start To
Finish Including:
Micro
BGA / Micro Via / Blind and Buried Vias
Rules Driven Designs
Schematic Capture
Library Development
Database Construction and Verification
Signal Integrity/Design Verification
EMI Checking
Full Document Package Creation
Electrical Engineering Expertise
We
are fully licensed and utilize industry leading tools, including Cadence Allegro, Mentor Expedition,
Mentor's PADS, Altium, Valor for DFM Analysis.
6
7. How to Build a Circuit Board
PCB 101
Customer Supplied Data
– CAD
• ODB++, Gerber, Gerber 274X
• Netlist (IPC-D-356)
– Drawing Package
• Fabrication drawing
• Readme File
• Specifications
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8. How to Build a Circuit Board
PCB 101
Cam Deliverables
– Conversion of Customer Supplied Data to Tooling
Panelization
– Optimized manufacturing Panel
– Customer defined sub-panels or arrays
Artwork
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Inner Layer
Outer Layer
Soldermask
Legend
Drill and Rout Programs
– Excellon format ASCII
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9. How to Build a Circuit Board
PCB 101
Engineering Strategy
– Epec’s Front End Engineering Department uses state of the art software to identify
and reduce or eliminate unnecessary manufacturing costs.
EpecDFx - Perfecting the DFM Process
– EpecDFx goes beyond DFM (Design for Manufacturability)
• Design for cost
• Design for functionality
– ALL jobs are processed through EpecDFx checking for:
• Shorts
• Opens
• Line widths
• Spacing issues
• Mask problems
• Legend problems
• Inner layer plane problems
• Controlled impedance
• Unused pads (and removal of same)
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10. How to Build a Circuit Board
PCB 101
Cores/Laminate
– A thin laminate material (usually under .250” thick) consisting of a glass epoxy
substrate clad with copper on both sides.
– The size of the core is larger than the finished size of the board.
Copper Foil
Laminate
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11. How to Build a Circuit Board
PCB 101
Laminate: CEM-1
Low cost – Single Sided Industry standard for low cost single sided PWB.
– Material of choice for low cost, single sided PWB applications
– Suitable for low to moderate board rigidity requirements (lowest rigidity of these
three laminates)
– May not be suitable in environments where moisture absorption is of high concern
COPPER FOIL
CEM-1: A 5-ply composite composed
of one ply of epoxy-resin impregnated
glass cloth above and below a 3-ply
epoxy-resin coated paper core.
EPOXY-RESIN GLASS CLOTH
3-PLY KRAFT PAPER CREATING AN
EPOXY-RESIN COATED PAPER CORE
EPOXY-RESIN GLASS CLOTH
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12. How to Build a Circuit Board
PCB 101
Laminate: FR-4
– Industry Standard Rigid PWB Laminate
– FR-4 is truly the most generic laminate
– Many different manufacturers offer products with different characteristics
COPPER FOIL
FR-4: Eight weaves of fiberglass
cloth laminated together with an
epoxy resin. (60% Glass / 40% Resin)
EIGHT WEAVES OF FIBERGLASS
CLOTH LAMINATED TOGETHER
WITH AN EPOXY RESIN
COPPER FOIL
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13. How to Build a Circuit Board
PCB 101
Dry Film Resist Coat
– A light sensitive film is applied by heat and pressure to the copper surfaces of the
core
Photo Tools & Artwork
– These are placed on the film coated surfaces of the core
– Artwork patterns are customer designs containing circuit and land patterns specific
to that part number
– Each surface has its own artwork pattern
Etch Photoresist
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14. How to Build a Circuit Board
PCB 101
Expose
– Panels are exposed to ultra-violet light
– Clear areas allow light to pass through and polymerize (harden) the film resist thus
creating a latent image of the circuit pattern
Develop
– The exposed core is passed through a chemical solution removing the resist from
areas not hardened (polymerized)
Artwork
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15. How to Build a Circuit Board
PCB 101
Etch
– Copper is chemically removed from the core in all areas not covered by film resist
– This creates a discrete copper pattern
– Core surface now shows through in areas where copper was etched away
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16. How to Build a Circuit Board
PCB 101
Strip Resist
– The developed dry film resist is now chemically removed from the panel
– Copper remains on the panel only in the patterns described by artwork
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17. How to Build a Circuit Board
PCB 101
Oxide Coating
– Copper is chemically treated to “rough-up” surface
– Rough surface improves adhesion to prepreg during the lamination cycle
– Oxide is typically black, though other types exist, i.e. Brown and Red
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18. How to Build a Circuit Board
PCB 101
Multilayer Lamination
– Materials Needed:
• Copper Foil
• Prepreg
• Cores
Prepreg
– Multilayer “glue”
– Fiberglass cloth preimpregnated with partially cured epoxy resin
– Also known as B-stage
Copper Foil
– Typically in sheets at ½ oz. or 1 oz. per square foot in weight (.0007 and .0014
inches nominal thickness respectively)
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19. How to Build a Circuit Board
PCB 101
Laminated Blank
– Inner Layer Core, Copper Foil and Prepreg are bonded together under heat and
pressure, usually in a vacuum, during the lamination process
– Prepreg resin is activated and “melts”, flowing across the layer to create a bond.
– Half-sheets are produced during this step
– Half-sheets are then cut or fabricated (fabed) into panel size
Primary Drilling
– Double Sided/Single Sided Start here
• Holes are drilled through a stack of panels (usually 2 to 3 high)
• Drilled holes are typically .005” larger than finished plated through hole size
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20. How to Build a Circuit Board
PCB 101
Drill
– Holes are CNC drilled to specific coordinates from the data supplied after it is
formatted
Inner Layer
Laminate
Copper Foil
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21. How to Build a Circuit Board
PCB 101
Multilayer Stack-up
(Cross Section)
4 Layer
6 Layer
Copper Foil
(.5, 1, 2, ... ounces)
Double sided core
(.028 for 4 layer)
(.014 for 6 layer)
(.008 for 8 layer)
Copper weight up to 3 ounces
B-stage Prepreg
(Bonding Sheets)
8 Layer
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22. How to Build a Circuit Board
PCB 101
Deburr & Clean
– A mechanical process where copper burs are removed from the panel
– All debris is cleaned from drill holes
Desmear
– Applies to multilayer boards only
– A chemical process where the coating of resin, produced by the heat of drilling, is
removed from the hole wall
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23. How to Build a Circuit Board
PCB 101
Copper Deposition
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Also called electroless copper
A thin coating is chemically deposited on the surface of the panel and hole walls
This creates a metallic base for subsequent electroplating operations
Typically thickness is 80-100 millionths of an inch
Electroless
Copper
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24. How to Build a Circuit Board
PCB 101
Dry Film Photo Resist Coat
– The panel is pre-cleaned
– Light sensitive film is applied, using heat and pressure, to the copper surfaces of
the laminated “blank”
– Film also covers, or tents, all drilled holes
Inner Layer
Laminate
Copper Foil
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25. How to Build a Circuit Board
PCB 101
Expose & Develop
– The panel is then exposed and developed
– Similar to the inner layer process for the core
– Holes that are to be plated have tents developed off
Photoresist
Artwork
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26. How to Build a Circuit Board
PCB 101
Copper Pattern Plate
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Also called electroplating
Additional copper is electrically plated onto the exposed electroless copper surfaces
Copper thickness is approximately 1 mil
Tin is also plated onto all copper surfaces
Typical tin thickness is .3 - .5 mils
Electroplated
Copper
Resist Metal (tin)
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27. How to Build a Circuit Board
PCB 101
Etch
– Copper is now removed any place not covered by tin
– The tin acts as an etch resist
– Traces and pads, as defined by the artwork, are now left on the surface of the panel
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28. How to Build a Circuit Board
PCB 101
Strip Resist
– The developed dry film resist is now chemically removed from the panel
– Tents that were placed have prevented plating to occur in holes designed to be
non-plated
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29. How to Build a Circuit Board
PCB 101
Solder Mask & Cure
– A Liquid Photo Imagable mask, is applied to each surface and dried to the touch,
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but not cured
Artwork is applied and exposed
Panel is developed, leaving mask in pattern described by artwork
Panels are cure baked
Mask protects panels from contamination and handling damage
Solder mask is a non-conductive material
Laminate is a natural color, solder
mask gives the circuit board its
final color, typically green
Solder Mask
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30. How to Build a Circuit Board
PCB 101
Hot Air Solder Leveling (HASL)
– Panels are processed thru a bath of molten solder, covering all exposed copper
surfaces
– High pressure hot air, directed at both sides of the panel simultaneously, removes
excess solder from the holes and surfaces
– While HASL is still the most common
PCB surface finish, many other
options exist that will allow our
customers to meet their end
product needs.
Solder
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31. How to Build a Circuit Board
PCB 101
Surface Finishes
– RoHS Compliant:
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•
•
•
•
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•
Organic Solder Preservation (OSP)
Single and Multi-Pass
Lead-free HASL
Nickel Plate
Nickel/Gold
Palladium – Nickel
Immersion Tin
Immersion Silver
– Not RoHS Compliant:
• Hot Air Solder Leveling (HASL)
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32. How to Build a Circuit Board
PCB 101
OSP Surface Finishes
– Single-Pass – single soldering operation (or heat cycle)
– Multi-Pass - able to survive multiple heat excursions for SMT applications
– Coating is molecular in thickness and is compatible with most flux systems,
including “no wash” systems
– DOES NOT CONTAIN LEAD!
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33. How to Build a Circuit Board
PCB 101
Lead Free HASL
– There are several types
• SN100 (most common in China)
– Tin – trace of Copper < 0.7%
• SAC305 – Limited availability
– Tin – 3.0% Silver - .05% Copper
– PCB is conveyed through the flux station, then through the solder bath and finally
through a set of air knives that remove (level) excess solder
– Thickness varies - Generally somewhat thinner than regular HASL:
• From .000100” to .001500”
– Lead Free HASL provides a solderable surface with most flux systems and is also
suitable for most surface mount applications
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34. How to Build a Circuit Board
PCB 101
Ni / Au Plating
– Electroplated Deposit
• SMOBC – soldermask used as plating resist
• We will only plate Ni/Au after etching – we will not use Ni/Au as an
etching resist
• All circuits or features which will be electrically connected with plating buss (tie
bars)
• Thickness for Gold: .000005” to .000050”
– ENIG – Electroless Nickel/Immersion Gold
• Bussing (tie bars) not required
• Max. Thickness for Gold: .000002” to .000005”
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35. How to Build a Circuit Board
PCB 101
Immersion Tin (Also known as White Tin)
– Excellent Co-planarity
– Shelf life equal to or exceeds HASL
– Will solder after multiple heat cycles – Solder paste, reflow, glue dot
and wave soldering
– Less dimensional stress than with HASL
– No special handling required
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36. How to Build a Circuit Board
PCB 101
Immersion Silver
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Totally flat topography
More solderable than copper
Does not require special handling like OSP (white gloves, etc.)
Shelf life is 6-12 months depending on storage conditions
Can withstand 5 temperature cycles
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37. How to Build a Circuit Board
PCB 101
Hot Air Leveling (HAL, HASL)
63/37 Solder Coating
– PCB is conveyed through the flux station, then through the solder bath and finally
through a set of air knives that remove (level) excess solder
– Thickness varies:
• From .000100” to .001500”
– HASL provides a solderable surface for all flux systems and is also suitable for
surface mounted applications
– Still the most common protective coating used in PCB manufacturing
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38. How to Build a Circuit Board
PCB 101
Legend & Cure
– Ink is silkscreened onto each side of the
panel as described by customer artwork
– The printing details component placement
and other surfaces details desired by
the customer
– Panels are baked to cure the ink
Legend & SMT
Nomenclature
Legends can create problems for the PCB manufacturers.
– Many designers put a box completely surrounding SMT pads to indicate component
placement
– Often the tolerances required to screen print legend are not considered. Avoid
narrow fonts, text height less than .040” and trace width below .006”
– Ask your designer to provide adequate clearances around SMT pads
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39. How to Build a Circuit Board
PCB 101
Legend Placement Around SMD Pads
Too Tight
Good
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40. How to Build a Circuit Board
PCB 101
Fabrication / Routing
– The board is cut to size
– Also known as routing, scoring, punching or profiling
– Chamfers and slots are also added during this step
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41. How to Build a Circuit Board
PCB 101
V-Groove Scoring
Engineers see scoring as a way to save. It does save from a material utilization basis,
but there are tradeoffs. Tolerances must be relaxed on the finished piece part to allow
for these tolerances. Furthermore, scoring has one of the highest fallout rates of any
process in manufacturing.
Score line to Score line
+/-.005”
Score line to holes
+/-.007”
Score line to Artwork
.015 - .020
Finished part tolerance
+.015/-.010
Web Remaining
+/-.005”
Typical Web remaining for each laminate
CEM-1
.030”
CEM-3
.030”
FR-4
.015”
HIGH Tg FR-4
.012”
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42. How to Build a Circuit Board
PCB 101
V-Groove Scoring
Scoring: Usually defined as “Web remaining.” This defines the amount of material remaining. The
cutter has a 30 degree included angle. (45 and 60 degree cutters available)
* Note how the width of the score line changes with the depth of cut.
0.008
Typical for FR-4
0.010
0.015
0.013
0.030
Typical for CEM1 and CEM-3
0.012
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43. How to Build a Circuit Board
PCB 101
Copper Weight vs. Minimum Spaces
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1 ounce copper - .008” between adjacent features
2 ounce copper - .010” between adjacent features
3 ounce copper - .012” between adjacent features
4 ounce copper - .015” between adjacent features
6 ounce copper - .020” between adjacent features
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44. How to Build a Circuit Board
PCB 101
Electrical Test
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Board is tested for electrical integrity, and if required, impedance
Data can be directly loaded from CAM to test machines in some cases
Most tests are feasible. Repairs of shorts and opens are also done at this point
Smaller lots tested on a flying probe, larger volume on a bed of nails test fixture
IPC Netlist is used if supplied by the Customer
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45. How to Build a Circuit Board
PCB 101
Functions Performed Throughout the Process:
– AOI
• Automatic Optical Inspection
• Inner layers and outer layers are tested against downloaded CAM data for
integrity, and against design rules
• If allowed and feasible, repairs are made at this point
• Data is fed back to
appropriate departments
to correct process
problems
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46. How to Build a Circuit Board
PCB 101
Functions Performed Throughout the Process:
– Reliability Lab
• In-house capability to test for compliance to many customer and industry
requirements
• Environmental Cycling, Ionic Contamination, Surface Insulation Resistance are
a few tests performed.
• Data is fed back to departments and customers as required
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47. How to Build a Circuit Board
PCB 101
Functions Performed Throughout the Process:
– SPC
• Statistical Process Control
• Method used both on and off-line to determine if process and product is
performing as expected
• ONLY reliable method to make process changes
• Often required by customers
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48. How to Build a Circuit Board
PCB 101
PCB Design Concerns
– Hole Size
• >10 Mils drilled standard
• 8 – 9 Mils, leading edge
• 5 Mils, bleeding edge
• Note: Drilled hole size typically
is .003”-.005’ larger than FHS
PCB Design Concerns
– Line/Space
• 5/5 standard
• 3/3 leading edge
– Aspect Ratio
• 8:1 standard
– 0.080” min hole size for 0.062”
– Pad Size
• 10 Mils over drilled hole
• 12:1 leading edge
– 0.005” hole for 0.062”
diameter standard
• 8 Mils leading edge
• PWG/GRD Clearance – 20 mils
over drill
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49. How to Build a Circuit Board
PCB 101
PCB Manufacturing Concerns
4 Layer Off Center Construction
.024”
.024”
.006”
Warpage Issues
Meets flatness specification
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50. How to Build a Circuit Board
PCB 101
Manufacturing / Design Concerns
Plating
– External copper thieving is recommended to be added to low-density areas to even
out copper distribution. Typical thieving pattern is .030” squares on .050” centers.
– The absence of copper thieving result in high, or over plating of isolated features,
typically differential pairs. It can also cause pitted appearance on fiducial pads,
which will cause assembly problems.
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51. How to Build a Circuit Board
PCB 101
Panelization
– PWB’s are manufactured on standard
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–
panel sizes
Cost is a factor of the number of individual
cards on a production panel
Impedance/Mil coupons, if required,
are placed in the production panel
May effect panelization yield, i.e. $$
Industry standard panel size is 18” x 24”
General rule:
• 0.750” border all 4 edges
• 0.100” spacing between images
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52. How to Build a Circuit Board
PCB 101
Sample Fabrication Drawings/Notes
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53. How to Build a Circuit Board
PCB 101
Price Considerations
– Low Cost Factors
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•
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•
•
Complex Routing/Scoring
Edge Routing
>0.093” Thick PWB’s
<0.030” Thick PWB’s
High Tg vs. low Tg Materials
– High Cost Factors
•
•
•
•
•
•
Advanced Technologies
Buried Vias
Layer Count
Material Utilization
Selective Plating
Line Width and Space
– Medium Cost Factors
•
•
•
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High Drill Hole Quantity
Plated hole tolerance less than +/- 0.003”
Edge Plating
Drilled holes <0.010”
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54. Industry’s Leading Online Tools
Sign up today and try InstantPCBQuote™, the most
flexible and user friendly internet quoting and ordering
tool in the PCB industry.
Try it Now!
www.epectec.com/instantpcbquote
54
55. World Class Quality Assurance
& Engineering
US Based QA Capabilities Include:
– Full Cross Section/Microsection Reporting and
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Ionic Testing Equipment
X-Ray Fisherscope for all Metal Thickness &
Purity Measurement on every lot.
Scienscope DMP-1000 stereo zoom
microscope with digital picture capability up to
100x
Vision Engineering Mantis Elite for 10X full
range visual inspection.
World Class Electronics Test Lab
Epec’s
superior on-time delivery rates
are the result of our significant,
dedicated engineering resources and
processes.
– Perform all DRC, DFM, Graphic Art and
Engineering reviews at our Engineering Center
outside of Boston, MA
– Documentation of all manufacturing and detailed
planning processes, for all special requirements,
– Consistent documentation and tooling at all
manufacturing locations to ensure seamless
prototype through production manufacturing.
55
56. Design Centers &
Technical Support
Battery Pack & Power Management – Denver, CO
User Interfaces – Largo, FL
Fans & Motors – Wales, UK
PCB’s – New Bedford, MA & Shenzhen, China
Flex & Rigid Flex – Toronto, Canada
Cable Assemblies – New Bedford, MA
Heaters & Sensors – Boston, MA
Our Engineering and Design teams are ready to help
our customers create world class and cost effective
product solutions.
56
57. Inventory Management
Customer requirements are always unique and customized, therefore
our inventory management system must accommodate for this type of
environment.
We Offer:
– Kanban
– Consignment
– JIT Programs
– Blanket Orders
– Customer Fulfillment
– Bonded Warehousing
– Kitting
– Safety Stock
– Other flexible solutions
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58. The Difference is Quality and Delivery
1.
Quicker Delivery - Epec's technology infrastructure and people, including the
Asian and US based operations, manufacturing and engineering teams, enable jobs to
get started the same day the order is received with no delays.
2.
Accurate Information - Epec's proven supply chain and manufacturing
experience allows accurate daily Work In Process reporting so customers can receive
immediate order status information.
3.
Better Quality - Epec ensures higher levels of quality through actual investment
in all of our processes. Whether it is our 10+ people strong quality organization in
Asia, equiping our tech centers with the latest tech gear to test parts, or our
continuous improvement auditing process, real investment is made to ensure quality.
4.
Flexibility - Each of our manufacturing facilities have been selected for their
best-in-class niche product and delivery and techology solutions, ensuring our optimal
facility is building every order.
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59.
If you require additional information please contact us with any
questions or requests.
North American Headquarters
174 Duchaine Blvd.
New Bedford, MA 02745
Tel: (508) 995-5171
Fax: (508) 998-8694
Contact Us By Email:
Sales
Quotes
Engineering
sales@epectec.com
quoting@epectec.com
engineering@epectec.com
Visit Our Website For More Information
www.epectec.com
Stay Connected with Epec Engineered Technologies
Join our Social Community and keep in touch with all our latest technology investments, current news, upcoming
events, and promotions. Visit our Social Media Websites for more information.
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