This slide covers SMT and PTH component identification and understanding; This is very helpful for candidate preparing for interview for electronics company.

1. EK KADAM
FOUNDATION"Accelerating Youth- Accelerating Nation"
Module : Component Identification

2. This module covers both Through-hole and Surface mount component identification.
 The Through-hole component section will cover the identification of
 Axial Leaded Devices
 Radial Leaded Devices
 Flat packs (IC's).
 Dual in-line packages
 The surface mount component section will cover the identification of
 Chip Resistor
 Chip Capacitors
 MELF Resistors and Diodes
 Tantalum Capacitors
 SOIC
 PLCC
 QFP
 BGA
 Polarity, value, tolerance and orientation will also be discussed.
Module 1: Component Identification
Component Identification
Electronics
Assembly

3. Through Hole Components
Component Identification
Electronics
Assembly

4. Transistors
NAME Transistor
TYPE Lead Frame Type
MOUNT Through Hole
CASING Plastic
Metal
PACKAGE Bulk
Tube
Tape & Reel
Component Identification
Electronics
Assembly

5. Axial Components
NAME Resistor
TYPE Axial
MOUNT Through Hole
PACKAGE Bulk
Tape & Reel
NAME Capacitor
TYPE Axial
MOUNT Through Hole
PACKAGE Bulk
Tape & Reel
NAME Diode
TYPE Axial
MOUNT Through
Hole
CASING Glass Case
Molded Case
PACKAGE Bulk
Tape & Reel
Component Identification
Electronics
Assembly

6. NAME Resistor
Capacitor
Resistor Array
Capacitor Array
TYPE Radial
MOUNT Through Hole
PACKAGE Bulk
Tube
Tape & Reel
Radial Components
Component Identification
Electronics
Assembly

7. Through Hole Components
Component Identification
Electronics
Assembly

8. Through Hole Components
Component Identification
Electronics
Assembly

9. DIP – Dual – in - Package
NAME Dual In-Line Package DIP
TYPE Lead Frame Type
MOUNT Through Hole
CASING Plastic
Ceramic C-DIP
CATEGORY Shrink DIP SDIP
Shrink DIP with Heat sink SDIPH
DIP with Heat sink DIPH
Terminals are on two opposite sides of the package and are arranged in two rows
Component Identification
Electronics
Assembly

10. NAME Dual In-Line Package DIP
TYPE Lead Frame Type
MOUNT Through Hole
CASING Plastic
Ceramic C-DIP
CATEGORY Shrink DIP SDIP
Shrink DIP with Heat sink SDIPH
DIP with Heat sink DIPH
DIP – Dual – in - Package
Component Identification
Electronics
Assembly

11. NAME Dual In-Line Package CERDIP
TYPE Lead Frame Type
MOUNT Through Hole
CASING Plastic
Ceramic C-DIP
CATEGORY Shrink DIP SDIP
Shrink DIP with Heat sink SDIPH
DIP with Heat sink DIPH
CERDIP – Ceramic Dual inline Package
Component Identification
Electronics
Assembly

12. Inch Metric
0201 0603
0402 1005
0603 1608
0805 2012
1206 3216
Ceramic Chip Capacitor Tantalum Capacitor Aluminum Capacitor
CHIP SIZE CHIP SIZE
Metric
3216
3528
6032
7343
1608
2012
Surface Mount Components
Nomenclature:
Chip size code is the component’s L x W dimensions. Example: 0805 = .08” x .05”
Chip size may also be expressed in metric code. Example: 2012 = 2.0mm x 1.2mm
Tantalum Capacitors & Aluminum capacitors are polarized devices and require proper
orientation during placement.
Component Identification
Electronics
Assembly

13. Surface Mount Components
CHIP SIZE
Chip Resistor
Nomenclature:
The chip size code is the component’s L x W dimensions. Example: 0805 = .08” x .05”
Chip size may also be expressed in metric code. Example: 2012 = 2.0mm x 1.2mm
Inch Metric
0201 0603
0402 1005
0603 1608
0805 2012
1206 3216
1210 3225
2010 5025
2512 6332
Inch
0604
0805
1206
1406
2308
CHIP SIZE
MELF Resistor
Component Identification
Electronics
Assembly

14. Surface Mount Components
MULTILAYER
INDUCTOR
Multi Layer Inductor Molded Case Inductor
Nomenclature:
The chip size code is the component’s L x W dimensions. Example: 0805 = .08” x .05”
Chip size may also be expressed in metric code. Example: 2012 = 2.0mm x 1.2mm
Inch Metric
0201 0603
0402 1005
0603 1608
0805 2012
1206 3216
Inch Metric
1008 2520
1210 3225
1812 4532
MOLDED CASE
INDUCTOR
Component Identification
Electronics
Assembly

15. Ultra Mini SOT
Mini SOT
Standard SOT
High Power
SOT
Surface Mount Components
SOT Transistor
3-lead devices are commonly used for diodes or transistors.
5- and 6-lead devices are used for integrated circuits or diode arrays.
Nomenclature:
SOT = Small Outline Transistor.
Component Identification
Electronics
Assembly

16. Info:
DPAKs are large packages used for power devices such as rectifiers and transistors.
Surface Mount Components
DPAK Power Device
Component Identification
Electronics
Assembly

17.  MELF and Mini MELF diodes are cylindrical cases constructed of glass or plastic.
 The glass package is commonly used lower power diodes.
 The Plastic package is used for high current rectifiers and zener diodes.
Nomenclature:
DO = Diode Outline
Surface Mount Components
MELF Diodes
Component Identification
Electronics
Assembly

18. Surface Mount Components
C-Bend Lead Gull Wing Lead
Rectangular Diodes
 Rectangular diodes and rectifiers are available in Gull-wing and C-bend leads (J-
leads).
 C-bend leads are similar to J-leads.
Nomenclature:
DO = Diode Outline
SOD = Small outline Diode
Component Identification
Electronics
Assembly

19. NAME Plastic Leaded Chip Carrier PLCC
TYPE Lead Frame Type
MOUNT SMT
CASING Plastic
Pitch 50 Mils
No. of Pins 18, 20, 28, 32, 44, 52, 68, 84
PACKAGE TUBE
Tape & Reel
Surface Mount Components
Plastic Leaded Chip Carrier
Component Identification
Electronics
Assembly

20. NAME Leadless Chip Carrier LCC
MOUNT SMT / Socket Mount
Pitch 50 Mils
No. of
Pins
20, 28, 32, 44, 52, 68, 84
Surface Mount Components
Leadless Chip Carrier
Component Identification
Electronics
Assembly

21. Surface Mount Components
SOIC – Small Outline Gull Wing
NAME Small Outline Gull wing SOIC
TYPE Lead Frame Type
MOUNT SMT
Pitch 50 Mils
No. of
Pins
4, 8, 14, 16, 18, 20, 28,
32, 40, 44
PACKAGE TUBE
Tape & Reel
Component Identification
Electronics
Assembly

22. Surface Mount Components
SOJ – Small Outline J-Lead
NAME Small Outline J-Lead SOJ
TYPE Lead Frame Type
MOUNT SMT
Pitch 50 Mils
No. of Pins 18, 20, 28, 32, 40, 42, 44
PACKAGE TUBE
Tape & Reel
Lead
Pattern
J - Lead
Component Identification
Electronics
Assembly

23. Surface Mount Components
MSOP (Gull Wing) – Miniature Small Outline Package
NAME Miniature Small
Outline Package
MSOP
TYPE Lead Frame Type
MOUNT SMT
Pitch 25.6 / 19.7 Mils
No. of
Pins
8, 10
Lead
Pattern
Gull Wing
Component Identification
Electronics
Assembly

24. Surface Mount Components
SSOP (Gull Wing) – Shrink Small Outline Package
NAME Shrink Small Outline
Package
SSOP
TYPE Lead Frame Type
MOUNT SMT
Pitch 25.7 / 31.5 Mils
No. of
Pins
8, 14, 16, 20, 24, 28,
34, 36, 40, 44, 48, 56,
64, 80
Lead
Pattern
Gull Wing
Component Identification
Electronics
Assembly

25. Surface Mount Components
TSSOP (Gull Wing) – Thin Shrink Small Outline Package
NAME Thin Shrink Small Outline
Package
TSSO
P
TYPE Lead Frame Type
MOUNT SMT
Pitch 25.7 / 19.7 / 15.7 Mils
No. of
Pins
8, 14, 16, 20, 24, 28, 32,
38, 40, 44, 48, 56, 64, 80
Lead
Pattern
Gull Wing
Component Identification
Electronics
Assembly

26. Surface Mount Components
TSOP Type1 – Thin Small Outline Package
NAME Thin Small Outline Package TSOP1
TYPE Lead Frame Type
MOUNT SMT
Pitch 19.7 Mils
No. of
Pins
28, 32, 40, 48, 56
Lead
Pattern
Gull Wing
Component Identification
Electronics
Assembly

27. Surface Mount Components
TQFP – Thin Quad Flat Pack
NAME Thin Quad Flat Package TQFP
TYPE Lead Frame Type
MOUNT SMT
Pitch 15.7 / 19.7 / 25.6 / 31.5
Mils
No. of Pins 32, 44, 48, 52, 64, 80, 100,
120, 128, 144, 176
Lead
Pattern
Component Identification
Electronics
Assembly

28. Surface Mount Components
LQFP – Low Profile Quad Flat Pack
NAME Low Profile Quad Flat Package LQFP
TYPE Lead Frame Type
MOUNT SMT
Pitch 11.8 / 15.7 / 19.7 / 25.6 /
31.5 Mils
No. of Pins 32, 44, 48, 52, 64, 80, 100,
120, 128, 144, 160, 168, 176,
208, 216, 256
Lead
Pattern
Component Identification
Electronics
Assembly

29. Surface Mount Components
QFP – Quad Flat Pack
NAME Quad Flat Package QFP
TYPE Lead Frame Type
MOUNT SMT
Pitch 11.8 / 15.7 / 19.7 / 25.6 /
31.5 / 40 Mils
No. of Pins 44, 52, 64, 80, 100, 128,
136, 144, 160, 184, 208,
240, 256, 304
Lead
Pattern
Component Identification
Electronics
Assembly

30. Surface Mount Components
CERQUAD & CLCC – Ceramic Quad Flat Pack
NAME Ceramic Quad Flat Package CERQFP
TYPE Lead Frame Type
MOUNT SMT
Pitch 19.7 / 25 / 50 Mils
No. of Pins 44, 52, 64, 80, 100, 128, 136, 144,
160, 184, 208, 240, 256, 304
Lead Pattern Flat Lead / J-Lead with CLCC / Gull
Wing
Component Identification
Electronics
Assembly

31. SMT Components - BGA
CPGA CBGACBGAFBGA
µBGA
PBGAPBGA
TBGA MMBGA Flip Chip BGA
Component Identification
Electronics
Assembly

32. SMT Components - BGA
NAME Ball Grid Array BGA
TYPE Area Array Type
MOUNT SMT
Category Plastic Ball Grid Array PBGA
Fine Pitch Ball grid Array FBGA
Chip Array Bal grid Array CABGA
High Performance Ball grid
Array
HBGA
Land Grid Array LGA
Pin Grid Array PGA
Quad Flat No lead QFN
Micro Ball Grid Array µBGA
Molded Multi Die Ball Grid
Array
MMBGA
Flip PAC Flip Chip
BGA
Super Ball Grid Array SBGA
Tape Ball Grid Array TBGA
Wire Bonding Ball Grid Array WBGA
Component Identification
Electronics
Assembly

33. COLOUR VALUE MULTIPLIER
Black 0 X 1
Brown 1 X 10
Red 2 X 100
Orange 3 X 1000
Yellow 4 X 10000
Green 5 X 100000
Blue 6 X 1000000
Violet 7 X 10000000
Grey 8 X 100000000
White 9 X 1000000000
Less Than 1000 Ohms Ohm
More Than 1000 Ohms K (Kilo Ohms)
More than 1000000 Ohms M (Mega ohm)
Calculating Through Hole Resistor Value
The Following markings have been used for calculation of component electrical value
METHOD:
1st
Band & 2nd
Band (or 3rd
) are the resistance in
ohms,
3rd
(or 4th
) is the number of zeros to follow -
'multiplier'.
Component Identification
Electronics
Assembly
Component Value

34. Component Value
1st
Band 2nd
Band 3rd
Band Multiplier Value In
Ohms
Value
conversion
Brown Black Red Red 10.2000 Ohm 10.2 K Ohm
Red Red Orange Yellow 223000 Ohm 223 K ohm
Green Blue Brown 56 Ohm 56 Ohm
White Grey Black 9.8 Ohm 9.8 Ohm
Orange Violet Blue 37000000 37 M Ohm
Examples for calculating Resistor Value
Less Than 1000 Ohms Ohm
More Than 1000 Ohms K (Kilo Ohms)
More than 1000000 Ohms M (Mega ohm)
Calculating Through Hole Resistor Value
Component Identification
Electronics
Assembly

35. Component Value
Calculating SMD Resistor Value
 The SMD Resistors are coded with a numerical equivalent of the familiar three band
colour code. In the same way as wire ended components, precision resistors (1% or
better) may be marked with a four digit code.
 1st Band & 2nd Band (or 3rd) are the resistance in ohms
 3rd (or 4th) is the number of zeros to follow - 'multiplier'
 Resistances of less than 10 ohms have a 'R' to indicate the position of the decimal
point.
Component Identification
Electronics
Assembly

36. Component Value
3 Digit Example 1st
Digit 2nd
Digit Multiplier Value
330 3 3 X 1 33 Ohms
221 2 2 X 10 220 Ohms
683 6 8 X 1000 68 K Ohm
105 1 0 X 100000 1 M Ohm
8R2 8 2 X 0.1 8.2 Ohm
Less Than 1000 Ohms Ohm
More Than 1000 Ohms K (Kilo Ohms)
More than 1000000 Ohms M (Mega ohm)
The Following markings have been used for calculation of component electrical value
Calculating SMD Resistor Value – 3 Digit
Component Identification
Electronics
Assembly

37. Component Value
4 Digit Example 1st
Digit 2nd
Digit 3rd
Digit Multiplier Value
1000 1 0 0 X 1 100 Ohms
4992 4 9 9 X 100 49.9 K Ohms
16234 1 6 2 X 1000 162 K Ohm
0R56 R 5 6 X 0.1 0.56 Ohm
R56 R 5 6 X 0.1 0.56 Ohm
Less Than 1000 Ohms Ohm
More Than 1000 Ohms K (Kilo Ohms)
More than 1000000 Ohms M (Mega ohm)
The Following markings have been used for calculation of component electrical value
Calculating SMD Resistor Value – 4 Digit
Component Identification
Electronics
Assembly

38. Component Value
Calculating SMD Resistor Value – EIA 96 Marking Method
EIA-96 marking method:
 a new coding system has appeared on 1% types.
 It consists of a three-character code.
 A look up table is provided.
 The first two digits signify the 3 significant digits of the resistor value,
using the lookup table below.
 The third character - a letter - signifies the multiplier for 1% Resistors
(Example = 22A)
 In case of 2%, 5% & 10% the multiplier character is assigned before the
code. (Example = A22)
Component Identification
Electronics
Assembly

39. Component Value
Calculating SMD Resistor Value – EIA 96 Marking Method
Letter
Multipli
er
A 1
B 10
C 100
D 1000
E 10000
F 100000
X or S 0.1
Y or R 0.01
Table for 1% Resistors Multiplier
Example:
22A = 165*1 = 165 ohm
68C = 499*100 = 49.9 K Ohm
43E = 274*10000 =2.74 M Ohm
Cod Val Cod Val Cod Val Cod Val Cod Val Cod Val
01 100 17 147 33 215 49 316 65 464 81
68
1
02 102 18 150 34 221 50 324 66 475 82
69
8
03 105 19 154 35 226 51 332 67 487 83
71
5
04 107 20 158 36 232 52 340 68 499 84
73
2
05 110 21 162 37 237 53 348 69 511 85
75
0
06 113 22 165 38 243 54 357 70 523 86
76
8
07 115 23 169 39 249 55 365 71 536 87
78
7
08 118 24 174 40 255 56 374 72 549 88
80
6
09 121 25 178 41 261 57 383 73 562 89
82
5
10 124 26 182 42 237 58 392 74 576 90
84
5
11 127 27 187 43 274 59 402 75 590 91
86
6
12 130 28 191 44 280 60 412 76 604 92
88
7
13 133 29 196 45 287 61 422 77 619 93
90
9
14 137 30 200 46 294 62 432 78 634 94
93
1
Component Identification
Electronics
Assembly

40. Component Value
Calculating SMD Resistor Value – EIA 96 Marking Method
Table for 2%, 5% & 10% Resistors
Multiplier
Example:
A22 = 750*1 = 750 ohm
C31 = 180*100 = 18 K Ohm
D18 = 510*1000 =390 K Ohm
10% 2% 5%
Co
d
Val
Co
d
Val
Co
d
Val Cod
Va
l
Co
d
Val
01
10
0
13
33
0
25
10
0
37
33
0
49
10
0
02
11
0
14
36
0
26
11
0
38
36
0
50
12
0
03
12
0
15
39
0
27
12
0
39
39
0
51
15
0
04
13
0
16
43
0
28
13
0
40
43
0
52
18
0
05
15
0
17
47
0
29
15
0
41
47
0
53
22
0
06
16
0
18
51
0
30
16
0
42
51
0
54
27
0
07
18
0
19
56
0
31
18
0
43
56
0
55
33
0
08
20
0
20
62
0
32
20
0
44
62
0
56
39
0
09
22
0
21
68
0
33
22
0
45
68
0
57
47
0
10
24
0
22
75
0
34
24
0
46
75
0
58
56
0
11
27
0
23
82
0
35
27
0
47
82
0
59
68
0
12
30
0
24
91
0
36
30
0
48
91
0
60
82
0
A 1
B 10
C 100
D 1000
E 10000
F 100000
X or S 0.1
Y or R 0.01
Component Identification
Electronics
Assembly

41. Component Value
Calculating SMD Capacitor Value – EIA 96 Marking Method
EIA-96 marking method:
 SMD ceramic capacitors are sometimes marked with a code, consisting of
one or two letters and a digit.
 The first letter if present is a manufacturer code (i.e K for Kemet, etc.)
 The second letter the mantissa and the digit the exponent (multiplier) of
the capacitance in Pico farad (PF)
Component Identification
Electronics
Assembly

42. Calculating SMD Capacitor Value – EIA 96 Marking Method
Table for Capacitors
Letter Mantissa Letter
Mantiss
a
A 1.0 T 5.1
B 1.1 U 5.6
C 1.2 V 6.2
D 1.3 W 6.8
E 1.5 X 7.5
F 1.6 Y 8.2
G 1.8 Z 9.1
H 2.0
J 2.2 a 2.5
K 2.4 b 3.5
L 2.7 d 4.0
M 3.0 e 4.5
N 3.3 f 5.0
P 3.6 m 6.0
Q 3.9 n 7.0
R 4.3 t 8.0
S 4.7 y 9.0
Example:
S3 = 4.7 * 10³ PF = 4.7 NF (Unknown MFR)
KA2 = 1.0 * 10² PF = 100 PF (MFR = KEMET)
J3
2.2 10³
Less Than 1000pf = Pf (Pico farad)
More Than 1000pf =Nf (Nan farad)
More Than 1000000pf =Uf (Microfarad)
Component Value
Component Identification
Electronics
Assembly